- Intelligently connecting products that create new values with the future

Lead-Free Flux Cored Solder

Senju Metal Industry is keenly aware of its social responsibility to help protect the global environment. We contribute to society by continuously offering products that create new values in the form of our ECO SOLDER products. Not only do we actively work to eliminate harmful lead, we also incorporate innovation for key environmental measures such as smart grids. We contribute to the realization of new high-density mounting techniques using next-generation solder materials, including narrow pitches, MEMS, 3D mounting methods, and low melting points, as well as the development of high-quality/low-cost materials. Our Smart Connection meets a broad range of industry needs, to enable an intelligent connection to the future.

Contact us regarding products with 4% flux content and sizes below 0.5 mmThe spreadability values in the above table are typical values when using M705, not guaranteed values

Environmentally Friendly Technology is the Key

NEO LSC CBF FORTE RMA08 MACROS

φ0.5 or more

EFC

φ0.08 to φ0.3Various types from φ0.3 to φ2.0

1×109Ω or more

・Electrical corrosion is prevented by the use of the newly-developed Sn-Zn material・Does not require flux with ultrasonic soldering・Significantly suppresses aluminum leaching

High-quality material that prevents electrical corrosion

●Lineup

●Special-Purpose Solder Wires

Solder wire for aluminum

Grade (ICP)

Halide content

Copper plate corrosion

Copper mirror test

Insulation resistance

Spreadability

Flux content

Wire diameter

Solder wire for glass

ROL1

0.49% or less

No corrosion

No corrosion

79%

3%,4%

ROL1

0.1% or less

No corrosion

No corrosion

78%

3%

ROL1

0.1% or less

No corrosion

No corrosion

76%

3%

ROL1

0.1% or less

No corrosion

No corrosion

76%

3%

ROL1

0.1% or less

No corrosion

No corrosion

78%

3%,4%

ROL1

0.1% or less

No corrosion

No corrosion

76%

3%,3.5%

ROL1

0.1% or less

No corrosion

No corrosion

78%

3%

1×108Ω or more

・Joint strength improved by ultrasonic soldering・Exhibits high electrical conductivity by metal jointing・Enables soldering on ITO films

For applications expanded toflat displays,etc.

http://www.senju-m.co.jp/

■Office LocationsHead Office

SENJU COMTEK CORP.

SENJU COMTEK CORP. /San Diego Sales Office

SENJU COMTEK CORP. /Guadalajara Sales Office

SENJU METAL EUROPE GMBH

SENJU METAL EUROPE GMBH /Prague Branch

Senju Hashido-cho 23, Adachi-ku, Tokyo 120-8555TEL: 03 3888 5151 / FAX: 03 3870 3032

1999 S.Bascom Ave. Suite #340 Campbell, CA 95008 U.S.A.TEL: 1-408-963-5300

4995 Murphy Canyon Road ., Suite 204 San Diego, CA 92123 U.S.A.TEL: 1-858-268-2437

Av. Periferico Sur 7999, Col, Santa Maria Tequepexpan Tlaquepaque, Jalisco, Mexico, C.P. 45601TEL: 52-33-3770-2314

Kirchnerstrasse 6-8 60311, Frankfurt Am Main GermanyTEL: 49-69-2980150

Smichov Gate2. Patro Plzenska 3217/16, 150 00 Praha 5, Czech RepublicTEL: 420-257-289-500

SENJU MANUFACTURING (EUROPE) LTD.

SENJU (MALAYSIA) SDN. BHD.

SENJU SOLDER (PHILS.) INC.

SENJU (THAILAND) CO., LTD.

SENJU METAL INDUSTRY CO., LTD.Korea Branch

5 The Gateway Centre, Coronation Road, Cressex Business Park, High Wycombe, Bucks Hp12 3Su, EnglandTEL: 44-1494-526000

Lot 36, Persiaran Sabak Bernam Sector B, Hicom Industrial Area Seksyen 26, 40000 Shah Alam, Selangor Darul Ehsan, MalaysiaTEL: 60-3-5191-2227

Phase 1 Block 9 Lot 6 PEZA, Rosario, Cavite, 4106 PhilippinesTEL: 63-46-437-2720

20 Bubhajit Bldg., 12th Fl., North Sathorn Rd.,Silom Bangrak, Bangkok 10500 ThailandTEL: 66-2633-8585

Kopomo Building #1109, 16-3, Sunae-Dong, Bundang-Gu, Seongnam-Si, Gyonggi-Do, 463-825 KoreaTEL: 82-31-711-5766～8

Beware of counterfeit products. Counterfeit flux cored and other inauthentic Senju solder products have been circulating abroad. Always purchase genuine Senju products from Senju subsidiaries or authorized distributors.

