LA/OC SM LA/OC SMTA NEWS LETTERTA NEWS LETTER3 - 4 Chapter Announcements & Events 5 Technical...

LA/OC SMTA NEWS LETTERLA/OC SMTA NEWS LETTER April 2010

2010 Calendar of Events...Save the Date! Date Time Event Location

Thursday, April 15th,

2010

6:00pm Social Hour

LA/O.C. SMTA Chapter Dinner

JT Schmid's Anaheim, CA

Thursday, May 20th,

2010

6:00pm Social Hour



Monday, August 16th,

2010

11:00am Sign-In 1:00pm

Shot-Gun Start

11th Annual Golf "Get Together"

Old Ranch Country Club Seal Beach, CA

Thursday, Sept. 16th,

2010

6:00pm Social Hour



April 2010 Educational

& Networking Event

Speaker Jordon Ross

Indium Corporation of America

Topic Nano-Bond Assembly, A Rapid

Room Temperature Fluxless Sol-dering Process

DATE Thursday, April 15th, 2010

AGENDA 6:00PM, Social Hour

7:00PM, Dinner/Presentation

MEETING FEES $25, Members

$35, Nonmembers

MENU Visit http://www.laocsmta.org

LOCATION JT Schmid's Restaurant & Brewery

2610 E. Katella Avenue Anaheim, California 92806

714.634.9200

LA/OC SMTA Chapter is Proud to Present…

April 2010 PRESENTATION DINNER MEETING

Nano-Bond Assembly, A Rapid Room Temperature Fluxless Soldering Process

PRESENTED BYPRESENTED BY Jordon Ross, Indium Corporation of AmericaJordon Ross, Indium Corporation of America

In this issue: Presidents Message 2

2009 10th Annual SMTA/CCA “California Dreamin” Golf ‘Get

Together’ Sponsors 3 - 4

Chapter Announcements & Events 5

Technical Article - NanoBond Assembly, A Rapid Room Temperature

Soldering Process 6 - 9

SMTA Member Profile 10

SMTA Student Chapter Flyer 12

SMTA MentorNet Information 13

SMTA Membership Benefits 14

ADS, Donation Letter, Corporate Membership Listing, & New Member

Welcome! 15 - 17

LA/OC SMTA & IPC CCA 11th Annual Golf Get Together 11 See Page 5 For Details...

Presentaion AbstractPresentaion Abstract

Indium Corporation of America has begun the commercialization of the Nano-Bond technology that was acquired from RNT in 2009. The product technology and application will be reviewed in detail . The Nano-bond joining process is based on the use of reactive multilayer foils as local heat sources. The foils are a new class of nano-engineered materials, in which selfpropagating exothermic reactions can be ignited at room tem-perature through an ignition process. By inserting a multilayer foil be-tween two solder layers and two components, heat generated by the reac-tion in the foil melts the solder and consequently bonds the components. The joining process can be completed at room temperature in air, argon or vacuum in approximately one second. The resulting metallic joints exhibit thermal conductivities two orders of magnitude higher, and thermal resis-tivities an order of magnitude lower, than current commercial TIMs. The use of reactive foils as a local heat source eliminates the need for torches, furnaces, or lasers, speeds the soldering processes, and dramatically re-duces the total heat that is needed. Thus, temperature-sensitive or small components can be joined without thermal damage or excessive heating. In addition, mismatches in thermal contraction on cooling can be avoided because components see very small increases in temperature. This is par-ticularly beneficial for joining metals to ceramics. The fabrication and characterization of the reactive foils is described, and the value proposi-tion for NanoBonding is presented. The presentation will also cover the applicability of this platform technology to many areas of packaging in-cluding Thermal Interface Materials, microelectronics, optoelectronics, and Light Emitting Diodes (LEDs).

Speaker Speaker ProfileProfile

Jordan manages the global initiatives for Indium’s thermal management prod-ucts, including engineering development for the Nano-Bond and Heat-Spring® thermal interface materi-als. He is responsible for new product launches, and developing and executing regional and application strategies. Jordan has pre-sented at numerous indus-try forums and confer-ences. In addition, he ac-tively participates in inter-active online communica-tions through his Thermal Blog, which can be found at www.indium.com/TIM. Jordan has a bachelor’s degree from the State Uni-versity of New York Insti-tute of Technology.

