LA E65F

1 Version 1.6 | 2020-01-15

Produktdatenblatt | Version 1.1 www.osram-os.com

Applications

LA E65F

Power TOPLED® Lens PowerTOPLED with lens, a powerful member of the TOPLED family. Thanks to their high luminous efficacy, the LEDs are ideal for rear light clusters and indicators on vehicles and for display panels for traffic control systems.

— Interior Illumination (e.g. Ambient Map)

— Signalling

— Traffic Lights

Features: — Package: white PLCC-4 package, colorless clear resin

— Chip technology: Thinfilm

— Typ. Radiation: 60°

— Color: λdom = 617 nm (● amber)

— Corrosion Robustness Class: 3B

— Qualifications: AEC-Q102 Qualified

— ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)

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Ordering Information

Type Luminous Intensity 1) Ordering CodeIF = 50 mAIv

LA E65F-DAFA-24-3A4B 4500 ... 14000 mcd Q65112A4803

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Maximum RatingsParameter Symbol Values

Operating Temperature Top min. max.

-40 °C100 °C

Storage Temperature Tstg min. max.

-40 °C100 °C

Junction Temperature Tj max. 125 °C

Forward current TS = 25 °C

IF max. 70 mA

Surge Current t ≤ 10 µs; D = 0.005 ; TS = 25 °C

IFS max. 100 mA

Reverse voltage 2) TS = 25 °C

VR max. 12 V

ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)

VESD 2 kV

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CharacteristicsIF = 50 mA; TS = 25 °C

Parameter Symbol Values

Peak Wavelength λpeak typ. 624 nm

Dominant Wavelength 3) IF = 50 mA

λdom min. typ. max.

612 nm617 nm624 nm

Spectral Bandwidth at 50% Irel,max ∆λ typ. 18 nm

Viewing angle at 50% IV 2φ typ. 60 °

Forward Voltage 4) IF = 50 mA

VF min. typ. max.

1.90 V2.15 V2.50 V

Reverse current 2) VR = 12 V

IR typ. max.

0.01 µA10 µA

Temperature Coefficient of Peak Wavelength -10°C ≤ T ≤ 100°C

TCλpeak typ. 0.14 nm / K

Real thermal resistance junction/solderpoint 5) RthJS real typ. max.

110 K / W130 K / W

Electrical thermal resistance junction/solderpoint 5) with efficiency ηe = 30 %

RthJS elec. typ. max.

77 K / W91 K / W

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Brightness Groups

Group Luminous Intensity 1) Luminous Intensity. 1) Luminous Flux 6)

IF = 50 mA IF = 50 mA IF = 50 mAmin. max. typ.Iv Iv ΦV

DA 4500 mcd 5600 mcd 5610 mlm

DB 5600 mcd 7100 mcd 7050 mlm

EA 7100 mcd 9000 mcd 8940 mlm

EB 9000 mcd 11200 mcd 11210 mlm

FA 11200 mcd 14000 mcd 13990 mlm

Forward Voltage Groups

Group Forward Voltage 4) Forward Voltage 4)

IF = 50 mA IF = 50 mAmin. max.VF VF

3A 1.90 V 2.05 V

3B 2.05 V 2.20 V

4A 2.20 V 2.35 V

4B 2.35 V 2.50 V

Wavelength Groups

Group Dominant Wavelength 3) Dominant Wavelength 3)

IF = 50 mA IF = 50 mAmin. max.λdom λdom

2 612 nm 616 nm

3 616 nm 620 nm

4 620 nm 624 nm

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Group Name on Label Example: DA-2-3ABrightness Wavelength Forward Voltage

DA 2 3A

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Relative Spectral Emission 6)

Irel = f (λ); IF = 50 mA; TS = 25 °C

LA E65F

350 400 450 500 550 600 650 700 750 800

λ /

0,0

0,2

0,4

0,6

0,8

1,0I

: Vλ

: amber

Radiation Characteristics 6)