© 2012 Senju Metal Industry Co., Ltd. All rights reserved.

061202K

Lead-Free Flux Cored Solder

NEO

M705 M53 M35 M20 M82 M24MT M40

LSC

MACROS

FORTE

RMA08

CBF

EFC

001122334455

Provides excellent wettabilitydespite being low-Ag/Ag-free

Ensures high insulation reliabilitydespite being low-Ag/Ag-free

Satisfies the Halogen-Free Standard

Ultra fine wire solder for narrow-pitch mounting

Ensures high-quality in severe environments, including in on-board equipment

Variety of Flux Cored Solders For Different Purposes

How to read a flux cored solder label Packaging format

●Choose flux and alloy according to the application or purpose.

NEOCBFLSCMACROSEFC

Packaging specifications that prevent oxidation

�B�a�c�k�g�r�o�u�n�d�E�v�e�r� �s�i�n�c�e� �1�9�5�5� �w�h�e�n� �w�e� �i�n�t�r�o�d�u�c�e�d� �t�h�e� �f�i�r�s�t� �f�l�u�x� �c�o�r�e�d� �s�o�l�d�e�r� �m�a�d�e� �i�n� �J�a�p�a�n� �u�n�d�e�r� �t�h�e� �b�r�a�n�d� �n�a�m�e� �"�S�p�a�r�k�l�e� �S�o�l�d�e�r�"�,� �w�e� �h�a�v�e� �c�o�n�t�i�n�u�e�d� �t�o� �d�e�v�e�l�o�p� �a� �n�u�m�b�e�r� �o�f� �f�l�u�x� �c�o�r�e�d� �s�o�l�d�e�r�s� �w�i�t�h� �v�a�r�i�o�u�s� �a�l�l�o�y�s� �f�o�r� �a� �w�i�d�e� �r�a�n�g�e� �o�f� �a�p�p�l�i�c�a�t�i�o�n�s�.� �T�h�i�s� �h�a�s� �c�o�n�t�r�i�b�u�t�e�d� �s�i�g�n�i�f�i�c�a�n�t�l�y� �t�o� �p�r�o�g�r�e�s�s� �i�n� �t�h�e� �e�l�e�c�t�r�o�n�i�c�s� �a�n�d� �a�u�t�o�m�o�t�i�v�e� �s�e�c�t�o�r�s� �a�s� �w�e�l�l� �a�s� �i�n� �o�t�h�e�r� �a�r�e�a�s� �o�f� �t�h�e� �i�n�d�u�s�t�r�y�.� �N�o�w� �t�h�a�t� �l�e�a�d�-�f�r�e�e� �s�o�l�d�e�r� �h�a�s� �b�e�c�o�m�e� �d�o�m�i�n�a�n�t�,� �w�e� �a�r�e� �c�o�n�t�i�n�u�o�u�s�l�y� �w�o�r�k�i�n�g� �o�n� �i�m�p�r�o�v�i�n�g� �w�e�t�t�a�b�i�l�i�t�y�,� �s�p�l�a�t�t�e�r� �b�e�h�a�v�i�o�r�,� �a�n�d� �o�t�h�e�r� �c�h�a�r�a�c�t�e�r�i�s�t�i�c�s� �t�o� �d�e�v�e�l�o�p� �n�e�x�t�-�g�e�n�e�r�a�t�i�o�n� �f�l�u�x� �c�o�r�e�d� �s�o�l�d�e�r� �p�r�o�d�u�c�t�s� �t�h�a�t� �a�n�t�i�c�i�p�a�t�e� �t�h�e� �n�e�e�d�s� �o�f� �o�u�r� �c�u�s�t�o�m�e�r�s�.

