Lab4MEMS “LAB FAB for smart sensors and actuators MEMS”

ENIAC KET Pilot Line 2012

Alberto Corigliano

Politecnico di Milano

Lab4MEMS: an ENIAC KET Pilot Line 2

Project Coordinator:

Roberto Zafalon, STMicroelectronics s.r.l. Italy

Duration: 30 months

Start: January 2013

End: June 2015

Budget: 28 M Euro (about 38 M $)

21 partners belonging to 10 Countries

Lab4MEMS: Consortium

• Italy, France, Malta, The Netherlands, Finland, Belgium, Romania, Poland,

Norway, Austria.

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Lead 1 STMicroelectronics srl (Coordinator) ST-I Italy Ind

2 ST-POLITO s.c.a.r.l. STP Italy Ind-Res

3 Politecnico di Torino PoliTO Italy Uni

4 Istituto Italiano di Tecnologia IIT Italy Res

5 Politecnico di Milano PoliMI Italy Uni

6 Consorzio Nazionale Interuniversitario per la

Nanoelettronica IUNET Italy Uni

7 Commissariat Energie Atomique Et Aux Energies

Alternatives CEA France Res

8 SERMA Technologies SA SERMA France Ind

9 STMicroelectronics Ltd. ST-M Malta Ind

10 University of Malta UoM Malta Uni

11 SolMateS BV SOL The Netherlands Ind

12 Cavendish KINETICS BV CK The Netherlands Ind

13 Okmetic OYJ OKM Finland Ind

14 VTT Technical Research Centre of Finland VTT Finland Res

15 PICOSUN OY Picosun Finland Ind

16 KLA-Tencor KLA Belgium Ind

17 University POLITEHNICA of Bucharest, CSSNT UPB Romania Uni

18 Instytut Technologii Elektronowej, Warsaw ITE Poland Res

19 Stiftelsen SINTEF SINTEF Norway Res

20 Sonitor Technologies AS SON Norway Ind

21 Datacon Technology GmbH DCON Austria Ind

Lab4MEMS: STMicroelectronics & MEMS

• ST is ideally placed to lead the Lab4MEMS research into next-generation

devices.

Over 800 MEMS-related patents, more than 3 billion devices shipped, extensive

in-house production capabilities currently producing more than 4 million MEMS

devices per day.

• ST is working with universities, research institutions and technology

businesses across ten European countries.

The project benefits from ST’s MEMS facilities in France, Italy and Malta to

establish a complete set of manufacturing competencies for next-generation

devices, spanning design and fabrication to test and packaging.

• The project will develop advanced packaging technologies and vertical

interconnections using flip-chip, through-silicon vias and through-mold vias,

enabling 3D-integrated devices for applications such as body area sensors and

remote monitoring. A key target is to perfect a PZT deposition process

compatible with mass production, enabling innovative actuators and sensors

on System-On-Chip.

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Lab4MEMS’s vision: key-enabling technologies and new

application areas 5

-

Established

MEMS

technology

Application

areas

Sensing:

Mech.: Accelerometer,

gyro, pressure, flow, tactile

Therm.: flow, temperature

Actuation:

Fluid.: Ink-jet, micropumps

Acoustic: ultrasound trans.

Optics: tunable filters, lenses

RF: Switches

Piezoelectric

thin-films

(PZT)

+Sensing & Energy

harvesting:

Low noise, low power

sensors: microphones,

accelerometers

Vibration energy

harvesters

Anisotropic

magneto resistive

materials

(permalloy)

+

Sensing:

Magnetic field: electronic

compass

3D

heterogenous

packaging

+ System aspects:

Miniaturisation, compact

elements

New functionalities

Wireless sensor nodes

Lab4MEMS: Scope & Mission

• Lab4MEMS will feature the Pilot Line for innovative technologies on

advanced piezoelectric and magnetic materials, including advanced

Packaging, expected to fuel the next generation’s smart sensors and

actuators based on MEMS.

• Micro-actuators, micro-pumps, sensors and electrical power generators,

integrated on silicon-based piezoelectric materials (PZT)

• for use in Data Storage, Ink Jet, Health Care, Automotive and Energy Scavenging

• Magnetic field sensors integrated on silicon-based Anisotropic Magneto

Resistance (AMR) materials.

• for use in consumer applications such as GPS platforms and mobile phones

• Advanced packaging technologies and vertical interconnections (flip chip,

Through Silicon Vias or Through Mold Vias) for full 3D integration.

• For use in CONSUMER and HEALTHCARE applications such as body area sensors and remote monitoring

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Lab4MEMS: Relevance with ENIAC Grand Challenges Lab4MEMS KET Pilot Line

Relevance with MASP Grand Challenge and priority research areas

Technological

development

Expected Achievements/

Applications

7. S

emic

on

du

cto

r

Pro

cess

In

teg

rati

on

7.3.3 Opportunities in System in Package

Focus on Advanced packaging technologies and vertical

interconnections (flip chip, Through Silicon Vias or

Through Mold Vias) for full 3D integration. This is to

add value and flexibility to a wide range of new smart

sensors which will combine different sensing/actuation

features with an extensive analog and digital processing

on the single package.

Advanced substrates,

wafer and module level

integration. TSV and

innovative assembly

technology.

Highest automatization

and yield. Quality

inspection, failure

analysis,

characterization and

modeling. Innovative

and EU centric Front-

End vs. Back-End value

chain.

8. E

qu

ipm

ent,

ma

teri

als

an

d m

an

ufa

ctu

rin

g

8.3.2 More than Moore

The over-arching goal of Lab4MEMS in this Grand

Challenge is to enable European E&M companies to

keep the leadership on MEMS sensors.

Piezoelectric and

magnetic materials at

the nanoscale and

associated enabling

compounds, for a new

class of integrated

MEMS sensors.

3D heterogeneous

integration and

packaging.

Agile line production,

mainly driven by

Consumer and

Automotive markets.

8.3.3 Manufacturing

Focus on highly flexible, high quality and cost

competitive, manufacturing line of MEMS sensors and

smart heterogeneous integrated products.

Manufacturing proven

quality and process

robustness, handling of

new material under

high yield/low

defectivity constraints.

Fab process control

flow, equipment and

tools for PZT epi

deposition and AMR

sputtering, metrology,

quality assurance and

defect inspection,

device characterization

and modeling.

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Lab4MEMS: Innovation

• Despite the presence of research centers in EU at the forefront of adv. material

research, there is still little industrial investment ready to push through.

• It is of paramount importance to increase the scientific know-how on those key

materials, but also the fast transferring of knowledge to production, by setting the

advanced infrastructure and R&D manufacturing Pilot Line.

• Lab4MEMS will be promoted as an add-on to the current facilities in Agrate and

Malta, aiming to implement and optimize the industrial processes and to validate

the demonstrators suitable to penetrate the market.

• 3D package integration for MEMS products will allow to integrate the ASIC die &

the MEMS sensors in a stacked configuration, thus

enhancing performance and reliability

while reducing size and cost.

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Lab4MEMS: Expected Impact

• The MEMS PL will be based in Agrate (IT), on 200 mm wafer scale and,

once in operation, it will process more than 600 wafers/week.

• ST-I will fit a new set of R&D equipments for PZT and AMR, as part of a larger manufacturing facility already in place for high volume (i.e. >100M devices/month) 3-axis MEMS accelerometers and gyroscope. This strategy will allow increasing and maintaining the know-how on those very strategic enabling technologies, combining scientific skills with the ability to design and manufacture a wide range of smart systems on silicon.

• The Packaging PL will be based in Kirkop (Malta)

• ST-M will integrate a new set of R&D equipment for flip chip, vertical interconnections (Through Silicon Vias and/or Through Mold Vias) and Wafer Level Package, as part of a larger manufacturing facility already in place for high volume MEMS products.

• Kirkop has a vast experience of BE technologies and assembly of 3 million MEMS devices per day (Motion sensors, Microphones and Pressure Sensors).

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1. proof-of-concept : a suite of intermediate demonstration vehicles will

be delivered and assessed at midterm (i.e. D5.2 at M18), to prove the

actual feasibility of initial device solutions, wafer substrates, process

steps, tools or equipments.

2. Final Technology Demonstrators : from the "proof-of-concept", the

work-flow will then converge and optimize a set of four Tech

Demonstrators intended to become the main flagship vehicles to

demonstrate the KET Pilot Lines.

Technology Demonstrators:

a. Print-head for industrial printers, piezo actuated

b. Micro-electric scavenger, powered by mechanical/vibration energy

c. AMR magnetic sensor

d. 3D MEMS packaging

10 Lab4MEMS: demonstration strategy

- Bridge/Building Vibration Monitoring

Low frequencies, large displacements

- Human motion Power generation for sensors

Low frequencies, high accelerations (shoes inserts)

- Tires monitoring

- Vehicle vibration monitoring and power generation for sensors

High frequencies

- ….

