Johann M. Heuser GSI Darmstadt, Germany VERTEX 2008, Utö Island , Sweden

28
J.M. Heuser Development of silicon tracking detectors for FAIR 1 Johann M. Heuser GSI Darmstadt, Germany VERTEX 2008, Utö Island , Sweden Brief overview of FAIR Nuclear structure/astrophysics experiments R 3 B, EXL Antiproton-annihilation experiment PANDA Nuclear interaction experiment CBM Development of Development of silicon tracking detectors silicon tracking detectors for FAIR for FAIR C B M EXL

description

C. B. M. Development of silicon tracking detectors for FAIR. Johann M. Heuser GSI Darmstadt, Germany VERTEX 2008, Utö Island , Sweden. Brief overview of FAIR Nuclear structure/astrophysics experiments R 3 B, EXL Antiproton-annihilation experiment PANDA - PowerPoint PPT Presentation

Transcript of Johann M. Heuser GSI Darmstadt, Germany VERTEX 2008, Utö Island , Sweden

Page 1: Johann M. Heuser  GSI Darmstadt, Germany VERTEX 2008, Utö Island , Sweden

JM Heuser Development of silicon tracking detectors for FAIR 1

Johann M Heuser GSI Darmstadt Germany

VERTEX 2008 Utouml Island Sweden

Brief overview of FAIR

Nuclear structureastrophysics experiments R3B EXL

Antiproton-annihilation experiment PANDA

Nuclear interaction experiment CBM

Development of Development of silicon tracking detectors for FAIRsilicon tracking detectors for FAIR

CBMEXL

JM Heuser Development of silicon tracking detectors for FAIR 2

FFacility for acility for AAntiproton and ntiproton and IIon on RResearch esearch

GSIGSI

FAIR FAIR 20162016

New international facility next to GSI

German national laboratory for research with ions

(in Darmstadt south of Frankfurt)

High-intensity primary and secondary beams

Efficient parallel operation of up to 4 programs

JM Heuser Development of silicon tracking detectors for FAIR 3

FAIR FAIR httpwwwgsidefair

Nov 2001 FAIR Conceptual Design Report

Jul 2002 FAIR recommended by german science council ldquoWissenschaftsratldquo

Feb 2003 FAIR approved by ministry of education and research BMBF

Mar 2006 Fed Government FAIR in budgetary plan up to 2014

Sept 2006 FAIR Baseline Technical Report

Nov 2007 FAIR Start-up event

in 2008 Foundation of the FAIR Company

Observers

First experiments 2012Completion in 3 phases until 2016

14 partner countries so far

Costs amp Funding~12 billion euro ndash 65 Germany 10 State of Hesse 25 Int Partners

Nuclear Structure amp Nuclear AstrophysicsRadiactive-ion beams from high-energy fragmentationNuclear Structure amp Nuclear AstrophysicsRadiactive-ion beams from high-energy fragmentation

QCD-Phase Diagram Nuclear amp QGP Matter Heavy-ion beams 2 to 45 GeVu

QCD-Phase Diagram Nuclear amp QGP Matter Heavy-ion beams 2 to 45 GeVuHadron Structure QCD-Vacuum amp Medium Stored and cooled Anti-proton beams up to 15 GeVcHadron Structure QCD-Vacuum amp Medium Stored and cooled Anti-proton beams up to 15 GeVc

Fund Symmetries amp Ultra- High EM FieldsAntiprotons and highly stripped ionsFund Symmetries amp Ultra- High EM FieldsAntiprotons and highly stripped ions

Physics of Dense Bulk Plasmas Ion-beam bunch compr + high-energy petawatt-laserPhysics of Dense Bulk Plasmas Ion-beam bunch compr + high-energy petawatt-laser

Materials Science Radiation Biology Ion amp anti-proton beamsMaterials Science Radiation Biology Ion amp anti-proton beams

Unprecedented research opportunities

JM Heuser Development of silicon tracking detectors for FAIR 4

More than 1400 people attending the event

Start of the FAIR project on 7 November 2007

Austria Germany Spain Finland France Poland Romania Russia Sweden Great

Britain and german State of Hesse

Officials from the FAIR partner states celebrating the launch of the start version

JM Heuser Development of silicon tracking detectors for FAIR 5

FFacility for acility for AAntiproton and ntiproton and IIon on RResearch esearch

GSI todayGSI today

FAIR FAIR 20162016

CBMCBM

SIS 100SIS 100

SIS 18SIS 18SIS 300SIS 300p lt 90 GeVp lt 90 GeV

ions up to U lt 45 AGeV ions up to U lt 45 AGeV

PANDAPANDA

RR33BB

EXLEXL

UnilacUnilac

p-Linacp-Linac

NewNew Widespread application of high-performance silicon detector systems at FAIR

JM Heuser Development of silicon tracking detectors for FAIR 6

experiment

Physics and programs

Structure of nuclear matter in its extreme states Exotic nuclei

Physics for nuclear energy nuclear data and modeling astrophysics

Goals of the experiment

Complete reconstruction of the reaction kinematics with stable as well as radioactive beams

Beam energies 150 MeV - 15 GeV per nucleon

Physics and programs

Nuclei far off stability

Exploring new regions in the chart of nuclides paramount interest in the fields of nuclear structure and astrophysics

Goals of the experiment

Complete reconstruction of light-ion induced direct reactions in inverse kinematics

Novel storage ring techniques and a universal detector system

Reaction studies with Relativistic

Radioactive Ion Beams

EXL experiment EXotic Nuclei Studied in Light-Ion

Induced Reactions

JM Heuser Development of silicon tracking detectors for FAIR 7

Neutrons

High Resolution Measurement

Heavy Fragments

Protons

Large Acceptance

Dipole

bull Targetbull Trackerbull Calorimeter

RIB

The R3B experiment

bull beam tracking and mom measurement pp ~10-4

bull exclusive measurement of the final state

- identification and mom analysis of fragments

(large acceptance mode pp~10-3 high-resolution mode pp~10-4)

- n p γ light recoil particles

bull applicable to a wide class of reactions

Si Recoil Tracker

First layerbull double-sided Si micro-strip detectorsbull 25 cm from target bull thickness 100 μm pitch 100 μmbull energy resolution 50 keV (FWHM)

Second layerbull double-sided Si micro-strip detectorsbull 10 cm from target bull thickness 300 μm pitch 100 μmbull energy resolution 50 keV (FWHM)

2-layer silicon tracker

~ 02 m2 area

JM Heuser Development of silicon tracking detectors for FAIR 8

EXLDetection systems for Target recoils and gammas (pnhellip) Forward ejectiles (pn) Beam-like heavy ions

Electroncooler

eA-Collider

RIB

Si DSSD E x y300 microm thick spatial resolution better than 500 microm in x and y ∆E = 30 keV (FWHM)1048766Thin Si DSSD trackinglt100 microm thick spatial reso-lution better than 100 microm in x and y ∆E = 30 keV (FWHM)1048766Si(Li) E9 mm thick large area 100 x 100 mm2 ∆E = 50 keV (FWHM)1048766CsI crystals E High efficiency high resolution 20 cm thick

2 nearly spherical silicon detector layers

~3 m2 area

Recoil detector

JM Heuser Development of silicon tracking detectors for FAIR 9

R3B 2-layer silicon tracker ~ 02 m2 area 60 microstrip detectors of about 5 cm by 7 cm size Double-sided detectors with orthogonal strip pattern read out from the same detector edge double-metal routing layer on one side Strip pitch 100 microm or smaller Detectors thickness 100 microm (inner layer)

100-300 microm thickness (outer layers)

EXL2 nearly spherical silicon layers ~3 m2 area Inner layer 100 microm thick double-sided orthogonal microstrip detectors

Spatial resolution better than 100 microm in x and yenergy resolution of 30 keV 300 detectors with typical dimensions of 9 cm by 9 cm

Outer layer 300 microm thick double-sided orthogonal microstrip detectors spatial resolution better than 500 microm in both coordinates

energy resolution of 30 keV 120 detectors of 9 cm by 9 cm size

Detectors operated in vacuum

JM Heuser Development of silicon tracking detectors for FAIR 10

Anti-proton annihilation experiment PANDAAnti-proton annihilation experiment PANDA

A next generation hadron physics detector

Cooled antiproton beams energy 15 - 15 GeV interacting with various internal targets

Main physics topics

hadron spectroscopy search for exotic charmonia states

charm hadrons in the nuclear medium

spectroscopy of double-hypernuclei and nucleon structure

PANDA detector system4 acceptance

vertex detection MVD

particle id of Kaons muons eplusmn

electromagnetic calorimetry

momentum resolution ~ δpp = 1

high interaction rates of up to 20 MHz

JM Heuser Development of silicon tracking detectors for FAIR 11

Design features 5 space points forward of 90deg

4 barrel layers

4 forward disks

Outer 2 barrels and disks

double-sided strips ~06m2

Inner barrels and disks

hybrid pixels

Smallest possible inner radius

Fast and untriggered readout

Micro-Vertex DetectorMicro-Vertex Detector

p beam

10 cm

pellet or cluster jet targetExperimental tasks

Identification of D mesons

Measurement of long-lived baryons and mesons (open charm and strangeness)

JM Heuser Development of silicon tracking detectors for FAIR 1212

Detector PrototypingDetector PrototypingStrip layers

Outer layers pixels strips keep number of space points but less material

double-sided sensors

thickness ~200 microm

orthogonal strips

pitch of 50 ndash 100 microm

typical barrel detector 6 cm by 35 cm

lab-start ITC detector APV 25 chip

readout untriggered FEE required

synergy with CBM on XYTER

ASIC TOPIX

13 micro technology

pixel size 100x100 microm2

high readout capability

sufficient buffering to operate without trigger

ToT to retain (some) energy information

radhard within typical limits

Sensor

EPI for minimum material lt 100 microm thickness

Hybrid pixel detector layers

JM Heuser Development of silicon tracking detectors for FAIR 13

PANDA MVD ndash Radiation load mapsPANDA MVD ndash Radiation load maps

ppp at 10 GeVc p at 10 GeVc p-p-Pb at 405 GeVc Pb at 405 GeVc

1313

calculation with DPM event generator ~ 110 of radiation dose at LHC

n-equiv fluencecm2

integrated over 1 year of PANDA operation

JM Heuser Development of silicon tracking detectors for FAIR 14

CCompressed ompressed BBaryonic aryonic MMatter Experimentatter ExperimentFixed-target experiment at the SIS300 synchrotron

High-rate heavy-ion collisions projectile energies up to 45 GeVnucleon

QCD phase diagram in regions of large baryon densities and moderate temperatures

Topics

Deconfinement phase transition and high-μB QGP

Critical point

Hadron properties in dense matter

(rare) probes e and micro pairs vector mesons strangeness and charmonium open charm

dense nuclear matter (6 ndash 12) 0

time

de

nsi

ty

JM Heuser Development of silicon tracking detectors for FAIR 15

Electron-Hadron setup Muon-setup

CCompressed ompressed BBaryonic aryonic MMatter Experimentatter Experiment

JM Heuser Development of silicon tracking detectors for FAIR 16

Au+Au interactions 25 GeVu 10 MHz interaction rate

up to 1000 charged particlesevent

Track densities 30 cm-2

UrQMD generator Monte Carlo tracks

and simulated hits in microstrip detector stations

Silicon Tracking SystemSilicon Tracking System tracking nuclear collisionsthe mission

+ micro vertex detection presentation by M Deveaux

JM Heuser Development of silicon tracking detectors for FAIR 17

Exploration of a system concept

STS 8 low-mass micro-strip station1 T dipole magnet

JM Heuser Development of silicon tracking detectors for FAIR 18

Tracking stationsTracking stations

tracking station

detector module

p side (front)stereo strips

blue double metal connect-ions of strips I to III

n side (back) vertical stripsvertical strips

current layout total area 8 stations 32 m2

total number of sectors 756total number of ro channels 15Mtotal number of sensors 1068

188 sensors 2 cm times 6 cm 166 sensors 4 cm times 6 cm714 sensors 6 cm times 6 cm

total number of FE chips ~ 12k

sector

I II

III

ro directiondouble-sided microstrip detector

station with sectorization max 5 occupancy

JM Heuser Development of silicon tracking detectors for FAIR 19

Microstrip detector prototype CBM01 GSI-CIS 82007Microstrip detector prototype CBM01 GSI-CIS 82007

4 wafer 285 microm Si Test sensors

Double-sided double-metal 1024 strips per side 50 microm pitch 15ordm stereo angle full-area sensitive contacts at top + bottom edge size 5656 mm2

Double-sided single-metal 256256 strips orthogonal 50(80) microm pitch size 1515 (22 22) mm2

Main sensor

CBM01

CBM01B1

CBM01B2

not rad hard

JM Heuser Development of silicon tracking detectors for FAIR 20

Pixel vs Strip detectorsPixel vs Strip detectors

microstrip detectors hybrid pixel detectors

One central Au+Au event at 25 GeVu tracking station at z=30 cm

compared with

track points rec points gt 115 track points rec points 11

combinatorial hits

thin thick cooling

true hits

Y [c

m]

X [cm]

current choice

JM Heuser Development of silicon tracking detectors for FAIR 21

Front view (XY projection)

78 ms on Pentium 4 processor

Future farm of multi-core processors

Top view (XZ projection)

Track reconstructionTrack reconstructionCentral collision Au+Au 25 AGeV (UrQMD)

Cellular automaton + Kalman filter algorithms

96Reconstruction efficiency

lt1 ghost tracks

JM Heuser Development of silicon tracking detectors for FAIR 22

Low mass detectorLow mass detector

x[cm]

y[c

m]

- silicon detector thickness

currently 03 X0 (300m)

- station with cables and support

structure 1 X0

XX0Station 5 ( at z = 60cm)

13 for tracks pointing to the vertex

Momentum resolution

JM Heuser Development of silicon tracking detectors for FAIR 23

Typical operation for about 6 years

Situation

Interaction rate 107s Au+AuEffective CBM run year

2 months at full operation 5 times 106 s

Fluence up to ~1015 1-MeV nequiv

Radiation EnvironmentRadiation Environment

CBM cave

beam

STS

FLUKA simulation

1-MeV nequiv fluence per 1 CBM run year

dump

neutron field

last STS stationfirst STS station

(Muon setup)

JM Heuser Development of silicon tracking detectors for FAIR 24

Beginning STS system engineeringBeginning STS system engineering

STS ndash MVD ndash beam pipein a thermal enclosure

Extractable from the magnet for maintenance

Including infrastructure (cables optical links cooling)

12k FEE chips 6 ndash 12 kW power

FEE ASICs operation at 18V current 3600 ndash 7200 A

DAQ data rate ~30 GHz ~200 GBytes

JM Heuser Development of silicon tracking detectors for FAIR 25

SummarySummary

International accelerator facility FAIR under preparation

Unprecedented and new research opportunities in various fields for large scientific communities

Silicon detector systems will be important

Challenging

some because small research groups go into new detector dimensions

some because truly demanding devices are required

very high channel densities high radiation environment very fast readout very low mass pretty big ( CBM)

Cooperations of the GSIFAIR groups eg on Sensors FEE labs

Inputadvice from other experienced communities searched for

One example Planned are in-kind contributions from Finland to FAIR with rad-hard silicon strip detectors (incl RD39-RD50

expertise)

JM Heuser Development of silicon tracking detectors for FAIR 26

backup slides

JM Heuser Development of silicon tracking detectors for FAIR 27

n-XYTER readout ASICn-XYTER readout ASICDETNI - GSIDETNI - GSI

NameNamebull n-XYTER NNeutron - XX YY TTime and EEnergy ReadoutReadout

Front-endFront-endbull 128(32) channels charge sensitive pre-amplifier both polarities

bull 30 pF detector capacitance ENC 1000 e

bull self-triggered autonomous hit detection

bull time stamping with 1 ns resolution (needed to correlate x-y views)

ReadoutReadoutbull energy (peak height) and time information for each hit

bull data driven de-randomizing sparsifying readout

bull 32 MHz average hit ratendash 128 channel version (SiGEM) ~ 250 kHz hit channel

ndash 32 channel version (MSGC) ~ 1 MHz hit channel

JM Heuser Development of silicon tracking detectors for FAIR 28

32 MHzreadoutrate

n-XYTER Architecturen-XYTER Architecture

PreAmpPreAmp fast shaperfast shaper

peaking timefast 20 nsslow 140 ns

slow shaperslow shaper

timewalk

comp

comparatorcomparator

tokencell

timestamp

counter

tokenmanager

1 ns step

32 MHzreadoutrate

self-triggerlatch amplitudelatch timestore in FIFOs

outputdrivers

digitalFIFO

analogFIFO

peakdetectamp hold

Page 2: Johann M. Heuser  GSI Darmstadt, Germany VERTEX 2008, Utö Island , Sweden

JM Heuser Development of silicon tracking detectors for FAIR 2

FFacility for acility for AAntiproton and ntiproton and IIon on RResearch esearch

GSIGSI

FAIR FAIR 20162016

New international facility next to GSI

German national laboratory for research with ions

(in Darmstadt south of Frankfurt)

High-intensity primary and secondary beams

Efficient parallel operation of up to 4 programs

JM Heuser Development of silicon tracking detectors for FAIR 3

FAIR FAIR httpwwwgsidefair

Nov 2001 FAIR Conceptual Design Report

Jul 2002 FAIR recommended by german science council ldquoWissenschaftsratldquo

Feb 2003 FAIR approved by ministry of education and research BMBF

Mar 2006 Fed Government FAIR in budgetary plan up to 2014

Sept 2006 FAIR Baseline Technical Report

Nov 2007 FAIR Start-up event

in 2008 Foundation of the FAIR Company

Observers

First experiments 2012Completion in 3 phases until 2016

14 partner countries so far

Costs amp Funding~12 billion euro ndash 65 Germany 10 State of Hesse 25 Int Partners

Nuclear Structure amp Nuclear AstrophysicsRadiactive-ion beams from high-energy fragmentationNuclear Structure amp Nuclear AstrophysicsRadiactive-ion beams from high-energy fragmentation

QCD-Phase Diagram Nuclear amp QGP Matter Heavy-ion beams 2 to 45 GeVu

QCD-Phase Diagram Nuclear amp QGP Matter Heavy-ion beams 2 to 45 GeVuHadron Structure QCD-Vacuum amp Medium Stored and cooled Anti-proton beams up to 15 GeVcHadron Structure QCD-Vacuum amp Medium Stored and cooled Anti-proton beams up to 15 GeVc

Fund Symmetries amp Ultra- High EM FieldsAntiprotons and highly stripped ionsFund Symmetries amp Ultra- High EM FieldsAntiprotons and highly stripped ions

Physics of Dense Bulk Plasmas Ion-beam bunch compr + high-energy petawatt-laserPhysics of Dense Bulk Plasmas Ion-beam bunch compr + high-energy petawatt-laser

Materials Science Radiation Biology Ion amp anti-proton beamsMaterials Science Radiation Biology Ion amp anti-proton beams

Unprecedented research opportunities

JM Heuser Development of silicon tracking detectors for FAIR 4

More than 1400 people attending the event

Start of the FAIR project on 7 November 2007

Austria Germany Spain Finland France Poland Romania Russia Sweden Great

Britain and german State of Hesse

Officials from the FAIR partner states celebrating the launch of the start version

JM Heuser Development of silicon tracking detectors for FAIR 5

FFacility for acility for AAntiproton and ntiproton and IIon on RResearch esearch

GSI todayGSI today

FAIR FAIR 20162016

CBMCBM

SIS 100SIS 100

SIS 18SIS 18SIS 300SIS 300p lt 90 GeVp lt 90 GeV

ions up to U lt 45 AGeV ions up to U lt 45 AGeV

PANDAPANDA

RR33BB

EXLEXL

UnilacUnilac

p-Linacp-Linac

NewNew Widespread application of high-performance silicon detector systems at FAIR

JM Heuser Development of silicon tracking detectors for FAIR 6

experiment

Physics and programs

Structure of nuclear matter in its extreme states Exotic nuclei

Physics for nuclear energy nuclear data and modeling astrophysics

Goals of the experiment

Complete reconstruction of the reaction kinematics with stable as well as radioactive beams

Beam energies 150 MeV - 15 GeV per nucleon

Physics and programs

Nuclei far off stability

Exploring new regions in the chart of nuclides paramount interest in the fields of nuclear structure and astrophysics

Goals of the experiment

Complete reconstruction of light-ion induced direct reactions in inverse kinematics

Novel storage ring techniques and a universal detector system

Reaction studies with Relativistic

Radioactive Ion Beams

EXL experiment EXotic Nuclei Studied in Light-Ion

Induced Reactions

JM Heuser Development of silicon tracking detectors for FAIR 7

Neutrons

High Resolution Measurement

Heavy Fragments

Protons

Large Acceptance

Dipole

bull Targetbull Trackerbull Calorimeter

RIB

The R3B experiment

bull beam tracking and mom measurement pp ~10-4

bull exclusive measurement of the final state

- identification and mom analysis of fragments

(large acceptance mode pp~10-3 high-resolution mode pp~10-4)

- n p γ light recoil particles

bull applicable to a wide class of reactions

Si Recoil Tracker

First layerbull double-sided Si micro-strip detectorsbull 25 cm from target bull thickness 100 μm pitch 100 μmbull energy resolution 50 keV (FWHM)

Second layerbull double-sided Si micro-strip detectorsbull 10 cm from target bull thickness 300 μm pitch 100 μmbull energy resolution 50 keV (FWHM)

2-layer silicon tracker

~ 02 m2 area

JM Heuser Development of silicon tracking detectors for FAIR 8

EXLDetection systems for Target recoils and gammas (pnhellip) Forward ejectiles (pn) Beam-like heavy ions

Electroncooler

eA-Collider

RIB

Si DSSD E x y300 microm thick spatial resolution better than 500 microm in x and y ∆E = 30 keV (FWHM)1048766Thin Si DSSD trackinglt100 microm thick spatial reso-lution better than 100 microm in x and y ∆E = 30 keV (FWHM)1048766Si(Li) E9 mm thick large area 100 x 100 mm2 ∆E = 50 keV (FWHM)1048766CsI crystals E High efficiency high resolution 20 cm thick

2 nearly spherical silicon detector layers

~3 m2 area

Recoil detector

JM Heuser Development of silicon tracking detectors for FAIR 9

R3B 2-layer silicon tracker ~ 02 m2 area 60 microstrip detectors of about 5 cm by 7 cm size Double-sided detectors with orthogonal strip pattern read out from the same detector edge double-metal routing layer on one side Strip pitch 100 microm or smaller Detectors thickness 100 microm (inner layer)

100-300 microm thickness (outer layers)

EXL2 nearly spherical silicon layers ~3 m2 area Inner layer 100 microm thick double-sided orthogonal microstrip detectors

Spatial resolution better than 100 microm in x and yenergy resolution of 30 keV 300 detectors with typical dimensions of 9 cm by 9 cm

Outer layer 300 microm thick double-sided orthogonal microstrip detectors spatial resolution better than 500 microm in both coordinates

energy resolution of 30 keV 120 detectors of 9 cm by 9 cm size

Detectors operated in vacuum

JM Heuser Development of silicon tracking detectors for FAIR 10

Anti-proton annihilation experiment PANDAAnti-proton annihilation experiment PANDA

A next generation hadron physics detector

Cooled antiproton beams energy 15 - 15 GeV interacting with various internal targets

Main physics topics

hadron spectroscopy search for exotic charmonia states

charm hadrons in the nuclear medium

spectroscopy of double-hypernuclei and nucleon structure

PANDA detector system4 acceptance

vertex detection MVD

particle id of Kaons muons eplusmn

electromagnetic calorimetry

momentum resolution ~ δpp = 1

high interaction rates of up to 20 MHz

JM Heuser Development of silicon tracking detectors for FAIR 11

Design features 5 space points forward of 90deg

4 barrel layers

4 forward disks

Outer 2 barrels and disks

double-sided strips ~06m2

Inner barrels and disks

hybrid pixels

Smallest possible inner radius

Fast and untriggered readout

Micro-Vertex DetectorMicro-Vertex Detector

p beam

10 cm

pellet or cluster jet targetExperimental tasks

Identification of D mesons

Measurement of long-lived baryons and mesons (open charm and strangeness)

