Level 1 Failure Analysis - EAG Laboratories · Copyrigh 01 EAG Inc AN46 8.13 EAG.CM MATEIALS...
Transcript of Level 1 Failure Analysis - EAG Laboratories · Copyrigh 01 EAG Inc AN46 8.13 EAG.CM MATEIALS...
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Copyright © 2013 EAG, Inc. AN469 08.13 EAG.COM
MATERIALS SCIENCES
Level 1 Failure AnalysisLevel 1 FAs include: non-destructive tests, optical inspection, X-ray, C-SAM, and electrical characterization. This can complete an analysis or indicate the path for deeper analyses.
2015 M-009316 06.15
PACKAGE OPTICAL INSPECTION
C-SAM INSPECTION THRU SCAN
X-RAY INSPECTION
Paddle Die Surface
EAG.COM+1 800 366 3867
Voids in the die attach are observed
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Copyright © 2013 EAG, Inc. AN469 08.13 EAG.COM
Level 1 Failure Analysis
2015 M-009316 06.15
ELECTRICAL CHARACTERIZATION
Drain I-V curve: Good vs. Leaky device Drain I-V curve: Good vs. Short device
Gate I-V curve: Good vs. Leaky device
Vth I-V curve: Good vs. Leaky device
Gate I-V curve: Good vs. Short device
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Copyright © 2013 EAG, Inc. AN469 08.13 EAG.COM
Level 1 Failure Analysis
2015 M-009316 06.15
To discuss EAG’s capabilities, contact EAG’s commercial team at http://www.eag.com/contact/ or by phone at +1 800 366 3867.
DECAPSULATION
Full boil out to remove all the encapsulation material Using drop method to preserve encapsulation material and protect leads
Vth I-V curve: Good vs. Leaky device (log scale) Transistor Characteristic Curves