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Basic concept

convert kinetic energy (e.g. from ambient vibration) into electric energy

Possible applications

Focus on: micro energy scavenger 11

Paradiso et al., 2006, Design

Automation Conference

Focus on: micro energy scavenger 12

From Mechanical to Electric Energy

• Large seismic Mass • Low frequency energy

KINETIC ENERGY

ELASTIC ENERGY

ELECTRIC POTENTIAL

ELECTRIC ENERGY

• Transduction at MEMS scale • High frequency energy

• Electric Circuit

Contrasting needs

Seismic Mass:

large mass vs. size reduction

Frequency mismatch:

high MEMS natural frequencies vs. low frequency of external signals

Focus on: micro energy scavenger 13

ELECTROSTATIC: Mobile plate capacitors

Easy integration in silicon MEMS, low power generation, need to pre-charge the plates

MAGNETIC: Induction in coils

High power generation, need for big magnets and difficult integration in MEMS

PIEZOELECTRIC: Material strain

High power density, possible integration in MEMS.

Functional Requirements:

- Power density, size, operational frequency, bandwidth

Goals:

- small scale (< < 0.5 cm3)

- power generation ~100 μW continuous

14 Cantilever beam with piezoelectric layer

piezoelectric layer

e.g. Pb(Zr,Ti)O3 (PZT)

• inertial force on the tip mass

• flexural vibration of the composite beam

• non-zero strain rate in the PZT layer

• generation of electric potential on the electrodes

Remarks

• mass-proportional power generation

• importance of piezoelectric coupling coefficient

• possible optimization of the mechanical scheme for maximum energy generation

• optimal behavior at resonance

Focus on: micro energy scavenger 14

Roundy et al., 2005, IEEE Pervasive Computing

L = 1000 µm b = 200 µm Mass = 400x200x200 µm3

Acc. = 10 g Q = 1000

P = 7.11 µW u = 510 µm u/L = 0.51 Ropt = 11 kΩ f0 = 1562 Hz

Possible MEMS design for optimal power generation

Problems:

• vibrations e.g. from human movements are in the range 2-10 Hz

• power generation is negligible for such a low excitation frequency!

• small bandwidth

power obtained for

resonance driven device

Question 1: how can we harvest energy with high mismatch between

source and MEMS frequency?

FREQUENCY UP CONVERSION

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Focus on: micro energy scavenger

Question 2: how can we increase the bandwidth?

NONLINEAR RESONANCE

Impulsive

phenomenon

Free

oscillation

Forced

vibration

Frequency-up conversion

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Frequency-up conversion

Bistable beams - Easy MEMS integration

- In-plane mechanism

- Complex compatibility with piezoelectricity Piezo works out of plane (process constraints)

- Electrostatic transduction

- Low power generations

Magnetic loading - Difficult MEMS integration

- Reliability issues

- Compatible with piezoelectric transduction

- Need for high acceleration

Impact loading

- Easy MEMS integration

- Reliability issues

- Compatible with piezoelectric

transduction

- Need for high acceleration

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Cottone et al., 2013, Proc. IEEE MEMS

Zorlu et al., 2011, IEEE Sensors Journal

Kulah et al., 2008, IEEE Sensors Journal

fEXT = 2 Hz

- Sine Excitation - Impulsive Excitation

Big Mass motion (to “capture” kinetic energy)

CONTACT

(Transfer of energy)

Small Beam motion

(to convert elastic energy into electric energy)

Big Mass Small Beam

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Frequency-up conversion

fmems = 52 kHz Peak Power generation = 43.18µW Size = 1x1x1 mm3

ST-Polimi Patent pending

19

Geometric non linearity: Hard spring effect, Duffing oscillator

Micro/Nano systems laboratory

3rd gen. UWB-PMPG

Non linear resonance helps increasing the bandwidth

- Bridge shape beam

- Only 33- mode

- Still too high natural frequency

- Need for a technique to avoid

jump-down phenomenon

Nonlinear resonance

MIT-Polimi collaboration

Hajati and Kim, 2008, Proceedings of SPIE - The

International Society for Optical Engineering

fmems = 359 Hz Peak Power generation = 21.95 µW Size = 1x1x1 mm3

Closing remarks 20

- Piezoelectric energy harvesters

- Resonant harvesters: for specific frequency and accelerations

- Frequency up conversion: to overcome the frequency mismatch

- Nonlinear harvesters: to increase the bandwidth

- Introduce new heavy materials to increase the weight of the seismic mass

- Find new mechanical schemes to optimize the conversion of energy

Energy scavengers

Lab4MEMS

- Large ENIAC Pilot Line project focusing on KET

- Enabling technology for terrific exploitation of MEMS in the short future

- Major Technology demonstrators

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Thank you for your attention!