LG Advanced Green Laminate (Core Materials) - · PDF file/Information Technology & Electronic...

/ Information Technology & Electronic Materials

LGC Confidential

LG Advanced Green Laminate

(Core Materials)

2010. 8. 11

Confidential1/20Information Technology & Electronic Materials R&D

Contents

- Overview

- 500GA for DDR2

- 500LC series for MCP / PoP


LG LG ChemChem’’ss Advanced Circuit MaterialsAdvanced Circuit Materials

• LCD Module

• Main Board (Keypad)

• IC Package Substrate (Image Sensor or Memory Card)

RCC (Resin Coated Copper)

Resin (65~80 ㎛)

Copper (12~18 ㎛)

IC Package Laminate

Copper (2~18 ㎛)

Resin + G/F (20~150 ㎛)

FCCL (Flexible Copper Clad Laminates)

Polyimide (25~40 ㎛)

Copper (9~18 ㎛)


Structure of Package LaminateStructure of Package Laminate

* Filler

- Type : Inorganic Filler

- Properties : Overall CTE, Stiffness

- Core Technology : Filler Dispersion

* Glass Fabric

- Type : E-Glass (or T-Glass)

- Properties : X-Y CTE, Stiffness

* Resin

- Type : Halogen-free, Phosphorous-free

- Properties : Tg, Moisture Absorption, Peel

- Core Technology : Resin Formulation

* Copper

- Type : ED (12㎛ VLP, 2㎛, 3㎛ with carrier Cu)


Raw Material (Copper Foil)Raw Material (Copper Foil)

Drum

Cathode (-)

Cu2+ +2e- à Cu

Raw Foil Shiny (Drum Side)

Matte Side

Nodule

Treatment

Heat/Chemical

Resistant

Treatment

Anti-tarnishing

Silane

Treatment

Drying

Surface Treated

Foil

Raw Foil (Matte Side) Surface Treated Foil (Matte Side)


Raw Material (Copper Foil)Raw Material (Copper Foil)

VLPStandard

DFR

Low Profile Cu Foil for Fine Pitch

Carrier Foil

(Protection &

Good Handling)

Releasing Layer

Ultra-thin Cu Foil

(Direct CO2 Laser,

L/S=30/30 using Flash Etching)

Ultra-Thin No Profile (with Primer)

Cu Foil (12㎛, Rz~0.6㎛)

(L/S=20/20 using Half-etching + Tenting)


Raw Material (Glass Fabric)Raw Material (Glass Fabric)

Evolution of Ultra-thin & Uniform Fabrics

Spread out(for Laser Drill)

Yarn Shape(X-section)


Raw Material (Glass Fabric)Raw Material (Glass Fabric)

171595 x 95#1015 HD

47

31

24

24

20

12

12

Base weight

(g/m2)

100 (2 ply)

150 (3 ply)4553 x 53#1078

60 (2 ply)2770 x 73#1037

50 (2 ply)1975 x 75#1027

30 (2 ply)1395 x 95#1017

2790 x 90#1037 HD

2090 x 90#1027 HD

40 (2 ply)1585 x 85#1015

Core

Thickness (㎛)

Thickness

(um)

Yarn Count

( / inch)Description

High Yarn Count for High Modulus


2. Resin FormulationTechnology

1. Filler DispersionTechnology

Milling

Prepreg(PPG)

(B-Stage or Partially-Cured)

Core(CCL)

(C-Stage or Fully-Cured)

Manufacturing ProcessManufacturing Process


Material LineMaterial Line--upup

4.3 / 0.006

0.50~0.550.50~0.550.40~0.45Moisture Absorption

(PCT-5hr %)

4.4 / 0.0124.2 / 0.0064.0 / 0.007Dk / Df (@1GHz)

EpoxyEpoxy / BTEpoxy / Cyanate EsterResin System

E-glass E-glassE-glassT-glassG/F Type

9 ~ 10 14 ~ 1512 ~ 137 ~ 8CTE (ppm/K)

Mass

STDLow CTEUltra-Low CTEConcept

466067Filler Content

(wt%)

500LC (W) 500GA500LC

MassProtoStatus

210250260Tg (DMA)

ITEM 500LC (Y)

0.06T


Standard Green Material

500GA

Memory Card

MCP

DDR2 Memory Module


PropertiesProperties LG-500GA

Test Sample : 0.4T Core

180~190

220~230

320~330

0.40~0.45

1.15~1.25

45 / 180

17~19

0.70

21~22

832HS

(halogenated)

