Large-scale freestanding nanometer-thick graphite ...web.skku.edu/~nmdl/publication/2015/199....

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Registered charity number: 207890 Showcasing research from the SKKU Advanced Institute of Nanotechnology (SAINT), Sungkyunkwan University, Suwon, Korea. Large-scale freestanding nanometer-thick graphite pellicles for mass production of nanodevices beyond 10 nm A nanometer-thick graphite film was fabricated for an extreme ultraviolet lithography (EUVL) pellicle. Its high EUV transmission and heat dissipation properties enabled practical application of the pellicle at the power density required for EUVL without failure. Scaling up of the nanometer-thick graphite film will make implementation of EUVL and sub-10 nm devices possible. Nanoscale www.rsc.org/nanoscale ISSN 2040-3364 PAPER Lin Guo, Shihe Yang et al. Novel sodium/lithium-ion anode material based on ultrathin Na2Ti2O4(OH)2nanosheet Volume 7 Number 35 21 September 2015 Pages 14549–14796 As featured in: See Mun Ja Kim, Ji-Beom Yoo et al. Nanoscale, 2015, 7, 14608. www.rsc.org/nanoscale

Transcript of Large-scale freestanding nanometer-thick graphite ...web.skku.edu/~nmdl/publication/2015/199....

Page 1: Large-scale freestanding nanometer-thick graphite ...web.skku.edu/~nmdl/publication/2015/199. [Nanoscale, 2015, 7, 14608... · 10 mm (the inset in Fig. 1a) by the scooping method

Registered charity number: 207890

Showcasing research from the SKKU Advanced Institute of

Nanotechnology (SAINT), Sungkyunkwan University, Suwon,

Korea.

Large-scale freestanding nanometer-thick graphite pellicles for

mass production of nanodevices beyond 10 nm

A nanometer-thick graphite fi lm was fabricated for an extreme

ultraviolet lithography (EUVL) pellicle. Its high EUV transmission

and heat dissipation properties enabled practical application

of the pellicle at the power density required for EUVL without

failure. Scaling up of the nanometer-thick graphite fi lm will make

implementation of EUVL and sub-10 nm devices possible.

Nanoscalewww.rsc.org/nanoscale

ISSN 2040-3364

PAPERLin Guo, Shihe Yang et al. Novel sodium/lithium-ion anode material based on ultrathin Na2Ti2O4(OH)2 nanosheet

Volume 7 Number 35 21 September 2015 Pages 14549–14796

As featured in:

See Mun Ja Kim, Ji-Beom Yoo et al.Nanoscale, 2015, 7, 14608.

www.rsc.org/nanoscale

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Nanoscale

COMMUNICATION

Cite this: Nanoscale, 2015, 7, 14608

Received 11th May 2015,Accepted 24th June 2015

DOI: 10.1039/c5nr03079j

www.rsc.org/nanoscale

Large-scale freestanding nanometer-thickgraphite pellicles for mass production ofnanodevices beyond 10 nm†

Seul-Gi Kim,‡a Dong-Wook Shin,‡a Taesung Kim,a Sooyoung Kim,a Jung Hun Lee,b

Chang Gu Lee,a Cheol-Woong Yang,b Sungjoo Lee,a Sang Jin Cho,c

Hwan Chul Jeon,d Mun Ja Kim,*d Byung-Gook Kimd and Ji-Beom Yoo*a,b

Extreme ultraviolet lithography (EUVL) has received much atten-

tion in the semiconductor industry as a promising candidate to

extend dimensional scaling beyond 10 nm. We present a new pelli-

cle material, nanometer-thick graphite film (NGF), which shows an

extreme ultraviolet (EUV) transmission of 92% at a thickness of

18 nm. The maximum temperature induced by laser irradiation (λ =

800 nm) of 9.9 W cm−2 was 267 °C, due to the high thermal con-

ductivity of the NGF. The freestanding NGF was found to be chemi-

cally stable during annealing at 500 °C in a hydrogen environment.

A 50 × 50 mm large area freestanding NGF was fabricated using

the wet and dry transfer (WaDT) method. The NGF can be used as

an EUVL pellicle for the mass production of nanodevices beyond

10 nm.