JM Heuser Development of silicon tracking detectors for FAIR 1212

Detector PrototypingDetector PrototypingStrip layers

Outer layers pixels strips keep number of space points but less material

double-sided sensors

thickness ~200 microm

orthogonal strips

pitch of 50 ndash 100 microm

typical barrel detector 6 cm by 35 cm

lab-start ITC detector APV 25 chip

readout untriggered FEE required

synergy with CBM on XYTER

ASIC TOPIX

13 micro technology

pixel size 100x100 microm2

high readout capability

sufficient buffering to operate without trigger

ToT to retain (some) energy information

radhard within typical limits

Sensor

EPI for minimum material lt 100 microm thickness

Hybrid pixel detector layers

JM Heuser Development of silicon tracking detectors for FAIR 13

PANDA MVD ndash Radiation load mapsPANDA MVD ndash Radiation load maps

ppp at 10 GeVc p at 10 GeVc p-p-Pb at 405 GeVc Pb at 405 GeVc

1313

calculation with DPM event generator ~ 110 of radiation dose at LHC

n-equiv fluencecm2

integrated over 1 year of PANDA operation

JM Heuser Development of silicon tracking detectors for FAIR 14

CCompressed ompressed BBaryonic aryonic MMatter Experimentatter ExperimentFixed-target experiment at the SIS300 synchrotron

High-rate heavy-ion collisions projectile energies up to 45 GeVnucleon

QCD phase diagram in regions of large baryon densities and moderate temperatures

Topics

Deconfinement phase transition and high-μB QGP

Critical point

Hadron properties in dense matter

(rare) probes e and micro pairs vector mesons strangeness and charmonium open charm

dense nuclear matter (6 ndash 12) 0

time

de

nsi

ty

JM Heuser Development of silicon tracking detectors for FAIR 15

Electron-Hadron setup Muon-setup

CCompressed ompressed BBaryonic aryonic MMatter Experimentatter Experiment

JM Heuser Development of silicon tracking detectors for FAIR 16

Au+Au interactions 25 GeVu 10 MHz interaction rate

up to 1000 charged particlesevent

Track densities 30 cm-2

UrQMD generator Monte Carlo tracks

and simulated hits in microstrip detector stations

Silicon Tracking SystemSilicon Tracking System tracking nuclear collisionsthe mission

+ micro vertex detection presentation by M Deveaux

JM Heuser Development of silicon tracking detectors for FAIR 17

Exploration of a system concept

STS 8 low-mass micro-strip station1 T dipole magnet

JM Heuser Development of silicon tracking detectors for FAIR 18

Tracking stationsTracking stations

tracking station

detector module

p side (front)stereo strips

blue double metal connect-ions of strips I to III

n side (back) vertical stripsvertical strips

current layout total area 8 stations 32 m2

total number of sectors 756total number of ro channels 15Mtotal number of sensors 1068

188 sensors 2 cm times 6 cm 166 sensors 4 cm times 6 cm714 sensors 6 cm times 6 cm

total number of FE chips ~ 12k

sector

I II

III

ro directiondouble-sided microstrip detector

station with sectorization max 5 occupancy

JM Heuser Development of silicon tracking detectors for FAIR 19

Microstrip detector prototype CBM01 GSI-CIS 82007Microstrip detector prototype CBM01 GSI-CIS 82007

4 wafer 285 microm Si Test sensors

Double-sided double-metal 1024 strips per side 50 microm pitch 15ordm stereo angle full-area sensitive contacts at top + bottom edge size 5656 mm2

Double-sided single-metal 256256 strips orthogonal 50(80) microm pitch size 1515 (22 22) mm2

Main sensor

CBM01

CBM01B1

CBM01B2

not rad hard

JM Heuser Development of silicon tracking detectors for FAIR 20

Pixel vs Strip detectorsPixel vs Strip detectors

microstrip detectors hybrid pixel detectors

One central Au+Au event at 25 GeVu tracking station at z=30 cm

compared with

track points rec points gt 115 track points rec points 11

combinatorial hits

thin thick cooling

true hits

Y [c

m]

X [cm]

current choice

JM Heuser Development of silicon tracking detectors for FAIR 21

Front view (XY projection)

78 ms on Pentium 4 processor

Future farm of multi-core processors

Top view (XZ projection)

Track reconstructionTrack reconstructionCentral collision Au+Au 25 AGeV (UrQMD)

Cellular automaton + Kalman filter algorithms

96Reconstruction efficiency

lt1 ghost tracks

JM Heuser Development of silicon tracking detectors for FAIR 22

Low mass detectorLow mass detector

x[cm]

y[c

m]

- silicon detector thickness

currently 03 X0 (300m)

- station with cables and support

structure 1 X0

XX0Station 5 ( at z = 60cm)

13 for tracks pointing to the vertex

Momentum resolution

JM Heuser Development of silicon tracking detectors for FAIR 23

Typical operation for about 6 years

Situation

Interaction rate 107s Au+AuEffective CBM run year

2 months at full operation 5 times 106 s

Fluence up to ~1015 1-MeV nequiv

Radiation EnvironmentRadiation Environment

CBM cave

beam

STS

FLUKA simulation

1-MeV nequiv fluence per 1 CBM run year

dump

neutron field

last STS stationfirst STS station

(Muon setup)

JM Heuser Development of silicon tracking detectors for FAIR 24

Beginning STS system engineeringBeginning STS system engineering

STS ndash MVD ndash beam pipein a thermal enclosure

Extractable from the magnet for maintenance

Including infrastructure (cables optical links cooling)

12k FEE chips 6 ndash 12 kW power

FEE ASICs operation at 18V current 3600 ndash 7200 A

DAQ data rate ~30 GHz ~200 GBytes

JM Heuser Development of silicon tracking detectors for FAIR 25

SummarySummary

International accelerator facility FAIR under preparation

Unprecedented and new research opportunities in various fields for large scientific communities

Silicon detector systems will be important

Challenging

some because small research groups go into new detector dimensions

some because truly demanding devices are required

very high channel densities high radiation environment very fast readout very low mass pretty big ( CBM)

Cooperations of the GSIFAIR groups eg on Sensors FEE labs

Inputadvice from other experienced communities searched for

One example Planned are in-kind contributions from Finland to FAIR with rad-hard silicon strip detectors (incl RD39-RD50

expertise)

JM Heuser Development of silicon tracking detectors for FAIR 26

backup slides

JM Heuser Development of silicon tracking detectors for FAIR 27

n-XYTER readout ASICn-XYTER readout ASICDETNI - GSIDETNI - GSI

NameNamebull n-XYTER NNeutron - XX YY TTime and EEnergy ReadoutReadout

Front-endFront-endbull 128(32) channels charge sensitive pre-amplifier both polarities

bull 30 pF detector capacitance ENC 1000 e

bull self-triggered autonomous hit detection

bull time stamping with 1 ns resolution (needed to correlate x-y views)

ReadoutReadoutbull energy (peak height) and time information for each hit

bull data driven de-randomizing sparsifying readout

bull 32 MHz average hit ratendash 128 channel version (SiGEM) ~ 250 kHz hit channel

ndash 32 channel version (MSGC) ~ 1 MHz hit channel

JM Heuser Development of silicon tracking detectors for FAIR 28

32 MHzreadoutrate

n-XYTER Architecturen-XYTER Architecture

PreAmpPreAmp fast shaperfast shaper

peaking timefast 20 nsslow 140 ns

slow shaperslow shaper

timewalk

comp

comparatorcomparator

tokencell

timestamp

counter

tokenmanager

1 ns step

32 MHzreadoutrate

self-triggerlatch amplitudelatch timestore in FIFOs

outputdrivers

digitalFIFO

analogFIFO

peakdetectamp hold

Page 3: Johann M. Heuser  GSI Darmstadt, Germany VERTEX 2008, Utö Island , Sweden

JM Heuser Development of silicon tracking detectors for FAIR 3

FAIR FAIR httpwwwgsidefair

Nov 2001 FAIR Conceptual Design Report

Jul 2002 FAIR recommended by german science council ldquoWissenschaftsratldquo

Feb 2003 FAIR approved by ministry of education and research BMBF

Mar 2006 Fed Government FAIR in budgetary plan up to 2014

Sept 2006 FAIR Baseline Technical Report

Nov 2007 FAIR Start-up event

in 2008 Foundation of the FAIR Company

Observers

First experiments 2012Completion in 3 phases until 2016

14 partner countries so far

Costs amp Funding~12 billion euro ndash 65 Germany 10 State of Hesse 25 Int Partners

Nuclear Structure amp Nuclear AstrophysicsRadiactive-ion beams from high-energy fragmentationNuclear Structure amp Nuclear AstrophysicsRadiactive-ion beams from high-energy fragmentation

QCD-Phase Diagram Nuclear amp QGP Matter Heavy-ion beams 2 to 45 GeVu

QCD-Phase Diagram Nuclear amp QGP Matter Heavy-ion beams 2 to 45 GeVuHadron Structure QCD-Vacuum amp Medium Stored and cooled Anti-proton beams up to 15 GeVcHadron Structure QCD-Vacuum amp Medium Stored and cooled Anti-proton beams up to 15 GeVc

Fund Symmetries amp Ultra- High EM FieldsAntiprotons and highly stripped ionsFund Symmetries amp Ultra- High EM FieldsAntiprotons and highly stripped ions

Physics of Dense Bulk Plasmas Ion-beam bunch compr + high-energy petawatt-laserPhysics of Dense Bulk Plasmas Ion-beam bunch compr + high-energy petawatt-laser

Materials Science Radiation Biology Ion amp anti-proton beamsMaterials Science Radiation Biology Ion amp anti-proton beams

Unprecedented research opportunities

JM Heuser Development of silicon tracking detectors for FAIR 4

More than 1400 people attending the event

Start of the FAIR project on 7 November 2007

Austria Germany Spain Finland France Poland Romania Russia Sweden Great

Britain and german State of Hesse

Officials from the FAIR partner states celebrating the launch of the start version

JM Heuser Development of silicon tracking detectors for FAIR 5

FFacility for acility for AAntiproton and ntiproton and IIon on RResearch esearch

GSI todayGSI today

FAIR FAIR 20162016

CBMCBM

SIS 100SIS 100

SIS 18SIS 18SIS 300SIS 300p lt 90 GeVp lt 90 GeV

ions up to U lt 45 AGeV ions up to U lt 45 AGeV

PANDAPANDA

RR33BB

EXLEXL

UnilacUnilac

p-Linacp-Linac

NewNew Widespread application of high-performance silicon detector systems at FAIR

JM Heuser Development of silicon tracking detectors for FAIR 6

experiment

Physics and programs

Structure of nuclear matter in its extreme states Exotic nuclei

Physics for nuclear energy nuclear data and modeling astrophysics

Goals of the experiment

Complete reconstruction of the reaction kinematics with stable as well as radioactive beams

Beam energies 150 MeV - 15 GeV per nucleon

Physics and programs

Nuclei far off stability

Exploring new regions in the chart of nuclides paramount interest in the fields of nuclear structure and astrophysics

Goals of the experiment

Complete reconstruction of light-ion induced direct reactions in inverse kinematics

Novel storage ring techniques and a universal detector system

Reaction studies with Relativistic

Radioactive Ion Beams

EXL experiment EXotic Nuclei Studied in Light-Ion

Induced Reactions

JM Heuser Development of silicon tracking detectors for FAIR 7

Neutrons

High Resolution Measurement

Heavy Fragments

Protons

Large Acceptance

Dipole

bull Targetbull Trackerbull Calorimeter

RIB

The R3B experiment

bull beam tracking and mom measurement pp ~10-4

bull exclusive measurement of the final state

- identification and mom analysis of fragments

(large acceptance mode pp~10-3 high-resolution mode pp~10-4)

- n p γ light recoil particles

bull applicable to a wide class of reactions

Si Recoil Tracker

First layerbull double-sided Si micro-strip detectorsbull 25 cm from target bull thickness 100 μm pitch 100 μmbull energy resolution 50 keV (FWHM)

Second layerbull double-sided Si micro-strip detectorsbull 10 cm from target bull thickness 300 μm pitch 100 μmbull energy resolution 50 keV (FWHM)

2-layer silicon tracker

~ 02 m2 area

JM Heuser Development of silicon tracking detectors for FAIR 8

EXLDetection systems for Target recoils and gammas (pnhellip) Forward ejectiles (pn) Beam-like heavy ions

Electroncooler

eA-Collider

RIB

Si DSSD E x y300 microm thick spatial resolution better than 500 microm in x and y ∆E = 30 keV (FWHM)1048766Thin Si DSSD trackinglt100 microm thick spatial reso-lution better than 100 microm in x and y ∆E = 30 keV (FWHM)1048766Si(Li) E9 mm thick large area 100 x 100 mm2 ∆E = 50 keV (FWHM)1048766CsI crystals E High efficiency high resolution 20 cm thick

2 nearly spherical silicon detector layers

~3 m2 area

Recoil detector

JM Heuser Development of silicon tracking detectors for FAIR 9

R3B 2-layer silicon tracker ~ 02 m2 area 60 microstrip detectors of about 5 cm by 7 cm size Double-sided detectors with orthogonal strip pattern read out from the same detector edge double-metal routing layer on one side Strip pitch 100 microm or smaller Detectors thickness 100 microm (inner layer)

100-300 microm thickness (outer layers)

EXL2 nearly spherical silicon layers ~3 m2 area Inner layer 100 microm thick double-sided orthogonal microstrip detectors

Spatial resolution better than 100 microm in x and yenergy resolution of 30 keV 300 detectors with typical dimensions of 9 cm by 9 cm

Outer layer 300 microm thick double-sided orthogonal microstrip detectors spatial resolution better than 500 microm in both coordinates

energy resolution of 30 keV 120 detectors of 9 cm by 9 cm size

Detectors operated in vacuum

JM Heuser Development of silicon tracking detectors for FAIR 10

Anti-proton annihilation experiment PANDAAnti-proton annihilation experiment PANDA

A next generation hadron physics detector

Cooled antiproton beams energy 15 - 15 GeV interacting with various internal targets

Main physics topics

hadron spectroscopy search for exotic charmonia states

charm hadrons in the nuclear medium

spectroscopy of double-hypernuclei and nucleon structure

PANDA detector system4 acceptance

vertex detection MVD

particle id of Kaons muons eplusmn

electromagnetic calorimetry

momentum resolution ~ δpp = 1

high interaction rates of up to 20 MHz

JM Heuser Development of silicon tracking detectors for FAIR 11

Design features 5 space points forward of 90deg

4 barrel layers

4 forward disks

Outer 2 barrels and disks

double-sided strips ~06m2

Inner barrels and disks

hybrid pixels

Smallest possible inner radius

Fast and untriggered readout

Micro-Vertex DetectorMicro-Vertex Detector

p beam

10 cm

pellet or cluster jet targetExperimental tasks

Identification of D mesons

Measurement of long-lived baryons and mesons (open charm and strangeness)

JM Heuser Development of silicon tracking detectors for FAIR 1212

Detector PrototypingDetector PrototypingStrip layers

Outer layers pixels strips keep number of space points but less material

double-sided sensors

thickness ~200 microm

orthogonal strips

pitch of 50 ndash 100 microm

typical barrel detector 6 cm by 35 cm

lab-start ITC detector APV 25 chip

readout untriggered FEE required

synergy with CBM on XYTER

ASIC TOPIX

13 micro technology

pixel size 100x100 microm2

high readout capability

sufficient buffering to operate without trigger

ToT to retain (some) energy information

radhard within typical limits

Sensor

EPI for minimum material lt 100 microm thickness

Hybrid pixel detector layers

JM Heuser Development of silicon tracking detectors for FAIR 13

PANDA MVD ndash Radiation load mapsPANDA MVD ndash Radiation load maps

ppp at 10 GeVc p at 10 GeVc p-p-Pb at 405 GeVc Pb at 405 GeVc

1313

calculation with DPM event generator ~ 110 of radiation dose at LHC

n-equiv fluencecm2

integrated over 1 year of PANDA operation

JM Heuser Development of silicon tracking detectors for FAIR 14

CCompressed ompressed BBaryonic aryonic MMatter Experimentatter ExperimentFixed-target experiment at the SIS300 synchrotron

High-rate heavy-ion collisions projectile energies up to 45 GeVnucleon

QCD phase diagram in regions of large baryon densities and moderate temperatures

Topics

Deconfinement phase transition and high-μB QGP

Critical point

Hadron properties in dense matter

(rare) probes e and micro pairs vector mesons strangeness and charmonium open charm

dense nuclear matter (6 ndash 12) 0

time

de

nsi

ty

JM Heuser Development of silicon tracking detectors for FAIR 15

Electron-Hadron setup Muon-setup

CCompressed ompressed BBaryonic aryonic MMatter Experimentatter Experiment

JM Heuser Development of silicon tracking detectors for FAIR 16

Au+Au interactions 25 GeVu 10 MHz interaction rate

up to 1000 charged particlesevent

Track densities 30 cm-2

UrQMD generator Monte Carlo tracks

and simulated hits in microstrip detector stations

Silicon Tracking SystemSilicon Tracking System tracking nuclear collisionsthe mission

+ micro vertex detection presentation by M Deveaux

JM Heuser Development of silicon tracking detectors for FAIR 17

Exploration of a system concept

STS 8 low-mass micro-strip station1 T dipole magnet

JM Heuser Development of silicon tracking detectors for FAIR 18

Tracking stationsTracking stations

tracking station

detector module

p side (front)stereo strips

blue double metal connect-ions of strips I to III

n side (back) vertical stripsvertical strips

current layout total area 8 stations 32 m2

total number of sectors 756total number of ro channels 15Mtotal number of sensors 1068

188 sensors 2 cm times 6 cm 166 sensors 4 cm times 6 cm714 sensors 6 cm times 6 cm

total number of FE chips ~ 12k

sector

I II

III

ro directiondouble-sided microstrip detector

station with sectorization max 5 occupancy

JM Heuser Development of silicon tracking detectors for FAIR 19

Microstrip detector prototype CBM01 GSI-CIS 82007Microstrip detector prototype CBM01 GSI-CIS 82007

4 wafer 285 microm Si Test sensors

Double-sided double-metal 1024 strips per side 50 microm pitch 15ordm stereo angle full-area sensitive contacts at top + bottom edge size 5656 mm2

Double-sided single-metal 256256 strips orthogonal 50(80) microm pitch size 1515 (22 22) mm2

Main sensor

CBM01

CBM01B1

CBM01B2

not rad hard

JM Heuser Development of silicon tracking detectors for FAIR 20

Pixel vs Strip detectorsPixel vs Strip detectors

microstrip detectors hybrid pixel detectors

One central Au+Au event at 25 GeVu tracking station at z=30 cm

compared with

track points rec points gt 115 track points rec points 11

combinatorial hits

thin thick cooling

true hits

Y [c

m]

X [cm]

current choice

JM Heuser Development of silicon tracking detectors for FAIR 21

Front view (XY projection)

78 ms on Pentium 4 processor

Future farm of multi-core processors

Top view (XZ projection)

Track reconstructionTrack reconstructionCentral collision Au+Au 25 AGeV (UrQMD)

Cellular automaton + Kalman filter algorithms

96Reconstruction efficiency

lt1 ghost tracks

JM Heuser Development of silicon tracking detectors for FAIR 22

Low mass detectorLow mass detector

x[cm]

y[c

m]

- silicon detector thickness

currently 03 X0 (300m)

- station with cables and support

structure 1 X0

XX0Station 5 ( at z = 60cm)

13 for tracks pointing to the vertex

Momentum resolution

JM Heuser Development of silicon tracking detectors for FAIR 23

Typical operation for about 6 years

Situation

Interaction rate 107s Au+AuEffective CBM run year

2 months at full operation 5 times 106 s

Fluence up to ~1015 1-MeV nequiv

Radiation EnvironmentRadiation Environment

CBM cave

beam

STS

FLUKA simulation

1-MeV nequiv fluence per 1 CBM run year

dump

neutron field

last STS stationfirst STS station

(Muon setup)

JM Heuser Development of silicon tracking detectors for FAIR 24

Beginning STS system engineeringBeginning STS system engineering

STS ndash MVD ndash beam pipein a thermal enclosure

Extractable from the magnet for maintenance

Including infrastructure (cables optical links cooling)

12k FEE chips 6 ndash 12 kW power

FEE ASICs operation at 18V current 3600 ndash 7200 A

DAQ data rate ~30 GHz ~200 GBytes

JM Heuser Development of silicon tracking detectors for FAIR 25

SummarySummary

International accelerator facility FAIR under preparation

Unprecedented and new research opportunities in various fields for large scientific communities

Silicon detector systems will be important

Challenging

some because small research groups go into new detector dimensions

some because truly demanding devices are required

very high channel densities high radiation environment very fast readout very low mass pretty big ( CBM)

Cooperations of the GSIFAIR groups eg on Sensors FEE labs

Inputadvice from other experienced communities searched for

One example Planned are in-kind contributions from Finland to FAIR with rad-hard silicon strip detectors (incl RD39-RD50

expertise)

JM Heuser Development of silicon tracking detectors for FAIR 26

backup slides

JM Heuser Development of silicon tracking detectors for FAIR 27

n-XYTER readout ASICn-XYTER readout ASICDETNI - GSIDETNI - GSI

NameNamebull n-XYTER NNeutron - XX YY TTime and EEnergy ReadoutReadout

Front-endFront-endbull 128(32) channels charge sensitive pre-amplifier both polarities

bull 30 pF detector capacitance ENC 1000 e

bull self-triggered autonomous hit detection

bull time stamping with 1 ns resolution (needed to correlate x-y views)

ReadoutReadoutbull energy (peak height) and time information for each hit

bull data driven de-randomizing sparsifying readout

bull 32 MHz average hit ratendash 128 channel version (SiGEM) ~ 250 kHz hit channel

ndash 32 channel version (MSGC) ~ 1 MHz hit channel

JM Heuser Development of silicon tracking detectors for FAIR 28

32 MHzreadoutrate

n-XYTER Architecturen-XYTER Architecture

PreAmpPreAmp fast shaperfast shaper

peaking timefast 20 nsslow 140 ns

slow shaperslow shaper

timewalk

comp

comparatorcomparator

tokencell

timestamp

counter

tokenmanager

1 ns step

32 MHzreadoutrate

self-triggerlatch amplitudelatch timestore in FIFOs

outputdrivers

digitalFIFO

analogFIFO

peakdetectamp hold

Page 4: Johann M. Heuser  GSI Darmstadt, Germany VERTEX 2008, Utö Island , Sweden

JM Heuser Development of silicon tracking detectors for FAIR 4

More than 1400 people attending the event

Start of the FAIR project on 7 November 2007

Austria Germany Spain Finland France Poland Romania Russia Sweden Great

Britain and german State of Hesse

Officials from the FAIR partner states celebrating the launch of the start version

JM Heuser Development of silicon tracking detectors for FAIR 5

FFacility for acility for AAntiproton and ntiproton and IIon on RResearch esearch

GSI todayGSI today

FAIR FAIR 20162016

CBMCBM

SIS 100SIS 100

SIS 18SIS 18SIS 300SIS 300p lt 90 GeVp lt 90 GeV

ions up to U lt 45 AGeV ions up to U lt 45 AGeV

PANDAPANDA

RR33BB

EXLEXL

UnilacUnilac

p-Linacp-Linac

NewNew Widespread application of high-performance silicon detector systems at FAIR

JM Heuser Development of silicon tracking detectors for FAIR 6

experiment

Physics and programs

Structure of nuclear matter in its extreme states Exotic nuclei

Physics for nuclear energy nuclear data and modeling astrophysics

Goals of the experiment

Complete reconstruction of the reaction kinematics with stable as well as radioactive beams

Beam energies 150 MeV - 15 GeV per nucleon

Physics and programs

Nuclei far off stability

Exploring new regions in the chart of nuclides paramount interest in the fields of nuclear structure and astrophysics

Goals of the experiment

Complete reconstruction of light-ion induced direct reactions in inverse kinematics

