LED Middle POWER - TME

1

LED Middle POWER

3030AZLxx Series

BNC-OD-C131/A4

Created Date : 05/26/2007

Revison : 1.01, 05/26/2008

LED Middle POWER 3030 Product Data Sheet AZLxx Series Created Date : 07/ 07 / 2014

Revision: 1.0

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3030AZLxx Series

BNC-OD-C131/A4


Revison : 1.0

1. Description

The LiteON 3030 Product series is a wide beam angle standard-dimension package, combining the lifetime and reliability

advantages of Light Emitting Diodes with the brightness of conventional lighting. It gives you total design freedom and

unmatched brightness, creating a new opportunities for solid state lighting to displace conventional lighting technologies.

1.1 Features

Package in 8mm tape on 7" diameter reels.

Compatible with automatic placement equipment.

Compatible with infrared and vapor phase reflow solder process.

EIA STD package.

I.C. compatible.

Meet green product and Pb-free(According to RoHS)

1.2 Available Part Numbers

CCT Part Number

2700K LTW-3030AZL27

3000K LTW-3030AZL30

3500K LTW-3030AZL35

4000K LTW-3030AZL40

5000K LTW-3030AZL50

5700K LTW-3030AZL57

6500K LTW-3030AZL65

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2. Package Dimensions

Part No. Lens Color Source Color

LTW-3030AZL65

Orange InGaN Blue

LTW-3030AZL57

LTW-3030AZL50

LTW-3030AZL40

LTW-3030AZL35

LTW-3030AZL30

LTW-3030AZL27

Notes:

1. All dimensions are in millimeters.

2. Tolerance is ±0.2 mm (.008") unless otherwise noted.

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3. Absolute Maximum Ratings at Ta=25°C

Parameter Symbol

Code4

Rating Unit

Power Dissipation Po 1320 mW

Continuous Forward Current IF 200 mA

Pulse Forward Current

Pulse Forward Current

IFP 200 mA

Operating Temperature Range Topr -40 ~ +100 °C

Storage Temperature Range Tstg -40 ~ +100 °C

Junction Temperature Tj ≦125 °C

Notes :

1. 1/10 duty cycle, Pulse width ≤10μs.

2. Forbid to operating at reverse voltage condition for long.

3. It is recommended to follow de-rating curve to use maximum rating to ensure LED can operated normally.

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4. Electro-Optical Characteristics

4.1 Typical Performance

Parameter Symbol Values Unit Test

Condition

Correlated Color

Temperature CCT Typ. 2700 3000 3500 4000 5000 5700 6500 ‘K

Chromaticity Coordinates x Typ. 0.458 0.434 0.382 0.382 0.345 0.329 0.312

-

IF =

150mA

y Typ. 0.410 0.403 0.380 0.380 0.355 0.342 0.328

Luminous Flux 1 Φv

Min 100 100 100 100 100 100 100

lm Typ. 110 115 118 118 120 120 118

Max. 128 132 132 132 132 132 132

Optical Efficiency ηopt Typ. 116 122 125 125 127 127 125 lm/W

Color Rendering Index CRI Min. 80 -

Viewing Angle 2θ1/2 Typ. 120 deg

Forward Voltage VF

Min 5.8

V Typ. 6.3

Max. 6.6

Thermal Resistance Rjs Typ. 8 °C/W

ESD-Withstand Voltage ESD Min 5K HBM V

Notes

1. Luminous flux is the total luminous flux output as measured with an integrating sphere.

2. Iv (flux v) classification code is marked on each packing bag.

3. The chromaticity coordinates (x, y) is derived from the 1931 CIE chromaticity diagram.

4. Caution in ESD:

Static Electricity and surge damages the LED. It is recommended using a wrist band or anti-electrostatic

glove when handling the LED. All devices, equipment and machinery must be properly grounded.