180~190

220~230

240~250

0.45~0.50

0.75~0.85

45 / 180

15~17

0.70

21~22

170~180

210-220

360~370

0.40~0.45

0.60~0.70

45 / 180

16~17

0.70

21~22

℃

%

ppm/℃

kgf/cm

GPa

TMA

DMA

Onset

85℃/85%RH168hr

PCT-168hr

α1 / α2

α1

12㎛

@50℃

Tg

Td

Moisture Absorption

CTE Z axis

X-Y axis

Cu Peel Strength

Elastic Modulus

832NX-A

(halogen-free)

500GA

(halogen-free)UnitConditionITEM


Reliability (PCB level)Reliability (PCB level)

HL-832HS

LG-500GA

HL-832HS

HL-832HS

▶ LG-500GA(halogen-free) is equivalent to MGC 832HS(halogenated)


Reliability (PCB level)Reliability (PCB level)

Insulation Reliability

HAST : 130℃/85%RH/96hr/5.5V

Preconditioning : 125℃/4hr +

85℃/85%RH/24hr +

IR Reflow 260℃ x 3cycles

Through Hole Connection Reliability

TC-C 1000 cycle, TS-C 1000 cycle

Preconditioning : 125℃/4hr +

85℃/85%RH/24hr +

IR Reflow 260℃ x 3cycles

HAST

* no problem

LG-500GA

Thermal Cycling Test

HL-832HS

HL-832HS

TS-C


Punching Workability (PCB level)Punching Workability (PCB level)

BOC Slot

LG-500GA

▶ Better punching quality than conventional product

LG-P-500GA


Low CTE Materials

- 500LC

- 500LC (W)

- 500LC (Y)


Concept of Low CTE MaterialsConcept of Low CTE Materials

► Lower CTE Mismatch à Low CTE

► Higher Rigidity (@ reflow temp.) à High Tg

Standard Sub

Low CTE Sub

· Source : Sumitomo Bakelite LαXY (2008)

· Source : MGC 832NS (2009)


Approach for Low CTEApproach for Low CTE

▶ Increasing Filler Content ▶ Using T-glass fabric

Mg

Al

O

Si

0.5 1 1.5 2 2.5 3

keVFull Scale 464 cts Cursor: 2.255 (2 cts)

Spectrum 1

2.9ppm5.5ppmCTE

T-glassE-glass5

6

7

8

9

10

11

12

13

14

15

40 50 60 70

Silica (wt%)

CTE

(ppm

/K)

. 500GA 500LC

500LC(W)


Thermal Mechanical Behavior Thermal Mechanical Behavior

* Test Sample : 0.06T Core

0.00

0.01

0.02

0.03

0.04

0.05

0.06

0.07

0.08

0.09

0.10

0.11

0.12

0.13

0.14

Ta

n D

elta

0

5000

10000

15000

20000

25000

Sto

rage

Mo

du

lus

(MP

a)

0 50 100 150 200 250 300 350

Temperature (°C)

500LC(W) T-HD––––––– 500LC E–––––––

Universal V4.5A TA Instruments

Enhanced Tg

Enhanced Modulus

500LC(W)

500LC(Y)

500LC

► High Modulus (Less Deformation) & Minimum CTE Mismatch (Low CTE)


PropertiesProperties

0.55~0.60

28/ 18

6.1 / 6.9

270

1 ply

T-glass

OOOO-TH

S社

0.40~0.45

26 / 17

9.8 / 10.6

260

2 ply

E-glass

500LC (W)

0.50~0.55

24 / 17

12.1 / 12.8

250

2 ply

E-glass

500LC500LC (Y)OOOO-NSOOOO-LEOOOO-X-Product

2 ply1 ply2 ply1 ply-Structure

0.60~0.65

27 / 18

8.4 / 9.0

270

T-glass

D社

0.40~0.45-0.60~0.65PCT-5hrMoisture

Absorption

(%)

T-glassE-glassE-glass-G/F Type

26 / 1721/ 1325 / 1550℃ / 260℃Modulus

(GPa)

7.5 / 8.112.2 / 12.812.8 / 13.260~150℃X-Y CTE

(ppm/K)

260240270DMATg (℃)

LG ChemM社ConditionITEM

0.06T


Product Roadmap

2010

IC PackagingMaterials

2009 2011 2012

Low CTE Core Primer Coated Foil for Fine Pattern

500LC(W)

8ppm

500LC(W)

8ppm

500LC(Y)

6ppm

500LC(Y)

6ppm5ppm5ppm

7ppm7ppm

L/S=20/20㎛L/S=20/20㎛ L/S=15/15㎛L/S=15/15㎛

500LC

12ppm

500LC

12ppm


LG Chem strives for customer satisfaction.

Be with LG Chem !!!

LG Chem strives for customer satisfaction.

Be with LG Chem !!!

Thank You!Thank You!

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