Irel = f (ϕ); TS = 25 °CLA E65F

-100°

-90°

-80°

-70°

-60°

-50°

-40°

-30°-20°

-10° 0° 10° 20° 30° 40° 50° 60° 70° 80° 90°ϕ / °

0.0

0.2

0.4

0.6

0.8

1.0Irel

: 0°: 90°

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Forward current 6), 7)

IF = f(VF); TS = 25 °CLA E65F

1,7 2,31,8 1,9 2,0 2,1 2,2

VF / V

1

2

3

4

5

10

20

30

40

50

IF / mA

Relative Luminous Intensity 6), 7)

Iv/Iv(50 mA) = f(IF); TS = 25 °CLA E65F

1 701 2 3 4 5 10 20 30 40 50

IF / mA

0,01

0,05

0,1

0,5

1

IVIV(50mA)

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Forward Voltage 6)

ΔVF = VF - VF(25 °C) = f(Tj); IF = 50 mALA E65F

-40 -20 0 20 40 60 80 100 120

Tj / °C

-0,3

-0,2

-0,1

0,0

0,1

0,2

0,3∆VF / V

Relative Luminous Intensity 6)

Iv/Iv(25 °C) = f(Tj); IF = 50 mALA E65F

-40 -20 0 20 40 60 80 100 120

Tj / °C

0,0

0,2

0,4

0,6

0,8

1,0

1,2

1,4

1,6IvIv(25°C)

Dominant Wavelength 6)

λdom = f(Tj); IF = 50 mALA E65F

-40 -20 0 20 40 60 80 100 120

T / °C

560

580

600

620

640

660

λ / nm

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Max. Permissible Forward CurrentIF = f(T)

OHL01413

00 20 40 60 80 ˚C 100

T

IF

20

40

60

80mA

AT ST

temp. ambienttemp. solder point

A

SΤΤ

10

30

70

50

Permissible Pulse Handling CapabilityIF = f(tp); D: Duty cycle; TA = 25 °C

0

A

OHL02046

pt

FI

-5 110-410 10-3 -2 1010-1 0 10 10s 210

0.02

0.04

0.06

0.08

0.10

0.12

PtD T=T

tP

IF

0.2

10.5

D =0.1

0.0050.01

=

0.020.05

D

Permissible Pulse Handling CapabilityIF = f(tp); D: Duty cycle; TA = 85 °C

0

A

OHL02045

pt

FI

-5 110-410 10-3 -2 1010-1 0 10 10s 210

0.02

0.04

0.06

0.08

0.10

0.12

PtD T=T

tP

IF

0.0050.01

=

0.020.05

D

0.10.20.51

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Dimensional Drawing 8)

3.5 (0.138) max.

ø2.5

5 (0

.100

)

0.13 (0.005)

0.18 (0.007)

0.1 (0.004) typ1.

1 (0

.043

)

0.5

(0.0

20)

2.6 (0.102)

3.4

(0.1

34)

3.0

(0.1

18)

2.1 (0.083)

2.3 (0.091)

3.0 (0.118)

3.7

(0.1

46)

3.3

(0.1

30) 4˚

±1

GPLY6085

0.4 (0.016)

0.6 (0.024)

0.9 (0.035)

0.7 (0.028)

1.7 (0.067)2.1 (0.083)

0.6 (0.024)0.8 (0.031)

A A

CA

ø2.6

0 (0

.102

)

Package marking

(2.4

) (0.

095)

A C

A A

Further Information:

Approximate Weight: 38.0 mg

Package marking: Cathode

Corrosion test: Class: 3B Test condition: 40°C / 90 % RH / 15 ppm H2S / 14 days (stricter than IEC 60068-2-43)

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Recommended Solder Pad 8)

OHLPY440

Padgeometrie fürverbesserte Wärmeableitung

improved heat dissipationPaddesign for

LötstoplackSolder resist

0.8 (0.031)

3.7

(0.1

46)

1.1

(0.0

43)

2.3 (0.091)

3.3 (0.130)

1.5

(0.0

59)

11.1

(0.4

37)

Cu Fläche / 16 mm per pad2

Cu-area_<

3.3 (0.130)

Kathode/Cathode

Anode

0.7 (0.028)

Fläche darf bei Verwendung von TOPLED®

For TOPLED® assembly do not use

elektrisch nicht beschaltet werden.

this area for electrical contact

Fläche darf bei Verwendung von TOPLED®

For TOPLED® assembly do not use

elektrisch nicht beschaltet werden.

this area for electrical contact

For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for ultra sonic cleaning.