5. CAS140B is the test standard for the chromaticity coordinates (x, y) & v.

6. The chromaticity coordinates (x, y) guarantee should be added +/- 0.01 tolerance

7. CRI measurement allowance is ±5, R9>0

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4.2 Forward Current vs. Lumen and Voltage

Current

(mA)

VF

(V)

Lumen (lm)

2700K 3000K 3500K 4000K 5000K 5700K 6500K

20 5.49 18.3 19.2 19.7 19.7 20.0 20.0 19.7

40 5.65 35.4 37.0 38.0 38.0 38.6 38.6 38.0

60 5.77 50.6 53.0 54.3 54.3 55.3 55.3 54.3

80 5.90 66.2 69.2 71.0 71.0 72.2 72.2 71.0

100 6.01 80.3 83.9 86.1 86.1 87.6 87.6 86.1

120 6.11 93.5 97.7 100.2 100.2 101.9 101.9 100.2

140 6.22 104.9 109.6 112.5 112.5 114.4 114.4 112.5

150 6.28 110.0 115.0 118.0 118.0 120.0 120.0 118.0

160 6.34 115.2 120.4 123.5 123.5 125.6 125.6 123.5

180 6.42 125.8 131.5 134.9 134.9 137.2 137.2 134.9

200 6.52 134.1 140.2 143.8 143.8 146.3 146.3 143.8

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4.3 Relative Spectral Power Distribution at Typical Current

4.4 Radiation Characteristics

3000K

25degC 25degC

85degC 85degC

5000K

0%

10%

20%

30%

40%

50%

60%

70%

80%

90%

100%

Re

lative

In

ten

sity (

%)

90° 60 30° 0° 50 100

60°

30°

0°

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4.5 Forward Voltage vs. Forward Current

4.6 Color Shift vs. Forward Current

Cool White

Warm White

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4.7 Forward Current Derating Curve vs. Ambient Temperature

4.8 Relative Intensity vs. Junction Temperature

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4.9 Voltage vs. Junction Temperature

4.10 Color Shift vs. Junction Temperature

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5. Binning Definition

5.1 Color Bin

6500K

5700K

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BNC-OD-C131/A4


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5000K

4000K

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3030AZLxx Series

BNC-OD-C131/A4


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3500K

3000K

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BNC-OD-C131/A4


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2700K

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Color Rank

6500K (IF = 150 mA)

Rank - x y Rank - x y Rank - x y

K1

1 0.3048 0.3209

K3

1 0.3145 0.3187

K5

1 0.3098 0.320

2 0.3028 0.3304 2 0.3138 0.3238 2 0.3081 0.3299

3 0.3117 0.3393 3 0.3177 0.3277 3 0.3124 0.3342

4 0.3124 0.3341 4 0.3172 0.3330 4 0.3138 0.3239

5 0.3081 0.3299 5 0.3213 0.3371

6 0.3089 0.3249 6 0.3221 0.3261

K2

1 0.3068 0.3113

K4

1 0.3117 0.3393

K6

1 0.3138 0.3239

2 0.3048 0.3209 2 0.3205 0.3481 2 0.3124 0.3342

3 0.3089 0.3249 3 0.3213 0.3371 3 0.3167 0.3384

4 0.3098 0.32 4 0.3172 0.333 4 0.3178 0.3277

5 0.3138 0.3238 5 0.3166 0.3384

6 0.3145 0.3187 6 0.3124 0.3341

5700K (IF = 150 mA)


J1

1 0.3215 0.3353

J3

1 0.3294 0.3306

J5

1 0.3256 0.3331

2 0.3207 0.3462 2 0.3293 0.3364 2 0.3251 0.3444

3 0.3292 0.3539 3 0.3331 0.3398 3 0.3292 0.3481

4 0.3292 0.3481 4 0.3332 0.3458 4 0.3293 0.3364

5 0.3251 0.3444 5 0.3371 0.3493

6 0.3254 0.3388 6 0.3366 0.3369

J2

1 0.3222 0.3243

J4

1 0.3292 0.3539

J6

1 0.3293 0.3364

2 0.3215 0.3353 2 0.3376 0.3616 2 0.3293 0.3481

3 0.3254 0.3388 3 0.3371 0.3493 3 0.3333 0.3518

4 0.3256 0.3331 4 0.3332 0.3458 4 0.3331 0.3398

5 0.3293 0.3364 5 0.3333 0.3518

6 0.3294 0.3306 6 0.3292 0.3481

Tolerance on each Hue bin (x,y) is +/- 0.01.