Novel storage ring techniques and a universal detector system

Reaction studies with Relativistic

Radioactive Ion Beams

EXL experiment EXotic Nuclei Studied in Light-Ion

Induced Reactions

JM Heuser Development of silicon tracking detectors for FAIR 7

Neutrons

High Resolution Measurement

Heavy Fragments

Protons

Large Acceptance

Dipole

bull Targetbull Trackerbull Calorimeter

RIB

The R3B experiment

bull beam tracking and mom measurement pp ~10-4

bull exclusive measurement of the final state

- identification and mom analysis of fragments

(large acceptance mode pp~10-3 high-resolution mode pp~10-4)

- n p γ light recoil particles

bull applicable to a wide class of reactions

Si Recoil Tracker

First layerbull double-sided Si micro-strip detectorsbull 25 cm from target bull thickness 100 μm pitch 100 μmbull energy resolution 50 keV (FWHM)

Second layerbull double-sided Si micro-strip detectorsbull 10 cm from target bull thickness 300 μm pitch 100 μmbull energy resolution 50 keV (FWHM)

2-layer silicon tracker

~ 02 m2 area

JM Heuser Development of silicon tracking detectors for FAIR 8

EXLDetection systems for Target recoils and gammas (pnhellip) Forward ejectiles (pn) Beam-like heavy ions

Electroncooler

eA-Collider

RIB

Si DSSD E x y300 microm thick spatial resolution better than 500 microm in x and y ∆E = 30 keV (FWHM)1048766Thin Si DSSD trackinglt100 microm thick spatial reso-lution better than 100 microm in x and y ∆E = 30 keV (FWHM)1048766Si(Li) E9 mm thick large area 100 x 100 mm2 ∆E = 50 keV (FWHM)1048766CsI crystals E High efficiency high resolution 20 cm thick

2 nearly spherical silicon detector layers

~3 m2 area

Recoil detector

JM Heuser Development of silicon tracking detectors for FAIR 9

R3B 2-layer silicon tracker ~ 02 m2 area 60 microstrip detectors of about 5 cm by 7 cm size Double-sided detectors with orthogonal strip pattern read out from the same detector edge double-metal routing layer on one side Strip pitch 100 microm or smaller Detectors thickness 100 microm (inner layer)

100-300 microm thickness (outer layers)

EXL2 nearly spherical silicon layers ~3 m2 area Inner layer 100 microm thick double-sided orthogonal microstrip detectors

Spatial resolution better than 100 microm in x and yenergy resolution of 30 keV 300 detectors with typical dimensions of 9 cm by 9 cm

Outer layer 300 microm thick double-sided orthogonal microstrip detectors spatial resolution better than 500 microm in both coordinates

energy resolution of 30 keV 120 detectors of 9 cm by 9 cm size

Detectors operated in vacuum

JM Heuser Development of silicon tracking detectors for FAIR 10

Anti-proton annihilation experiment PANDAAnti-proton annihilation experiment PANDA

A next generation hadron physics detector

Cooled antiproton beams energy 15 - 15 GeV interacting with various internal targets

Main physics topics

hadron spectroscopy search for exotic charmonia states

charm hadrons in the nuclear medium

spectroscopy of double-hypernuclei and nucleon structure

PANDA detector system4 acceptance

vertex detection MVD

particle id of Kaons muons eplusmn

electromagnetic calorimetry

momentum resolution ~ δpp = 1

high interaction rates of up to 20 MHz

JM Heuser Development of silicon tracking detectors for FAIR 11

Design features 5 space points forward of 90deg

4 barrel layers

4 forward disks

Outer 2 barrels and disks

double-sided strips ~06m2

Inner barrels and disks

hybrid pixels

Smallest possible inner radius

Fast and untriggered readout

Micro-Vertex DetectorMicro-Vertex Detector

p beam

10 cm

pellet or cluster jet targetExperimental tasks

Identification of D mesons

Measurement of long-lived baryons and mesons (open charm and strangeness)

JM Heuser Development of silicon tracking detectors for FAIR 1212

Detector PrototypingDetector PrototypingStrip layers

Outer layers pixels strips keep number of space points but less material

double-sided sensors

thickness ~200 microm

orthogonal strips

pitch of 50 ndash 100 microm

typical barrel detector 6 cm by 35 cm

lab-start ITC detector APV 25 chip

readout untriggered FEE required

synergy with CBM on XYTER

ASIC TOPIX

13 micro technology

pixel size 100x100 microm2

high readout capability

sufficient buffering to operate without trigger

ToT to retain (some) energy information

radhard within typical limits

Sensor

EPI for minimum material lt 100 microm thickness

Hybrid pixel detector layers

JM Heuser Development of silicon tracking detectors for FAIR 13

PANDA MVD ndash Radiation load mapsPANDA MVD ndash Radiation load maps

ppp at 10 GeVc p at 10 GeVc p-p-Pb at 405 GeVc Pb at 405 GeVc

1313

calculation with DPM event generator ~ 110 of radiation dose at LHC

n-equiv fluencecm2

integrated over 1 year of PANDA operation

JM Heuser Development of silicon tracking detectors for FAIR 14

CCompressed ompressed BBaryonic aryonic MMatter Experimentatter ExperimentFixed-target experiment at the SIS300 synchrotron

High-rate heavy-ion collisions projectile energies up to 45 GeVnucleon

QCD phase diagram in regions of large baryon densities and moderate temperatures

Topics

Deconfinement phase transition and high-μB QGP

Critical point

Hadron properties in dense matter

(rare) probes e and micro pairs vector mesons strangeness and charmonium open charm

dense nuclear matter (6 ndash 12) 0

time

de

nsi

ty

JM Heuser Development of silicon tracking detectors for FAIR 15

Electron-Hadron setup Muon-setup

CCompressed ompressed BBaryonic aryonic MMatter Experimentatter Experiment

JM Heuser Development of silicon tracking detectors for FAIR 16

Au+Au interactions 25 GeVu 10 MHz interaction rate

up to 1000 charged particlesevent

Track densities 30 cm-2

UrQMD generator Monte Carlo tracks

and simulated hits in microstrip detector stations

Silicon Tracking SystemSilicon Tracking System tracking nuclear collisionsthe mission

+ micro vertex detection presentation by M Deveaux

JM Heuser Development of silicon tracking detectors for FAIR 17

Exploration of a system concept

STS 8 low-mass micro-strip station1 T dipole magnet

JM Heuser Development of silicon tracking detectors for FAIR 18

Tracking stationsTracking stations

tracking station

detector module

p side (front)stereo strips

blue double metal connect-ions of strips I to III

n side (back) vertical stripsvertical strips

current layout total area 8 stations 32 m2

total number of sectors 756total number of ro channels 15Mtotal number of sensors 1068

188 sensors 2 cm times 6 cm 166 sensors 4 cm times 6 cm714 sensors 6 cm times 6 cm

total number of FE chips ~ 12k

sector

I II

III

ro directiondouble-sided microstrip detector

station with sectorization max 5 occupancy

JM Heuser Development of silicon tracking detectors for FAIR 19

Microstrip detector prototype CBM01 GSI-CIS 82007Microstrip detector prototype CBM01 GSI-CIS 82007

4 wafer 285 microm Si Test sensors

Double-sided double-metal 1024 strips per side 50 microm pitch 15ordm stereo angle full-area sensitive contacts at top + bottom edge size 5656 mm2

Double-sided single-metal 256256 strips orthogonal 50(80) microm pitch size 1515 (22 22) mm2

Main sensor

CBM01

CBM01B1

CBM01B2

not rad hard

JM Heuser Development of silicon tracking detectors for FAIR 20

Pixel vs Strip detectorsPixel vs Strip detectors

microstrip detectors hybrid pixel detectors

One central Au+Au event at 25 GeVu tracking station at z=30 cm

compared with

track points rec points gt 115 track points rec points 11

combinatorial hits

thin thick cooling

true hits

Y [c

m]

X [cm]

current choice

JM Heuser Development of silicon tracking detectors for FAIR 21

Front view (XY projection)

78 ms on Pentium 4 processor

Future farm of multi-core processors

Top view (XZ projection)

Track reconstructionTrack reconstructionCentral collision Au+Au 25 AGeV (UrQMD)

Cellular automaton + Kalman filter algorithms

96Reconstruction efficiency

lt1 ghost tracks

JM Heuser Development of silicon tracking detectors for FAIR 22

Low mass detectorLow mass detector

x[cm]

y[c

m]

- silicon detector thickness

currently 03 X0 (300m)

- station with cables and support

structure 1 X0

XX0Station 5 ( at z = 60cm)

13 for tracks pointing to the vertex

Momentum resolution

JM Heuser Development of silicon tracking detectors for FAIR 23

Typical operation for about 6 years

Situation

Interaction rate 107s Au+AuEffective CBM run year

2 months at full operation 5 times 106 s

Fluence up to ~1015 1-MeV nequiv

Radiation EnvironmentRadiation Environment

CBM cave

beam

STS

FLUKA simulation

1-MeV nequiv fluence per 1 CBM run year

dump

neutron field

last STS stationfirst STS station

(Muon setup)

JM Heuser Development of silicon tracking detectors for FAIR 24

Beginning STS system engineeringBeginning STS system engineering

STS ndash MVD ndash beam pipein a thermal enclosure

Extractable from the magnet for maintenance

Including infrastructure (cables optical links cooling)

12k FEE chips 6 ndash 12 kW power

FEE ASICs operation at 18V current 3600 ndash 7200 A

DAQ data rate ~30 GHz ~200 GBytes

JM Heuser Development of silicon tracking detectors for FAIR 25

SummarySummary

International accelerator facility FAIR under preparation

Unprecedented and new research opportunities in various fields for large scientific communities

Silicon detector systems will be important

Challenging

some because small research groups go into new detector dimensions

some because truly demanding devices are required

very high channel densities high radiation environment very fast readout very low mass pretty big ( CBM)

Cooperations of the GSIFAIR groups eg on Sensors FEE labs

Inputadvice from other experienced communities searched for

One example Planned are in-kind contributions from Finland to FAIR with rad-hard silicon strip detectors (incl RD39-RD50

expertise)

JM Heuser Development of silicon tracking detectors for FAIR 26

backup slides

JM Heuser Development of silicon tracking detectors for FAIR 27

n-XYTER readout ASICn-XYTER readout ASICDETNI - GSIDETNI - GSI

NameNamebull n-XYTER NNeutron - XX YY TTime and EEnergy ReadoutReadout

Front-endFront-endbull 128(32) channels charge sensitive pre-amplifier both polarities

bull 30 pF detector capacitance ENC 1000 e

bull self-triggered autonomous hit detection

bull time stamping with 1 ns resolution (needed to correlate x-y views)

ReadoutReadoutbull energy (peak height) and time information for each hit

bull data driven de-randomizing sparsifying readout

bull 32 MHz average hit ratendash 128 channel version (SiGEM) ~ 250 kHz hit channel

ndash 32 channel version (MSGC) ~ 1 MHz hit channel

JM Heuser Development of silicon tracking detectors for FAIR 28

32 MHzreadoutrate

n-XYTER Architecturen-XYTER Architecture

PreAmpPreAmp fast shaperfast shaper

peaking timefast 20 nsslow 140 ns

slow shaperslow shaper

timewalk

comp

comparatorcomparator

tokencell

timestamp

counter

tokenmanager

1 ns step

32 MHzreadoutrate

self-triggerlatch amplitudelatch timestore in FIFOs

outputdrivers

digitalFIFO

analogFIFO

peakdetectamp hold

Page 5: Johann M. Heuser  GSI Darmstadt, Germany VERTEX 2008, Utö Island , Sweden

JM Heuser Development of silicon tracking detectors for FAIR 5

FFacility for acility for AAntiproton and ntiproton and IIon on RResearch esearch

GSI todayGSI today

FAIR FAIR 20162016

CBMCBM

SIS 100SIS 100

SIS 18SIS 18SIS 300SIS 300p lt 90 GeVp lt 90 GeV

ions up to U lt 45 AGeV ions up to U lt 45 AGeV

PANDAPANDA

RR33BB

EXLEXL

UnilacUnilac

p-Linacp-Linac

NewNew Widespread application of high-performance silicon detector systems at FAIR

JM Heuser Development of silicon tracking detectors for FAIR 6

experiment

Physics and programs

Structure of nuclear matter in its extreme states Exotic nuclei

Physics for nuclear energy nuclear data and modeling astrophysics

Goals of the experiment

Complete reconstruction of the reaction kinematics with stable as well as radioactive beams

Beam energies 150 MeV - 15 GeV per nucleon

Physics and programs

Nuclei far off stability

Exploring new regions in the chart of nuclides paramount interest in the fields of nuclear structure and astrophysics

Goals of the experiment

Complete reconstruction of light-ion induced direct reactions in inverse kinematics

Novel storage ring techniques and a universal detector system

Reaction studies with Relativistic

Radioactive Ion Beams

EXL experiment EXotic Nuclei Studied in Light-Ion

Induced Reactions

JM Heuser Development of silicon tracking detectors for FAIR 7

Neutrons

High Resolution Measurement

Heavy Fragments

Protons

Large Acceptance

Dipole

bull Targetbull Trackerbull Calorimeter

RIB

The R3B experiment

bull beam tracking and mom measurement pp ~10-4

bull exclusive measurement of the final state

- identification and mom analysis of fragments

(large acceptance mode pp~10-3 high-resolution mode pp~10-4)

- n p γ light recoil particles

bull applicable to a wide class of reactions

Si Recoil Tracker

First layerbull double-sided Si micro-strip detectorsbull 25 cm from target bull thickness 100 μm pitch 100 μmbull energy resolution 50 keV (FWHM)

Second layerbull double-sided Si micro-strip detectorsbull 10 cm from target bull thickness 300 μm pitch 100 μmbull energy resolution 50 keV (FWHM)

2-layer silicon tracker

~ 02 m2 area

JM Heuser Development of silicon tracking detectors for FAIR 8

EXLDetection systems for Target recoils and gammas (pnhellip) Forward ejectiles (pn) Beam-like heavy ions

Electroncooler

eA-Collider

RIB

Si DSSD E x y300 microm thick spatial resolution better than 500 microm in x and y ∆E = 30 keV (FWHM)1048766Thin Si DSSD trackinglt100 microm thick spatial reso-lution better than 100 microm in x and y ∆E = 30 keV (FWHM)1048766Si(Li) E9 mm thick large area 100 x 100 mm2 ∆E = 50 keV (FWHM)1048766CsI crystals E High efficiency high resolution 20 cm thick

2 nearly spherical silicon detector layers

~3 m2 area

Recoil detector

JM Heuser Development of silicon tracking detectors for FAIR 9

R3B 2-layer silicon tracker ~ 02 m2 area 60 microstrip detectors of about 5 cm by 7 cm size Double-sided detectors with orthogonal strip pattern read out from the same detector edge double-metal routing layer on one side Strip pitch 100 microm or smaller Detectors thickness 100 microm (inner layer)

100-300 microm thickness (outer layers)

EXL2 nearly spherical silicon layers ~3 m2 area Inner layer 100 microm thick double-sided orthogonal microstrip detectors

Spatial resolution better than 100 microm in x and yenergy resolution of 30 keV 300 detectors with typical dimensions of 9 cm by 9 cm

Outer layer 300 microm thick double-sided orthogonal microstrip detectors spatial resolution better than 500 microm in both coordinates

energy resolution of 30 keV 120 detectors of 9 cm by 9 cm size

Detectors operated in vacuum

JM Heuser Development of silicon tracking detectors for FAIR 10

Anti-proton annihilation experiment PANDAAnti-proton annihilation experiment PANDA

A next generation hadron physics detector

Cooled antiproton beams energy 15 - 15 GeV interacting with various internal targets

Main physics topics

hadron spectroscopy search for exotic charmonia states

charm hadrons in the nuclear medium

spectroscopy of double-hypernuclei and nucleon structure

PANDA detector system4 acceptance

vertex detection MVD

particle id of Kaons muons eplusmn

electromagnetic calorimetry

momentum resolution ~ δpp = 1

high interaction rates of up to 20 MHz

JM Heuser Development of silicon tracking detectors for FAIR 11

Design features 5 space points forward of 90deg

4 barrel layers

4 forward disks

Outer 2 barrels and disks

double-sided strips ~06m2

Inner barrels and disks

hybrid pixels

Smallest possible inner radius

Fast and untriggered readout

Micro-Vertex DetectorMicro-Vertex Detector

p beam

10 cm

pellet or cluster jet targetExperimental tasks

Identification of D mesons

Measurement of long-lived baryons and mesons (open charm and strangeness)

JM Heuser Development of silicon tracking detectors for FAIR 1212

Detector PrototypingDetector PrototypingStrip layers

Outer layers pixels strips keep number of space points but less material

double-sided sensors

thickness ~200 microm

orthogonal strips

pitch of 50 ndash 100 microm

typical barrel detector 6 cm by 35 cm

lab-start ITC detector APV 25 chip

readout untriggered FEE required

synergy with CBM on XYTER

ASIC TOPIX

13 micro technology

pixel size 100x100 microm2

high readout capability

sufficient buffering to operate without trigger

ToT to retain (some) energy information

radhard within typical limits

Sensor

EPI for minimum material lt 100 microm thickness

Hybrid pixel detector layers

JM Heuser Development of silicon tracking detectors for FAIR 13

PANDA MVD ndash Radiation load mapsPANDA MVD ndash Radiation load maps

ppp at 10 GeVc p at 10 GeVc p-p-Pb at 405 GeVc Pb at 405 GeVc

1313

calculation with DPM event generator ~ 110 of radiation dose at LHC

n-equiv fluencecm2

integrated over 1 year of PANDA operation

JM Heuser Development of silicon tracking detectors for FAIR 14

CCompressed ompressed BBaryonic aryonic MMatter Experimentatter ExperimentFixed-target experiment at the SIS300 synchrotron

High-rate heavy-ion collisions projectile energies up to 45 GeVnucleon

QCD phase diagram in regions of large baryon densities and moderate temperatures

Topics

Deconfinement phase transition and high-μB QGP

Critical point

Hadron properties in dense matter

(rare) probes e and micro pairs vector mesons strangeness and charmonium open charm

dense nuclear matter (6 ndash 12) 0

time

de

nsi

ty

JM Heuser Development of silicon tracking detectors for FAIR 15

Electron-Hadron setup Muon-setup

CCompressed ompressed BBaryonic aryonic MMatter Experimentatter Experiment

JM Heuser Development of silicon tracking detectors for FAIR 16

Au+Au interactions 25 GeVu 10 MHz interaction rate

up to 1000 charged particlesevent

Track densities 30 cm-2

UrQMD generator Monte Carlo tracks

and simulated hits in microstrip detector stations

Silicon Tracking SystemSilicon Tracking System tracking nuclear collisionsthe mission

+ micro vertex detection presentation by M Deveaux

JM Heuser Development of silicon tracking detectors for FAIR 17

Exploration of a system concept

STS 8 low-mass micro-strip station1 T dipole magnet

JM Heuser Development of silicon tracking detectors for FAIR 18

Tracking stationsTracking stations

tracking station

detector module

p side (front)stereo strips

blue double metal connect-ions of strips I to III

n side (back) vertical stripsvertical strips

current layout total area 8 stations 32 m2

total number of sectors 756total number of ro channels 15Mtotal number of sensors 1068

188 sensors 2 cm times 6 cm 166 sensors 4 cm times 6 cm714 sensors 6 cm times 6 cm

total number of FE chips ~ 12k

sector

I II

III

ro directiondouble-sided microstrip detector

station with sectorization max 5 occupancy

JM Heuser Development of silicon tracking detectors for FAIR 19

Microstrip detector prototype CBM01 GSI-CIS 82007Microstrip detector prototype CBM01 GSI-CIS 82007

4 wafer 285 microm Si Test sensors

Double-sided double-metal 1024 strips per side 50 microm pitch 15ordm stereo angle full-area sensitive contacts at top + bottom edge size 5656 mm2

Double-sided single-metal 256256 strips orthogonal 50(80) microm pitch size 1515 (22 22) mm2

Main sensor

CBM01

CBM01B1

CBM01B2

not rad hard

JM Heuser Development of silicon tracking detectors for FAIR 20

Pixel vs Strip detectorsPixel vs Strip detectors

microstrip detectors hybrid pixel detectors

One central Au+Au event at 25 GeVu tracking station at z=30 cm

compared with

track points rec points gt 115 track points rec points 11

combinatorial hits

thin thick cooling

true hits

Y [c

m]

X [cm]

current choice

JM Heuser Development of silicon tracking detectors for FAIR 21

Front view (XY projection)

78 ms on Pentium 4 processor

Future farm of multi-core processors

Top view (XZ projection)

Track reconstructionTrack reconstructionCentral collision Au+Au 25 AGeV (UrQMD)

Cellular automaton + Kalman filter algorithms

96Reconstruction efficiency

lt1 ghost tracks

JM Heuser Development of silicon tracking detectors for FAIR 22

Low mass detectorLow mass detector

x[cm]

y[c

m]

- silicon detector thickness

currently 03 X0 (300m)

- station with cables and support

structure 1 X0

XX0Station 5 ( at z = 60cm)

13 for tracks pointing to the vertex

Momentum resolution

JM Heuser Development of silicon tracking detectors for FAIR 23

Typical operation for about 6 years

Situation

Interaction rate 107s Au+AuEffective CBM run year

2 months at full operation 5 times 106 s

Fluence up to ~1015 1-MeV nequiv

Radiation EnvironmentRadiation Environment

CBM cave

beam

STS

FLUKA simulation

1-MeV nequiv fluence per 1 CBM run year

dump

neutron field

last STS stationfirst STS station

(Muon setup)

JM Heuser Development of silicon tracking detectors for FAIR 24

Beginning STS system engineeringBeginning STS system engineering

STS ndash MVD ndash beam pipein a thermal enclosure

Extractable from the magnet for maintenance

Including infrastructure (cables optical links cooling)

12k FEE chips 6 ndash 12 kW power

FEE ASICs operation at 18V current 3600 ndash 7200 A

DAQ data rate ~30 GHz ~200 GBytes

JM Heuser Development of silicon tracking detectors for FAIR 25

SummarySummary

International accelerator facility FAIR under preparation

Unprecedented and new research opportunities in various fields for large scientific communities

Silicon detector systems will be important

Challenging

some because small research groups go into new detector dimensions

some because truly demanding devices are required

very high channel densities high radiation environment very fast readout very low mass pretty big ( CBM)

Cooperations of the GSIFAIR groups eg on Sensors FEE labs

Inputadvice from other experienced communities searched for

One example Planned are in-kind contributions from Finland to FAIR with rad-hard silicon strip detectors (incl RD39-RD50

expertise)

JM Heuser Development of silicon tracking detectors for FAIR 26

backup slides

JM Heuser Development of silicon tracking detectors for FAIR 27

n-XYTER readout ASICn-XYTER readout ASICDETNI - GSIDETNI - GSI

NameNamebull n-XYTER NNeutron - XX YY TTime and EEnergy ReadoutReadout

Front-endFront-endbull 128(32) channels charge sensitive pre-amplifier both polarities

bull 30 pF detector capacitance ENC 1000 e

bull self-triggered autonomous hit detection

bull time stamping with 1 ns resolution (needed to correlate x-y views)

ReadoutReadoutbull energy (peak height) and time information for each hit

bull data driven de-randomizing sparsifying readout

bull 32 MHz average hit ratendash 128 channel version (SiGEM) ~ 250 kHz hit channel

ndash 32 channel version (MSGC) ~ 1 MHz hit channel

JM Heuser Development of silicon tracking detectors for FAIR 28

32 MHzreadoutrate

n-XYTER Architecturen-XYTER Architecture

PreAmpPreAmp fast shaperfast shaper

peaking timefast 20 nsslow 140 ns

slow shaperslow shaper

timewalk

comp

comparatorcomparator

tokencell

timestamp

counter

tokenmanager

1 ns step

32 MHzreadoutrate

self-triggerlatch amplitudelatch timestore in FIFOs

outputdrivers

digitalFIFO

analogFIFO

peakdetectamp hold

Page 6: Johann M. Heuser  GSI Darmstadt, Germany VERTEX 2008, Utö Island , Sweden

JM Heuser Development of silicon tracking detectors for FAIR 6

experiment

Physics and programs

Structure of nuclear matter in its extreme states Exotic nuclei

Physics for nuclear energy nuclear data and modeling astrophysics

Goals of the experiment

Complete reconstruction of the reaction kinematics with stable as well as radioactive beams