General-purpose3.0Ag product

For on-boardapplication

General-purposelow-Ag alloy

General-purposeAg-free alloy

For iron corrosionprevention

Ag-free reworksolder alloy

Low-Ag reworksolder alloy

Lead-free Product name

Flux content (%)Alloy name

Alloycomposition

Wire diameter (mm)

Weight (kg)

Guaranteedusability

date

Product codenumber

Lot number

Workability (iron)

Workability(laser)

Scattering(iron)

Scattering (laser)

Cost

Reliability

Note: is a trademark or registered trademark of Senju Metal Industry Co., Ltd.

Lead-Free Flux Cored Solder

NEO

M705 M53 M35 M20 M82 M24MT M40

LSC

MACROS

FORTE

RMA08

CBF

EFC

001122334455

Provides excellent wettabilitydespite being low-Ag/Ag-free

Ensures high insulation reliabilitydespite being low-Ag/Ag-free

Satisfies the Halogen-Free Standard

Ultra fine wire solder for narrow-pitch mounting

Ensures high-quality in severe environments, including in on-board equipment

Variety of Flux Cored Solders For Different Purposes

How to read a flux cored solder label Packaging format

●Choose flux and alloy according to the application or purpose.

NEOCBFLSCMACROSEFC

Packaging specifications that prevent oxidation

�B�a�c�k�g�r�o�u�n�d�E�v�e�r� �s�i�n�c�e� �1�9�5�5� �w�h�e�n� �w�e� �i�n�t�r�o�d�u�c�e�d� �t�h�e� �f�i�r�s�t� �f�l�u�x� �c�o�r�e�d� �s�o�l�d�e�r� �m�a�d�e� �i�n� �J�a�p�a�n� �u�n�d�e�r� �t�h�e� �b�r�a�n�d� �n�a�m�e� �"�S�p�a�r�k�l�e� �S�o�l�d�e�r�"�,� �w�e� �h�a�v�e� �c�o�n�t�i�n�u�e�d� �t�o� �d�e�v�e�l�o�p� �a� �n�u�m�b�e�r� �o�f� �f�l�u�x� �c�o�r�e�d� �s�o�l�d�e�r�s� �w�i�t�h� �v�a�r�i�o�u�s� �a�l�l�o�y�s� �f�o�r� �a� �w�i�d�e� �r�a�n�g�e� �o�f� �a�p�p�l�i�c�a�t�i�o�n�s�.� �T�h�i�s� �h�a�s� �c�o�n�t�r�i�b�u�t�e�d� �s�i�g�n�i�f�i�c�a�n�t�l�y� �t�o� �p�r�o�g�r�e�s�s� �i�n� �t�h�e� �e�l�e�c�t�r�o�n�i�c�s� �a�n�d� �a�u�t�o�m�o�t�i�v�e� �s�e�c�t�o�r�s� �a�s� �w�e�l�l� �a�s� �i�n� �o�t�h�e�r� �a�r�e�a�s� �o�f� �t�h�e� �i�n�d�u�s�t�r�y�.� �N�o�w� �t�h�a�t� �l�e�a�d�-�f�r�e�e� �s�o�l�d�e�r� �h�a�s� �b�e�c�o�m�e� �d�o�m�i�n�a�n�t�,� �w�e� �a�r�e� �c�o�n�t�i�n�u�o�u�s�l�y� �w�o�r�k�i�n�g� �o�n� �i�m�p�r�o�v�i�n�g� �w�e�t�t�a�b�i�l�i�t�y�,� �s�p�l�a�t�t�e�r� �b�e�h�a�v�i�o�r�,� �a�n�d� �o�t�h�e�r� �c�h�a�r�a�c�t�e�r�i�s�t�i�c�s� �t�o� �d�e�v�e�l�o�p� �n�e�x�t�-�g�e�n�e�r�a�t�i�o�n� �f�l�u�x� �c�o�r�e�d� �s�o�l�d�e�r� �p�r�o�d�u�c�t�s� �t�h�a�t� �a�n�t�i�c�i�p�a�t�e� �t�h�e� �n�e�e�d�s� �o�f� �o�u�r� �c�u�s�t�o�m�e�r�s�.

General-purpose3.0Ag product

For on-boardapplication

General-purposelow-Ag alloy

General-purposeAg-free alloy

For iron corrosionprevention

Ag-free reworksolder alloy

Low-Ag reworksolder alloy

Lead-free Product name

Flux content (%)Alloy name

Alloycomposition

Wire diameter (mm)

Weight (kg)

Guaranteedusability

date

Product codenumber

Lot number

Workability (iron)

Workability(laser)

Scattering(iron)

Scattering (laser)

Cost

Reliability

Note: is a trademark or registered trademark of Senju Metal Industry Co., Ltd.