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5000K (IF = 150 mA)


H1

1 0.3371 0.3493

H3

1 0.3441 0.3428

H5

1 0.3407 0.3462

2 0.3376 0.3616 2 0.3446 0.3493 2 0.3416 0.3589

3 0.3464 0.3688 3 0.3485 0.3524 3 0.3458 0.3623

4 0.3458 0.3623 4 0.3493 0.3591 4 0.3446 0.3493

5 0.3416 0.3589 5 0.3533 0.3624

6 0.3412 0.3525 6 0.3515 0.3487

H2

1 0.3366 0.3369

H4

1 0.3464 0.3688

H6

1 0.3446 0.3493

2 0.3371 0.3493 2 0.3551 0.3760 2 0.3458 0.3623

3 0.3412 0.3525 3 0.3533 0.3624 3 0.3500 0.3657

4 0.3407 0.3462 4 0.3493 0.3591 4 0.3485 0.3524

5 0.3446 0.3493 5 0.3500 0.3657

6 0.3441 0.3428 6 0.3458 0.3623

4000K (IF = 150 mA)


G1

1 0.3703 0.3726

G3

1 0.3784 0.3647

G5

1 0.3746 0.3689

2 0.3736 0.3874 2 0.3806 0.3725 2 0.3784 0.3841

3 0.3871 0.3959 3 0.3865 0.3762 3 0.3849 0.3882

4 0.3849 0.3881 4 0.3890 0.3842 4 0.3806 0.3726

5 0.3784 0.3841 5 0.3952 0.3880

6 0.3766 0.3765 6 0.3898 0.3716

G2

1 0.3670 0.3578

G4

1 0.3871 0.3959

G6

1 0.3806 0.3726

2 0.3703 0.3726 2 0.4006 0.4044 2 0.3849 0.3882

3 0.3766 0.3765 3 0.3952 0.3880 3 0.3914 0.3922

4 0.3746 0.3689 4 0.3890 0.3842 4 0.3865 0.3762

5 0.3806 0.3725 5 0.3914 0.3922

6 0.3784 0.3647 6 0.3849 0.3881



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BNC-OD-C131/A4


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3500K (IF = 150 mA)


F1

1 0.3943 0.3853

F3

1 0.4018 0.3752

F5

1 0.3983 0.3804

2 0.3996 0.4015 2 0.4050 0.3837 2 0.4042 0.3970

3 0.4148 0.4090 3 0.4118 0.3869 3 0.4115 0.4006

4 0.4115 0.4006 4 0.4153 0.3955 4 0.4050 0.3837

5 0.4042 0.3970 5 0.4223 0.3990

6 0.4013 0.3887 6 0.4147 0.3814

F2

1 0.3889 0.3690

F4

1 0.4148 0.4090

F6

1 0.4050 0.3837

2 0.3943 0.3853 2 0.4299 0.4165 2 0.4115 0.4006

3 0.4013 0.3887 3 0.4223 0.3990 3 0.4188 0.4041

4 0.3983 0.3804 4 0.4153 0.3955 4 0.4118 0.3869

5 0.4050 0.3837 5 0.4188 0.4041

6 0.4018 0.3752 6 0.4115 0.4006

3000K (IF = 150 mA)