Beam energies 150 MeV - 15 GeV per nucleon

Physics and programs

Nuclei far off stability

Exploring new regions in the chart of nuclides paramount interest in the fields of nuclear structure and astrophysics

Goals of the experiment

Complete reconstruction of light-ion induced direct reactions in inverse kinematics

Novel storage ring techniques and a universal detector system

Reaction studies with Relativistic

Radioactive Ion Beams

EXL experiment EXotic Nuclei Studied in Light-Ion

Induced Reactions

JM Heuser Development of silicon tracking detectors for FAIR 7

Neutrons

High Resolution Measurement

Heavy Fragments

Protons

Large Acceptance

Dipole

bull Targetbull Trackerbull Calorimeter

RIB

The R3B experiment

bull beam tracking and mom measurement pp ~10-4

bull exclusive measurement of the final state

- identification and mom analysis of fragments

(large acceptance mode pp~10-3 high-resolution mode pp~10-4)

- n p γ light recoil particles

bull applicable to a wide class of reactions

Si Recoil Tracker

First layerbull double-sided Si micro-strip detectorsbull 25 cm from target bull thickness 100 μm pitch 100 μmbull energy resolution 50 keV (FWHM)

Second layerbull double-sided Si micro-strip detectorsbull 10 cm from target bull thickness 300 μm pitch 100 μmbull energy resolution 50 keV (FWHM)

2-layer silicon tracker

~ 02 m2 area

JM Heuser Development of silicon tracking detectors for FAIR 8

EXLDetection systems for Target recoils and gammas (pnhellip) Forward ejectiles (pn) Beam-like heavy ions

Electroncooler

eA-Collider

RIB

Si DSSD E x y300 microm thick spatial resolution better than 500 microm in x and y ∆E = 30 keV (FWHM)1048766Thin Si DSSD trackinglt100 microm thick spatial reso-lution better than 100 microm in x and y ∆E = 30 keV (FWHM)1048766Si(Li) E9 mm thick large area 100 x 100 mm2 ∆E = 50 keV (FWHM)1048766CsI crystals E High efficiency high resolution 20 cm thick

2 nearly spherical silicon detector layers

~3 m2 area

Recoil detector

JM Heuser Development of silicon tracking detectors for FAIR 9

R3B 2-layer silicon tracker ~ 02 m2 area 60 microstrip detectors of about 5 cm by 7 cm size Double-sided detectors with orthogonal strip pattern read out from the same detector edge double-metal routing layer on one side Strip pitch 100 microm or smaller Detectors thickness 100 microm (inner layer)

100-300 microm thickness (outer layers)

EXL2 nearly spherical silicon layers ~3 m2 area Inner layer 100 microm thick double-sided orthogonal microstrip detectors

Spatial resolution better than 100 microm in x and yenergy resolution of 30 keV 300 detectors with typical dimensions of 9 cm by 9 cm

Outer layer 300 microm thick double-sided orthogonal microstrip detectors spatial resolution better than 500 microm in both coordinates

energy resolution of 30 keV 120 detectors of 9 cm by 9 cm size

Detectors operated in vacuum

JM Heuser Development of silicon tracking detectors for FAIR 10

Anti-proton annihilation experiment PANDAAnti-proton annihilation experiment PANDA

A next generation hadron physics detector

Cooled antiproton beams energy 15 - 15 GeV interacting with various internal targets

Main physics topics

hadron spectroscopy search for exotic charmonia states

charm hadrons in the nuclear medium

spectroscopy of double-hypernuclei and nucleon structure

PANDA detector system4 acceptance

vertex detection MVD

particle id of Kaons muons eplusmn

electromagnetic calorimetry

momentum resolution ~ δpp = 1

high interaction rates of up to 20 MHz

JM Heuser Development of silicon tracking detectors for FAIR 11

Design features 5 space points forward of 90deg

4 barrel layers

4 forward disks

Outer 2 barrels and disks

double-sided strips ~06m2

Inner barrels and disks

hybrid pixels

Smallest possible inner radius

Fast and untriggered readout

Micro-Vertex DetectorMicro-Vertex Detector

p beam

10 cm

pellet or cluster jet targetExperimental tasks

Identification of D mesons

Measurement of long-lived baryons and mesons (open charm and strangeness)

JM Heuser Development of silicon tracking detectors for FAIR 1212

Detector PrototypingDetector PrototypingStrip layers

Outer layers pixels strips keep number of space points but less material

double-sided sensors

thickness ~200 microm

orthogonal strips

pitch of 50 ndash 100 microm

typical barrel detector 6 cm by 35 cm

lab-start ITC detector APV 25 chip

readout untriggered FEE required

synergy with CBM on XYTER

ASIC TOPIX

13 micro technology

pixel size 100x100 microm2

high readout capability

sufficient buffering to operate without trigger

ToT to retain (some) energy information

radhard within typical limits

Sensor

EPI for minimum material lt 100 microm thickness

Hybrid pixel detector layers

JM Heuser Development of silicon tracking detectors for FAIR 13

PANDA MVD ndash Radiation load mapsPANDA MVD ndash Radiation load maps

ppp at 10 GeVc p at 10 GeVc p-p-Pb at 405 GeVc Pb at 405 GeVc

1313

calculation with DPM event generator ~ 110 of radiation dose at LHC

n-equiv fluencecm2

integrated over 1 year of PANDA operation

JM Heuser Development of silicon tracking detectors for FAIR 14

CCompressed ompressed BBaryonic aryonic MMatter Experimentatter ExperimentFixed-target experiment at the SIS300 synchrotron

High-rate heavy-ion collisions projectile energies up to 45 GeVnucleon

QCD phase diagram in regions of large baryon densities and moderate temperatures

Topics

Deconfinement phase transition and high-μB QGP

Critical point

Hadron properties in dense matter

(rare) probes e and micro pairs vector mesons strangeness and charmonium open charm

dense nuclear matter (6 ndash 12) 0

time

de

nsi

ty

JM Heuser Development of silicon tracking detectors for FAIR 15

Electron-Hadron setup Muon-setup

CCompressed ompressed BBaryonic aryonic MMatter Experimentatter Experiment

JM Heuser Development of silicon tracking detectors for FAIR 16

Au+Au interactions 25 GeVu 10 MHz interaction rate

up to 1000 charged particlesevent

Track densities 30 cm-2

UrQMD generator Monte Carlo tracks

and simulated hits in microstrip detector stations

Silicon Tracking SystemSilicon Tracking System tracking nuclear collisionsthe mission

+ micro vertex detection presentation by M Deveaux

JM Heuser Development of silicon tracking detectors for FAIR 17

Exploration of a system concept

STS 8 low-mass micro-strip station1 T dipole magnet

JM Heuser Development of silicon tracking detectors for FAIR 18

Tracking stationsTracking stations

tracking station

detector module

p side (front)stereo strips

blue double metal connect-ions of strips I to III

n side (back) vertical stripsvertical strips

current layout total area 8 stations 32 m2

total number of sectors 756total number of ro channels 15Mtotal number of sensors 1068

188 sensors 2 cm times 6 cm 166 sensors 4 cm times 6 cm714 sensors 6 cm times 6 cm

total number of FE chips ~ 12k

sector

I II

III

ro directiondouble-sided microstrip detector

station with sectorization max 5 occupancy

JM Heuser Development of silicon tracking detectors for FAIR 19

Microstrip detector prototype CBM01 GSI-CIS 82007Microstrip detector prototype CBM01 GSI-CIS 82007

4 wafer 285 microm Si Test sensors

Double-sided double-metal 1024 strips per side 50 microm pitch 15ordm stereo angle full-area sensitive contacts at top + bottom edge size 5656 mm2

Double-sided single-metal 256256 strips orthogonal 50(80) microm pitch size 1515 (22 22) mm2

Main sensor

CBM01

CBM01B1

CBM01B2

not rad hard

JM Heuser Development of silicon tracking detectors for FAIR 20

Pixel vs Strip detectorsPixel vs Strip detectors

microstrip detectors hybrid pixel detectors

One central Au+Au event at 25 GeVu tracking station at z=30 cm

compared with

track points rec points gt 115 track points rec points 11

combinatorial hits

thin thick cooling

true hits

Y [c

m]

X [cm]

current choice

JM Heuser Development of silicon tracking detectors for FAIR 21

Front view (XY projection)

78 ms on Pentium 4 processor

Future farm of multi-core processors

Top view (XZ projection)

Track reconstructionTrack reconstructionCentral collision Au+Au 25 AGeV (UrQMD)

Cellular automaton + Kalman filter algorithms

96Reconstruction efficiency

lt1 ghost tracks

JM Heuser Development of silicon tracking detectors for FAIR 22

Low mass detectorLow mass detector

x[cm]

y[c

m]

- silicon detector thickness

currently 03 X0 (300m)

- station with cables and support

structure 1 X0

XX0Station 5 ( at z = 60cm)

13 for tracks pointing to the vertex

Momentum resolution

JM Heuser Development of silicon tracking detectors for FAIR 23

Typical operation for about 6 years

Situation

Interaction rate 107s Au+AuEffective CBM run year

2 months at full operation 5 times 106 s

Fluence up to ~1015 1-MeV nequiv

Radiation EnvironmentRadiation Environment

CBM cave

beam

STS

FLUKA simulation

1-MeV nequiv fluence per 1 CBM run year

dump

neutron field

last STS stationfirst STS station

(Muon setup)

JM Heuser Development of silicon tracking detectors for FAIR 24

Beginning STS system engineeringBeginning STS system engineering

STS ndash MVD ndash beam pipein a thermal enclosure

Extractable from the magnet for maintenance

Including infrastructure (cables optical links cooling)

12k FEE chips 6 ndash 12 kW power

FEE ASICs operation at 18V current 3600 ndash 7200 A

DAQ data rate ~30 GHz ~200 GBytes

JM Heuser Development of silicon tracking detectors for FAIR 25

SummarySummary

International accelerator facility FAIR under preparation

Unprecedented and new research opportunities in various fields for large scientific communities

Silicon detector systems will be important

Challenging

some because small research groups go into new detector dimensions

some because truly demanding devices are required

very high channel densities high radiation environment very fast readout very low mass pretty big ( CBM)

Cooperations of the GSIFAIR groups eg on Sensors FEE labs

Inputadvice from other experienced communities searched for

One example Planned are in-kind contributions from Finland to FAIR with rad-hard silicon strip detectors (incl RD39-RD50

expertise)

JM Heuser Development of silicon tracking detectors for FAIR 26

backup slides

JM Heuser Development of silicon tracking detectors for FAIR 27

n-XYTER readout ASICn-XYTER readout ASICDETNI - GSIDETNI - GSI

NameNamebull n-XYTER NNeutron - XX YY TTime and EEnergy ReadoutReadout

Front-endFront-endbull 128(32) channels charge sensitive pre-amplifier both polarities

bull 30 pF detector capacitance ENC 1000 e

bull self-triggered autonomous hit detection

bull time stamping with 1 ns resolution (needed to correlate x-y views)

ReadoutReadoutbull energy (peak height) and time information for each hit

bull data driven de-randomizing sparsifying readout

bull 32 MHz average hit ratendash 128 channel version (SiGEM) ~ 250 kHz hit channel

ndash 32 channel version (MSGC) ~ 1 MHz hit channel

JM Heuser Development of silicon tracking detectors for FAIR 28

32 MHzreadoutrate

n-XYTER Architecturen-XYTER Architecture

PreAmpPreAmp fast shaperfast shaper

peaking timefast 20 nsslow 140 ns

slow shaperslow shaper

timewalk

comp

comparatorcomparator

tokencell

timestamp

counter

tokenmanager

1 ns step

32 MHzreadoutrate

self-triggerlatch amplitudelatch timestore in FIFOs

outputdrivers

digitalFIFO

analogFIFO

peakdetectamp hold

Page 7: Johann M. Heuser  GSI Darmstadt, Germany VERTEX 2008, Utö Island , Sweden

JM Heuser Development of silicon tracking detectors for FAIR 7

Neutrons

High Resolution Measurement

Heavy Fragments

Protons

Large Acceptance

Dipole

bull Targetbull Trackerbull Calorimeter

RIB

The R3B experiment

bull beam tracking and mom measurement pp ~10-4

bull exclusive measurement of the final state

- identification and mom analysis of fragments

(large acceptance mode pp~10-3 high-resolution mode pp~10-4)

- n p γ light recoil particles

bull applicable to a wide class of reactions

Si Recoil Tracker

First layerbull double-sided Si micro-strip detectorsbull 25 cm from target bull thickness 100 μm pitch 100 μmbull energy resolution 50 keV (FWHM)

Second layerbull double-sided Si micro-strip detectorsbull 10 cm from target bull thickness 300 μm pitch 100 μmbull energy resolution 50 keV (FWHM)

2-layer silicon tracker

~ 02 m2 area

JM Heuser Development of silicon tracking detectors for FAIR 8

EXLDetection systems for Target recoils and gammas (pnhellip) Forward ejectiles (pn) Beam-like heavy ions

Electroncooler

eA-Collider

RIB

Si DSSD E x y300 microm thick spatial resolution better than 500 microm in x and y ∆E = 30 keV (FWHM)1048766Thin Si DSSD trackinglt100 microm thick spatial reso-lution better than 100 microm in x and y ∆E = 30 keV (FWHM)1048766Si(Li) E9 mm thick large area 100 x 100 mm2 ∆E = 50 keV (FWHM)1048766CsI crystals E High efficiency high resolution 20 cm thick

2 nearly spherical silicon detector layers

~3 m2 area

Recoil detector

JM Heuser Development of silicon tracking detectors for FAIR 9

R3B 2-layer silicon tracker ~ 02 m2 area 60 microstrip detectors of about 5 cm by 7 cm size Double-sided detectors with orthogonal strip pattern read out from the same detector edge double-metal routing layer on one side Strip pitch 100 microm or smaller Detectors thickness 100 microm (inner layer)

100-300 microm thickness (outer layers)

EXL2 nearly spherical silicon layers ~3 m2 area Inner layer 100 microm thick double-sided orthogonal microstrip detectors

Spatial resolution better than 100 microm in x and yenergy resolution of 30 keV 300 detectors with typical dimensions of 9 cm by 9 cm

Outer layer 300 microm thick double-sided orthogonal microstrip detectors spatial resolution better than 500 microm in both coordinates

energy resolution of 30 keV 120 detectors of 9 cm by 9 cm size

Detectors operated in vacuum

JM Heuser Development of silicon tracking detectors for FAIR 10

Anti-proton annihilation experiment PANDAAnti-proton annihilation experiment PANDA

A next generation hadron physics detector

Cooled antiproton beams energy 15 - 15 GeV interacting with various internal targets

Main physics topics

hadron spectroscopy search for exotic charmonia states

charm hadrons in the nuclear medium

spectroscopy of double-hypernuclei and nucleon structure

PANDA detector system4 acceptance

vertex detection MVD

particle id of Kaons muons eplusmn

electromagnetic calorimetry

momentum resolution ~ δpp = 1

high interaction rates of up to 20 MHz

JM Heuser Development of silicon tracking detectors for FAIR 11

Design features 5 space points forward of 90deg

4 barrel layers

4 forward disks

Outer 2 barrels and disks

double-sided strips ~06m2

Inner barrels and disks

hybrid pixels

Smallest possible inner radius

Fast and untriggered readout

Micro-Vertex DetectorMicro-Vertex Detector

p beam

10 cm

pellet or cluster jet targetExperimental tasks

Identification of D mesons

Measurement of long-lived baryons and mesons (open charm and strangeness)

JM Heuser Development of silicon tracking detectors for FAIR 1212

Detector PrototypingDetector PrototypingStrip layers

Outer layers pixels strips keep number of space points but less material

double-sided sensors

thickness ~200 microm

orthogonal strips

pitch of 50 ndash 100 microm

typical barrel detector 6 cm by 35 cm

lab-start ITC detector APV 25 chip

readout untriggered FEE required

synergy with CBM on XYTER

ASIC TOPIX

13 micro technology

pixel size 100x100 microm2

high readout capability

sufficient buffering to operate without trigger

ToT to retain (some) energy information

radhard within typical limits

Sensor

EPI for minimum material lt 100 microm thickness

Hybrid pixel detector layers

JM Heuser Development of silicon tracking detectors for FAIR 13

PANDA MVD ndash Radiation load mapsPANDA MVD ndash Radiation load maps

ppp at 10 GeVc p at 10 GeVc p-p-Pb at 405 GeVc Pb at 405 GeVc

1313

calculation with DPM event generator ~ 110 of radiation dose at LHC

n-equiv fluencecm2

integrated over 1 year of PANDA operation

JM Heuser Development of silicon tracking detectors for FAIR 14

CCompressed ompressed BBaryonic aryonic MMatter Experimentatter ExperimentFixed-target experiment at the SIS300 synchrotron

High-rate heavy-ion collisions projectile energies up to 45 GeVnucleon

QCD phase diagram in regions of large baryon densities and moderate temperatures

Topics

Deconfinement phase transition and high-μB QGP

Critical point

Hadron properties in dense matter

(rare) probes e and micro pairs vector mesons strangeness and charmonium open charm

dense nuclear matter (6 ndash 12) 0

time

de

nsi

ty

JM Heuser Development of silicon tracking detectors for FAIR 15

Electron-Hadron setup Muon-setup

CCompressed ompressed BBaryonic aryonic MMatter Experimentatter Experiment

JM Heuser Development of silicon tracking detectors for FAIR 16

Au+Au interactions 25 GeVu 10 MHz interaction rate

up to 1000 charged particlesevent

Track densities 30 cm-2

UrQMD generator Monte Carlo tracks

and simulated hits in microstrip detector stations

Silicon Tracking SystemSilicon Tracking System tracking nuclear collisionsthe mission

+ micro vertex detection presentation by M Deveaux

JM Heuser Development of silicon tracking detectors for FAIR 17

Exploration of a system concept

STS 8 low-mass micro-strip station1 T dipole magnet

JM Heuser Development of silicon tracking detectors for FAIR 18

Tracking stationsTracking stations

tracking station

detector module

p side (front)stereo strips

blue double metal connect-ions of strips I to III

n side (back) vertical stripsvertical strips

current layout total area 8 stations 32 m2

total number of sectors 756total number of ro channels 15Mtotal number of sensors 1068

188 sensors 2 cm times 6 cm 166 sensors 4 cm times 6 cm714 sensors 6 cm times 6 cm

total number of FE chips ~ 12k

sector

I II

III

ro directiondouble-sided microstrip detector

station with sectorization max 5 occupancy

JM Heuser Development of silicon tracking detectors for FAIR 19

Microstrip detector prototype CBM01 GSI-CIS 82007Microstrip detector prototype CBM01 GSI-CIS 82007

4 wafer 285 microm Si Test sensors

Double-sided double-metal 1024 strips per side 50 microm pitch 15ordm stereo angle full-area sensitive contacts at top + bottom edge size 5656 mm2

Double-sided single-metal 256256 strips orthogonal 50(80) microm pitch size 1515 (22 22) mm2

Main sensor

CBM01

CBM01B1

CBM01B2

not rad hard

JM Heuser Development of silicon tracking detectors for FAIR 20

Pixel vs Strip detectorsPixel vs Strip detectors

microstrip detectors hybrid pixel detectors

One central Au+Au event at 25 GeVu tracking station at z=30 cm

compared with

track points rec points gt 115 track points rec points 11

combinatorial hits

thin thick cooling

true hits

Y [c

m]

X [cm]

current choice

JM Heuser Development of silicon tracking detectors for FAIR 21

Front view (XY projection)

78 ms on Pentium 4 processor

Future farm of multi-core processors

Top view (XZ projection)

Track reconstructionTrack reconstructionCentral collision Au+Au 25 AGeV (UrQMD)

Cellular automaton + Kalman filter algorithms

96Reconstruction efficiency

lt1 ghost tracks

JM Heuser Development of silicon tracking detectors for FAIR 22

Low mass detectorLow mass detector

x[cm]

y[c

m]

- silicon detector thickness

currently 03 X0 (300m)

- station with cables and support

structure 1 X0

XX0Station 5 ( at z = 60cm)

13 for tracks pointing to the vertex

Momentum resolution

JM Heuser Development of silicon tracking detectors for FAIR 23

Typical operation for about 6 years

Situation

Interaction rate 107s Au+AuEffective CBM run year

2 months at full operation 5 times 106 s

Fluence up to ~1015 1-MeV nequiv

Radiation EnvironmentRadiation Environment

CBM cave

beam

STS

FLUKA simulation

1-MeV nequiv fluence per 1 CBM run year

dump

neutron field

last STS stationfirst STS station

(Muon setup)

JM Heuser Development of silicon tracking detectors for FAIR 24

Beginning STS system engineeringBeginning STS system engineering

STS ndash MVD ndash beam pipein a thermal enclosure

Extractable from the magnet for maintenance

Including infrastructure (cables optical links cooling)

12k FEE chips 6 ndash 12 kW power

FEE ASICs operation at 18V current 3600 ndash 7200 A

DAQ data rate ~30 GHz ~200 GBytes

JM Heuser Development of silicon tracking detectors for FAIR 25

SummarySummary

International accelerator facility FAIR under preparation

Unprecedented and new research opportunities in various fields for large scientific communities

Silicon detector systems will be important

Challenging

some because small research groups go into new detector dimensions

some because truly demanding devices are required

very high channel densities high radiation environment very fast readout very low mass pretty big ( CBM)

Cooperations of the GSIFAIR groups eg on Sensors FEE labs

Inputadvice from other experienced communities searched for

One example Planned are in-kind contributions from Finland to FAIR with rad-hard silicon strip detectors (incl RD39-RD50

expertise)

JM Heuser Development of silicon tracking detectors for FAIR 26

backup slides

JM Heuser Development of silicon tracking detectors for FAIR 27

n-XYTER readout ASICn-XYTER readout ASICDETNI - GSIDETNI - GSI

NameNamebull n-XYTER NNeutron - XX YY TTime and EEnergy ReadoutReadout

Front-endFront-endbull 128(32) channels charge sensitive pre-amplifier both polarities

bull 30 pF detector capacitance ENC 1000 e

bull self-triggered autonomous hit detection

bull time stamping with 1 ns resolution (needed to correlate x-y views)

ReadoutReadoutbull energy (peak height) and time information for each hit

bull data driven de-randomizing sparsifying readout

bull 32 MHz average hit ratendash 128 channel version (SiGEM) ~ 250 kHz hit channel

ndash 32 channel version (MSGC) ~ 1 MHz hit channel

JM Heuser Development of silicon tracking detectors for FAIR 28

32 MHzreadoutrate

n-XYTER Architecturen-XYTER Architecture

PreAmpPreAmp fast shaperfast shaper

peaking timefast 20 nsslow 140 ns

slow shaperslow shaper

timewalk

comp

comparatorcomparator

tokencell

timestamp

counter

tokenmanager

1 ns step

32 MHzreadoutrate

self-triggerlatch amplitudelatch timestore in FIFOs

outputdrivers

digitalFIFO

analogFIFO

peakdetectamp hold

Page 8: Johann M. Heuser  GSI Darmstadt, Germany VERTEX 2008, Utö Island , Sweden

JM Heuser Development of silicon tracking detectors for FAIR 8

EXLDetection systems for Target recoils and gammas (pnhellip) Forward ejectiles (pn) Beam-like heavy ions

Electroncooler

eA-Collider

RIB

Si DSSD E x y300 microm thick spatial resolution better than 500 microm in x and y ∆E = 30 keV (FWHM)1048766Thin Si DSSD trackinglt100 microm thick spatial reso-lution better than 100 microm in x and y ∆E = 30 keV (FWHM)1048766Si(Li) E9 mm thick large area 100 x 100 mm2 ∆E = 50 keV (FWHM)1048766CsI crystals E High efficiency high resolution 20 cm thick

2 nearly spherical silicon detector layers

~3 m2 area

Recoil detector

JM Heuser Development of silicon tracking detectors for FAIR 9

R3B 2-layer silicon tracker ~ 02 m2 area 60 microstrip detectors of about 5 cm by 7 cm size Double-sided detectors with orthogonal strip pattern read out from the same detector edge double-metal routing layer on one side Strip pitch 100 microm or smaller Detectors thickness 100 microm (inner layer)