Lead-Free Flux Cored Solder

Existingproduct/M705

Generalproduct

■ Condition: Solder iron temperature 350℃

■ Condition: Solder iron temperature 320℃

Provides excellent solder wettability despite being low-Ag/Ag-free・Enables quick soldering due to its short wetting time・Provides good solder wettability on copper plating・Flux residue has a light yellow color, which makes appearance inspections easy.

Prevents occurrence of migration despite being no-clean type・No cracking of flux residue occurs even by bending and　under harsh conditions such as in on-board equipment・Flux residue with high adhesiveness and water repellency　prevents corrosion and migration・Highly reliable connection with aluminum is achieved　in combination with the Sn-Zn alloy

Designed to prevent flux residue cracking and peeling・No flux residue is caused by mechanical bending or shock,　maintaining the class of air cleanliness・Realized good wettability and peeling prevention in addition to　residue cracking prevention through the development of the new flux・Low flux spattering has been simultaneously achieved

Simultaneously realizes high insulation resistance and low price・Maintains workability equivalent to that of M705, 　despite being low-Ag/Ag-free・Ensures a good work environment, due to low spattering・Exhibits high insulation resistance value even after being left in a　high-temperature, high humidity environment for a long period of time

FORTE

NEO/M705

NEO

M705 Low-Ag/M35 Ag-free/M20

LSCApprox. 33%reduction

0 sec.

RMA08/Ｍ35

LSC/Ｍ35

Good wettability that supports high-efficiency production

Improved wettability for low-Ag/Ag-free alloys Improved flux spattering

Realizes good solder wettability despite being low-Ag/Ag-free

Comparison of residue cracking and peeling Spattering test result

MACROSPrevents occurrence ofmigration despite being

no-clean type

LSCAchieves high insulationresistance despite being

low-Ag/Ag-free

NEOExcellent wettability despite

being low-Ag/Ag-free

FORTENo flux residue cracking

or peeling occurs.

0 0 1 1 2 2 3 3 4 4 5 5

0 0 1 1 2 2 3 3 4 4 5 5

0 0

1 1

2 2

3 3

4 4

5 5

0 0 1 1 2 2 3 3 4 4 5 5

0

5

10

15

20

25

1.2 sec. 1.6 sec.

M705 M35 M20

NEO LSC

Num

ber o

f dro

ps

LSC realizes even better low spatter characteristics

FORTEConventionalproduct

0

5

10

15

20

25

Workability(iron)

Cost

Cost

Workability(laser)

Reliability

Scattering(iron)Fume

Scattering(laser)

Odor

Workability(iron)

Workability(laser)

Reliability

Scattering(iron)Fume

Scattering(laser)

Odor

0.8 sec. 1.6 sec.

0.8 sec. 1.6 sec.

2.4 sec.

Finished

Finished

Approx. 25%reduction

Spat

ter c

ount

Approx. 80% reduction

Workability(iron)

Cost

Workability(laser)

Reliability

Scattering(iron)

Thermalshockcycle

resistance

Scattering(laser)

Shockresistance

Workability(iron)

Cost

Workability(laser)

Reliability

Scattering(iron)

Thermalshockcycle

resistance

Scattering(laser)

Shockresistance

【Test condition】　Temperature : 121℃　Humidity : 100% RH　Atmospheric pressure : 2 atm　Applied voltage : 50 V　Measuring voltage : 100 V　Measuring time : every 0.5 h　Applied voltage mode : DC1.00E+04

1.00E+06

1.00E+08

1.00E+10

1.00E+12

1.00E+14

0 2 4 6 8 10

＜MACROS＞

＜General product＞　

Migration test by PCT

High water repellency prevents corrosion and migration

Insu

latio

n re

sist

ance

Time

Highly water-repellentflux residue prevents migration

Corrosion is preventedby controlling

the oxidation-reduction reaction

＜-30⇔+110℃　Hold time: 30 mins. 1000 hrs.＞

Cracks occur in flux residue No cracks in flux residue

Migration caused by condensationoccurs at cracks

No migration occursduring water drop testing

Water drop migration test after temperature cycle test

General product MACROS

General product MACROS

MACROS prevents the occurrence of cracks in flux residue during temperature cycle tests

Solder (Sn-Zn)

Lead-Free Flux Cored Solder

Existingproduct/M705

Generalproduct

■ Condition: Solder iron temperature 350℃

■ Condition: Solder iron temperature 320℃

Provides excellent solder wettability despite being low-Ag/Ag-free・Enables quick soldering due to its short wetting time・Provides good solder wettability on copper plating・Flux residue has a light yellow color, which makes appearance inspections easy.