E1

1 0.4223 0.3990

E3

1 0.4260 0.3854

E5

1 0.4244 0.3923

2 0.4299 0.4165 2 0.4303 0.3943 2 0.4324 0.4100

3 0.4431 0.4213 3 0.4361 0.3964 3 0.4388 0.4123

4 0.4388 0.4123 4 0.4406 0.4055 4 0.4303 0.3944

5 0.4324 0.4100 5 0.4468 0.4077

6 0.4284 0.4011 6 0.4373 0.3893

E2

1 0.4147 0.3814

E4

1 0.4431 0.4213

E6

1 0.4303 0.3944

2 0.4223 0.3990 2 0.4562 0.4260 2 0.4388 0.4123

3 0.4284 0.4011 3 0.4468 0.4077 3 0.4452 0.4146

4 0.4244 0.3923 4 0.4406 0.4055 4 0.4361 0.3964

5 0.4303 0.3943 5 0.4451 0.4146

6 0.4260 0.3854 6 0.4388 0.4123

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BNC-OD-C131/A4


Revison : 1.0

2700K (IF = 150 mA)


D1

1 0.4468 0.4077

D3

1 0.4483 0.3919

D5

1 0.4477 0.3998

2 0.4562 0.4260 2 0.4534 0.4011 2 0.4576 0.4183

3 0.4688 0.4290 3 0.4591 0.4025 3 0.4637 0.4197

4 0.4636 0.4197 4 0.4644 0.4118 4 0.4534 0.4012

5 0.4576 0.4183 5 0.4703 0.4132

6 0.4527 0.4090 6 0.4593 0.3944

D2

1 0.4373 0.3893

D4

1 0.4688 0.4290

D6

1 0.4534 0.4012

2 0.4468 0.4077 2 0.4813 0.4319 2 0.4637 0.4197

3 0.4527 0.4090 3 0.4703 0.4132 3 0.4697 0.4211

4 0.4477 0.3998 4 0.4644 0.4118 4 0.4591 0.4025

5 0.4534 0.4011 5 0.4697 0.4211

6 0.4483 0.3919 6 0.4636 0.4197


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5.2 Flux Bin

2700K v Luminous Flux Spec. Table


v BinLumen (lm) at IF = 150 mA


Min Max

Min Max

EF 100 104

EG 100 108

FI 104 116

GJ 108 120

IL 116 128

JM 120 132





Min Max

Min Max

EG 100 108

EG 100 108

GJ 108 120

GJ 108 120

JM 120 132

JM 120 132





Min Max

Min Max

EG 100 108

EG 100 108

GJ 108 120

GJ 108 120

JM 120 132

JM 120 132



Min Max

EG 100 108

GJ 108 120

JM 120 132

Tolerance on each Luminous Flux bin is +/- 10%.

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5.3 Voltage Bin

VF Spec. Table

VF Bin Forward Voltage (volts) at IF = 150mA

Min Max

V1 5.8 6.0

V2 6.0 6.2

V3 6.2 6.4

V4 6.4 6.6

Tolerance on each Forward Voltage bin is +/- 0.1V

6. Bin Code List

※ Notes: Full Rank on Label

Example: V1 / FI/ D5

Forward Voltage Rank Luminous Flux Rank Color Rank

V1 FI D5

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7. Reflow Soldering Characteristics

Profile Feature Lead Free Assembly

Average Ramp-Up Rate (TSmax to TP) 3°C / second max

Preheat Temperature Min (TSmin) 150°C

Preheat Temperature Max (TSmax) 200°C

Preheat Time (tSmin to tSmax) 60 – 180 seconds

Time Maintained Above Temperature (TL) 217°C

Time Maintained Above Time (tL) 60 – 150 seconds

Peak / Classification Temperature (TP) 260°C

Time Within 5°C of Actual Peak Temperature (tP) 5 seconds

Ramp – Down Rate 6°C / second max

Time 25°C to Peak Temperature 8 minutes max

Notes:

1. The LEDs can be soldered using the reflow soldering or hand soldering method. The recommended hand

soldering condition is 350 °C max. and 2 secs max. for one time only, and the recommended reflow soldering

condition is 260 °C max. and 5 secs max. for three times max.