Extreme ultraviolet lithography (EUVL), at a wavelength of13.5 nm, is an indispensable technique to extend dimensionalscaling beyond 10 nm in the semiconductor industry.1,2 Forthe high-volume manufacturing of Si-based nanodevices usingextreme ultraviolet lithography (EUVL), controlling mask defec-tivity during exposure to extreme ultraviolet (EUV) light hasbeen considered the top priority among the various chal-lenges, such as increasing the EUV source power and improv-ing the line-width roughness of the resist.3–5 Using a physicalparticle shield, a pellicle, complete blocking of the particleadders on the reflection mask during EUV exposure can beachieved, and it has been used in the imaging process of stan-dard optical lithography for the same purpose.6–8 However,

issues with the pellicle materials still remain because of thestrict requirements of EUVL pellicles.6,9 For practical appli-cation to EUVL, a pellicle should have an EUV transmission ofmore than 90%, excellent thermal and chemical stability uponexposure to EUV with a high energy density of 5 W cm−2

in a hydrogen environment, and a large freestanding size of110 × 140 mm.6

Based on these strict requirements of EUVL pellicles, free-standing thin films composed of several different materials,including Si, Ru, Mo, and Nb, have been investigated.6,8,10

Among them, a 60 nm thick Si-based pellicle with a size of 110× 140 mm showed the highest EUV transmission of ∼85%.6,9

However, it was crippled by the high temperature induced byEUV irradiation with a power density of 5 W cm−2 due to thelow thermal conductivity and reduced emissivity of the verythin Si layer.6 This thermal breakdown of Si caused us to lookfor other materials with high EUV transmission and thermalstability against EUV induced heating. Here, we present a newpellicle material, nanometer-thick graphite film (NGF), whichhas high theoretical EUV transmission,11 heat dissipationproperties,12–14 and chemical stability.15 NGF synthesized bychemical vapor deposition (CVD) shows an EUV transmissionof 92% at a thickness of 18 nm, along with excellent chemicalstability and heat dissipation properties. A 50 × 50 mm large-scale freestanding NGF pellicle was fabricated by the wet anddry transfer (WaDT) method. The EUV transmission, heat dis-sipation properties, and chemical stability of the NGF pellicleconfirm the feasibility of using NGF pellicles for the mass pro-duction of nanodevices beyond 10 nm.

Since the EUV beam passes through the pellicle twicebecause of the reflection mask (Fig. S1†), the EUV trans-mission of a pellicle is directly related to the efficiency of EUVlithography. To obtain high transmission above 90%, NGFswith various thicknesses were synthesized by controlling thegrowth temperature in the range from 910 to 1035 °C. Thethicknesses of the NGFs were measured using AFM and foundto vary from 18 to 78 nm (Fig. S2†). Each freestanding NGFwas fabricated on a circular frame with an inner diameter of

†Electronic supplementary information (ESI) available. See DOI: 10.1039/c5nr03079j‡These authors contributed equally.

aSKKU Advanced Institute of Nanotechnology (SAINT) and Center for Human

Interface Nano Technology (HINT), Sungkyunkwan University, Suwon, 440-746,

Republic of Korea. E-mail: [email protected] of Advanced Materials Science and Engineering (BK21), Sungkyunkwan

University, Suwon, 440-746, Republic of KoreacFine Semitech, Osan, 447-210, Republic of KoreadMask Development Team, Semiconductor R&D Center, SAMSUNG ELECTRONICS

CO., Ltd, Hwaseong, 445-701, Republic of Korea. E-mail: [email protected]

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10 mm (the inset in Fig. 1a) by the scooping method and itstransmission was measured at EUV (λ = 13.5 nm) and visiblelight (λ = 550 nm) wavelengths as shown in Fig. 1a. The EUVtransmission of the freestanding NGF with a thickness of18 nm was 92% (51% @ 550 nm), which was the best EUVtransmission among the EUV pellicles using Si and other thinfilms,6,8,10 and represents excellent optical properties andshows the feasibility of NGF for EUV pellicles. The correlationbetween the transmission at the EUV and visible light wave-lengths suggests a convenient way to assess the EUV trans-mission from visible light transmission. Theoreticalcalculations on the EUV and UV transmissions were carriedout§ based on the Beer–Lambert law. The simulation results ofthe EUV transmission (red dotted line) and visible light trans-mission (blue dotted line) with various thicknesses showedgood agreement with the measured values.11,16 The representa-tive Raman spectrum of the NGF showed typical Raman spec-tral features of highly oriented pyrolytic graphite,17 and thenanometer thickness of the graphite was confirmed by crosssectional transmission electron microscopy (TEM) (Fig. 1b andc). The thickness of the NGF was 18 nm and a well-arrangedlayer structure was observed (Fig. 1d). The thicknesses of theNGFs synthesized at other temperatures were 28 nm (925 °C)

and 67 nm (1000 °C), and the fine graphite structures werealso observed without changes in the crystalline qualities(Fig. S4†). The high-resolution TEM (HRTEM) image of theNGF shown in Fig. 1e reveals a uniform honeycomb structureof the NGF. The crystallinity of NGF was observed indirectly bythe selected area electron diffraction pattern which was col-lected using a 1.2 μm aperture (Fig. S4†).