Prevents occurrence of migration despite being no-clean type・No cracking of flux residue occurs even by bending and　under harsh conditions such as in on-board equipment・Flux residue with high adhesiveness and water repellency　prevents corrosion and migration・Highly reliable connection with aluminum is achieved　in combination with the Sn-Zn alloy

Designed to prevent flux residue cracking and peeling・No flux residue is caused by mechanical bending or shock,　maintaining the class of air cleanliness・Realized good wettability and peeling prevention in addition to　residue cracking prevention through the development of the new flux・Low flux spattering has been simultaneously achieved

Simultaneously realizes high insulation resistance and low price・Maintains workability equivalent to that of M705, 　despite being low-Ag/Ag-free・Ensures a good work environment, due to low spattering・Exhibits high insulation resistance value even after being left in a　high-temperature, high humidity environment for a long period of time

FORTE

NEO/M705

NEO

M705 Low-Ag/M35 Ag-free/M20

LSCApprox. 33%reduction

0 sec.

RMA08/Ｍ35

LSC/Ｍ35

Good wettability that supports high-efficiency production

Improved wettability for low-Ag/Ag-free alloys Improved flux spattering

Realizes good solder wettability despite being low-Ag/Ag-free

Comparison of residue cracking and peeling Spattering test result

MACROSPrevents occurrence ofmigration despite being

no-clean type

LSCAchieves high insulationresistance despite being

low-Ag/Ag-free

NEOExcellent wettability despite

being low-Ag/Ag-free

FORTENo flux residue cracking

or peeling occurs.

0 0 1 1 2 2 3 3 4 4 5 5

0 0 1 1 2 2 3 3 4 4 5 5

0 0

1 1

2 2

3 3

4 4

5 5

0 0 1 1 2 2 3 3 4 4 5 5

0

5

10

15

20

25

1.2 sec. 1.6 sec.

M705 M35 M20

NEO LSC

Num

ber o

f dro

ps

LSC realizes even better low spatter characteristics

FORTEConventionalproduct

0

5

10

15

20

25

Workability(iron)

Cost

Cost

Workability(laser)

Reliability

Scattering(iron)Fume

Scattering(laser)

Odor

Workability(iron)

Workability(laser)

Reliability

Scattering(iron)Fume

Scattering(laser)

Odor

0.8 sec. 1.6 sec.

0.8 sec. 1.6 sec.

2.4 sec.

Finished

Finished

Approx. 25%reduction

Spat

ter c

ount

Approx. 80% reduction

Workability(iron)

Cost

Workability(laser)

Reliability

Scattering(iron)

Thermalshockcycle

resistance

Scattering(laser)

Shockresistance

Workability(iron)

Cost

Workability(laser)

Reliability

Scattering(iron)

Thermalshockcycle

resistance

Scattering(laser)

Shockresistance

【Test condition】　Temperature : 121℃　Humidity : 100% RH　Atmospheric pressure : 2 atm　Applied voltage : 50 V　Measuring voltage : 100 V　Measuring time : every 0.5 h　Applied voltage mode : DC1.00E+04

1.00E+06

1.00E+08

1.00E+10

1.00E+12

1.00E+14

0 2 4 6 8 10

＜MACROS＞

＜General product＞　

Migration test by PCT

High water repellency prevents corrosion and migration

Insu

latio

n re

sist

ance

Time

Highly water-repellentflux residue prevents migration

Corrosion is preventedby controlling

the oxidation-reduction reaction

＜-30⇔+110℃　Hold time: 30 mins. 1000 hrs.＞

Cracks occur in flux residue No cracks in flux residue

Migration caused by condensationoccurs at cracks

No migration occursduring water drop testing

Water drop migration test after temperature cycle test

General product MACROS

General product MACROS

MACROS prevents the occurrence of cracks in flux residue during temperature cycle tests