2. All temperatures refer to topside of the package, measured on the package body surface.

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3. The soldering condition referring to J-STD-020B. The storage ambient for the LEDs should not exceed 30 °C

temperature or 70% relative humidity. It is recommended that LEDs out of their original packaging are

soldered within one week. For extended storage out of their original packaging, it is recommended that the

LEDs were stored in a sealed container with appropriate desiccant, or desiccators with nitrogen ambient. If

the LEDs were unpacked more than 168hrs, baking the LEDs at 60 ℃ for 24hrs before soldering process.

4. The soldering profile could be further referred to different soldering grease material characteristic. The

grease vendor will provide this information.

5. A rapid-rate process is not recommended for the LEDs cooling down from the peak temperature.

6. Although the recommended reflow conditions are specified above, the reflow or hand soldering

condition at the lowest possible temperature is desirable for the LEDs.

7. LiteOn cannot make a guarantee on the LEDs which have been already assembled using the dip

soldering method.

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8. Reliability Test

No Test item Test Condition Duration Number of

Damaged

1 Steady State Operating Life of

High Temperature (HTOL) Ta=85℃, IF=150mA 1000 hrs 0/20

2 Steady State Operating Life of

Low Temperature (LTOL) Ta=-40℃, IF=150mA 1000 hrs 0/20

3 Pulse Wet Operating Life of

High Temperature (PWHTOL)

60℃/90%RH, IF=150mA

30mins ON/30min OFF 500 hrs 0/20

4 High Temperature Storage (HTS) 100℃ 1000 hrs 0/20

5 Low Temperature Storage (LTS) -40℃ 1000 hrs 0/20

6 Thermal Cycle (TC) -40℃~100℃

30min dwell 5min transfer 200 cycles 0/20

7 Thermal Shock (TS) -40℃~100℃

20min dwell 20sec transfer 200 cycles 0/20

8 Solder Resistance (SR) 265℃, 3X MSL 5sec 0/20

9 Solder Ability (SA) 245℃5sec, 95% coverage 5sec 0/11

10 Mechanical Shock (MS) 1500G 0.5msec pulse shock each 6

axis 0/6

11 Random Vibration (RV) 6G RMS, 10-2000Hz, 10min per axis 0/6

12 Variable Vibration Frequency

(VVF)

10-2000-10Hz, log or linear sweep rate, 20G

for 1 min, 1.5mm each apply 3x per axis over 6hrs 0/6

13 Salt Spread (SS) 35℃, 30g/m2/day 48hrs 0/11

Criteria for Judging the Damage

Item Symbol Test Condition Criteria for Judgment

Min. Max.

Forward Voltage VF IF=Typical Current U.S.L. x 1.1

Luminous Flux lm IF=Typical Current L.S.L. x 0.7

CCX&CCY x,y IF=Typical Current Shift<0.02

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9. User Guide

Cleaning

Do not use unspecified chemical liquid to clean LED they could harm the package. If cleaning is necessary,

immerse the LED in ethyl alcohol or isopropyl alcohol at normal temperature for less than one minute.

Recommend Printed Circuit Board Attachment Pad

Infrared / vapor phase

Reflow Soldering

Package Dimensions of Tape

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Note: All dimensions are in millimeters (inches).

Package Dimensions of Reel

Notes:

1. Empty component pockets sealed with top cover tape.

2. 7 inch reel-1000 pieces per reel.

3. Minimum packing quantity is 500 pieces for remainders.

4. The maximum number of consecutive missing lamps is two.

5. In accordance with EIA-481-1-B specifications.

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10. Cautions

10.1 Application

The LEDs described here are intended to be used for ordinary electronic equipment (such as office

equipment, communication equipment and household applications).Consult Liteon’s Sales in advance for

information on applications in which exceptional reliability is required, particularly when the failure or

malfunction of the LEDs may directly jeopardize life or health (such as in aviation, transportation, traffic

control equipment, medical and life support systems and safety devices).