For the application of the freestanding NGF to EUV pelli-cles, its thermal and chemical stability should be ensured inan EUV lithography environment. We investigated the thermaland chemical stability of the NGFs using an infrared (IR, λ =800 nm) laser and a rapid thermal annealing (RTA) system.The IR laser was used as the heat source, because the absorp-tion of the IR laser in NGF is higher than that in EUV (ESI,Fig. S3†).18 Considering that the EUV source power requiredfor high-volume manufacturing is 250 W, corresponding to5 W cm−2 for the pellicle,6 the power density of the IR laserbeam should be higher than 5 W cm−2. Fig. 2a shows themaximum temperatures of the freestanding NGFs, induced byvarious power densities (higher than 5 W cm−2) of the laser.The temperature, achieved instantly upon exposure to laserirradiation, was measured using a thermal imaging camera(Fluke, Ti10), and the pressure was maintained at 3 Pa in ahydrogen environment. The maximum temperatures of 165 °C

Fig. 1 Transmission of a freestanding nanometer-thick graphite film(NGF), the Raman spectrum of NGF, and a high-resolution transmissionelectron microscopy (HRTEM) image. (a) EUV (λ = 13.5 nm) and visiblelight (λ = 550 nm) transmission of the NGF pellicle as a function of NGFthickness. The inset of (a) is a photo image of the pellicle (an 18 nmthick freestanding NGF) with a diameter of 10 mm. The red and bluedotted lines correspond to the simulations of transmission for EUV andvisible light, respectively. (b) The representative Raman spectrum ofNGF. (c) A cross-sectional TEM image of the thickness of 18 nm and (d)a well-arranged layer structure of the NGF. (e) HRTEM image of the NGF.The inset of (e) is the selected area electron diffraction (SAED) pattern ofthe NGF. The SAED pattern was collected using a 1.2 μm aperture.

Fig. 2 Thermal and chemical stability of NGF in a hydrogen and infrared(IR) laser irradiation environment. The thickness of the NGF was 100 nmand the inner diameter of the pellicle was 5.3 mm. (a) The maximumtemperature of the freestanding NGF was measured using a thermalimage camera as a function of the power density of the laser (λ =800 nm). (b) The EUV transmission (λ = 13.5 nm) of the NGF withincreasing exposure time in a hydrogen environment at a power densityof 5 W cm−2. The diameter of the laser beam was 4 mm and thechamber pressure in the hydrogen environment was 3 Pa. (c) The Ramanspectra of NGF after thermal annealing in a hydrogen environment atvarious temperatures for 4 h. (d) ID/IG of NGF before and after annealingat different temperatures.

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and 267 °C were measured at power densities of 5.1 W cm−2

and 9.9 W cm−2, respectively. The maximum temperatureinduced by the irradiation of the laser is very low comparedwith that of the Si-based pellicle,6 suggesting that it is an excel-lent heat dissipation material due to the high thermal conduc-tivity.12 The temperature profile of the NGF with a powerdensity of 5.1 W cm−2 is shown in Fig. S5.† The EUV trans-mission was not changed after 24 h of laser irradiation(Fig. 2b). The Raman spectra before and after irradiation alsoshow almost the same intensity ratios of the D to G peaks (ID/IG), indicating that the levels of crystalline defects had notbeen changed (Fig. S6†). Fig. 2c and d show the Ramanspectra and ID/IG of the NGF after the chemical stability testusing a RTA system in a hydrogen environment (3 Pa) at elev-ated temperatures for 4 h. The ID/IG of each Raman spectrumremained almost the same as the as-grown NGF up to 500 °C,except at 700 °C where the ID/IG changed from 0.02 to 0.08.The excellent heat dissipation properties and chemical stabilityshow the feasibility of NGF in the EUV pellicle environment.

In addition to an EUV transmission of over 90% and stabi-lity in thermal and chemical environments, the scalability ofthe freestanding film size should be ensured for the appli-cation of the NGF to EUV pellicles. Fig. 3a shows the scheme

of the wet and dry transfer (WaDT) process for the fabricationof the large-scale freestanding NGF with a freestanding size of50 × 50 mm. The fabrication procedure for the large-scale free-standing NGF is as follows: NGF coated with PMMA wasfloated on water and then transferred onto a polycarbonatetrack etched (PCTE) membrane. The half-dried PMMA/NGF/PCTE was attached directly onto a 50 × 50 mm frame with anadhesive. Finally, the PCTE membrane was simply detachedfrom the PMMA/NGF, and the PMMA was removed by oxygenplasma treatment (ESI, Fig. S7†).19,20 The product of the large-scale freestanding NGF (50 × 50 mm) is shown in Fig. 3b. Thethickness of the freestanding NGF was 86.06 ± 8.13 nm, whichwas obtained from the EUV transmission map (57.59 ± 2.91%,Fig. 3c).11 To obtain a high EUV transmission large-scale free-standing NGF, the thickness of the NGF was reduced byoxygen plasma. As a function of etching time, the transmissionof the NGF under visible light (λ = 550 nm) was measured witha UV-vis-NIR spectrometer (Fig. S8†). The large-scale freestand-ing NGF having a thickness of 59.73 ± 5.83 nm was fabricatedby applying this treatment condition, as shown in Fig. 3d. TheEUV transmission of the NGF is 68.17 ± 2.91%. We found thatthe areal non-uniformity of EUV transmission might beinduced by large wrinkles of freestanding NGFs6,21 formed inthe NGF transfer processes conducted under ambient con-ditions. Even though further studies are needed to obtain auniform-transmission freestanding film, a large-scale freestand-ing NGF (or full-size NGF pellicles) with a high EUV trans-mission, above 90%, can be obtained by plasma treatment.

Conclusions

The excellent optical properties, high thermal stability, andthe possibility of scaling up the NGF demonstrate convincinglythat the NGF is the best material for the EUV pellicle. The EUVtransmission of 92% on a freestanding film (10 mm in dia-meter) and a 50 × 50 mm freestanding NGF with a 59.7 nmthickness is demonstrated. The NGF shows exceptional heatdissipation properties under IR laser illumination with apower density of 9.9 W cm−2 and excellent chemical stability at500 °C in a hydrogen environment. The NGF is expected to bethe best material for EUV pellicles, and we believe that the useof NGFs in EUVL extends the implementation of high volumemanufacturing of nanoscale devices beyond 10 nm.

Author contributions

S.-G. Kim and J.-B. Yoo conceived and designed the experi-ment. S.-G. Kim synthesized the NGFs. S.-G. Kim, D.-W. Shin,T. Kim, and S. Kim transferred NGF and fabricatedpellicle. J. H. Lee and C. G. Lee assisted with atomic forcemicroscopy and Raman measurement. C.-W. Yang analyzedthe microstructure of NGFs using HRTEM. S. J. Cho andH. C. Jeon evaluated optical properties of NGF pellicles.J.-B. Yoo and M. J. Kim supervised the study. S.-G. Kim, D.-W. Shin

Fig. 3 Large-scale freestanding process, EUV transmission maps ofNGF and their photo images. (a) Scheme of the wet and dry transfer(WaDT) process for the large-scale freestanding NGF. A PMMA-coatedNGF was floated on water after Ni etching and washing. A polycarbonatetrack etched (PCTE) membrane was used for the wet transfer of NGF.A half-dried PMMA/NGF/PCTE was attached directly on the frame, andthen a PCTE membrane was simply detached (dry transfer). (b, d) Photoimages of the large-scale freestanding NGFs (50 × 50 mm) before andafter O2 plasma treatment. (c, d) EUV transmission maps (45 × 45 mm)before and after O2 plasma etching.

Communication Nanoscale

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and J.-B. Yoo discussed and wrote the paper, with the help ofM. J. Kim, H. C. Jeon, B.-G. Kim, C.-W. Yang, and S. Lee.

Acknowledgements

This study was supported by the Basic Science ResearchProgram through the National Research Foundation of Korea(NRF) funded by the Ministry of Education, Science and Tech-nology (2009-0083540) and Samsung Electronics Co. Ltd.

Notes and references§TEUV = e−4πβN·d/λ, where β = 6.9054 × 10−3 at λ = 13.5 nm and N·d is the thicknessof the NGF,11 and Tvis = e−4πκt/λ, where κ = 1.3 at λ = 550 nm and t is the thicknessof the NGF16 (see the ESI).

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