100-300 microm thickness (outer layers)

EXL2 nearly spherical silicon layers ~3 m2 area Inner layer 100 microm thick double-sided orthogonal microstrip detectors

Spatial resolution better than 100 microm in x and yenergy resolution of 30 keV 300 detectors with typical dimensions of 9 cm by 9 cm

Outer layer 300 microm thick double-sided orthogonal microstrip detectors spatial resolution better than 500 microm in both coordinates

energy resolution of 30 keV 120 detectors of 9 cm by 9 cm size

Detectors operated in vacuum

JM Heuser Development of silicon tracking detectors for FAIR 10

Anti-proton annihilation experiment PANDAAnti-proton annihilation experiment PANDA

A next generation hadron physics detector

Cooled antiproton beams energy 15 - 15 GeV interacting with various internal targets

Main physics topics

hadron spectroscopy search for exotic charmonia states

charm hadrons in the nuclear medium

spectroscopy of double-hypernuclei and nucleon structure

PANDA detector system4 acceptance

vertex detection MVD

particle id of Kaons muons eplusmn

electromagnetic calorimetry

momentum resolution ~ δpp = 1

high interaction rates of up to 20 MHz

JM Heuser Development of silicon tracking detectors for FAIR 11

Design features 5 space points forward of 90deg

4 barrel layers

4 forward disks

Outer 2 barrels and disks

double-sided strips ~06m2

Inner barrels and disks

hybrid pixels

Smallest possible inner radius

Fast and untriggered readout

Micro-Vertex DetectorMicro-Vertex Detector

p beam

10 cm

pellet or cluster jet targetExperimental tasks

Identification of D mesons

Measurement of long-lived baryons and mesons (open charm and strangeness)

JM Heuser Development of silicon tracking detectors for FAIR 1212

Detector PrototypingDetector PrototypingStrip layers

Outer layers pixels strips keep number of space points but less material

double-sided sensors

thickness ~200 microm

orthogonal strips

pitch of 50 ndash 100 microm

typical barrel detector 6 cm by 35 cm

lab-start ITC detector APV 25 chip

readout untriggered FEE required

synergy with CBM on XYTER

ASIC TOPIX

13 micro technology

pixel size 100x100 microm2

high readout capability

sufficient buffering to operate without trigger

ToT to retain (some) energy information

radhard within typical limits

Sensor

EPI for minimum material lt 100 microm thickness

Hybrid pixel detector layers

JM Heuser Development of silicon tracking detectors for FAIR 13

PANDA MVD ndash Radiation load mapsPANDA MVD ndash Radiation load maps

ppp at 10 GeVc p at 10 GeVc p-p-Pb at 405 GeVc Pb at 405 GeVc

1313

calculation with DPM event generator ~ 110 of radiation dose at LHC

n-equiv fluencecm2

integrated over 1 year of PANDA operation

JM Heuser Development of silicon tracking detectors for FAIR 14

CCompressed ompressed BBaryonic aryonic MMatter Experimentatter ExperimentFixed-target experiment at the SIS300 synchrotron

High-rate heavy-ion collisions projectile energies up to 45 GeVnucleon

QCD phase diagram in regions of large baryon densities and moderate temperatures

Topics

Deconfinement phase transition and high-μB QGP

Critical point

Hadron properties in dense matter

(rare) probes e and micro pairs vector mesons strangeness and charmonium open charm

dense nuclear matter (6 ndash 12) 0

time

de

nsi

ty

JM Heuser Development of silicon tracking detectors for FAIR 15

Electron-Hadron setup Muon-setup

CCompressed ompressed BBaryonic aryonic MMatter Experimentatter Experiment

JM Heuser Development of silicon tracking detectors for FAIR 16

Au+Au interactions 25 GeVu 10 MHz interaction rate

up to 1000 charged particlesevent

Track densities 30 cm-2

UrQMD generator Monte Carlo tracks

and simulated hits in microstrip detector stations

Silicon Tracking SystemSilicon Tracking System tracking nuclear collisionsthe mission

+ micro vertex detection presentation by M Deveaux

JM Heuser Development of silicon tracking detectors for FAIR 17

Exploration of a system concept

STS 8 low-mass micro-strip station1 T dipole magnet

JM Heuser Development of silicon tracking detectors for FAIR 18

Tracking stationsTracking stations

tracking station

detector module

p side (front)stereo strips

blue double metal connect-ions of strips I to III

n side (back) vertical stripsvertical strips

current layout total area 8 stations 32 m2

total number of sectors 756total number of ro channels 15Mtotal number of sensors 1068

188 sensors 2 cm times 6 cm 166 sensors 4 cm times 6 cm714 sensors 6 cm times 6 cm

total number of FE chips ~ 12k

sector

I II

III

ro directiondouble-sided microstrip detector

station with sectorization max 5 occupancy

JM Heuser Development of silicon tracking detectors for FAIR 19

Microstrip detector prototype CBM01 GSI-CIS 82007Microstrip detector prototype CBM01 GSI-CIS 82007

4 wafer 285 microm Si Test sensors

Double-sided double-metal 1024 strips per side 50 microm pitch 15ordm stereo angle full-area sensitive contacts at top + bottom edge size 5656 mm2

Double-sided single-metal 256256 strips orthogonal 50(80) microm pitch size 1515 (22 22) mm2

Main sensor

CBM01

CBM01B1

CBM01B2

not rad hard

JM Heuser Development of silicon tracking detectors for FAIR 20

Pixel vs Strip detectorsPixel vs Strip detectors

microstrip detectors hybrid pixel detectors

One central Au+Au event at 25 GeVu tracking station at z=30 cm

compared with

track points rec points gt 115 track points rec points 11

combinatorial hits

thin thick cooling

true hits

Y [c

m]

X [cm]

current choice

JM Heuser Development of silicon tracking detectors for FAIR 21

Front view (XY projection)

78 ms on Pentium 4 processor

Future farm of multi-core processors

Top view (XZ projection)

Track reconstructionTrack reconstructionCentral collision Au+Au 25 AGeV (UrQMD)

Cellular automaton + Kalman filter algorithms

96Reconstruction efficiency

lt1 ghost tracks

JM Heuser Development of silicon tracking detectors for FAIR 22

Low mass detectorLow mass detector

x[cm]

y[c

m]

- silicon detector thickness

currently 03 X0 (300m)

- station with cables and support

structure 1 X0

XX0Station 5 ( at z = 60cm)

13 for tracks pointing to the vertex

Momentum resolution

JM Heuser Development of silicon tracking detectors for FAIR 23

Typical operation for about 6 years

Situation

Interaction rate 107s Au+AuEffective CBM run year

2 months at full operation 5 times 106 s

Fluence up to ~1015 1-MeV nequiv

Radiation EnvironmentRadiation Environment

CBM cave

beam

STS

FLUKA simulation

1-MeV nequiv fluence per 1 CBM run year

dump

neutron field

last STS stationfirst STS station

(Muon setup)

JM Heuser Development of silicon tracking detectors for FAIR 24

Beginning STS system engineeringBeginning STS system engineering

STS ndash MVD ndash beam pipein a thermal enclosure

Extractable from the magnet for maintenance

Including infrastructure (cables optical links cooling)

12k FEE chips 6 ndash 12 kW power

FEE ASICs operation at 18V current 3600 ndash 7200 A

DAQ data rate ~30 GHz ~200 GBytes

JM Heuser Development of silicon tracking detectors for FAIR 25

SummarySummary

International accelerator facility FAIR under preparation

Unprecedented and new research opportunities in various fields for large scientific communities

Silicon detector systems will be important

Challenging

some because small research groups go into new detector dimensions

some because truly demanding devices are required

very high channel densities high radiation environment very fast readout very low mass pretty big ( CBM)

Cooperations of the GSIFAIR groups eg on Sensors FEE labs

Inputadvice from other experienced communities searched for

One example Planned are in-kind contributions from Finland to FAIR with rad-hard silicon strip detectors (incl RD39-RD50

expertise)

JM Heuser Development of silicon tracking detectors for FAIR 26

backup slides

JM Heuser Development of silicon tracking detectors for FAIR 27

n-XYTER readout ASICn-XYTER readout ASICDETNI - GSIDETNI - GSI

NameNamebull n-XYTER NNeutron - XX YY TTime and EEnergy ReadoutReadout

Front-endFront-endbull 128(32) channels charge sensitive pre-amplifier both polarities

bull 30 pF detector capacitance ENC 1000 e

bull self-triggered autonomous hit detection

bull time stamping with 1 ns resolution (needed to correlate x-y views)

ReadoutReadoutbull energy (peak height) and time information for each hit

bull data driven de-randomizing sparsifying readout

bull 32 MHz average hit ratendash 128 channel version (SiGEM) ~ 250 kHz hit channel

ndash 32 channel version (MSGC) ~ 1 MHz hit channel

JM Heuser Development of silicon tracking detectors for FAIR 28

32 MHzreadoutrate

n-XYTER Architecturen-XYTER Architecture

PreAmpPreAmp fast shaperfast shaper

peaking timefast 20 nsslow 140 ns

slow shaperslow shaper

timewalk

comp

comparatorcomparator

tokencell

timestamp

counter

tokenmanager

1 ns step

32 MHzreadoutrate

self-triggerlatch amplitudelatch timestore in FIFOs

outputdrivers

digitalFIFO

analogFIFO

peakdetectamp hold

Page 9: Johann M. Heuser  GSI Darmstadt, Germany VERTEX 2008, Utö Island , Sweden

JM Heuser Development of silicon tracking detectors for FAIR 9

R3B 2-layer silicon tracker ~ 02 m2 area 60 microstrip detectors of about 5 cm by 7 cm size Double-sided detectors with orthogonal strip pattern read out from the same detector edge double-metal routing layer on one side Strip pitch 100 microm or smaller Detectors thickness 100 microm (inner layer)

100-300 microm thickness (outer layers)

EXL2 nearly spherical silicon layers ~3 m2 area Inner layer 100 microm thick double-sided orthogonal microstrip detectors

Spatial resolution better than 100 microm in x and yenergy resolution of 30 keV 300 detectors with typical dimensions of 9 cm by 9 cm

Outer layer 300 microm thick double-sided orthogonal microstrip detectors spatial resolution better than 500 microm in both coordinates

energy resolution of 30 keV 120 detectors of 9 cm by 9 cm size

Detectors operated in vacuum

JM Heuser Development of silicon tracking detectors for FAIR 10

Anti-proton annihilation experiment PANDAAnti-proton annihilation experiment PANDA

A next generation hadron physics detector

Cooled antiproton beams energy 15 - 15 GeV interacting with various internal targets

Main physics topics

hadron spectroscopy search for exotic charmonia states

charm hadrons in the nuclear medium

spectroscopy of double-hypernuclei and nucleon structure

PANDA detector system4 acceptance

vertex detection MVD

particle id of Kaons muons eplusmn

electromagnetic calorimetry

momentum resolution ~ δpp = 1

high interaction rates of up to 20 MHz

JM Heuser Development of silicon tracking detectors for FAIR 11

Design features 5 space points forward of 90deg

4 barrel layers

4 forward disks

Outer 2 barrels and disks

double-sided strips ~06m2

Inner barrels and disks

hybrid pixels

Smallest possible inner radius

Fast and untriggered readout

Micro-Vertex DetectorMicro-Vertex Detector

p beam

10 cm

pellet or cluster jet targetExperimental tasks

Identification of D mesons

Measurement of long-lived baryons and mesons (open charm and strangeness)

JM Heuser Development of silicon tracking detectors for FAIR 1212

Detector PrototypingDetector PrototypingStrip layers

Outer layers pixels strips keep number of space points but less material

double-sided sensors

thickness ~200 microm

orthogonal strips

pitch of 50 ndash 100 microm

typical barrel detector 6 cm by 35 cm

lab-start ITC detector APV 25 chip

readout untriggered FEE required

synergy with CBM on XYTER

ASIC TOPIX

13 micro technology

pixel size 100x100 microm2

high readout capability

sufficient buffering to operate without trigger

ToT to retain (some) energy information

radhard within typical limits

Sensor

EPI for minimum material lt 100 microm thickness

Hybrid pixel detector layers

JM Heuser Development of silicon tracking detectors for FAIR 13

PANDA MVD ndash Radiation load mapsPANDA MVD ndash Radiation load maps

ppp at 10 GeVc p at 10 GeVc p-p-Pb at 405 GeVc Pb at 405 GeVc

1313

calculation with DPM event generator ~ 110 of radiation dose at LHC

n-equiv fluencecm2

integrated over 1 year of PANDA operation

JM Heuser Development of silicon tracking detectors for FAIR 14

CCompressed ompressed BBaryonic aryonic MMatter Experimentatter ExperimentFixed-target experiment at the SIS300 synchrotron

High-rate heavy-ion collisions projectile energies up to 45 GeVnucleon

QCD phase diagram in regions of large baryon densities and moderate temperatures

Topics

Deconfinement phase transition and high-μB QGP

Critical point

Hadron properties in dense matter

(rare) probes e and micro pairs vector mesons strangeness and charmonium open charm

dense nuclear matter (6 ndash 12) 0

time

de

nsi

ty

JM Heuser Development of silicon tracking detectors for FAIR 15

Electron-Hadron setup Muon-setup

CCompressed ompressed BBaryonic aryonic MMatter Experimentatter Experiment

JM Heuser Development of silicon tracking detectors for FAIR 16

Au+Au interactions 25 GeVu 10 MHz interaction rate

up to 1000 charged particlesevent

Track densities 30 cm-2

UrQMD generator Monte Carlo tracks

and simulated hits in microstrip detector stations

Silicon Tracking SystemSilicon Tracking System tracking nuclear collisionsthe mission

+ micro vertex detection presentation by M Deveaux

JM Heuser Development of silicon tracking detectors for FAIR 17

Exploration of a system concept

STS 8 low-mass micro-strip station1 T dipole magnet

JM Heuser Development of silicon tracking detectors for FAIR 18

Tracking stationsTracking stations

tracking station

detector module

p side (front)stereo strips

blue double metal connect-ions of strips I to III

n side (back) vertical stripsvertical strips

current layout total area 8 stations 32 m2

total number of sectors 756total number of ro channels 15Mtotal number of sensors 1068

188 sensors 2 cm times 6 cm 166 sensors 4 cm times 6 cm714 sensors 6 cm times 6 cm

total number of FE chips ~ 12k

sector

I II

III

ro directiondouble-sided microstrip detector

station with sectorization max 5 occupancy

JM Heuser Development of silicon tracking detectors for FAIR 19

Microstrip detector prototype CBM01 GSI-CIS 82007Microstrip detector prototype CBM01 GSI-CIS 82007

4 wafer 285 microm Si Test sensors

Double-sided double-metal 1024 strips per side 50 microm pitch 15ordm stereo angle full-area sensitive contacts at top + bottom edge size 5656 mm2

Double-sided single-metal 256256 strips orthogonal 50(80) microm pitch size 1515 (22 22) mm2

Main sensor

CBM01

CBM01B1

CBM01B2

not rad hard

JM Heuser Development of silicon tracking detectors for FAIR 20

Pixel vs Strip detectorsPixel vs Strip detectors

microstrip detectors hybrid pixel detectors

One central Au+Au event at 25 GeVu tracking station at z=30 cm

compared with

track points rec points gt 115 track points rec points 11

combinatorial hits

thin thick cooling

true hits

Y [c

m]

X [cm]

current choice

JM Heuser Development of silicon tracking detectors for FAIR 21

Front view (XY projection)

78 ms on Pentium 4 processor

Future farm of multi-core processors

Top view (XZ projection)

Track reconstructionTrack reconstructionCentral collision Au+Au 25 AGeV (UrQMD)

Cellular automaton + Kalman filter algorithms

96Reconstruction efficiency

lt1 ghost tracks

JM Heuser Development of silicon tracking detectors for FAIR 22

Low mass detectorLow mass detector

x[cm]

y[c

m]

- silicon detector thickness

currently 03 X0 (300m)

- station with cables and support

structure 1 X0

XX0Station 5 ( at z = 60cm)

13 for tracks pointing to the vertex

Momentum resolution

JM Heuser Development of silicon tracking detectors for FAIR 23

Typical operation for about 6 years

Situation

Interaction rate 107s Au+AuEffective CBM run year

2 months at full operation 5 times 106 s

Fluence up to ~1015 1-MeV nequiv

Radiation EnvironmentRadiation Environment

CBM cave

beam

STS

FLUKA simulation

1-MeV nequiv fluence per 1 CBM run year

dump

neutron field

last STS stationfirst STS station

(Muon setup)

JM Heuser Development of silicon tracking detectors for FAIR 24

Beginning STS system engineeringBeginning STS system engineering

STS ndash MVD ndash beam pipein a thermal enclosure

Extractable from the magnet for maintenance

Including infrastructure (cables optical links cooling)

12k FEE chips 6 ndash 12 kW power

FEE ASICs operation at 18V current 3600 ndash 7200 A

DAQ data rate ~30 GHz ~200 GBytes

JM Heuser Development of silicon tracking detectors for FAIR 25

SummarySummary

International accelerator facility FAIR under preparation

Unprecedented and new research opportunities in various fields for large scientific communities

Silicon detector systems will be important

Challenging

some because small research groups go into new detector dimensions

some because truly demanding devices are required

very high channel densities high radiation environment very fast readout very low mass pretty big ( CBM)

Cooperations of the GSIFAIR groups eg on Sensors FEE labs

Inputadvice from other experienced communities searched for

One example Planned are in-kind contributions from Finland to FAIR with rad-hard silicon strip detectors (incl RD39-RD50

expertise)

JM Heuser Development of silicon tracking detectors for FAIR 26

backup slides

JM Heuser Development of silicon tracking detectors for FAIR 27

n-XYTER readout ASICn-XYTER readout ASICDETNI - GSIDETNI - GSI

NameNamebull n-XYTER NNeutron - XX YY TTime and EEnergy ReadoutReadout

Front-endFront-endbull 128(32) channels charge sensitive pre-amplifier both polarities

bull 30 pF detector capacitance ENC 1000 e

bull self-triggered autonomous hit detection

bull time stamping with 1 ns resolution (needed to correlate x-y views)

ReadoutReadoutbull energy (peak height) and time information for each hit

bull data driven de-randomizing sparsifying readout

bull 32 MHz average hit ratendash 128 channel version (SiGEM) ~ 250 kHz hit channel

ndash 32 channel version (MSGC) ~ 1 MHz hit channel

JM Heuser Development of silicon tracking detectors for FAIR 28

32 MHzreadoutrate

n-XYTER Architecturen-XYTER Architecture

PreAmpPreAmp fast shaperfast shaper

peaking timefast 20 nsslow 140 ns

slow shaperslow shaper

timewalk

comp

comparatorcomparator

tokencell

timestamp

counter

tokenmanager

1 ns step

32 MHzreadoutrate

self-triggerlatch amplitudelatch timestore in FIFOs

outputdrivers

digitalFIFO

analogFIFO

peakdetectamp hold

Page 10: Johann M. Heuser  GSI Darmstadt, Germany VERTEX 2008, Utö Island , Sweden

JM Heuser Development of silicon tracking detectors for FAIR 10

Anti-proton annihilation experiment PANDAAnti-proton annihilation experiment PANDA

A next generation hadron physics detector

Cooled antiproton beams energy 15 - 15 GeV interacting with various internal targets

Main physics topics

hadron spectroscopy search for exotic charmonia states

charm hadrons in the nuclear medium

spectroscopy of double-hypernuclei and nucleon structure

PANDA detector system4 acceptance

vertex detection MVD

particle id of Kaons muons eplusmn

electromagnetic calorimetry

momentum resolution ~ δpp = 1

high interaction rates of up to 20 MHz

JM Heuser Development of silicon tracking detectors for FAIR 11

Design features 5 space points forward of 90deg

4 barrel layers

4 forward disks

Outer 2 barrels and disks

double-sided strips ~06m2

Inner barrels and disks

hybrid pixels

Smallest possible inner radius

Fast and untriggered readout

Micro-Vertex DetectorMicro-Vertex Detector

p beam

10 cm

pellet or cluster jet targetExperimental tasks

Identification of D mesons

Measurement of long-lived baryons and mesons (open charm and strangeness)

JM Heuser Development of silicon tracking detectors for FAIR 1212

Detector PrototypingDetector PrototypingStrip layers

Outer layers pixels strips keep number of space points but less material

double-sided sensors

thickness ~200 microm

orthogonal strips

pitch of 50 ndash 100 microm

typical barrel detector 6 cm by 35 cm

lab-start ITC detector APV 25 chip

readout untriggered FEE required

synergy with CBM on XYTER

ASIC TOPIX

13 micro technology

pixel size 100x100 microm2

high readout capability

sufficient buffering to operate without trigger

ToT to retain (some) energy information

radhard within typical limits

Sensor

EPI for minimum material lt 100 microm thickness

Hybrid pixel detector layers

JM Heuser Development of silicon tracking detectors for FAIR 13

PANDA MVD ndash Radiation load mapsPANDA MVD ndash Radiation load maps

ppp at 10 GeVc p at 10 GeVc p-p-Pb at 405 GeVc Pb at 405 GeVc

1313

calculation with DPM event generator ~ 110 of radiation dose at LHC

n-equiv fluencecm2

integrated over 1 year of PANDA operation

JM Heuser Development of silicon tracking detectors for FAIR 14

CCompressed ompressed BBaryonic aryonic MMatter Experimentatter ExperimentFixed-target experiment at the SIS300 synchrotron

High-rate heavy-ion collisions projectile energies up to 45 GeVnucleon

QCD phase diagram in regions of large baryon densities and moderate temperatures

Topics

Deconfinement phase transition and high-μB QGP

Critical point

Hadron properties in dense matter

(rare) probes e and micro pairs vector mesons strangeness and charmonium open charm

dense nuclear matter (6 ndash 12) 0

time

de

nsi

ty

JM Heuser Development of silicon tracking detectors for FAIR 15

Electron-Hadron setup Muon-setup

CCompressed ompressed BBaryonic aryonic MMatter Experimentatter Experiment

JM Heuser Development of silicon tracking detectors for FAIR 16

Au+Au interactions 25 GeVu 10 MHz interaction rate

up to 1000 charged particlesevent

Track densities 30 cm-2

UrQMD generator Monte Carlo tracks

and simulated hits in microstrip detector stations

Silicon Tracking SystemSilicon Tracking System tracking nuclear collisionsthe mission

+ micro vertex detection presentation by M Deveaux

JM Heuser Development of silicon tracking detectors for FAIR 17

Exploration of a system concept

STS 8 low-mass micro-strip station1 T dipole magnet

JM Heuser Development of silicon tracking detectors for FAIR 18

Tracking stationsTracking stations

tracking station

detector module

p side (front)stereo strips

blue double metal connect-ions of strips I to III

n side (back) vertical stripsvertical strips

current layout total area 8 stations 32 m2

total number of sectors 756total number of ro channels 15Mtotal number of sensors 1068

188 sensors 2 cm times 6 cm 166 sensors 4 cm times 6 cm714 sensors 6 cm times 6 cm

total number of FE chips ~ 12k

sector

I II

III

ro directiondouble-sided microstrip detector

station with sectorization max 5 occupancy

JM Heuser Development of silicon tracking detectors for FAIR 19

Microstrip detector prototype CBM01 GSI-CIS 82007Microstrip detector prototype CBM01 GSI-CIS 82007

4 wafer 285 microm Si Test sensors

Double-sided double-metal 1024 strips per side 50 microm pitch 15ordm stereo angle full-area sensitive contacts at top + bottom edge size 5656 mm2

Double-sided single-metal 256256 strips orthogonal 50(80) microm pitch size 1515 (22 22) mm2

Main sensor

CBM01

CBM01B1

CBM01B2

not rad hard

JM Heuser Development of silicon tracking detectors for FAIR 20

Pixel vs Strip detectorsPixel vs Strip detectors

microstrip detectors hybrid pixel detectors

One central Au+Au event at 25 GeVu tracking station at z=30 cm

compared with

track points rec points gt 115 track points rec points 11

combinatorial hits

thin thick cooling

true hits

Y [c

m]