Solder (Sn-Zn)

Lead-Free Flux Cored SolderComparison of flux scatter

Scattering test Comparison of bridge formation in drag soldering

EFCFlux cored solderfor fine wiring use

CBFSatisfies halogen-free

standards

RMA08For high insulation

reliability applications

General-purpose product that realizes high insulation reliability・Realizes high insulation resistance and high corrosion resistance,　which is ideal for automotive and other industrial applications・Features low spattering as well as minimal odor and smoke　emission, providing a good working environment・The flux residue is colorless and transparent,　making appearance inspections easy

Flux cored solder for fine wiring use for narrow pitch mounting・Improved strength and other qualities peculiar to ultrafine　wires,owing to improved stability of the wire drawing process・Realizes low scattering by the flux developed for ultra fine wire・Prevents bridge formation by the flux developed　for ultra fine wires

0 0 1 1 2 2 3 3 4 4 5 5

Scattering test

Solder delivery：1 cm/sec

Earlier HF product CBF

Bridge

0 0 1 1 2 2 3 3 4 4 5 5

Earlier ultra-fine

wire

Scattering testresult

Wetting spreadcharacteristics Solder fluidity

Low scattering EFC EFC has excellentwettability

No bridge formation with EFCeven when drag soldering

EFC

EFC is a flux cored solderwith a diameter of less than 0.3 mm

0 0 1 1 2 2 3 3 4 4 5 5

■ Regarding non-use of raw materials from the Democratic Republic of Congo　 Senju Metal Industry does not use any base metals from the Democratic Republic of Congo and adjacent conflict areas. 　 This is ascertained through on-site inspections of suppliers and procurement source refineries.

M705

M53

M35

M20

M82

M24MT

M40

OthersAlloyname

Temperature (%)

Solidusline Peak Liquidus

line

・ M705 ; General-purpose lead-free 3.0Ag solder alloy with a 10 year history・ M53 ; Suitable for environments such as on-board equipment, due to its excellent thermal fatigue resistance・ M35 ; Low-Ag flux-cored 0.3Ag solder alloy

・ M20 ; Ag-free flux-cored solder alloy・ M82 ; Alloy that prevents corrosion of soldering irons・ M24MT ; Low-price rework solder alloy for flow soldering・ M40 ; For reworking of 1.0Ag solder paste

217

198

217

227

218

228

211

3.0

0.1or

less

0.1or

less

0.1or

less

0.1or

less

0.1or

less

3.0

1.6

0.5

0.7

0.75

0.7

0.7

0.7

3.0

3.0

0.3

0.3

1.0

220

214

227

229

229

230

222

219

214

219

229

219

230

222

Ag Cu Bi Ni In Sb P Ge

Comparison of smoke emission

Insulation resistance test results

Alloy Lineup

120

100

80

60

40

20

0Earliersolderwith

halogen

EarlierHF

product

CBF

Lead-free flux cored solder with excellent wettability ・Complies with halogen free standards, containing　no more than 900 ppm of chlorine and bromine, respectively・Achieves better wettability and causes minimal bridge　formation even with drag soldering・Features low scattering and outstanding heat resistance,　making the product ideal for prolonged heating processes

Scat

ter c

ount

Insu

latio

n re

sist

ance

(Ω)

Time (hr)

Scatter distance(mm)

Conventional product

NEO

Conventionalproduct

RMA08

Scat

ter c

ount

Flux

High-quality, high-precision flux cored solderwith flux in 0.1 mm center section

Solder

0.1mm

0.2or

less

Workability(iron)

Workability(laser)

Reliability

Scattering(iron)Fume

Scattering(laser)

Odor

Cost

Workability(iron)

Workability(laser)

Reliability

Scattering(iron)

Thermal shockcycle resistance

Scattering(laser)

Shockresistance

Cost

ConventionalproductRMA08

Blank PCB

Test PCB

Workability(iron)

Workability(laser)

Reliability

Scattering(iron)Fume

Scattering(laser)