May 2010 LA/OC SMTA Chapter

Dinner Meeting Speaker

Brian O’Leary KIC

Topic Profiling for Dummies

DATE Thursday, May 20th, 2010



MEETING FEES $25, Members

$35, Nonmembers

MENU Visit http://www.laocsmta.org

LOCATION JT Schmid's Restaurant & Brewery

2610 E. Katella Avenue Anaheim, California 92806

714.634.9200

EVENT RESERVATIONS http://www.laocsmta.org/

reservation.php NO SHOWS WILL BE INVOICED

If you can not attend, please cancel your reservation by 12

Noon on Wednesday, prior to the meeting. See you there!

April 2010

Chapter Officers

President Kathy Palumbo CEO & Founder

Production Analysis & Learning Services, LLC

5 Homestead Drive Trabuco Canyon, CA

TEL: 949.713.7229 FAX: 949.713.7229

E-mail: [email protected]

Vice- President & Golf Tournament Chairman

Scott Penin, CSMTPE President & Co-Founder

Paradigm Manufacturing Partners 11562 Knott Avenue, Unit 17

Garden Grove, Ca. 92841 TEL: 714.889.7074 FAX: 714.889.7062


Secretary

Michelle Ogihara Sales Manager

Seika Machinery, Inc. 3528 Torrance Blvd., Suite 100

Torrance, CA TEL: 310.540.7310


Treasurer Ron Gonzales

V.P. Manufacturing REVCO Products, Inc.

7221 Acacia Avenue Garden Grove, CA 92841-3908

TEL: 714. 891.6688 Email:

[email protected]

Vice-President of Membership OPEN

Vice-President of

Technical Programs Doug Dixon

Electronics Marketing Director Henkel Corporation

15350 Barranca Parkway Irvine, California 92618

TEL: 949.789.2517 Email:

[email protected]

Hello Everyone,

Thanks to all who came out to our March meeting on Advanced Vapor Phase Soldering. It was well attended and Jochen Lipp with IBL Technologies did a great job. Thank you Jochen! If you missed this educational event we hope you can make it out to our April 15th meeting where Jordon Ross will present on Nano-Bond Assembly - A Rapid Room Temperature, Fluxless Soldering Process, which is based on using reactive foils and an external heat source for soldering. A big thanks to PMR Representatives & APS Wittco Sales for purchasing vendor tables for this event. If you are interested in purchasing a Vendor Table for the April 15th event please contact any of our board mem-bers for arrangements. For our May 20th Dinner meeting Brian O’Leary will be presenting on Profiling for Dummies. Another great educational opportunity for networking and having an ex-cellent meal. Additional meeting details are located on Page 5 of this newsletter as well as on our home web page. The LA/OC SMTA board would like to thank our presenters in advance for agreeing to provide an educational seminar and we are all looking forward to our great 2010 educational events. If you would like to be a presenter at one of our upcoming meetings then contact Doug Dixon our VP of Technical Programs. To re-serve your spot for the educational dinner events please go to http://www.laocsmta.org/reservation.php. Our 11th Annual Golf Tournament will be held on Monday, August 16th at Old Ranch Country Club in Seal Beach, California. Sign ups are now open for sponsors and players (you will not be invoiced until June/July) on our website at http://www.laocsmta.org/Golf/golf.php . This is a great event to come out and spend the day with friends and colleagues. A printable flyer is available on our website at http://www.laocsmta.org/Golf/2010_Golf_Flyer.pdf (& page 11). Please help our chapter get the word out by printing this flyer and posting it at your work place. This event funds our chapter for the year as well as several great charities. This year a portion of our pro-ceeds will be donated to THINK.org (see page 16), an educational organization that pro-vides after school programs for children in the Southern California area. So come on out and support your SMTA & IPC CCA chapter and local charities! The IPC APEX show is next week (4/6 to 4/8/10) at Mandalay Bay in Las Vegas, Nevada. I hope many of you will be able to take some time and come out to the show. This show brings Design, PCB Fab, and & Electronic Assembly all under one roof and it is a great opportunity to learn new solutions and check out the latest on software, equip-ment, and consumables.