X [cm]

current choice

JM Heuser Development of silicon tracking detectors for FAIR 21

Front view (XY projection)

78 ms on Pentium 4 processor

Future farm of multi-core processors

Top view (XZ projection)

Track reconstructionTrack reconstructionCentral collision Au+Au 25 AGeV (UrQMD)

Cellular automaton + Kalman filter algorithms

96Reconstruction efficiency

lt1 ghost tracks

JM Heuser Development of silicon tracking detectors for FAIR 22

Low mass detectorLow mass detector

x[cm]

y[c

m]

- silicon detector thickness

currently 03 X0 (300m)

- station with cables and support

structure 1 X0

XX0Station 5 ( at z = 60cm)

13 for tracks pointing to the vertex

Momentum resolution

JM Heuser Development of silicon tracking detectors for FAIR 23

Typical operation for about 6 years

Situation

Interaction rate 107s Au+AuEffective CBM run year

2 months at full operation 5 times 106 s

Fluence up to ~1015 1-MeV nequiv

Radiation EnvironmentRadiation Environment

CBM cave

beam

STS

FLUKA simulation

1-MeV nequiv fluence per 1 CBM run year

dump

neutron field

last STS stationfirst STS station

(Muon setup)

JM Heuser Development of silicon tracking detectors for FAIR 24

Beginning STS system engineeringBeginning STS system engineering

STS ndash MVD ndash beam pipein a thermal enclosure

Extractable from the magnet for maintenance

Including infrastructure (cables optical links cooling)

12k FEE chips 6 ndash 12 kW power

FEE ASICs operation at 18V current 3600 ndash 7200 A

DAQ data rate ~30 GHz ~200 GBytes

JM Heuser Development of silicon tracking detectors for FAIR 25

SummarySummary

International accelerator facility FAIR under preparation

Unprecedented and new research opportunities in various fields for large scientific communities

Silicon detector systems will be important

Challenging

some because small research groups go into new detector dimensions

some because truly demanding devices are required

very high channel densities high radiation environment very fast readout very low mass pretty big ( CBM)

Cooperations of the GSIFAIR groups eg on Sensors FEE labs

Inputadvice from other experienced communities searched for

One example Planned are in-kind contributions from Finland to FAIR with rad-hard silicon strip detectors (incl RD39-RD50

expertise)

JM Heuser Development of silicon tracking detectors for FAIR 26

backup slides

JM Heuser Development of silicon tracking detectors for FAIR 27

n-XYTER readout ASICn-XYTER readout ASICDETNI - GSIDETNI - GSI

NameNamebull n-XYTER NNeutron - XX YY TTime and EEnergy ReadoutReadout

Front-endFront-endbull 128(32) channels charge sensitive pre-amplifier both polarities

bull 30 pF detector capacitance ENC 1000 e

bull self-triggered autonomous hit detection

bull time stamping with 1 ns resolution (needed to correlate x-y views)

ReadoutReadoutbull energy (peak height) and time information for each hit

bull data driven de-randomizing sparsifying readout

bull 32 MHz average hit ratendash 128 channel version (SiGEM) ~ 250 kHz hit channel

ndash 32 channel version (MSGC) ~ 1 MHz hit channel

JM Heuser Development of silicon tracking detectors for FAIR 28

32 MHzreadoutrate

n-XYTER Architecturen-XYTER Architecture

PreAmpPreAmp fast shaperfast shaper

peaking timefast 20 nsslow 140 ns

slow shaperslow shaper

timewalk

comp

comparatorcomparator

tokencell

timestamp

counter

tokenmanager

1 ns step

32 MHzreadoutrate

self-triggerlatch amplitudelatch timestore in FIFOs

outputdrivers

digitalFIFO

analogFIFO

peakdetectamp hold

Page 11: Johann M. Heuser  GSI Darmstadt, Germany VERTEX 2008, Utö Island , Sweden

JM Heuser Development of silicon tracking detectors for FAIR 11

Design features 5 space points forward of 90deg

4 barrel layers

4 forward disks

Outer 2 barrels and disks

double-sided strips ~06m2

Inner barrels and disks

hybrid pixels

Smallest possible inner radius

Fast and untriggered readout

Micro-Vertex DetectorMicro-Vertex Detector

p beam

10 cm

pellet or cluster jet targetExperimental tasks

Identification of D mesons

Measurement of long-lived baryons and mesons (open charm and strangeness)

JM Heuser Development of silicon tracking detectors for FAIR 1212

Detector PrototypingDetector PrototypingStrip layers

Outer layers pixels strips keep number of space points but less material

double-sided sensors

thickness ~200 microm

orthogonal strips

pitch of 50 ndash 100 microm

typical barrel detector 6 cm by 35 cm

lab-start ITC detector APV 25 chip

readout untriggered FEE required

synergy with CBM on XYTER

ASIC TOPIX

13 micro technology

pixel size 100x100 microm2

high readout capability

sufficient buffering to operate without trigger

ToT to retain (some) energy information

radhard within typical limits

Sensor

EPI for minimum material lt 100 microm thickness

Hybrid pixel detector layers

JM Heuser Development of silicon tracking detectors for FAIR 13

PANDA MVD ndash Radiation load mapsPANDA MVD ndash Radiation load maps

ppp at 10 GeVc p at 10 GeVc p-p-Pb at 405 GeVc Pb at 405 GeVc

1313

calculation with DPM event generator ~ 110 of radiation dose at LHC

n-equiv fluencecm2

integrated over 1 year of PANDA operation

JM Heuser Development of silicon tracking detectors for FAIR 14

CCompressed ompressed BBaryonic aryonic MMatter Experimentatter ExperimentFixed-target experiment at the SIS300 synchrotron

High-rate heavy-ion collisions projectile energies up to 45 GeVnucleon

QCD phase diagram in regions of large baryon densities and moderate temperatures

Topics

Deconfinement phase transition and high-μB QGP

Critical point

Hadron properties in dense matter

(rare) probes e and micro pairs vector mesons strangeness and charmonium open charm

dense nuclear matter (6 ndash 12) 0

time

de

nsi

ty

JM Heuser Development of silicon tracking detectors for FAIR 15

Electron-Hadron setup Muon-setup

CCompressed ompressed BBaryonic aryonic MMatter Experimentatter Experiment

JM Heuser Development of silicon tracking detectors for FAIR 16

Au+Au interactions 25 GeVu 10 MHz interaction rate

up to 1000 charged particlesevent

Track densities 30 cm-2

UrQMD generator Monte Carlo tracks

and simulated hits in microstrip detector stations

Silicon Tracking SystemSilicon Tracking System tracking nuclear collisionsthe mission

+ micro vertex detection presentation by M Deveaux

JM Heuser Development of silicon tracking detectors for FAIR 17

Exploration of a system concept

STS 8 low-mass micro-strip station1 T dipole magnet

JM Heuser Development of silicon tracking detectors for FAIR 18

Tracking stationsTracking stations

tracking station

detector module

p side (front)stereo strips

blue double metal connect-ions of strips I to III

n side (back) vertical stripsvertical strips

current layout total area 8 stations 32 m2

total number of sectors 756total number of ro channels 15Mtotal number of sensors 1068

188 sensors 2 cm times 6 cm 166 sensors 4 cm times 6 cm714 sensors 6 cm times 6 cm

total number of FE chips ~ 12k

sector

I II

III

ro directiondouble-sided microstrip detector

station with sectorization max 5 occupancy

JM Heuser Development of silicon tracking detectors for FAIR 19

Microstrip detector prototype CBM01 GSI-CIS 82007Microstrip detector prototype CBM01 GSI-CIS 82007

4 wafer 285 microm Si Test sensors

Double-sided double-metal 1024 strips per side 50 microm pitch 15ordm stereo angle full-area sensitive contacts at top + bottom edge size 5656 mm2

Double-sided single-metal 256256 strips orthogonal 50(80) microm pitch size 1515 (22 22) mm2

Main sensor

CBM01

CBM01B1

CBM01B2

not rad hard

JM Heuser Development of silicon tracking detectors for FAIR 20

Pixel vs Strip detectorsPixel vs Strip detectors

microstrip detectors hybrid pixel detectors

One central Au+Au event at 25 GeVu tracking station at z=30 cm

compared with

track points rec points gt 115 track points rec points 11

combinatorial hits

thin thick cooling

true hits

Y [c

m]

X [cm]

current choice

JM Heuser Development of silicon tracking detectors for FAIR 21

Front view (XY projection)

78 ms on Pentium 4 processor

Future farm of multi-core processors

Top view (XZ projection)

Track reconstructionTrack reconstructionCentral collision Au+Au 25 AGeV (UrQMD)

Cellular automaton + Kalman filter algorithms

96Reconstruction efficiency

lt1 ghost tracks

JM Heuser Development of silicon tracking detectors for FAIR 22

Low mass detectorLow mass detector

x[cm]

y[c

m]

- silicon detector thickness

currently 03 X0 (300m)

- station with cables and support

structure 1 X0

XX0Station 5 ( at z = 60cm)

13 for tracks pointing to the vertex

Momentum resolution

JM Heuser Development of silicon tracking detectors for FAIR 23

Typical operation for about 6 years

Situation

Interaction rate 107s Au+AuEffective CBM run year

2 months at full operation 5 times 106 s

Fluence up to ~1015 1-MeV nequiv

Radiation EnvironmentRadiation Environment

CBM cave

beam

STS

FLUKA simulation

1-MeV nequiv fluence per 1 CBM run year

dump

neutron field

last STS stationfirst STS station

(Muon setup)

JM Heuser Development of silicon tracking detectors for FAIR 24

Beginning STS system engineeringBeginning STS system engineering

STS ndash MVD ndash beam pipein a thermal enclosure

Extractable from the magnet for maintenance

Including infrastructure (cables optical links cooling)

12k FEE chips 6 ndash 12 kW power

FEE ASICs operation at 18V current 3600 ndash 7200 A

DAQ data rate ~30 GHz ~200 GBytes

JM Heuser Development of silicon tracking detectors for FAIR 25

SummarySummary

International accelerator facility FAIR under preparation

Unprecedented and new research opportunities in various fields for large scientific communities

Silicon detector systems will be important

Challenging

some because small research groups go into new detector dimensions

some because truly demanding devices are required

very high channel densities high radiation environment very fast readout very low mass pretty big ( CBM)

Cooperations of the GSIFAIR groups eg on Sensors FEE labs

Inputadvice from other experienced communities searched for

One example Planned are in-kind contributions from Finland to FAIR with rad-hard silicon strip detectors (incl RD39-RD50

expertise)

JM Heuser Development of silicon tracking detectors for FAIR 26

backup slides

JM Heuser Development of silicon tracking detectors for FAIR 27

n-XYTER readout ASICn-XYTER readout ASICDETNI - GSIDETNI - GSI

NameNamebull n-XYTER NNeutron - XX YY TTime and EEnergy ReadoutReadout

Front-endFront-endbull 128(32) channels charge sensitive pre-amplifier both polarities

bull 30 pF detector capacitance ENC 1000 e

bull self-triggered autonomous hit detection

bull time stamping with 1 ns resolution (needed to correlate x-y views)

ReadoutReadoutbull energy (peak height) and time information for each hit

bull data driven de-randomizing sparsifying readout

bull 32 MHz average hit ratendash 128 channel version (SiGEM) ~ 250 kHz hit channel

ndash 32 channel version (MSGC) ~ 1 MHz hit channel

JM Heuser Development of silicon tracking detectors for FAIR 28

32 MHzreadoutrate

n-XYTER Architecturen-XYTER Architecture

PreAmpPreAmp fast shaperfast shaper

peaking timefast 20 nsslow 140 ns

slow shaperslow shaper

timewalk

comp

comparatorcomparator

tokencell

timestamp

counter

tokenmanager

1 ns step

32 MHzreadoutrate

self-triggerlatch amplitudelatch timestore in FIFOs

outputdrivers

digitalFIFO

analogFIFO

peakdetectamp hold

Page 12: Johann M. Heuser  GSI Darmstadt, Germany VERTEX 2008, Utö Island , Sweden

JM Heuser Development of silicon tracking detectors for FAIR 1212

Detector PrototypingDetector PrototypingStrip layers

Outer layers pixels strips keep number of space points but less material

double-sided sensors

thickness ~200 microm

orthogonal strips

pitch of 50 ndash 100 microm

typical barrel detector 6 cm by 35 cm

lab-start ITC detector APV 25 chip

readout untriggered FEE required

synergy with CBM on XYTER

ASIC TOPIX

13 micro technology

pixel size 100x100 microm2

high readout capability

sufficient buffering to operate without trigger

ToT to retain (some) energy information

radhard within typical limits

Sensor

EPI for minimum material lt 100 microm thickness

Hybrid pixel detector layers

JM Heuser Development of silicon tracking detectors for FAIR 13

PANDA MVD ndash Radiation load mapsPANDA MVD ndash Radiation load maps

ppp at 10 GeVc p at 10 GeVc p-p-Pb at 405 GeVc Pb at 405 GeVc

1313

calculation with DPM event generator ~ 110 of radiation dose at LHC

n-equiv fluencecm2

integrated over 1 year of PANDA operation

JM Heuser Development of silicon tracking detectors for FAIR 14

CCompressed ompressed BBaryonic aryonic MMatter Experimentatter ExperimentFixed-target experiment at the SIS300 synchrotron

High-rate heavy-ion collisions projectile energies up to 45 GeVnucleon

QCD phase diagram in regions of large baryon densities and moderate temperatures

Topics

Deconfinement phase transition and high-μB QGP

Critical point

Hadron properties in dense matter

(rare) probes e and micro pairs vector mesons strangeness and charmonium open charm

dense nuclear matter (6 ndash 12) 0

time

de

nsi

ty

JM Heuser Development of silicon tracking detectors for FAIR 15

Electron-Hadron setup Muon-setup

CCompressed ompressed BBaryonic aryonic MMatter Experimentatter Experiment

JM Heuser Development of silicon tracking detectors for FAIR 16

Au+Au interactions 25 GeVu 10 MHz interaction rate

up to 1000 charged particlesevent

Track densities 30 cm-2

UrQMD generator Monte Carlo tracks

and simulated hits in microstrip detector stations

Silicon Tracking SystemSilicon Tracking System tracking nuclear collisionsthe mission

+ micro vertex detection presentation by M Deveaux

JM Heuser Development of silicon tracking detectors for FAIR 17

Exploration of a system concept

STS 8 low-mass micro-strip station1 T dipole magnet

JM Heuser Development of silicon tracking detectors for FAIR 18

Tracking stationsTracking stations

tracking station

detector module

p side (front)stereo strips

blue double metal connect-ions of strips I to III

n side (back) vertical stripsvertical strips

current layout total area 8 stations 32 m2

total number of sectors 756total number of ro channels 15Mtotal number of sensors 1068

188 sensors 2 cm times 6 cm 166 sensors 4 cm times 6 cm714 sensors 6 cm times 6 cm

total number of FE chips ~ 12k

sector

I II

III

ro directiondouble-sided microstrip detector

station with sectorization max 5 occupancy

JM Heuser Development of silicon tracking detectors for FAIR 19

Microstrip detector prototype CBM01 GSI-CIS 82007Microstrip detector prototype CBM01 GSI-CIS 82007

4 wafer 285 microm Si Test sensors

Double-sided double-metal 1024 strips per side 50 microm pitch 15ordm stereo angle full-area sensitive contacts at top + bottom edge size 5656 mm2

Double-sided single-metal 256256 strips orthogonal 50(80) microm pitch size 1515 (22 22) mm2

Main sensor

CBM01

CBM01B1

CBM01B2

not rad hard

JM Heuser Development of silicon tracking detectors for FAIR 20

Pixel vs Strip detectorsPixel vs Strip detectors

microstrip detectors hybrid pixel detectors

One central Au+Au event at 25 GeVu tracking station at z=30 cm

compared with

track points rec points gt 115 track points rec points 11

combinatorial hits

thin thick cooling

true hits

Y [c

m]

X [cm]

current choice

JM Heuser Development of silicon tracking detectors for FAIR 21

Front view (XY projection)

78 ms on Pentium 4 processor

Future farm of multi-core processors

Top view (XZ projection)

Track reconstructionTrack reconstructionCentral collision Au+Au 25 AGeV (UrQMD)

Cellular automaton + Kalman filter algorithms

96Reconstruction efficiency

lt1 ghost tracks

JM Heuser Development of silicon tracking detectors for FAIR 22

Low mass detectorLow mass detector

x[cm]

y[c

m]

- silicon detector thickness

currently 03 X0 (300m)

- station with cables and support

structure 1 X0

XX0Station 5 ( at z = 60cm)

13 for tracks pointing to the vertex

Momentum resolution

JM Heuser Development of silicon tracking detectors for FAIR 23

Typical operation for about 6 years

Situation

Interaction rate 107s Au+AuEffective CBM run year

2 months at full operation 5 times 106 s

Fluence up to ~1015 1-MeV nequiv

Radiation EnvironmentRadiation Environment

CBM cave

beam

STS

FLUKA simulation

1-MeV nequiv fluence per 1 CBM run year

dump

neutron field

last STS stationfirst STS station

(Muon setup)

JM Heuser Development of silicon tracking detectors for FAIR 24

Beginning STS system engineeringBeginning STS system engineering

STS ndash MVD ndash beam pipein a thermal enclosure

Extractable from the magnet for maintenance

Including infrastructure (cables optical links cooling)

12k FEE chips 6 ndash 12 kW power

FEE ASICs operation at 18V current 3600 ndash 7200 A

DAQ data rate ~30 GHz ~200 GBytes

JM Heuser Development of silicon tracking detectors for FAIR 25

SummarySummary

International accelerator facility FAIR under preparation

Unprecedented and new research opportunities in various fields for large scientific communities

Silicon detector systems will be important

Challenging

some because small research groups go into new detector dimensions

some because truly demanding devices are required

very high channel densities high radiation environment very fast readout very low mass pretty big ( CBM)

Cooperations of the GSIFAIR groups eg on Sensors FEE labs

Inputadvice from other experienced communities searched for

One example Planned are in-kind contributions from Finland to FAIR with rad-hard silicon strip detectors (incl RD39-RD50

expertise)

JM Heuser Development of silicon tracking detectors for FAIR 26

backup slides

JM Heuser Development of silicon tracking detectors for FAIR 27

n-XYTER readout ASICn-XYTER readout ASICDETNI - GSIDETNI - GSI

NameNamebull n-XYTER NNeutron - XX YY TTime and EEnergy ReadoutReadout

Front-endFront-endbull 128(32) channels charge sensitive pre-amplifier both polarities

bull 30 pF detector capacitance ENC 1000 e

bull self-triggered autonomous hit detection

bull time stamping with 1 ns resolution (needed to correlate x-y views)

ReadoutReadoutbull energy (peak height) and time information for each hit

bull data driven de-randomizing sparsifying readout

bull 32 MHz average hit ratendash 128 channel version (SiGEM) ~ 250 kHz hit channel

ndash 32 channel version (MSGC) ~ 1 MHz hit channel

JM Heuser Development of silicon tracking detectors for FAIR 28

32 MHzreadoutrate

n-XYTER Architecturen-XYTER Architecture

PreAmpPreAmp fast shaperfast shaper

peaking timefast 20 nsslow 140 ns

slow shaperslow shaper

timewalk

comp

comparatorcomparator

tokencell

timestamp

counter

tokenmanager

1 ns step

32 MHzreadoutrate

self-triggerlatch amplitudelatch timestore in FIFOs

outputdrivers

digitalFIFO

analogFIFO

peakdetectamp hold

Page 13: Johann M. Heuser  GSI Darmstadt, Germany VERTEX 2008, Utö Island , Sweden

JM Heuser Development of silicon tracking detectors for FAIR 13

PANDA MVD ndash Radiation load mapsPANDA MVD ndash Radiation load maps

ppp at 10 GeVc p at 10 GeVc p-p-Pb at 405 GeVc Pb at 405 GeVc

1313

calculation with DPM event generator ~ 110 of radiation dose at LHC

n-equiv fluencecm2

integrated over 1 year of PANDA operation

JM Heuser Development of silicon tracking detectors for FAIR 14

CCompressed ompressed BBaryonic aryonic MMatter Experimentatter ExperimentFixed-target experiment at the SIS300 synchrotron

High-rate heavy-ion collisions projectile energies up to 45 GeVnucleon

QCD phase diagram in regions of large baryon densities and moderate temperatures

Topics

Deconfinement phase transition and high-μB QGP

Critical point

Hadron properties in dense matter

(rare) probes e and micro pairs vector mesons strangeness and charmonium open charm

dense nuclear matter (6 ndash 12) 0

time

de

nsi

ty

JM Heuser Development of silicon tracking detectors for FAIR 15

Electron-Hadron setup Muon-setup

CCompressed ompressed BBaryonic aryonic MMatter Experimentatter Experiment

JM Heuser Development of silicon tracking detectors for FAIR 16

Au+Au interactions 25 GeVu 10 MHz interaction rate

up to 1000 charged particlesevent

Track densities 30 cm-2

UrQMD generator Monte Carlo tracks

and simulated hits in microstrip detector stations

Silicon Tracking SystemSilicon Tracking System tracking nuclear collisionsthe mission

+ micro vertex detection presentation by M Deveaux

JM Heuser Development of silicon tracking detectors for FAIR 17

Exploration of a system concept

STS 8 low-mass micro-strip station1 T dipole magnet

JM Heuser Development of silicon tracking detectors for FAIR 18

Tracking stationsTracking stations

tracking station

detector module

p side (front)stereo strips

blue double metal connect-ions of strips I to III

n side (back) vertical stripsvertical strips

current layout total area 8 stations 32 m2

total number of sectors 756total number of ro channels 15Mtotal number of sensors 1068

188 sensors 2 cm times 6 cm 166 sensors 4 cm times 6 cm714 sensors 6 cm times 6 cm

total number of FE chips ~ 12k

sector

I II

III

ro directiondouble-sided microstrip detector

station with sectorization max 5 occupancy

JM Heuser Development of silicon tracking detectors for FAIR 19

Microstrip detector prototype CBM01 GSI-CIS 82007Microstrip detector prototype CBM01 GSI-CIS 82007

4 wafer 285 microm Si Test sensors

Double-sided double-metal 1024 strips per side 50 microm pitch 15ordm stereo angle full-area sensitive contacts at top + bottom edge size 5656 mm2

Double-sided single-metal 256256 strips orthogonal 50(80) microm pitch size 1515 (22 22) mm2

Main sensor

CBM01

CBM01B1

CBM01B2

not rad hard

JM Heuser Development of silicon tracking detectors for FAIR 20

Pixel vs Strip detectorsPixel vs Strip detectors

microstrip detectors hybrid pixel detectors

One central Au+Au event at 25 GeVu tracking station at z=30 cm

compared with

track points rec points gt 115 track points rec points 11

combinatorial hits

thin thick cooling

true hits

Y [c

m]

X [cm]

current choice

JM Heuser Development of silicon tracking detectors for FAIR 21

Front view (XY projection)

78 ms on Pentium 4 processor

Future farm of multi-core processors

Top view (XZ projection)

Track reconstructionTrack reconstructionCentral collision Au+Au 25 AGeV (UrQMD)

Cellular automaton + Kalman filter algorithms

96Reconstruction efficiency

lt1 ghost tracks

JM Heuser Development of silicon tracking detectors for FAIR 22

Low mass detectorLow mass detector

x[cm]

y[c

m]

- silicon detector thickness

currently 03 X0 (300m)

- station with cables and support

structure 1 X0

XX0Station 5 ( at z = 60cm)

13 for tracks pointing to the vertex

Momentum resolution

JM Heuser Development of silicon tracking detectors for FAIR 23

Typical operation for about 6 years

Situation

Interaction rate 107s Au+AuEffective CBM run year

2 months at full operation 5 times 106 s

Fluence up to ~1015 1-MeV nequiv

Radiation EnvironmentRadiation Environment

CBM cave

beam

STS

FLUKA simulation

1-MeV nequiv fluence per 1 CBM run year

dump

neutron field

last STS stationfirst STS station

(Muon setup)

JM Heuser Development of silicon tracking detectors for FAIR 24

Beginning STS system engineeringBeginning STS system engineering

STS ndash MVD ndash beam pipein a thermal enclosure

Extractable from the magnet for maintenance

Including infrastructure (cables optical links cooling)