Odor

Cost

Lead-Free Flux Cored SolderComparison of flux scatter

Scattering test Comparison of bridge formation in drag soldering

EFCFlux cored solderfor fine wiring use

CBFSatisfies halogen-free

standards

RMA08For high insulation

reliability applications

General-purpose product that realizes high insulation reliability・Realizes high insulation resistance and high corrosion resistance,　which is ideal for automotive and other industrial applications・Features low spattering as well as minimal odor and smoke　emission, providing a good working environment・The flux residue is colorless and transparent,　making appearance inspections easy

Flux cored solder for fine wiring use for narrow pitch mounting・Improved strength and other qualities peculiar to ultrafine　wires,owing to improved stability of the wire drawing process・Realizes low scattering by the flux developed for ultra fine wire・Prevents bridge formation by the flux developed　for ultra fine wires

0 0 1 1 2 2 3 3 4 4 5 5

Scattering test

Solder delivery：1 cm/sec

Earlier HF product CBF

Bridge

0 0 1 1 2 2 3 3 4 4 5 5

Earlier ultra-fine

wire

Scattering testresult

Wetting spreadcharacteristics Solder fluidity

Low scattering EFC EFC has excellentwettability

No bridge formation with EFCeven when drag soldering

EFC

EFC is a flux cored solderwith a diameter of less than 0.3 mm

0 0 1 1 2 2 3 3 4 4 5 5

■ Regarding non-use of raw materials from the Democratic Republic of Congo　 Senju Metal Industry does not use any base metals from the Democratic Republic of Congo and adjacent conflict areas. 　 This is ascertained through on-site inspections of suppliers and procurement source refineries.

M705

M53

M35

M20

M82

M24MT

M40

OthersAlloyname

Temperature (%)

Solidusline Peak Liquidus

line

・ M705 ; General-purpose lead-free 3.0Ag solder alloy with a 10 year history・ M53 ; Suitable for environments such as on-board equipment, due to its excellent thermal fatigue resistance・ M35 ; Low-Ag flux-cored 0.3Ag solder alloy

・ M20 ; Ag-free flux-cored solder alloy・ M82 ; Alloy that prevents corrosion of soldering irons・ M24MT ; Low-price rework solder alloy for flow soldering・ M40 ; For reworking of 1.0Ag solder paste

217

198

217

227

218

228

211

3.0

0.1or

less

0.1or

less

0.1or

less

0.1or

less

0.1or

less

3.0

1.6

0.5

0.7

0.75

0.7

0.7

0.7

3.0

3.0

0.3

0.3

1.0

220

214

227

229

229

230

222

219

214

219

229

219

230

222

Ag Cu Bi Ni In Sb P Ge

Comparison of smoke emission

Insulation resistance test results

Alloy Lineup

120

100

80

60

40

20

0Earliersolderwith

halogen

EarlierHF

product

CBF

Lead-free flux cored solder with excellent wettability ・Complies with halogen free standards, containing　no more than 900 ppm of chlorine and bromine, respectively・Achieves better wettability and causes minimal bridge　formation even with drag soldering・Features low scattering and outstanding heat resistance,　making the product ideal for prolonged heating processes

Scat

ter c

ount

Insu

latio

n re

sist

ance

(Ω)

Time (hr)

Scatter distance(mm)

Conventional product

NEO

Conventionalproduct

RMA08

Scat

ter c

ount

Flux

High-quality, high-precision flux cored solderwith flux in 0.1 mm center section

Solder

0.1mm

0.2or

less

Workability(iron)

Workability(laser)

Reliability

Scattering(iron)Fume

Scattering(laser)

Odor

Cost

Workability(iron)

Workability(laser)

Reliability

Scattering(iron)

Thermal shockcycle resistance

Scattering(laser)

Shockresistance

Cost

ConventionalproductRMA08

Blank PCB

Test PCB

Workability(iron)

Workability(laser)

Reliability

Scattering(iron)Fume

Scattering(laser)

Odor

Cost

- Intelligently connecting products that create new values with the future

Lead-Free Flux Cored Solder

Senju Metal Industry is keenly aware of its social responsibility to help protect the global environment. We contribute to society by continuously offering products that create new values in the form of our ECO SOLDER products. Not only do we actively work to eliminate harmful lead, we also incorporate innovation for key environmental measures such as smart grids. We contribute to the realization of new high-density mounting techniques using next-generation solder materials, including narrow pitches, MEMS, 3D mounting methods, and low melting points, as well as the development of high-quality/low-cost materials. Our Smart Connection meets a broad range of industry needs, to enable an intelligent connection to the future.