10.2 Storage

This product is qualified as Moisture sensitive Level 3 per JEDEC J-STD-020 Precaution when handing

this moisture sensitive product is important to ensure the reliability of the product.

The package is sealed:

The LEDs should be stored at 30°C or less and 90%RH or less. And the LEDs are limited to use

within one year, while the LEDs is packed in moisture-proof package with the desiccants inside.

The package is opened:

The LEDs should be stored at 30°C or less and 60%RH or less. Moreover, the LEDs are limited to

solder process within 168hrs. If exceeding the storage limiting time since opened, that we

recommended to baking LEDs at 60°C at least 24hrs. To seal the remainder LEDs return to package,

it’s recommended to be with workable desiccants in original package.

10.3 Cleaning

Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED if necessary.

10.4 Drive Mode

An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs

connected in parallel in an application, it is recommended that a current limiting resistor be

incorporated in the drive circuit, in series with each LED as shown in Circuit A below

(A) Recommended circuit. Circuit model A Circuit model B

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(B) The brightness of each LED might appear different due to the differences in the I-V characteristics

of those LEDs.

10.5 ESD (Electrostatic Discharge)

Static Electricity or power surge will damage the LED. Suggestions to prevent ESD damage:

Use of a conductive wrist band or anti-electrostatic glove when handling these LEDs.

All devices, equipment, and machinery must be properly grounded.

Work tables, storage racks, etc. should be properly grounded.

Use ion blower to neutralize the static charge which might have built up on surface of the

LED’s plastic lens as a result of friction between LEDs during storage and handling.

ESD-damaged LEDs will exhibit abnormal characteristics such as high reverse leakage current, low

forward voltage, or “no lightup” at low currents.To verify for ESD damage, check for “light up” and Vf of

the suspect LEDs at low currents.The Vf of “good” LEDs should be >2.0V per die @0.1mA for InGaN

product and >1.4V per die @0.1mA for AlInGaP product.

10.6 Suggested Checking List:

Training and Certification

1. Everyone working in a static-safe area is ESD-certified?

2. Training records kept and re-certification dates monitored?

Static-Safe Workstation & Work Areas

1. Static-safe workstation or work-areas have ESD signs?

2. All surfaces and objects at all static-safe workstation and within 1 ft measure less

than 100V?

3. All ionizer activated, positioned towards the units?

4. Each work surface mats grounding is good?

Personnel Grounding

1. Every person (including visitors) handling ESD sensitive (ESDS) items wear wrist strap,

heel strap or conductive shoes with conductive flooring?

2. If conductive footwear used, conductive flooring also present where operator stand

or walk?

3. Garments, hairs or anything closer than 1 ft to ESD items measure less than 100V*?

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4. Every wrist strap or heel strap/conductive shoes checked daily and result recorded for

all DLs?

5. All wrist strap or heel strap checkers calibration up to date?

Note: *50V for Blue LED.

Device Handling

1. Every ESDS items identified by EIA-471 labels on item or packaging?

2. All ESDS items completely inside properly closed static-shielding containers when

not at static-safe workstation?

3. No static charge generators (e.g. plastics) inside shielding containers with ESDS items?

4. All flexible conductive and dissipative package materials inspected before reuse

or recycle?

Others

1. Audit result reported to entity ESD control coordinator?

2. Corrective action from previous audits completed?

3. Are audit records complete and on file?

10.7 Others:

Do not put any pressure on the light emitting surface either by finger or any hand tool and do

not stack the products. Stress or pressure may cause damage to the wires of the LED array.

This product is not designed for the use under any of the following conditions, please confirm

the performance and reliability are well enough if you use it under any of the following

conditions

Do not use sulfur-containing materials in commercial products including the materials such as

seals and adhesives that may contain sulfur.

Do not put this product in a place with a lot of moisture (over 85% relative humidity), dew

condensation, briny air, and corrosive gas (Cl, H2S, NH3, SO2, NOX, etc.), exposure to a

corrosive environment may affect silver plating.

The appearance and specifications of the product may be modified for improvement without

prior notice.

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