Lead Less Rework of Components - fhi.nl · Franjo Josipovic Head of Application Martin GmbH Lead...
Transcript of Lead Less Rework of Components - fhi.nl · Franjo Josipovic Head of Application Martin GmbH Lead...
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Franjo JosipovicHead of ApplicationMartin GmbH
Lead Less Rework of Components
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• Outline shape of lead less components
• Rework procedure for lead less components
• LED Rework
• Connector
• Martin Rework Systems
Agenda
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1. Rework Challenges:
- MLP/QFNMicro Lead frame packageQuad flat package no lead
- DFNDual flat no lead
- LEDLight-Emitting-Diode
- Fusion Quad
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1. Rework Challenges :
- MLP/QFNMicro Lead frame packageQuad flat package no lead
- DFNDual flat no lead
- LEDLight-Emitting-Diode
- Fusion Quad
![Page 5: Lead Less Rework of Components - fhi.nl · Franjo Josipovic Head of Application Martin GmbH Lead Less Rework of Components •](https://reader030.fdocuments.us/reader030/viewer/2022041216/5e04c6b469561846e144ad81/html5/thumbnails/5.jpg)
1. Rework Challenges :
- MLP/QFNMicro Lead frame packageQuad flat package no lead
- DFNDual flat no lead
- LEDLight-Emitting-Diode
- Fusion Quad
![Page 6: Lead Less Rework of Components - fhi.nl · Franjo Josipovic Head of Application Martin GmbH Lead Less Rework of Components •](https://reader030.fdocuments.us/reader030/viewer/2022041216/5e04c6b469561846e144ad81/html5/thumbnails/6.jpg)
1. Rework Challenges :
- MLP/QFNMicro Lead frame packageQuad flat package no lead
- DFNDual flat no lead
- LEDLight-Emitting-Diode
- Fusion Quad
![Page 7: Lead Less Rework of Components - fhi.nl · Franjo Josipovic Head of Application Martin GmbH Lead Less Rework of Components •](https://reader030.fdocuments.us/reader030/viewer/2022041216/5e04c6b469561846e144ad81/html5/thumbnails/7.jpg)
Advantage of QFN components?
• Space-saving
• Robust
• Good heat dissipation
• Large numbers of contact pads
• Suitable for power electronics
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MINIOVEN 05
• Standard masks
• Customized masks
• Nitrogen connection
• Reflow environment through convection
• Very low invest
• Masks and stencil from 1 x 1mm body size
• Multiprebumping and Reballing masks
• Solder paste / solder balls (leaded and lead free)
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1. Apply Flux to clean contact pads and avoid oxidation.
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2. Place the dedicated mask and belonging frame into the Prebumping fixture and place the component face down into the frame.
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3. Close fixture and turn around.
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4. Place the solder paste beside the apertures.
5. Print solder paste with squeegee and remove residual solder paste.
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Printing
C = 0.66 x B
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Printing
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Printing
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Too much solder paste.No air extraction canals
Perfect solder paste print
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Important Parameter forSolder paste printing.
• Precise distribution of Solder paste on Heat Sinks.
• Reduction of apertures according data sheet.
• Appropriate use of solder paste Type 4
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HOTBEAM Family
HOTBEAM 04HOTBEAM 05
EXPERT Rework Family
EXPERT 05.6 IXHEXPERT 10.6 HV /HXV
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Thank you for your attention
Franjo Josipovic
Martin GmbH
See you at booth 7A073