Contact us regarding products with 4% flux content and sizes below 0.5 mmThe spreadability values in the above table are typical values when using M705, not guaranteed values

Environmentally Friendly Technology is the Key

NEO LSC CBF FORTE RMA08 MACROS

φ0.5 or more

EFC

φ0.08 to φ0.3Various types from φ0.3 to φ2.0

1×109Ω or more

・Electrical corrosion is prevented by the use of the newly-developed Sn-Zn material・Does not require flux with ultrasonic soldering・Significantly suppresses aluminum leaching

High-quality material that prevents electrical corrosion

●Lineup

●Special-Purpose Solder Wires

Solder wire for aluminum

Grade (ICP)

Halide content

Copper plate corrosion

Copper mirror test

Insulation resistance

Spreadability

Flux content

Wire diameter

Solder wire for glass

ROL1

0.49% or less

No corrosion

No corrosion

79%

3%,4%

ROL1

0.1% or less

No corrosion

No corrosion

78%

3%

ROL1

0.1% or less

No corrosion

No corrosion

76%

3%

ROL1

0.1% or less

No corrosion

No corrosion

76%

3%

ROL1

0.1% or less

No corrosion

No corrosion

78%

3%,4%

ROL1

0.1% or less

No corrosion

No corrosion

76%

3%,3.5%

ROL1

0.1% or less

No corrosion

No corrosion

78%

3%

1×108Ω or more

・Joint strength improved by ultrasonic soldering・Exhibits high electrical conductivity by metal jointing・Enables soldering on ITO films

For applications expanded toflat displays,etc.

http://www.senju-m.co.jp/

■Office LocationsHead Office

SENJU COMTEK CORP.

SENJU COMTEK CORP. /San Diego Sales Office

SENJU COMTEK CORP. /Guadalajara Sales Office

SENJU METAL EUROPE GMBH

SENJU METAL EUROPE GMBH /Prague Branch

Senju Hashido-cho 23, Adachi-ku, Tokyo 120-8555TEL: 03 3888 5151 / FAX: 03 3870 3032

1999 S.Bascom Ave. Suite #340 Campbell, CA 95008 U.S.A.TEL: 1-408-963-5300

4995 Murphy Canyon Road ., Suite 204 San Diego, CA 92123 U.S.A.TEL: 1-858-268-2437

Av. Periferico Sur 7999, Col, Santa Maria Tequepexpan Tlaquepaque, Jalisco, Mexico, C.P. 45601TEL: 52-33-3770-2314

Kirchnerstrasse 6-8 60311, Frankfurt Am Main GermanyTEL: 49-69-2980150

Smichov Gate2. Patro Plzenska 3217/16, 150 00 Praha 5, Czech RepublicTEL: 420-257-289-500

SENJU MANUFACTURING (EUROPE) LTD.

SENJU (MALAYSIA) SDN. BHD.

SENJU SOLDER (PHILS.) INC.

SENJU (THAILAND) CO., LTD.

SENJU METAL INDUSTRY CO., LTD.Korea Branch

5 The Gateway Centre, Coronation Road, Cressex Business Park, High Wycombe, Bucks Hp12 3Su, EnglandTEL: 44-1494-526000

Lot 36, Persiaran Sabak Bernam Sector B, Hicom Industrial Area Seksyen 26, 40000 Shah Alam, Selangor Darul Ehsan, MalaysiaTEL: 60-3-5191-2227

Phase 1 Block 9 Lot 6 PEZA, Rosario, Cavite, 4106 PhilippinesTEL: 63-46-437-2720

20 Bubhajit Bldg., 12th Fl., North Sathorn Rd.,Silom Bangrak, Bangkok 10500 ThailandTEL: 66-2633-8585

Kopomo Building #1109, 16-3, Sunae-Dong, Bundang-Gu, Seongnam-Si, Gyonggi-Do, 463-825 KoreaTEL: 82-31-711-5766～8

Beware of counterfeit products. Counterfeit flux cored and other inauthentic Senju solder products have been circulating abroad. Always purchase genuine Senju products from Senju subsidiaries or authorized distributors.

© 2012 Senju Metal Industry Co., Ltd. All rights reserved.

061202K