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Reflow Soldering ProfileProduct complies to MSL Level 2 acc. to JEDEC J-STD-020E

00

s

OHA04525

50

100

150

200

250

300

50 100 150 200 250 300t

T

˚C

St

t

Pt

Tp240 ˚C

217 ˚C

245 ˚C

25 ˚C

L

Profile Feature Symbol Pb-Free (SnAgCu) Assembly UnitMinimum Recommendation Maximum

Ramp-up rate to preheat*)

25 °C to 150 °C2 3 K/s

Time tSTSmin to TSmax

tS 60 100 120 s

Ramp-up rate to peak*)

TSmax to TP

2 3 K/s

Liquidus temperature TL 217 °C

Time above liquidus temperature tL 80 100 s

Peak temperature TP 245 250 °C

Time within 5 °C of the specified peaktemperature TP - 5 K

tP 10 20 30 s

Ramp-down rate*TP to 100 °C

3 4 K/s

Time25 °C to TP

480 s

All temperatures refer to the center of the package, measured on the top of the component* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range

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Taping 8)

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Tape and Reel 9)

Reel DimensionsA W Nmin W1 W2 max Pieces per PU

330 mm 12 + 0.3 / - 0.1 mm 60 mm 12.4 + 2 mm 18.4 mm 2000

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Barcode-Product-Label (BPL)

Dry Packing Process and Materials 8)

OHA00539

OSRAM

Moisture-sensitive label or print

Barcode label

Desiccant

Humidity indicator

Barcode label

OSRAM

Please check the HIC immidiately afterbag opening.

Discard if circles overrun.Avoid metal contact.

WET

Do not eat.

Comparatorcheck dot

parts still adequately dry.

examine units, if necessary

examine units, if necessary

5%

15%

10%bake units

bake units

If wet,

change desiccant

If wet,

Humidity IndicatorMIL-I-8835

If wet,

Mois

ture

Level 3

Flo

or tim

e 168 H

ours

Mois

ture

Level 6

Flo

or tim

e 6

Hours

a) H

umid

ity In

dicato

r C

ard is

> 1

0% w

hen read a

t 23 ˚

C ±

5 ˚C

, or

reflo

w, v

apor-phase r

eflow

, or equiv

alent p

rocessin

g (peak p

ackage

2. Afte

r th

is b

ag is o

pened, devic

es that w

ill b

e subje

cted to

infrare

d

1. Shelf

life in

seale

d bag: 2

4 month

s at <

40 ˚

C a

nd < 9

0% rela

tive h

umid

ity (R

H).

Mois

ture

Level 5

a

at facto

ry c

onditions o

f

(if b

lank, s

eal date

is id

entical w

ith d

ate c

ode).

a) M

ounted w

ithin

b) S

tore

d at

body tem

p.

3. Devic

es require

bakin

g, befo

re m

ounting, i

f:

Bag s

eal date

Mois

ture

Level 1

Mois

ture

Level 2

Mois

ture

Level 2

a4. If b

aking is

require

d,

b) 2a o

r 2b is

not m

et.

Date

and ti

me o

pened:

refe

rence IP

C/J

ED

EC

J-S

TD

-033 fo

r bake p

rocedure

.

Flo

or tim

e see b

elow

If bla

nk, see b

ar code la

bel

Flo

or tim

e > 1

Year

Flo

or tim

e 1

Year

Flo

or tim

e 4

Weeks10%

RH

.

_<

Mois

ture

Level 4

Mois

ture

Level 5

˚C).