12k FEE chips 6 ndash 12 kW power

FEE ASICs operation at 18V current 3600 ndash 7200 A

DAQ data rate ~30 GHz ~200 GBytes

JM Heuser Development of silicon tracking detectors for FAIR 25

SummarySummary

International accelerator facility FAIR under preparation

Unprecedented and new research opportunities in various fields for large scientific communities

Silicon detector systems will be important

Challenging

some because small research groups go into new detector dimensions

some because truly demanding devices are required

very high channel densities high radiation environment very fast readout very low mass pretty big ( CBM)

Cooperations of the GSIFAIR groups eg on Sensors FEE labs

Inputadvice from other experienced communities searched for

One example Planned are in-kind contributions from Finland to FAIR with rad-hard silicon strip detectors (incl RD39-RD50

expertise)

JM Heuser Development of silicon tracking detectors for FAIR 26

backup slides

JM Heuser Development of silicon tracking detectors for FAIR 27

n-XYTER readout ASICn-XYTER readout ASICDETNI - GSIDETNI - GSI

NameNamebull n-XYTER NNeutron - XX YY TTime and EEnergy ReadoutReadout

Front-endFront-endbull 128(32) channels charge sensitive pre-amplifier both polarities

bull 30 pF detector capacitance ENC 1000 e

bull self-triggered autonomous hit detection

bull time stamping with 1 ns resolution (needed to correlate x-y views)

ReadoutReadoutbull energy (peak height) and time information for each hit

bull data driven de-randomizing sparsifying readout

bull 32 MHz average hit ratendash 128 channel version (SiGEM) ~ 250 kHz hit channel

ndash 32 channel version (MSGC) ~ 1 MHz hit channel

JM Heuser Development of silicon tracking detectors for FAIR 28

32 MHzreadoutrate

n-XYTER Architecturen-XYTER Architecture

PreAmpPreAmp fast shaperfast shaper

peaking timefast 20 nsslow 140 ns

slow shaperslow shaper

timewalk

comp

comparatorcomparator

tokencell

timestamp

counter

tokenmanager

1 ns step

32 MHzreadoutrate

self-triggerlatch amplitudelatch timestore in FIFOs

outputdrivers

digitalFIFO

analogFIFO

peakdetectamp hold

Page 14: Johann M. Heuser  GSI Darmstadt, Germany VERTEX 2008, Utö Island , Sweden

JM Heuser Development of silicon tracking detectors for FAIR 14

CCompressed ompressed BBaryonic aryonic MMatter Experimentatter ExperimentFixed-target experiment at the SIS300 synchrotron

High-rate heavy-ion collisions projectile energies up to 45 GeVnucleon

QCD phase diagram in regions of large baryon densities and moderate temperatures

Topics

Deconfinement phase transition and high-μB QGP

Critical point

Hadron properties in dense matter

(rare) probes e and micro pairs vector mesons strangeness and charmonium open charm

dense nuclear matter (6 ndash 12) 0

time

de

nsi

ty

JM Heuser Development of silicon tracking detectors for FAIR 15

Electron-Hadron setup Muon-setup

CCompressed ompressed BBaryonic aryonic MMatter Experimentatter Experiment

JM Heuser Development of silicon tracking detectors for FAIR 16

Au+Au interactions 25 GeVu 10 MHz interaction rate

up to 1000 charged particlesevent

Track densities 30 cm-2

UrQMD generator Monte Carlo tracks

and simulated hits in microstrip detector stations

Silicon Tracking SystemSilicon Tracking System tracking nuclear collisionsthe mission

+ micro vertex detection presentation by M Deveaux

JM Heuser Development of silicon tracking detectors for FAIR 17

Exploration of a system concept

STS 8 low-mass micro-strip station1 T dipole magnet

JM Heuser Development of silicon tracking detectors for FAIR 18

Tracking stationsTracking stations

tracking station

detector module

p side (front)stereo strips

blue double metal connect-ions of strips I to III

n side (back) vertical stripsvertical strips

current layout total area 8 stations 32 m2

total number of sectors 756total number of ro channels 15Mtotal number of sensors 1068

188 sensors 2 cm times 6 cm 166 sensors 4 cm times 6 cm714 sensors 6 cm times 6 cm

total number of FE chips ~ 12k

sector

I II

III

ro directiondouble-sided microstrip detector

station with sectorization max 5 occupancy

JM Heuser Development of silicon tracking detectors for FAIR 19

Microstrip detector prototype CBM01 GSI-CIS 82007Microstrip detector prototype CBM01 GSI-CIS 82007

4 wafer 285 microm Si Test sensors

Double-sided double-metal 1024 strips per side 50 microm pitch 15ordm stereo angle full-area sensitive contacts at top + bottom edge size 5656 mm2

Double-sided single-metal 256256 strips orthogonal 50(80) microm pitch size 1515 (22 22) mm2

Main sensor

CBM01

CBM01B1

CBM01B2

not rad hard

JM Heuser Development of silicon tracking detectors for FAIR 20

Pixel vs Strip detectorsPixel vs Strip detectors

microstrip detectors hybrid pixel detectors

One central Au+Au event at 25 GeVu tracking station at z=30 cm

compared with

track points rec points gt 115 track points rec points 11

combinatorial hits

thin thick cooling

true hits

Y [c

m]

X [cm]

current choice

JM Heuser Development of silicon tracking detectors for FAIR 21

Front view (XY projection)

78 ms on Pentium 4 processor

Future farm of multi-core processors

Top view (XZ projection)

Track reconstructionTrack reconstructionCentral collision Au+Au 25 AGeV (UrQMD)

Cellular automaton + Kalman filter algorithms

96Reconstruction efficiency

lt1 ghost tracks

JM Heuser Development of silicon tracking detectors for FAIR 22

Low mass detectorLow mass detector

x[cm]

y[c

m]

- silicon detector thickness

currently 03 X0 (300m)

- station with cables and support

structure 1 X0

XX0Station 5 ( at z = 60cm)

13 for tracks pointing to the vertex

Momentum resolution

JM Heuser Development of silicon tracking detectors for FAIR 23

Typical operation for about 6 years

Situation

Interaction rate 107s Au+AuEffective CBM run year

2 months at full operation 5 times 106 s

Fluence up to ~1015 1-MeV nequiv

Radiation EnvironmentRadiation Environment

CBM cave

beam

STS

FLUKA simulation

1-MeV nequiv fluence per 1 CBM run year

dump

neutron field

last STS stationfirst STS station

(Muon setup)

JM Heuser Development of silicon tracking detectors for FAIR 24

Beginning STS system engineeringBeginning STS system engineering

STS ndash MVD ndash beam pipein a thermal enclosure

Extractable from the magnet for maintenance

Including infrastructure (cables optical links cooling)

12k FEE chips 6 ndash 12 kW power

FEE ASICs operation at 18V current 3600 ndash 7200 A

DAQ data rate ~30 GHz ~200 GBytes

JM Heuser Development of silicon tracking detectors for FAIR 25

SummarySummary

International accelerator facility FAIR under preparation

Unprecedented and new research opportunities in various fields for large scientific communities

Silicon detector systems will be important

Challenging

some because small research groups go into new detector dimensions

some because truly demanding devices are required

very high channel densities high radiation environment very fast readout very low mass pretty big ( CBM)

Cooperations of the GSIFAIR groups eg on Sensors FEE labs

Inputadvice from other experienced communities searched for

One example Planned are in-kind contributions from Finland to FAIR with rad-hard silicon strip detectors (incl RD39-RD50

expertise)

JM Heuser Development of silicon tracking detectors for FAIR 26

backup slides

JM Heuser Development of silicon tracking detectors for FAIR 27

n-XYTER readout ASICn-XYTER readout ASICDETNI - GSIDETNI - GSI

NameNamebull n-XYTER NNeutron - XX YY TTime and EEnergy ReadoutReadout

Front-endFront-endbull 128(32) channels charge sensitive pre-amplifier both polarities

bull 30 pF detector capacitance ENC 1000 e

bull self-triggered autonomous hit detection

bull time stamping with 1 ns resolution (needed to correlate x-y views)

ReadoutReadoutbull energy (peak height) and time information for each hit

bull data driven de-randomizing sparsifying readout

bull 32 MHz average hit ratendash 128 channel version (SiGEM) ~ 250 kHz hit channel

ndash 32 channel version (MSGC) ~ 1 MHz hit channel

JM Heuser Development of silicon tracking detectors for FAIR 28

32 MHzreadoutrate

n-XYTER Architecturen-XYTER Architecture

PreAmpPreAmp fast shaperfast shaper

peaking timefast 20 nsslow 140 ns

slow shaperslow shaper

timewalk

comp

comparatorcomparator

tokencell

timestamp

counter

tokenmanager

1 ns step

32 MHzreadoutrate

self-triggerlatch amplitudelatch timestore in FIFOs

outputdrivers

digitalFIFO

analogFIFO

peakdetectamp hold

Page 15: Johann M. Heuser  GSI Darmstadt, Germany VERTEX 2008, Utö Island , Sweden

JM Heuser Development of silicon tracking detectors for FAIR 15

Electron-Hadron setup Muon-setup

CCompressed ompressed BBaryonic aryonic MMatter Experimentatter Experiment

JM Heuser Development of silicon tracking detectors for FAIR 16

Au+Au interactions 25 GeVu 10 MHz interaction rate

up to 1000 charged particlesevent

Track densities 30 cm-2

UrQMD generator Monte Carlo tracks

and simulated hits in microstrip detector stations

Silicon Tracking SystemSilicon Tracking System tracking nuclear collisionsthe mission

+ micro vertex detection presentation by M Deveaux

JM Heuser Development of silicon tracking detectors for FAIR 17

Exploration of a system concept

STS 8 low-mass micro-strip station1 T dipole magnet

JM Heuser Development of silicon tracking detectors for FAIR 18

Tracking stationsTracking stations

tracking station

detector module

p side (front)stereo strips

blue double metal connect-ions of strips I to III

n side (back) vertical stripsvertical strips

current layout total area 8 stations 32 m2

total number of sectors 756total number of ro channels 15Mtotal number of sensors 1068

188 sensors 2 cm times 6 cm 166 sensors 4 cm times 6 cm714 sensors 6 cm times 6 cm

total number of FE chips ~ 12k

sector

I II

III

ro directiondouble-sided microstrip detector

station with sectorization max 5 occupancy

JM Heuser Development of silicon tracking detectors for FAIR 19

Microstrip detector prototype CBM01 GSI-CIS 82007Microstrip detector prototype CBM01 GSI-CIS 82007

4 wafer 285 microm Si Test sensors

Double-sided double-metal 1024 strips per side 50 microm pitch 15ordm stereo angle full-area sensitive contacts at top + bottom edge size 5656 mm2

Double-sided single-metal 256256 strips orthogonal 50(80) microm pitch size 1515 (22 22) mm2

Main sensor

CBM01

CBM01B1

CBM01B2

not rad hard

JM Heuser Development of silicon tracking detectors for FAIR 20

Pixel vs Strip detectorsPixel vs Strip detectors

microstrip detectors hybrid pixel detectors

One central Au+Au event at 25 GeVu tracking station at z=30 cm

compared with

track points rec points gt 115 track points rec points 11

combinatorial hits

thin thick cooling

true hits

Y [c

m]

X [cm]

current choice

JM Heuser Development of silicon tracking detectors for FAIR 21

Front view (XY projection)

78 ms on Pentium 4 processor

Future farm of multi-core processors

Top view (XZ projection)

Track reconstructionTrack reconstructionCentral collision Au+Au 25 AGeV (UrQMD)

Cellular automaton + Kalman filter algorithms

96Reconstruction efficiency

lt1 ghost tracks

JM Heuser Development of silicon tracking detectors for FAIR 22

Low mass detectorLow mass detector

x[cm]

y[c

m]

- silicon detector thickness

currently 03 X0 (300m)

- station with cables and support

structure 1 X0

XX0Station 5 ( at z = 60cm)

13 for tracks pointing to the vertex

Momentum resolution

JM Heuser Development of silicon tracking detectors for FAIR 23

Typical operation for about 6 years

Situation

Interaction rate 107s Au+AuEffective CBM run year

2 months at full operation 5 times 106 s

Fluence up to ~1015 1-MeV nequiv

Radiation EnvironmentRadiation Environment

CBM cave

beam

STS

FLUKA simulation

1-MeV nequiv fluence per 1 CBM run year

dump

neutron field

last STS stationfirst STS station

(Muon setup)

JM Heuser Development of silicon tracking detectors for FAIR 24

Beginning STS system engineeringBeginning STS system engineering

STS ndash MVD ndash beam pipein a thermal enclosure

Extractable from the magnet for maintenance

Including infrastructure (cables optical links cooling)

12k FEE chips 6 ndash 12 kW power

FEE ASICs operation at 18V current 3600 ndash 7200 A

DAQ data rate ~30 GHz ~200 GBytes

JM Heuser Development of silicon tracking detectors for FAIR 25

SummarySummary

International accelerator facility FAIR under preparation

Unprecedented and new research opportunities in various fields for large scientific communities

Silicon detector systems will be important

Challenging

some because small research groups go into new detector dimensions

some because truly demanding devices are required

very high channel densities high radiation environment very fast readout very low mass pretty big ( CBM)

Cooperations of the GSIFAIR groups eg on Sensors FEE labs

Inputadvice from other experienced communities searched for

One example Planned are in-kind contributions from Finland to FAIR with rad-hard silicon strip detectors (incl RD39-RD50

expertise)

JM Heuser Development of silicon tracking detectors for FAIR 26

backup slides

JM Heuser Development of silicon tracking detectors for FAIR 27

n-XYTER readout ASICn-XYTER readout ASICDETNI - GSIDETNI - GSI

NameNamebull n-XYTER NNeutron - XX YY TTime and EEnergy ReadoutReadout

Front-endFront-endbull 128(32) channels charge sensitive pre-amplifier both polarities

bull 30 pF detector capacitance ENC 1000 e

bull self-triggered autonomous hit detection

bull time stamping with 1 ns resolution (needed to correlate x-y views)

ReadoutReadoutbull energy (peak height) and time information for each hit

bull data driven de-randomizing sparsifying readout

bull 32 MHz average hit ratendash 128 channel version (SiGEM) ~ 250 kHz hit channel

ndash 32 channel version (MSGC) ~ 1 MHz hit channel

JM Heuser Development of silicon tracking detectors for FAIR 28

32 MHzreadoutrate

n-XYTER Architecturen-XYTER Architecture

PreAmpPreAmp fast shaperfast shaper

peaking timefast 20 nsslow 140 ns

slow shaperslow shaper

timewalk

comp

comparatorcomparator

tokencell

timestamp

counter

tokenmanager

1 ns step

32 MHzreadoutrate

self-triggerlatch amplitudelatch timestore in FIFOs

outputdrivers

digitalFIFO

analogFIFO

peakdetectamp hold

Page 16: Johann M. Heuser  GSI Darmstadt, Germany VERTEX 2008, Utö Island , Sweden

JM Heuser Development of silicon tracking detectors for FAIR 16

Au+Au interactions 25 GeVu 10 MHz interaction rate

up to 1000 charged particlesevent

Track densities 30 cm-2

UrQMD generator Monte Carlo tracks

and simulated hits in microstrip detector stations

Silicon Tracking SystemSilicon Tracking System tracking nuclear collisionsthe mission

+ micro vertex detection presentation by M Deveaux

JM Heuser Development of silicon tracking detectors for FAIR 17

Exploration of a system concept

STS 8 low-mass micro-strip station1 T dipole magnet

JM Heuser Development of silicon tracking detectors for FAIR 18

Tracking stationsTracking stations

tracking station

detector module

p side (front)stereo strips

blue double metal connect-ions of strips I to III

n side (back) vertical stripsvertical strips

current layout total area 8 stations 32 m2

total number of sectors 756total number of ro channels 15Mtotal number of sensors 1068

188 sensors 2 cm times 6 cm 166 sensors 4 cm times 6 cm714 sensors 6 cm times 6 cm

total number of FE chips ~ 12k

sector

I II

III

ro directiondouble-sided microstrip detector

station with sectorization max 5 occupancy

JM Heuser Development of silicon tracking detectors for FAIR 19

Microstrip detector prototype CBM01 GSI-CIS 82007Microstrip detector prototype CBM01 GSI-CIS 82007

4 wafer 285 microm Si Test sensors

Double-sided double-metal 1024 strips per side 50 microm pitch 15ordm stereo angle full-area sensitive contacts at top + bottom edge size 5656 mm2

Double-sided single-metal 256256 strips orthogonal 50(80) microm pitch size 1515 (22 22) mm2

Main sensor

CBM01

CBM01B1

CBM01B2

not rad hard

JM Heuser Development of silicon tracking detectors for FAIR 20

Pixel vs Strip detectorsPixel vs Strip detectors

microstrip detectors hybrid pixel detectors

One central Au+Au event at 25 GeVu tracking station at z=30 cm

compared with

track points rec points gt 115 track points rec points 11

combinatorial hits

thin thick cooling

true hits

Y [c

m]

X [cm]

current choice

JM Heuser Development of silicon tracking detectors for FAIR 21

Front view (XY projection)

78 ms on Pentium 4 processor

Future farm of multi-core processors

Top view (XZ projection)

Track reconstructionTrack reconstructionCentral collision Au+Au 25 AGeV (UrQMD)

Cellular automaton + Kalman filter algorithms

96Reconstruction efficiency

lt1 ghost tracks

JM Heuser Development of silicon tracking detectors for FAIR 22

Low mass detectorLow mass detector

x[cm]

y[c

m]

- silicon detector thickness

currently 03 X0 (300m)

- station with cables and support

structure 1 X0

XX0Station 5 ( at z = 60cm)

13 for tracks pointing to the vertex

Momentum resolution

JM Heuser Development of silicon tracking detectors for FAIR 23

Typical operation for about 6 years

Situation

Interaction rate 107s Au+AuEffective CBM run year

2 months at full operation 5 times 106 s

Fluence up to ~1015 1-MeV nequiv

Radiation EnvironmentRadiation Environment

CBM cave

beam

STS

FLUKA simulation

1-MeV nequiv fluence per 1 CBM run year

dump

neutron field

last STS stationfirst STS station

(Muon setup)

JM Heuser Development of silicon tracking detectors for FAIR 24

Beginning STS system engineeringBeginning STS system engineering

STS ndash MVD ndash beam pipein a thermal enclosure

Extractable from the magnet for maintenance

Including infrastructure (cables optical links cooling)

12k FEE chips 6 ndash 12 kW power

FEE ASICs operation at 18V current 3600 ndash 7200 A

DAQ data rate ~30 GHz ~200 GBytes

JM Heuser Development of silicon tracking detectors for FAIR 25

SummarySummary

International accelerator facility FAIR under preparation

Unprecedented and new research opportunities in various fields for large scientific communities

Silicon detector systems will be important

Challenging

some because small research groups go into new detector dimensions

some because truly demanding devices are required

very high channel densities high radiation environment very fast readout very low mass pretty big ( CBM)

Cooperations of the GSIFAIR groups eg on Sensors FEE labs

Inputadvice from other experienced communities searched for

One example Planned are in-kind contributions from Finland to FAIR with rad-hard silicon strip detectors (incl RD39-RD50

expertise)

JM Heuser Development of silicon tracking detectors for FAIR 26

backup slides

JM Heuser Development of silicon tracking detectors for FAIR 27

n-XYTER readout ASICn-XYTER readout ASICDETNI - GSIDETNI - GSI

NameNamebull n-XYTER NNeutron - XX YY TTime and EEnergy ReadoutReadout

Front-endFront-endbull 128(32) channels charge sensitive pre-amplifier both polarities

bull 30 pF detector capacitance ENC 1000 e

bull self-triggered autonomous hit detection

bull time stamping with 1 ns resolution (needed to correlate x-y views)

ReadoutReadoutbull energy (peak height) and time information for each hit

bull data driven de-randomizing sparsifying readout

bull 32 MHz average hit ratendash 128 channel version (SiGEM) ~ 250 kHz hit channel

ndash 32 channel version (MSGC) ~ 1 MHz hit channel

JM Heuser Development of silicon tracking detectors for FAIR 28

32 MHzreadoutrate

n-XYTER Architecturen-XYTER Architecture

PreAmpPreAmp fast shaperfast shaper

peaking timefast 20 nsslow 140 ns

slow shaperslow shaper

timewalk

comp

comparatorcomparator

tokencell

timestamp

counter

tokenmanager

1 ns step

32 MHzreadoutrate

self-triggerlatch amplitudelatch timestore in FIFOs

outputdrivers

digitalFIFO

analogFIFO

peakdetectamp hold

Page 17: Johann M. Heuser  GSI Darmstadt, Germany VERTEX 2008, Utö Island , Sweden

JM Heuser Development of silicon tracking detectors for FAIR 17

Exploration of a system concept

STS 8 low-mass micro-strip station1 T dipole magnet

JM Heuser Development of silicon tracking detectors for FAIR 18

Tracking stationsTracking stations

tracking station

detector module

p side (front)stereo strips

blue double metal connect-ions of strips I to III

n side (back) vertical stripsvertical strips

current layout total area 8 stations 32 m2

total number of sectors 756total number of ro channels 15Mtotal number of sensors 1068

188 sensors 2 cm times 6 cm 166 sensors 4 cm times 6 cm714 sensors 6 cm times 6 cm

total number of FE chips ~ 12k

sector

I II

III

ro directiondouble-sided microstrip detector

station with sectorization max 5 occupancy

JM Heuser Development of silicon tracking detectors for FAIR 19

Microstrip detector prototype CBM01 GSI-CIS 82007Microstrip detector prototype CBM01 GSI-CIS 82007

4 wafer 285 microm Si Test sensors

Double-sided double-metal 1024 strips per side 50 microm pitch 15ordm stereo angle full-area sensitive contacts at top + bottom edge size 5656 mm2

Double-sided single-metal 256256 strips orthogonal 50(80) microm pitch size 1515 (22 22) mm2

Main sensor

CBM01

CBM01B1

CBM01B2

not rad hard

JM Heuser Development of silicon tracking detectors for FAIR 20

Pixel vs Strip detectorsPixel vs Strip detectors

microstrip detectors hybrid pixel detectors

One central Au+Au event at 25 GeVu tracking station at z=30 cm

compared with

track points rec points gt 115 track points rec points 11

combinatorial hits

thin thick cooling

true hits

Y [c

m]

X [cm]

current choice

JM Heuser Development of silicon tracking detectors for FAIR 21

Front view (XY projection)

78 ms on Pentium 4 processor

Future farm of multi-core processors

Top view (XZ projection)

Track reconstructionTrack reconstructionCentral collision Au+Au 25 AGeV (UrQMD)

Cellular automaton + Kalman filter algorithms

96Reconstruction efficiency

lt1 ghost tracks

JM Heuser Development of silicon tracking detectors for FAIR 22

Low mass detectorLow mass detector

x[cm]

y[c

m]

- silicon detector thickness

currently 03 X0 (300m)

- station with cables and support

structure 1 X0

XX0Station 5 ( at z = 60cm)

13 for tracks pointing to the vertex

Momentum resolution

JM Heuser Development of silicon tracking detectors for FAIR 23

Typical operation for about 6 years

Situation

Interaction rate 107s Au+AuEffective CBM run year

2 months at full operation 5 times 106 s

Fluence up to ~1015 1-MeV nequiv

Radiation EnvironmentRadiation Environment

CBM cave

beam

STS

FLUKA simulation

1-MeV nequiv fluence per 1 CBM run year

dump

neutron field

last STS stationfirst STS station

(Muon setup)

JM Heuser Development of silicon tracking detectors for FAIR 24

Beginning STS system engineeringBeginning STS system engineering

STS ndash MVD ndash beam pipein a thermal enclosure

Extractable from the magnet for maintenance

Including infrastructure (cables optical links cooling)

12k FEE chips 6 ndash 12 kW power

FEE ASICs operation at 18V current 3600 ndash 7200 A

DAQ data rate ~30 GHz ~200 GBytes

JM Heuser Development of silicon tracking detectors for FAIR 25

SummarySummary

International accelerator facility FAIR under preparation

Unprecedented and new research opportunities in various fields for large scientific communities