Best Regards, Kathy Palumbo

LA/OC SMTA PRESIDENT MESSAGELA/OC SMTA PRESIDENT MESSAGE

“Anyone who has never made a mistake has never tried anything

new.“ -- Albert Einstein

Christopher Associates http://www.christopherweb.com/

2009 SMTA/CCA Golf Tournament Sponsors2009 SMTA/CCA Golf Tournament Sponsors

3

AMTECH, Inc. http://www.amtechsolder.com/

Burkle North America http://www.burkleusa.com

Express Manufacturing http://www.eminc.com

GC Aero, Inc. http://www.gcaero.com

ADS Gold http://www.adsgold.com/

Chemcut http://www.chemcut.net

Circuit Check http://www.circuitcheck.com/

DiversiTech Representatives, Inc. http://www.dtech-reps.com

eMT http://www.emtllc.com

Henkel Corp http://www.loctite.com

Heraeus, Inc http://www.heraeus-contactmaterials.com

Indium Corporation http://www.indium.com

Cooper Tools http://www.cooperhandtools.com/weller/index.cfm

4

Christopher Associates http://www.christopherweb.com/

2009 SMTA/CCA Golf Tournament Sponsors2009 SMTA/CCA Golf Tournament Sponsors

Jack Engle & Co. http://www.jackengleco.com

PA&LS, LLC http://www.palsrvs.com

SolderMask, Inc. http://www.soldermask.com

Seika Machinery http://www.seikausa.com

Scienscope International http://www.scienscope.com/

Tapco Circuit Supply http://www.tapcocircuitsupply.com

Technic http://www.technic.com

Univar USA http://www.univarusa.com

YESTech, Inc. http://www.yestechinc.com

Practical Tools http://www.practicaltool.com

Pentagon EMS http://www.pentagon-ems.com

P-Kay Metals http://www.pkaymetal.com

Revco Products, Inc. http://www.revcoproducts.com

Technical Devices Company http://www.technicaldev.com

Thursday, May 20th, 2010 Thursday, May 20th, 2010 LA/OC SMTA is Proud to Present An Educational Opportunity…LA/OC SMTA is Proud to Present An Educational Opportunity…

Profiling for Dummies

PRESENTED BY Brian O'Leary

Americas Sales Manager KIC

http://www.kicthermal.com

PRESENTATION ABSTRACT KIC and the Rochester Institute of Technology recently completed a comprehensive study with the end goal of discovering reli-able non-destructive methods for profiling sensitive critical components such as BGAs. This study demonstrates the merits of

various thermocouple attachment methods and how common tried and true practices are drawn into question since they are seen to have a negative impact on modern profiling reliability. Based on these new findings, KIC will discuss strategies for profiling complex PCBs that do not require drilling holes and destroying components in the process. Creating “off-set” as well as how to

“balance your board” will be discussed.

SPEAKER PROFILE Brian O'Leary is the Americas Sales Manager for KIC. Brian brings with him over a decade of industrial sales, marketing and

management experience in North & South America, Mexico and Asia. Brian spends much of his time today focused on emerging markets such as Brazil and Mexico working with overseas OEMs and CMs. Prior to joining KIC, Brian worked for Sono-Tek, a

manufacturer of spray fluxing equipment where he spent much of his time in China and India out on factory floors. Brian re-ceived his MBA from the Thunderbird School of Global Management, speaks numerous languages and has lived several years in Asia and Europe. Last year Brian co-authored a successful book titled, "Profiling Guide for Profitability," with over a thousand copies in circulation. He has an award winning blog dedicated to the topic of thermal profiling, profilingguru.com Brian is an

avid runner, having completed last year his first 50 mile trail run.



COST $25, Members

$35, Nonmembers $100, Vendor Table

(When Applicable. Check with Chapter President) Vendor Table Includes The Following:

1. Table At the Meeting To Display Services And/Or Literature 2. Promotion of Services During Cocktail Hour

3. Brief Announcement/Introduction Before Seminar Begins 4. Promotion of Services After The Presentation

5. FREE 1/4 Page Ad In One Month's SMTA LA/OC Chapter Newsletter

Menu http://www.laocsmta.org/images/SMTA_Dinner_Menu.pdf

Location

JT Schmid's Restaurant & Brewery 2610 E. Katella Avenue

Anaheim, California 92806 714.634.9200

http://www.jtschmids.com/

Map http://www.laocsmta.org 5

LA/OC SMTA TECHNICAL ARTICLELA/OC SMTA TECHNICAL ARTICLE

6

NanoBond Assembly - A Rapid, Room Temperature Soldering Process Presented by:

Greg Caswell, VP Engineering, Reactive NanoTechnologies, www.rntfoil.com, [email protected]

Background

There are numerous instances where it is necessary to provide a thermal path from one element of a product to another, e.g. cir-cuit board to heatsink, power amplifier to heatsink, High Bright-ness LED to printed wiring board, etc. Most of these applica-tions have utilized some form of thermal adhesive or reflow soldering technique to provide the bond. Often it has been found that the thermal stresses inherent in the product require a better methodology for the heat transfer. There are also situations where the materials to be joined together have Coefficient of Thermal Expansion (CTE) mismatches which then result in a stress being applied to the solder joint itself. The use of Nano-foil® and the process of Nanobonding® provide such a solution. This paper will delineate several applications where this process provided significant improvement in both the thermal and elec-trical performance of the product.

Nanofoil® Fabrication and Characterization

Nanostructured, Ni/Al reactive multilayer foils were fabricated using a large-area, magnetron sputter system. The foils were deposited onto substrates and then were peeled from their sub-strates for use as freestanding samples. The reactive foils incor-porate thousands of alternating layers of Ni and Al that are ap-proximately 25nm thick. Total foil thicknesses can range from 40 to 200µm and are varied by simply changing the total num-ber of Ni and Al layers.

To create a bond, the NanoFoil is placed between the two com-ponents being joined, along with a solder layer or Sn plated foil. An energy impulse such as a battery, power supply, laser, or soldering iron is then applied to the foil. This initiates a self-propagating reaction in the NanoFoil material. The like-like bonds of the atoms of each layer in the foil are exchanged for more stable unlike bonds between atoms from neighboring lay-ers. As the atoms of each layer mix, additional heat is generated, creating a self-sustaining reaction traveling the length of the foil. Temperatures at the joining surface are raised above the tem-perature necessary to melt the solder or braze, and thus create a bond. With most of the heat focused only on the joining surface, the temperature of the components does not rise, and their mi-crostructure is not compromised. Joining dissimilar materials with different coefficients of thermal expansion, such as metals and ceramics, does not present a problem because heat is applied only to the surface.

When choosing a solder for the reactive bonding process, sev-eral criteria were considered including a desire to: (1) minimize solder cost; (2) maximize the thermal conductivity of the solder, (3) ensure compatibility with reactive foil and component sur-faces, and (4) maintain a moderate solder melting temperature so as to minimize thermal exposure of the components. This process has been found to work equally well with SnAg, SAC305, SAC405, SnPb or matte tin interfaces.

Figure 2 is a model of the actual reaction of the NanoFoil once ignited and shows the limited depth of penetration of the temperature increase with regard to the heat sink side as well as the die side of this structure.

Applications

One of the byproducts of increasing power density in high power electronic components is higher heat dissipation and the consequent need to more effectively cool the component to ensure long term reliability. Minimizing the thermal resistance at the device/heat sink interface is critical for the development of new generations of high power electronic components. Similarly, reducing the junction temperature of LEDs is known to increase their lifetime significantly.

High Brightness LEDs

Bonds were fabricated between OSRAM Dragon-series LED packages and Sn-plated MCPCBs. The strength and thermal performance of the reactive multilayer bond was optimized by varying the reactive multilayer foil thickness and bond process parameters such as bonding pres-sure. The resulting optimized bonds exhibit average measured thermal conductivities of 30W/Km and shear strengths of 35 MPa (5130 PSI) with less than 5% void content. There is no significant degradation observed in the thermal performance and structural performance after a series of reliability tests. The reliability test results are detailed in Table 2.

The comparison tests between reactive multilayer bonds and epoxy thermal interfaces were conducted on both 1.6W Golden Dragon and 4.6W Platinum Dragon LED’s attached to MCPCB’s. The resulting reactive multilayer bonds have an average thermal resistance from the heat slug on the LED to ambient Rca of 4.3oC/W and a slug temperature Tc(1A SS) of 44oC at a steady state current of 1A, whereas the ther-mal epoxy bonds exhibit a thermal resistance of 5.2oC/W with a Tc(1A SS) of 47oC on Golden Dragon LEDs. Platinum Dragon LEDs ex-hibit an average Rca(2.5A SS) values of 3.6oC/W for reactive multilayer bonds at 2.5A and 8.9oC/W for thermal epoxy. For all tests ambient was maintained at 25oC. Clearly the reactive multilayer bonds dramatically outperform thermal epoxy, especially at high operating currents. With further optimization it is believed that the gap between the reactive bonds and thermal epoxy will be even larger. It is well documented that this improvement in thermal resistance can more than double the anticipated lifetime of an LED device.

Heatsink to Printed Wiring Board

The Nanobonding process is extremely amenable to the attachment of circuit boards to heatsinks. Figure 3 shows two RF circuit boards and corresponding heatsinks. The circuit boards have an Electroless-Nickel Immersion-Gold (ENIG) finish as do the heatsinks (one copper and one aluminum). 60u thick tin plated foil was used to successfully bond these surfaces.

For comparison purposes, two of the heatsink assemblies were tin plated. The tin plated NanoFoil preform was placed between the PCB or power amplifier and heat sink. A joining pressure of 100 psi was applied on the top of PCB or power amplifier. The NanoFoil was then ig-nited electrically; the reacting foil melted the solder and joined the components. RNT has also successfully bonded silver backed PWBs to silver heatsinks, tin plated interfaces and hot-air solder leveled (HASL) interfaces.

Table 2. Reactive multilayer bonded LED Reliability Test Result Summary Scanning Acoustic Microscopy (SAM): Scanning acoustic microscopy images (C-scans) were used to determine the quality of the Nano-Bonded samples. Acoustic microscopy is an imaging technique that utilizes changes in material properties across interface boundaries to de-tect the presence of internal flaws and anomalies. Differences in acoustic impedance at a material interface result in a change in the response to an incident ultrasound wave. A portion of the ultrasound wave is reflected back to the transducer from the material boundary, while the remainder propagates through the boundary. The larger the change in impedance, the larger the fraction of the signal reflected. The technique is particularly useful for revealing voids or a lack of wetting in a bond; both appear as regions with white contrast in the acoustic image.

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8

A typical SAM image of the bonded samples is shown in Figure 4. The black areas are either openings or holes in the printed wiring board for power amplifier attach at a subsequent time or are tooling holes. The gray contrast areas in the image indicate good bond quality at the interface between the circuit board and the heatsink.

The processed assemblies were then subjected to 500 cycles of -40 to +125C tem-perature cycling, (2 chamber system), following the JESD22-A104C standard. Each cycle consisted of a 15-minute dwell at each extreme temperature, and less than one minute transfer time from one extreme temperature to the other.

The samples were C-scanned after cycling; there was no evidence of an increase in voids or delamination of the bonds. Figure 5 is a cross section of the subject bond after temperature cycling. The stackup from top to bottom is circuit board layer, cop-per layer, tin plating, solder, Nanofoil, solder, tinned heatsink, copper heatsink.

Power Amplifier to Heatsink

Power Amplifiers (PA) are being utilized in several applications where the compo-nent must be attached to the heatsink through an opening in the circuit board. One of the byproducts of this trend is higher heat dissipation and the consequent need to more effectively cool the PA to ensure long term reliability. Typically, the largest contributor of thermal resistance along the heat conduction path from the die to am-bient arises from the thermal interface between the PA and the adjacent heat sink. Minimizing the thermal resistance at this interface is critical for the development higher power amplifier installations. Figure 6 shows 3 power amplifier devices bonded to a copper heatsink and Figure 7 illustrates the C-Scan results obtained. Tin plated foil was used for this interface as the base of the power amplifier device had a thick gold layer. Utilizing tin plated foil enhanced the solder bond and the subse-quent temperature cycling tests of 500 cycles from -40 to+125C were easily accom-plished.

Figure 8 is a cross section of the bond of the power amplifier and illustrates the stability of the bond structure after completion of 500 temperature cycles from -40 to+125C.

The stackup in the figure (from top to bottom) is the power amplifier base, the gold finish on the part, solder, NanoFoil, solder, tin plating and copper heatsink.

RF Filter Components

Nanofoil and the Nanobonding process has also been used to successfully bond RF filter compo-nents to silver plated chassis.

The bonding configuration used is shown in Figure 9. A piece of tin plated NanoFoil® was placed on the top of silver plated aluminum cavity, followed by silver plated ceramic parts. A bonding pressure (600 psi) was applied on the top of ceramic parts with a load cell, and the NanoFoil was ignited elec-trically. The foil melted the tin solder layers and joined the components.

Reliability and Stability

One parameter that is used to determine the stability of a solder bond is the thermal resistance of the completed joint structures. Consistency of this resis-tance is paramount in determining the long term viability of an assembly from a thermal interface perspective. RNT has performed multiple tests of this parameter to assure stability over 50 lots of material which is illustrated in Figure 10.

Many Thanks To:

Indium Co. Of America

& West-Tech Materials, Inc.

For providing this Technical Article

& permission to reprint.

Your continued Support of the LA/OC SMTA Chapter is very much appreciated!

If you have a Techni-cal Article you would like to run in the LA/OC SMTA Newsletter then please contact

any of our board members.

You can support our LA/OC SMTA chapter too! Find out how by contacting any of our

board members.

Conclusions

It has been demonstrated that a viable solder attachment technology where the resultant bond is formed in less than a millisecond is adaptable to numerous applications. It has also been shown that the resultant solder joints possess a high degree of reliability and stabil-ity when implemented in these applications. The nature of the bond permits materials that have dissimilar CTE’s to be effectively bonded without incurring any stress to the resultant solder joint due to the bond being formed at room temperature.

9

10

Doug WintherDoug Winther

LA/OC SMTA Member ProfileLA/OC SMTA Member Profile

PresidentPresident Technical Devices CompanyTechnical Devices Company

In 1963, Douglas Winther was a fresh faced kid right out of school. He found a job as a trainee at Technical Devices Company. What Doug thought at the time would just be job to pay the bills, quickly turned out to be his true passion. In the 1960’s, Doug learned all about wave solder-ing while helping to develop and build the Mark I series of table top wave soldering machines. These were sturdy, built to last wave soldering machines. In fact, just a few months ago Doug got a call from an old customer, Bob Gage, who was retiring and asked if he would be inter-ested in taking our Mark I back. Bob and his wife towed the Mark I from Oregon to Torrance, CA behind their RV. The ma-chine was in excellent condition for being 40 years old and could still be used today. That’s a testament to the quality of work pro-duced by Technical Devices Company. The fact that Bob remembers Doug and has given him an open invitation to come and stay with him in Oregon, is a testament to the kind of impression Doug makes on his customers. After the Mark I, Technical Devices built the first fully automated wave soldering machine called the Mark IV. The Mark IV featured a roll out solder pot, pre-computer control logic, automated wave height and width control plus many other major advances in soldering tech-nology that are now considered standard for wave soldering machines. With the success of the Mark IV in the 1970’s, the 1980’s saw a tremendous growth of new products at Tech-nical Devices Company. By this time Doug was the Vice-President and General Manager. He personally helmed the development of the Nu/Era MP Computerized wave solder-ing machines (including the introduction of dual waves for soldering), the Nu/Clean Inline Cleaners, the Nu/Clean batch cleaners, and a vapor degreaser. By 1990, Doug was the president and owner of Technical Devices. As a hands-on leader, he was involved in upgrading the Nu/Clean Inline cleaners to include such innovations as topside belts, touch screen controls, hybrid

energy options, and adjustable air knives. He also revisited the Mark I by applying many of the same ideas of a smaller wave soldering machine into the Nu/Era Jr. Also thinking smaller, the Nu/Clean Galaxy was produced as a small inline cleaner with many of the same features found in the larger models, just in a smaller footprint. He also made sure the software used on the Nu/Era MP wave soldering machines and the Nu/Clean Touch Screens were Windows based and up to date. This last decade has been a challenge for all Ameri-can companies. Technical Devices has survived and even grown during this time by following the guidelines Doug has for his company – listen to our customers, provide quality equipment, stay ahead of the technology curve, and always look for a way to do better. With that philosophy in mind, Doug recently reintroduced Nu/Clean Batch Cleaners back into the current product line. The very latest product, the Nu/Clean D.I. Elite, is a direct result of Doug listening to our customers and finding that many of them have the need of a D.I. Water system for their batch cleaning pro-duction. Many of the employees at Technical Devices Com-pany have been with the company for over 20 years. Doug creates the kind of family environment where people want to stay and work. Many customers remember Doug for his honest hard working approach to helping them meet their production needs. Doug has traveled the world as an expert on cleaning and soldering including a memorable tour through Asia and the South Pacific that included some of the best Scuba diving he has ever seen. He has presented technical papers and participated in expert panels at many trade shows and con-ventions, including Nepcon, Productronica, and APEX just to name a few. Outside of the office, Doug enjoys playing racquet-ball. He claims it keeps him in shape to keep up with his 5 year old son, Arthur. He is the son of a preacher man and tries to live by the Biblical standards he was raised with including giving his time and his money to several charita-ble organizations. In fact the awards he receives from these groups are proudly displayed in our front office right next to the business awards. On occasion Doug likes to visit a Harley Davidson dealership, sit on a new Fat Boy bike and dream --- he dreams the economy would come back like it was during the Reagan years and he dreams that his wife would give him permission to ride a motorcycle so he could drive one of those Fat Boy bikes right off the lot.

Come out to one of our Fun & Educational Meetings Come out to one of our Fun & Educational Meetings and Meet Doug!and Meet Doug!

SMTA Corporate Members - CALL FOR MENTORS!

Please share this information with your colleagues!

The SMTA & MentorNet One-on-One E-Mentoring Program is a chance to make a big difference in the life of a student in as little as 15 minutes a week.

SMTA seeks members to be mentors who are: Science and engineering professionals

In our related industries Active, on leave, or retired

To match with protégés who are: Pursuing a professional future in the fields of engineering and science

At the undergraduate, graduate, postdoctoral, or early career faculty (untenured) levels

Although mentors volunteer their time to benefit the protégé, they can also find a rewarding experience for themselves. “I hope [my student] is getting as much out of it as I am,” is how one MentorNet mentor de-

scribes the experience. More than 70% of mentors have recommended MentorNet's e-mentoring program to a friend or colleague!

Mentoring relationships last 8 months. Because mentors and students communicate entirely by email, they can choose a schedule that is convenient for both. In fact, 90% of our mentors feel that

How can you volunteer to be a mentor? It’s e-a-s-y! 1) Join the MentorNet Community at http://www.mentornet.net/join

2) Follow the One-on-One Mentoring Programs links to create a mentor profile. Be sure to indicate SMTA membership in your profile!

Since 1997, MentorNet has matched more than 22,500 pairs of protégés and mentors with exceptional re-

sults. We hope you will join them!

MentorNet’s sponsors include 3M Foundation, Adobe, Alcoa Foundation, Agilent Technologies, AT&T, Cisco Systems, Hewlett-Packard Company, IBM Corporation, Intel Foundation, Lockheed Martin Space Systems,

Los Alamos National Laboratory, Naval Research Laboratory, NVIDIA, Sandia National Laboratories, Texas Instruments, The MathWorks, and Thomson Reuters.

For more information, please go to http://www.smta.org/education/mentornet/mentornet.cfm or contact Karen, SMTA MentorNet Coordinator, at 952-920-7682 or [email protected].

13

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Express Manufacturing General Monitors, Inc. Henkel Technologies

I Source Technical Services, Inc. Jet Propulsion Laboratory

Microtek Laboratories Multi-Fineline Electronix

P. Kay Metal, Inc. PDQ Precision Inc.

Practical Components Inc. Production Analysis & Learning Services LLC

QSC Audio Products, Inc. Qual-Pro Corporation

Revco Products Scienscope International

Seika Machinery, Inc. SolderMask Inc.

Sony Manufacturing Systems America, Inc. STEC, Inc.

Technical Devices Company Teledyne Microelectronic Technologies

Valor Computerized Systems Yestech, Inc. Zephyrtronics

Global Members of our Chapter

Henkel Corporation

Global Participating Members of our Chapter Henkel Corporation

HISCO Inc.

Jessie Lester Beckman Coulter

Andy Reinelt

Viking Modular Solutions

Sazzad Hossain Viking Modular Solutions

Mark Patterson

Inphi Corporation

Dave Isenberg Parker Hannifin

The LA/OC SMTA board The LA/OC SMTA board The LA/OC SMTA board would like to Welcome would like to Welcome would like to Welcome

the following 2009 / 2010the following 2009 / 2010the following 2009 / 2010

New Members:New Members:New Members:

Thank you so Much for Joining our Chapter. We hope we get a

chance to meet you in person at one of our up coming events, and if we already have then thank you for

taking the time out of your busy schedule to attend! Membership makes our chapter strong and the

board is grateful for each and every member.

See page 14 for our membership flyer or visit our website at:

http://www.laocsmta.org/ and click on Become a Member Today

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LA/OC SM LA/OC SMTA NEWS LETTERTA NEWS LETTER3 - 4 Chapter Announcements & Events 5 Technical...

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