OPTO

SEM

ICO

NDUCTORS

MO

ISTURE S

ENSITIV

E

This b

ag conta

ins

CAUTION

Flo

or tim

e 72 H

ours

Flo

or tim

e 48 H

ours

Flo

or tim

e 24 H

ours

30 ˚C

/60%

RH

.

_<

LE

VE

L

If bla

nk, see

bar code la

bel

Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.

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Chip Technology: 5: HOP 2000 B: HOP 2000 C: ATON D: Low cost ThinGaN/ Thinfilm (e.g. 6mil) F: Thinfilm InGaAlP G: ThinGaN(Thinfilm InGaN) (Subcon:Sapphire)

´ Encapsulant Type / Lens Properties 7: Colorless clear or white volume conversion

(resin encapsulation) S: Silicone (with or without diffuser) 3: lens 30° … 70° 5: lens 40° .. 80°

Wavelength Emission Color Color coordinates according (λdom typ.) CIE 1931/Emission color: A: 617 nm amber W: white S: 633 nm super red UW: ultra white T: 528 nm true green CW: warm white Y: 587 nm yellow CB: color on demand blue O: 606 nm orange CR: crystal pink CP/P: 560 nm pure green R: 625 nm red B: 470 nm blue

L: Light emitting diode

Package Type E: PowerTOPLED

Lead / Package Properties 6: folded leads T: folded leads, improved corrosion stability

(Au-LF), w/o TiO2 jetting

Type Designation System

L A E 6 7 6

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NotesThe evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this data sheet falls into the class exempt group (exposure time 10000 s). Under real circumstances (for expo-sure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light sources have a high secondary exposure potential due to their blinding effect. When looking at bright light sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irrita-tion, annoyance, visual impairment, and even accidents, depending on the situation.

Subcomponents of this device contain, in addition to other substances, metal filled materials including silver. Metal filled materials can be affected by environments that contain traces of aggressive substances. There-fore, we recommend that customers minimize device exposure to aggressive substances during storage, production, and use. Devices that showed visible discoloration when tested using the described tests above did show no performance deviations within failure limits during the stated test duration. Respective failure limits are described in the IEC60810.

For further application related information please visit www.osram-os.com/appnotes

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Disclaimer

Attention please!The information describes the type of component and shall not be considered as assured characteristics.Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances.For information on the types in question please contact our Sales Organization.If printed or downloaded, please find the latest version on the OSRAM OS website.

PackingPlease use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred.

Product and functional safety devices/applications or medical devices/applicationsOSRAM OS components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices.OSRAM OS products are not qualified at module and system level for such application.

In case buyer – or customer supplied by buyer – considers using OSRAM OS components in product safety devices/applications or medical devices/applications, buyer and/or customer has to inform the local sales partner of OSRAM OS immediately and OSRAM OS and buyer and /or customer will analyze and coordi-nate the customer-specific request between OSRAM OS and buyer and/or customer.

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Glossary1) Brightness: Brightness values are measured during a current pulse of typically 25 ms, with an internal

reproducibility of ±8 % and an expanded uncertainty of ±11 % (acc. to GUM with a coverage factor of k = 3).

2) Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse opera-tion is not allowed.

3) Wavelength: The wavelength is measured at a current pulse of typically 25 ms, with an internal repro-ducibility of ±0.5 nm and an expanded uncertainty of ±1 nm (acc. to GUM with a coverage factor of k = 3).

4) Forward Voltage: The forward voltage is measured during a current pulse of typically 8 ms, with an internal reproducibility of ±0.05 V and an expanded uncertainty of ±0.1 V (acc. to GUM with a coverage factor of k = 3).

5) Thermal Resistance: Rth max is based on statistic values (6σ).6) Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devic-

es, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could dif-fer from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice.

7) Characteristic curve: In the range where the line of the graph is broken, you must expect higher differ-ences between single devices within one packing unit.

8) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and dimensions are specified in mm.

9) Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.

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Revision HistoryVersion Date Change

1.6 2020-01-15 Features Brightness Groups Electro - Optical Characteristics (Diagrams) Dimensions of Transportation Box Disclaimer

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Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved.