Faculty of Microsystem Electronics

and Photonics

Laboratory for Interconnecting

and Packaging

Electronic Circuits

Wrocław, Poland

http://www.lipec.info

We are here – Wrocław – The Heart of Europe

Metropolis Wrocław

•„Polish Venice” - 117 bridges,

- 12 islands,

- 25 rivers and channels

•650 000 citizens,

•11 Universities and Academies

•293 km2 partly covered in June 1997 with water

Wrocław University of Technology

THE STORY:

• founded in 1945 by Polish academic teachers, mostly from Lviv, arrived in Wrocław, in ruins in the wake of the last siege of World War II

• housed in the buildings of the former Technische Hochschule Breslau (1910)

• first lecture - 15th of Nov. 1945 - the day of university's anniversary celebrated up to now

UNIVERSITY CAMPUS AND NUMBERS:

•over 4 000 employees, including about 2 000 research and teaching staff

•managed by Rector and five vice-rectors of research, education, student affairs, development and general affairs. They are elected by the staff for four-year terms and may be re-elected only once

• The highest governing body within the university is the senate, which consists of 70 persons (rector, five vice-rectors, 12 deans, 12 students and 40 eligible staff representatives)

Wrocław University of Technology

We are here

•one of the largest academic schools in Poland

•32 929 students

•12 Faculties and the Department of Fundamental Studies in Wrocław a

•4 regional branches in Bielawa, Jelenia Góra, Legnica and Wałbrzych

•over 250 buildings with modern laboratories, libraries, Internet access, multimedia-fitted lecture rooms

•over 400 international agreements

THE UNIVERSITY FACULTIES: 1. Architecture

2. Engineering

3. Chemistry

4. Electronics

5. Electrical Engineering

6. Mining Engineering

7. Environmental Engineering 8. Computer Science and Management 9. Mechanical and Power Engineering 10. Mechanical Engineering 11. Basic Problems of Technology 12. Microsystem Electronics and Photonics

THE RESEARCH:

• Mathematics: theory of probability, mathematical statistics, functional analysis, differential equations

• Chemistry: physical chemistry of solids, organic and inorganic synthesis, quantum chemistry

• Physics: solid-state physics (semiconductors, ferroelectric, thin films, surface physics) and optics

• Biology: biochemistry and microbiology, biodegradation and biotechnological processes

• Electronics: control systems, robotics, microelectronics, optoelectronics, microsystems, photonics;

• Computer science: information processing, computer networks, expert systems and artificial intelligence

• Electrical engineering: high voltage engineering, distribution and utilization of electrical energy

• Materials and raw materials: extraction, utilization of inorganic wastes and synthesis of new materials

• Bioengineering: bioreactor, biotechnology and bioengineering processes, biomechanical engineering

• Environmental control and ecological threats discrimination: protection technologies, waste utilization

• Mechanical engineering: solids and fluid mechanics, materials engineering, biomechanical engineering

• Thermal and power engineering: thermodynamics and fluid dynamics, heat transfer, energy recovery

Wrocław University of Technology

Faculty of Microsystem Electronics and Photonics - WEMIF

Faculty employs 58 academic teachers,

including 11 full professors, 8 associated professors

and currently 59 PhD students.

Faculty Majors:

Microelectronics

and Microsystems

development of microsensors and microsystems for environmental and chemical applications

silicon micromechatronics and microsystems

thick and thin film circuits

process technology and characterisation of device structures for microwave

digital ASIC design

hybrid microelectronics

interconnecting and packaging electronic circuits (assemblies, materials, prototyping methods)

Photonics

photovoltaics and solar cells (PV modules assembling/encapsulation, design and monitoring of PV systems)

optoelectronics, including integrated optics and fiber waveguides, design, fabrication and measurements of photonics devices and systems

process technology and characterisation of device structures for optoelectronics

DIAGNOSTICS TECHNOLOGY

LIPEC

• LIPEC laboratory was established in 1994

• Since November of 1999 it is headed by Prof. Jan Felba

• Staff of the laboratory consists currently of fourteen

researchers and technicians. Seven of them are PhD

students

• The main activity is education and research

in the area of microelectronic packaging

www.lipec.info

Laboratory for Interconnecting and Packaging Electronic Circuits - LIPEC

Jan Felba – head of Group

• Interconnecting and packaging microelectronic circuits

• Investigation of new materials for green polymer as well as micro and nano-scale electronics

• Numerical prototyping, optimization and multi-physics simulations of the microelectronic devices, packages and MEMS

• Microelectronic devices and packages reliability evaluation and assessment

• Thermo-mechanical material properties characterization in reference to micro-scale and molecular-scale

THE CENTER OF ECOLOGICAL AND RELIABLE ELECTRONIC PACKAGING

THE MAIN ACTIVITY:

Laboratory for Interconnecting and Packaging Electronic Circuits - LIPEC

LIPEC - The Main Activity

Von Misses Stress [Pa]

Area Description

Microsystems

- coupled field simulations,

- optimization,

- robust and tolerance design.

Micro-

electronic

packaging

- thermo-mechanical simulations, - failure analysis, - reliability assessment (fatigue)

<110>

<110>

<100>

(100)

(111)

• Numerical modelling and qualification using FEM method (ANSYS and ABAQUS)

• Design of Experiments DoE

• Response Surface Analysis RSM

• Numerical method of nanointentation

! Self-designed software package VPT

(Virtual Prototyping Tool)

NUMERICAL PROTOTYPING OF

MICROELECTRONIC COMPONENTS

AND MICRO-SYSTEM PACKAGES

Electrically Conductive Adhesives

Thermally Conductive Adhesives

MATERIALS and TECHNOLOGY FOR

MICROELECTRONIC PACKAGING

„Tin-lead alloy in electronics packaging has to be replaced by new materials. Lead-free alloys and polymer-based materials seem to be the most probable candidates”

Lead-free soldering

alloys 0

200

400

600

800

1000

1200

1400

1600

1800

2000

0 20 40 60 80 100

Time [s]

Res

ista

nc

e [O

hm

]

Snap – curing electrically conductive adhesives

1.Should not be much more expensive

as normal soldering method is.

2.New technology should use this same

production equipment as actual.

3.New technology shouldn't require

more space as the old one.

4.New technology ought to be as quick,

as normal is.

5.New technology ought to be more simply

like actual process is.

Technical assumptions for solder

replacement technology:

LIPEC - The Main Activity

LEAD-FREE SOLDER JOINTS QUALITY

solderability test system

LIPEC - The Main Activity

• Solderability testing

• Mechanical strength testing

• Detecting changes of electrical resistance

• Detecting internal defects of joints

• Identification of intermetallic compounds

Silver Jumper

Adhesive

Joint

Strip

l

g

d

d

LIPEC - The Main Activity

ELECTRICALLY CONDUCTIVE ADHESIVES

FOR MICROWAVE APPLICATIONS

An adhesive electrical bonding requirements for

microwave applications are much more

demanding than those for low frequency

analogue or digital electronics. The main

reason of differences is the skin effect. Since

due to this effect only thin layer of adhesive

plays important role in current conduction.

3.5.. 14GHz

Partner

LIPEC - The Main Activity

• Heat transfer calculation

• Thermal conductivity Molecular Dynamics Simulations

• Croslinking phenomena modeling

• Calculation of contact pressure relaxation

• Modeling of thermal constriction resistance

• Calculation and measurement of composite density changes

2R 2R

2r

Thermal

metallic contact

POLYMER MATRIX BEHAVIOR AND HEAT

TRANSFER MODELING IN MOLECULAR-

AND BULK-SCALE DOMAIN

THERMALLY CONDUCTIVE COMPOSITES WITH

NANO- AND MICRO-FILLERS

LIPEC - The Main Activity

• Composites with micro sized silver

• Composites with nano sized fillers (silver, CNT)

THERMALLY CONDUCTIVE COMPOSITES WITH

NANO- AND MICRO-FILLERS

T1

T2

T3

T4

T5

T615 mm

15 mm

15 mm

15 mm

5 mm

5 mmSpacimen

35 mm

Heater

Heat sinkContact member λ=80.4 W/mK

Partners

THERMAL CONDUCTIVITY MEASUREMENT

LIPEC - The Main Activity

• Sensitivity analysis and tolerance design

• Single and multi-criteria optimization

NUMERICAL PREDICTION OF SOLDER

AND ADHESIVE JOINTS RELIABILITY

LIPEC - The Main Activity

SYSTEM FOR SOLDER AND ADHESIVE

JOINTS RELIABILITY TESTING

+

6 days of testing =

18 years of usage

• Vibrations and temperature cycles (humidity)

• Detecting of joint resistance changes

• Detection of temporary solder joints opens

• Max. 128 tested channels

LIPEC - The Main Activity

NANOCOMPOSITES AND ELECTRICALLY CONDUCTIVE

MICROSTRUCTURES FOR PRINTED ELECTRONICS

• Very high packaging possibility

• Nature of nano Inks - formula is with the best homogeneous properties (uniform concentration),

• The highest repeatability of dosing ink volumes

• Very high repeatability of printed shapes

Printed

structure!

Bulk silver

Partner

thickness ~ 500 nm

QUALITY INSPECTION OF MATERIALS, PACKAGES AND

SYSTEMS IN MICROELECTRONICS

LIPEC - The Main Activity

• Phoenix nanome|x system

• Power: 180 kV /15 W,

• 200 nanometer detail detectability

• 2D X-ray inspection

• full 3D computed tomography

X-RAY INSPECTION AND COMPUTER TOMOGRAPHY

• System for drilling, milling and engraving of PCB

• Stencil printer

• Semi-automatic pick-and place system

• Infrared BGA rework station

• Forced convection reflow oven

• Semi-automatic thermo-ultrasonic wire bonder

• Sonic wire bonder

• Epoxy die mounter and pull tester system

• System for rework, repair and assembly of PCB's

• Ink-jet printer

LIPEC - Basic Laboratory Equipment

MANUFACTURING

• Solderability test system

• Ionic contamination measurement system

• X-ray fluorescence spectroscopy

• Optical microscope

• Climatic chamber

• Tensile machine

• Automatic adhesion tester

• Vibration exciter

• Infrared camera

• Thermal conductivity measurement system

• Nanofocus X-ray inspection system and computed tomography

• System for solder and adhesive joints reliability testing

• CTE and Tg measurement system

LIPEC - Basic Laboratory Equipment

TESTING and INSPECTION

Application of adhesives in modern electronic packages and assemblies.

Novel nano composite polymers and joining technologies for reliable and

efficient assembly of electronic components

Innovative thermo-mechanical prediction and optimisation methods for

virtual prototyping of miniaturised packages and assemblies

Green Electronics and Material Recycling Centre of Excellence

Downscaled Assembly of Vertically Interconnected Devices

CANOPY - CArbon NanOtubes/ePoxY composites

Nanoelectronics for save, fuel efficient and environment friendly

automotive solutions

Development, characterization and reliability of high performance nano

thermal interface materials for large power dissipation applications

PARSIMO - Partitioning and Modelling of System in Package

LIPEC - Selected Research International Projects

mevipro

marec

LIPEC - Bilateral Cooperation

• Long term reliability of solder and adhesive joints

• Combined thermo-mechanical loading including vibration – event detector

The CALCE Electronic Products and System

Center - University of Maryland (USA)

• Optimization of the stacked packaging 3D (SIP and SOP)

• Extraction of material properties by nanoidentation technique, e.g. thin layers

The FRAUNHOFER Research Institution for

Electronic Nano Systems ENAS Chemnitz

(Germany)

LIPEC - Partners

LIPEC - Knowledge dissemination

CONFERENCES ORGANIZATION EDITORIAL WORK

Microelectronics Reliability

(Guest Editor)

Materials Science-Poland

(Editor-in-Chief)

MEMBERSHIP IN INTERNATIONAL

ADVISORY BOARDS

ORGANIZATION

MEMBERSHIP IN

INTERNATIONAL COMMITTEES

−IEEE EuroSimE

−Polymers and Adhesives in Microelectronic

and Photonics, IEEE Polytronic

−Electron Beam Technologies, EBT

−International Microelectronics and Packaging

IMAPS – CPMT IEEE Poland

−Electronics Systemintegration Technology,

ESTC

−Microreliability and Nanoreliability in Key

Technology Applications, MicroNanoReliability

−International Spring Seminar on Electronics

Technology, ISSE

−Conference on Nanotechnology, IEEE Nano

LIPEC - Knowledge dissemination

BOOKS (in English)

Chapter 6 WYMYSŁOWSKI A., et al. Virtual Thermo-Mechanical Prototyping of

Microelectronics and Microsystems

Chapter 12 FELBA J., Schaefer H. Materials and Technology for

Conductive Microstructures

Chapter 10 FELBA J. Thermally Conductive

Nanocomposites

Chapter 2 FELBA J. Thermally Conductive

Adhesives in Electronics

FAŁAT T., FELBA J., MATKOWSKI P. Packaging of Electronics,

Photonics and Microsystems

Chapter 7 PLATEK B., FALAT T., FELBA J., Influence of Structural Parameters of Carbon Nanotubes on their Thermal Conductivity: Numerical Assessment

Chapter 13 TESARSKI S.J. WYMYSLOWSKI A., Glass Transition Analysis of Cross-Linked Polymers: Numerical and Mesoscale Approach