Silicon detector systems will be important

Challenging

some because small research groups go into new detector dimensions

some because truly demanding devices are required

very high channel densities high radiation environment very fast readout very low mass pretty big ( CBM)

Cooperations of the GSIFAIR groups eg on Sensors FEE labs

Inputadvice from other experienced communities searched for

One example Planned are in-kind contributions from Finland to FAIR with rad-hard silicon strip detectors (incl RD39-RD50

expertise)

JM Heuser Development of silicon tracking detectors for FAIR 26

backup slides

JM Heuser Development of silicon tracking detectors for FAIR 27

n-XYTER readout ASICn-XYTER readout ASICDETNI - GSIDETNI - GSI

NameNamebull n-XYTER NNeutron - XX YY TTime and EEnergy ReadoutReadout

Front-endFront-endbull 128(32) channels charge sensitive pre-amplifier both polarities

bull 30 pF detector capacitance ENC 1000 e

bull self-triggered autonomous hit detection

bull time stamping with 1 ns resolution (needed to correlate x-y views)

ReadoutReadoutbull energy (peak height) and time information for each hit

bull data driven de-randomizing sparsifying readout

bull 32 MHz average hit ratendash 128 channel version (SiGEM) ~ 250 kHz hit channel

ndash 32 channel version (MSGC) ~ 1 MHz hit channel

JM Heuser Development of silicon tracking detectors for FAIR 28

32 MHzreadoutrate

n-XYTER Architecturen-XYTER Architecture

PreAmpPreAmp fast shaperfast shaper

peaking timefast 20 nsslow 140 ns

slow shaperslow shaper

timewalk

comp

comparatorcomparator

tokencell

timestamp

counter

tokenmanager

1 ns step

32 MHzreadoutrate

self-triggerlatch amplitudelatch timestore in FIFOs

outputdrivers

digitalFIFO

analogFIFO

peakdetectamp hold

Page 18: Johann M. Heuser  GSI Darmstadt, Germany VERTEX 2008, Utö Island , Sweden

JM Heuser Development of silicon tracking detectors for FAIR 18

Tracking stationsTracking stations

tracking station

detector module

p side (front)stereo strips

blue double metal connect-ions of strips I to III

n side (back) vertical stripsvertical strips

current layout total area 8 stations 32 m2

total number of sectors 756total number of ro channels 15Mtotal number of sensors 1068

188 sensors 2 cm times 6 cm 166 sensors 4 cm times 6 cm714 sensors 6 cm times 6 cm

total number of FE chips ~ 12k

sector

I II

III

ro directiondouble-sided microstrip detector

station with sectorization max 5 occupancy

JM Heuser Development of silicon tracking detectors for FAIR 19

Microstrip detector prototype CBM01 GSI-CIS 82007Microstrip detector prototype CBM01 GSI-CIS 82007

4 wafer 285 microm Si Test sensors

Double-sided double-metal 1024 strips per side 50 microm pitch 15ordm stereo angle full-area sensitive contacts at top + bottom edge size 5656 mm2

Double-sided single-metal 256256 strips orthogonal 50(80) microm pitch size 1515 (22 22) mm2

Main sensor

CBM01

CBM01B1

CBM01B2

not rad hard

JM Heuser Development of silicon tracking detectors for FAIR 20

Pixel vs Strip detectorsPixel vs Strip detectors

microstrip detectors hybrid pixel detectors

One central Au+Au event at 25 GeVu tracking station at z=30 cm

compared with

track points rec points gt 115 track points rec points 11

combinatorial hits

thin thick cooling

true hits

Y [c

m]

X [cm]

current choice

JM Heuser Development of silicon tracking detectors for FAIR 21

Front view (XY projection)

78 ms on Pentium 4 processor

Future farm of multi-core processors

Top view (XZ projection)

Track reconstructionTrack reconstructionCentral collision Au+Au 25 AGeV (UrQMD)

Cellular automaton + Kalman filter algorithms

96Reconstruction efficiency

lt1 ghost tracks

JM Heuser Development of silicon tracking detectors for FAIR 22

Low mass detectorLow mass detector

x[cm]

y[c

m]

- silicon detector thickness

currently 03 X0 (300m)

- station with cables and support

structure 1 X0

XX0Station 5 ( at z = 60cm)

13 for tracks pointing to the vertex

Momentum resolution

JM Heuser Development of silicon tracking detectors for FAIR 23

Typical operation for about 6 years

Situation

Interaction rate 107s Au+AuEffective CBM run year

2 months at full operation 5 times 106 s

Fluence up to ~1015 1-MeV nequiv

Radiation EnvironmentRadiation Environment

CBM cave

beam

STS

FLUKA simulation

1-MeV nequiv fluence per 1 CBM run year

dump

neutron field

last STS stationfirst STS station

(Muon setup)

JM Heuser Development of silicon tracking detectors for FAIR 24

Beginning STS system engineeringBeginning STS system engineering

STS ndash MVD ndash beam pipein a thermal enclosure

Extractable from the magnet for maintenance

Including infrastructure (cables optical links cooling)

12k FEE chips 6 ndash 12 kW power

FEE ASICs operation at 18V current 3600 ndash 7200 A

DAQ data rate ~30 GHz ~200 GBytes

JM Heuser Development of silicon tracking detectors for FAIR 25

SummarySummary

International accelerator facility FAIR under preparation

Unprecedented and new research opportunities in various fields for large scientific communities

Silicon detector systems will be important

Challenging

some because small research groups go into new detector dimensions

some because truly demanding devices are required

very high channel densities high radiation environment very fast readout very low mass pretty big ( CBM)

Cooperations of the GSIFAIR groups eg on Sensors FEE labs

Inputadvice from other experienced communities searched for

One example Planned are in-kind contributions from Finland to FAIR with rad-hard silicon strip detectors (incl RD39-RD50

expertise)

JM Heuser Development of silicon tracking detectors for FAIR 26

backup slides

JM Heuser Development of silicon tracking detectors for FAIR 27

n-XYTER readout ASICn-XYTER readout ASICDETNI - GSIDETNI - GSI

NameNamebull n-XYTER NNeutron - XX YY TTime and EEnergy ReadoutReadout

Front-endFront-endbull 128(32) channels charge sensitive pre-amplifier both polarities

bull 30 pF detector capacitance ENC 1000 e

bull self-triggered autonomous hit detection

bull time stamping with 1 ns resolution (needed to correlate x-y views)

ReadoutReadoutbull energy (peak height) and time information for each hit

bull data driven de-randomizing sparsifying readout

bull 32 MHz average hit ratendash 128 channel version (SiGEM) ~ 250 kHz hit channel

ndash 32 channel version (MSGC) ~ 1 MHz hit channel

JM Heuser Development of silicon tracking detectors for FAIR 28

32 MHzreadoutrate

n-XYTER Architecturen-XYTER Architecture

PreAmpPreAmp fast shaperfast shaper

peaking timefast 20 nsslow 140 ns

slow shaperslow shaper

timewalk

comp

comparatorcomparator

tokencell

timestamp

counter

tokenmanager

1 ns step

32 MHzreadoutrate

self-triggerlatch amplitudelatch timestore in FIFOs

outputdrivers

digitalFIFO

analogFIFO

peakdetectamp hold

Page 19: Johann M. Heuser  GSI Darmstadt, Germany VERTEX 2008, Utö Island , Sweden

JM Heuser Development of silicon tracking detectors for FAIR 19

Microstrip detector prototype CBM01 GSI-CIS 82007Microstrip detector prototype CBM01 GSI-CIS 82007

4 wafer 285 microm Si Test sensors

Double-sided double-metal 1024 strips per side 50 microm pitch 15ordm stereo angle full-area sensitive contacts at top + bottom edge size 5656 mm2

Double-sided single-metal 256256 strips orthogonal 50(80) microm pitch size 1515 (22 22) mm2

Main sensor

CBM01

CBM01B1

CBM01B2

not rad hard

JM Heuser Development of silicon tracking detectors for FAIR 20

Pixel vs Strip detectorsPixel vs Strip detectors

microstrip detectors hybrid pixel detectors

One central Au+Au event at 25 GeVu tracking station at z=30 cm

compared with

track points rec points gt 115 track points rec points 11

combinatorial hits

thin thick cooling

true hits

Y [c

m]

X [cm]

current choice

JM Heuser Development of silicon tracking detectors for FAIR 21

Front view (XY projection)

78 ms on Pentium 4 processor

Future farm of multi-core processors

Top view (XZ projection)

Track reconstructionTrack reconstructionCentral collision Au+Au 25 AGeV (UrQMD)

Cellular automaton + Kalman filter algorithms

96Reconstruction efficiency

lt1 ghost tracks

JM Heuser Development of silicon tracking detectors for FAIR 22

Low mass detectorLow mass detector

x[cm]

y[c

m]

- silicon detector thickness

currently 03 X0 (300m)

- station with cables and support

structure 1 X0

XX0Station 5 ( at z = 60cm)

13 for tracks pointing to the vertex

Momentum resolution

JM Heuser Development of silicon tracking detectors for FAIR 23

Typical operation for about 6 years

Situation

Interaction rate 107s Au+AuEffective CBM run year

2 months at full operation 5 times 106 s

Fluence up to ~1015 1-MeV nequiv

Radiation EnvironmentRadiation Environment

CBM cave

beam

STS

FLUKA simulation

1-MeV nequiv fluence per 1 CBM run year

dump

neutron field

last STS stationfirst STS station

(Muon setup)

JM Heuser Development of silicon tracking detectors for FAIR 24

Beginning STS system engineeringBeginning STS system engineering

STS ndash MVD ndash beam pipein a thermal enclosure

Extractable from the magnet for maintenance

Including infrastructure (cables optical links cooling)

12k FEE chips 6 ndash 12 kW power

FEE ASICs operation at 18V current 3600 ndash 7200 A

DAQ data rate ~30 GHz ~200 GBytes

JM Heuser Development of silicon tracking detectors for FAIR 25

SummarySummary

International accelerator facility FAIR under preparation

Unprecedented and new research opportunities in various fields for large scientific communities

Silicon detector systems will be important

Challenging

some because small research groups go into new detector dimensions

some because truly demanding devices are required

very high channel densities high radiation environment very fast readout very low mass pretty big ( CBM)

Cooperations of the GSIFAIR groups eg on Sensors FEE labs

Inputadvice from other experienced communities searched for

One example Planned are in-kind contributions from Finland to FAIR with rad-hard silicon strip detectors (incl RD39-RD50

expertise)

JM Heuser Development of silicon tracking detectors for FAIR 26

backup slides

JM Heuser Development of silicon tracking detectors for FAIR 27

n-XYTER readout ASICn-XYTER readout ASICDETNI - GSIDETNI - GSI

NameNamebull n-XYTER NNeutron - XX YY TTime and EEnergy ReadoutReadout

Front-endFront-endbull 128(32) channels charge sensitive pre-amplifier both polarities

bull 30 pF detector capacitance ENC 1000 e

bull self-triggered autonomous hit detection

bull time stamping with 1 ns resolution (needed to correlate x-y views)

ReadoutReadoutbull energy (peak height) and time information for each hit

bull data driven de-randomizing sparsifying readout

bull 32 MHz average hit ratendash 128 channel version (SiGEM) ~ 250 kHz hit channel

ndash 32 channel version (MSGC) ~ 1 MHz hit channel

JM Heuser Development of silicon tracking detectors for FAIR 28

32 MHzreadoutrate

n-XYTER Architecturen-XYTER Architecture

PreAmpPreAmp fast shaperfast shaper

peaking timefast 20 nsslow 140 ns

slow shaperslow shaper

timewalk

comp

comparatorcomparator

tokencell

timestamp

counter

tokenmanager

1 ns step

32 MHzreadoutrate

self-triggerlatch amplitudelatch timestore in FIFOs

outputdrivers

digitalFIFO

analogFIFO

peakdetectamp hold

Page 20: Johann M. Heuser  GSI Darmstadt, Germany VERTEX 2008, Utö Island , Sweden

JM Heuser Development of silicon tracking detectors for FAIR 20

Pixel vs Strip detectorsPixel vs Strip detectors

microstrip detectors hybrid pixel detectors

One central Au+Au event at 25 GeVu tracking station at z=30 cm

compared with

track points rec points gt 115 track points rec points 11

combinatorial hits

thin thick cooling

true hits

Y [c

m]

X [cm]

current choice

JM Heuser Development of silicon tracking detectors for FAIR 21

Front view (XY projection)

78 ms on Pentium 4 processor

Future farm of multi-core processors

Top view (XZ projection)

Track reconstructionTrack reconstructionCentral collision Au+Au 25 AGeV (UrQMD)

Cellular automaton + Kalman filter algorithms

96Reconstruction efficiency

lt1 ghost tracks

JM Heuser Development of silicon tracking detectors for FAIR 22

Low mass detectorLow mass detector

x[cm]

y[c

m]

- silicon detector thickness

currently 03 X0 (300m)

- station with cables and support

structure 1 X0

XX0Station 5 ( at z = 60cm)

13 for tracks pointing to the vertex

Momentum resolution

JM Heuser Development of silicon tracking detectors for FAIR 23

Typical operation for about 6 years

Situation

Interaction rate 107s Au+AuEffective CBM run year

2 months at full operation 5 times 106 s

Fluence up to ~1015 1-MeV nequiv

Radiation EnvironmentRadiation Environment

CBM cave

beam

STS

FLUKA simulation

1-MeV nequiv fluence per 1 CBM run year

dump

neutron field

last STS stationfirst STS station

(Muon setup)

JM Heuser Development of silicon tracking detectors for FAIR 24

Beginning STS system engineeringBeginning STS system engineering

STS ndash MVD ndash beam pipein a thermal enclosure

Extractable from the magnet for maintenance

Including infrastructure (cables optical links cooling)

12k FEE chips 6 ndash 12 kW power

FEE ASICs operation at 18V current 3600 ndash 7200 A

DAQ data rate ~30 GHz ~200 GBytes

JM Heuser Development of silicon tracking detectors for FAIR 25

SummarySummary

International accelerator facility FAIR under preparation

Unprecedented and new research opportunities in various fields for large scientific communities

Silicon detector systems will be important

Challenging

some because small research groups go into new detector dimensions

some because truly demanding devices are required

very high channel densities high radiation environment very fast readout very low mass pretty big ( CBM)

Cooperations of the GSIFAIR groups eg on Sensors FEE labs

Inputadvice from other experienced communities searched for

One example Planned are in-kind contributions from Finland to FAIR with rad-hard silicon strip detectors (incl RD39-RD50

expertise)

JM Heuser Development of silicon tracking detectors for FAIR 26

backup slides

JM Heuser Development of silicon tracking detectors for FAIR 27

n-XYTER readout ASICn-XYTER readout ASICDETNI - GSIDETNI - GSI

NameNamebull n-XYTER NNeutron - XX YY TTime and EEnergy ReadoutReadout

Front-endFront-endbull 128(32) channels charge sensitive pre-amplifier both polarities

bull 30 pF detector capacitance ENC 1000 e

bull self-triggered autonomous hit detection

bull time stamping with 1 ns resolution (needed to correlate x-y views)

ReadoutReadoutbull energy (peak height) and time information for each hit

bull data driven de-randomizing sparsifying readout

bull 32 MHz average hit ratendash 128 channel version (SiGEM) ~ 250 kHz hit channel

ndash 32 channel version (MSGC) ~ 1 MHz hit channel

JM Heuser Development of silicon tracking detectors for FAIR 28

32 MHzreadoutrate

n-XYTER Architecturen-XYTER Architecture

PreAmpPreAmp fast shaperfast shaper

peaking timefast 20 nsslow 140 ns

slow shaperslow shaper

timewalk

comp

comparatorcomparator

tokencell

timestamp

counter

tokenmanager

1 ns step

32 MHzreadoutrate

self-triggerlatch amplitudelatch timestore in FIFOs

outputdrivers

digitalFIFO

analogFIFO

peakdetectamp hold

Page 21: Johann M. Heuser  GSI Darmstadt, Germany VERTEX 2008, Utö Island , Sweden

JM Heuser Development of silicon tracking detectors for FAIR 21

Front view (XY projection)

78 ms on Pentium 4 processor

Future farm of multi-core processors

Top view (XZ projection)

Track reconstructionTrack reconstructionCentral collision Au+Au 25 AGeV (UrQMD)

Cellular automaton + Kalman filter algorithms

96Reconstruction efficiency

lt1 ghost tracks

JM Heuser Development of silicon tracking detectors for FAIR 22

Low mass detectorLow mass detector

x[cm]

y[c

m]

- silicon detector thickness

currently 03 X0 (300m)

- station with cables and support

structure 1 X0

XX0Station 5 ( at z = 60cm)

13 for tracks pointing to the vertex

Momentum resolution

JM Heuser Development of silicon tracking detectors for FAIR 23

Typical operation for about 6 years

Situation

Interaction rate 107s Au+AuEffective CBM run year

2 months at full operation 5 times 106 s

Fluence up to ~1015 1-MeV nequiv

Radiation EnvironmentRadiation Environment

CBM cave

beam

STS

FLUKA simulation

1-MeV nequiv fluence per 1 CBM run year

dump

neutron field

last STS stationfirst STS station

(Muon setup)

JM Heuser Development of silicon tracking detectors for FAIR 24

Beginning STS system engineeringBeginning STS system engineering

STS ndash MVD ndash beam pipein a thermal enclosure

Extractable from the magnet for maintenance

Including infrastructure (cables optical links cooling)

12k FEE chips 6 ndash 12 kW power

FEE ASICs operation at 18V current 3600 ndash 7200 A

DAQ data rate ~30 GHz ~200 GBytes

JM Heuser Development of silicon tracking detectors for FAIR 25

SummarySummary

International accelerator facility FAIR under preparation

Unprecedented and new research opportunities in various fields for large scientific communities

Silicon detector systems will be important

Challenging

some because small research groups go into new detector dimensions

some because truly demanding devices are required

very high channel densities high radiation environment very fast readout very low mass pretty big ( CBM)

Cooperations of the GSIFAIR groups eg on Sensors FEE labs

Inputadvice from other experienced communities searched for

One example Planned are in-kind contributions from Finland to FAIR with rad-hard silicon strip detectors (incl RD39-RD50

expertise)

JM Heuser Development of silicon tracking detectors for FAIR 26

backup slides

JM Heuser Development of silicon tracking detectors for FAIR 27

n-XYTER readout ASICn-XYTER readout ASICDETNI - GSIDETNI - GSI

NameNamebull n-XYTER NNeutron - XX YY TTime and EEnergy ReadoutReadout

Front-endFront-endbull 128(32) channels charge sensitive pre-amplifier both polarities

bull 30 pF detector capacitance ENC 1000 e

bull self-triggered autonomous hit detection

bull time stamping with 1 ns resolution (needed to correlate x-y views)

ReadoutReadoutbull energy (peak height) and time information for each hit

bull data driven de-randomizing sparsifying readout

bull 32 MHz average hit ratendash 128 channel version (SiGEM) ~ 250 kHz hit channel

ndash 32 channel version (MSGC) ~ 1 MHz hit channel

JM Heuser Development of silicon tracking detectors for FAIR 28

32 MHzreadoutrate

n-XYTER Architecturen-XYTER Architecture

PreAmpPreAmp fast shaperfast shaper

peaking timefast 20 nsslow 140 ns

slow shaperslow shaper

timewalk

comp

comparatorcomparator

tokencell

timestamp

counter

tokenmanager

1 ns step

32 MHzreadoutrate

self-triggerlatch amplitudelatch timestore in FIFOs

outputdrivers

digitalFIFO

analogFIFO

peakdetectamp hold

Page 22: Johann M. Heuser  GSI Darmstadt, Germany VERTEX 2008, Utö Island , Sweden

JM Heuser Development of silicon tracking detectors for FAIR 22

Low mass detectorLow mass detector

x[cm]

y[c

m]

- silicon detector thickness

currently 03 X0 (300m)

- station with cables and support

structure 1 X0

XX0Station 5 ( at z = 60cm)

13 for tracks pointing to the vertex

Momentum resolution

JM Heuser Development of silicon tracking detectors for FAIR 23

Typical operation for about 6 years

Situation

Interaction rate 107s Au+AuEffective CBM run year

2 months at full operation 5 times 106 s

Fluence up to ~1015 1-MeV nequiv

Radiation EnvironmentRadiation Environment

CBM cave

beam

STS

FLUKA simulation

1-MeV nequiv fluence per 1 CBM run year

dump

neutron field

last STS stationfirst STS station

(Muon setup)

JM Heuser Development of silicon tracking detectors for FAIR 24

Beginning STS system engineeringBeginning STS system engineering

STS ndash MVD ndash beam pipein a thermal enclosure

Extractable from the magnet for maintenance

Including infrastructure (cables optical links cooling)

12k FEE chips 6 ndash 12 kW power

FEE ASICs operation at 18V current 3600 ndash 7200 A

DAQ data rate ~30 GHz ~200 GBytes

JM Heuser Development of silicon tracking detectors for FAIR 25

SummarySummary

International accelerator facility FAIR under preparation

Unprecedented and new research opportunities in various fields for large scientific communities

Silicon detector systems will be important

Challenging

some because small research groups go into new detector dimensions

some because truly demanding devices are required

very high channel densities high radiation environment very fast readout very low mass pretty big ( CBM)

Cooperations of the GSIFAIR groups eg on Sensors FEE labs

Inputadvice from other experienced communities searched for

One example Planned are in-kind contributions from Finland to FAIR with rad-hard silicon strip detectors (incl RD39-RD50

expertise)

JM Heuser Development of silicon tracking detectors for FAIR 26

backup slides

JM Heuser Development of silicon tracking detectors for FAIR 27

n-XYTER readout ASICn-XYTER readout ASICDETNI - GSIDETNI - GSI

NameNamebull n-XYTER NNeutron - XX YY TTime and EEnergy ReadoutReadout

Front-endFront-endbull 128(32) channels charge sensitive pre-amplifier both polarities

bull 30 pF detector capacitance ENC 1000 e

bull self-triggered autonomous hit detection

bull time stamping with 1 ns resolution (needed to correlate x-y views)

ReadoutReadoutbull energy (peak height) and time information for each hit

bull data driven de-randomizing sparsifying readout

bull 32 MHz average hit ratendash 128 channel version (SiGEM) ~ 250 kHz hit channel

ndash 32 channel version (MSGC) ~ 1 MHz hit channel

JM Heuser Development of silicon tracking detectors for FAIR 28

32 MHzreadoutrate

n-XYTER Architecturen-XYTER Architecture

PreAmpPreAmp fast shaperfast shaper

peaking timefast 20 nsslow 140 ns

slow shaperslow shaper

timewalk

comp

comparatorcomparator

tokencell

timestamp

counter

tokenmanager

1 ns step

32 MHzreadoutrate

self-triggerlatch amplitudelatch timestore in FIFOs

outputdrivers

digitalFIFO

analogFIFO

peakdetectamp hold

Page 23: Johann M. Heuser  GSI Darmstadt, Germany VERTEX 2008, Utö Island , Sweden

JM Heuser Development of silicon tracking detectors for FAIR 23

Typical operation for about 6 years

Situation

Interaction rate 107s Au+AuEffective CBM run year

2 months at full operation 5 times 106 s

Fluence up to ~1015 1-MeV nequiv

Radiation EnvironmentRadiation Environment

CBM cave

beam

STS

FLUKA simulation

1-MeV nequiv fluence per 1 CBM run year

dump

neutron field

last STS stationfirst STS station

(Muon setup)

JM Heuser Development of silicon tracking detectors for FAIR 24

Beginning STS system engineeringBeginning STS system engineering

STS ndash MVD ndash beam pipein a thermal enclosure

Extractable from the magnet for maintenance

Including infrastructure (cables optical links cooling)

12k FEE chips 6 ndash 12 kW power

FEE ASICs operation at 18V current 3600 ndash 7200 A

DAQ data rate ~30 GHz ~200 GBytes

JM Heuser Development of silicon tracking detectors for FAIR 25

SummarySummary

International accelerator facility FAIR under preparation

Unprecedented and new research opportunities in various fields for large scientific communities

Silicon detector systems will be important

Challenging

some because small research groups go into new detector dimensions

some because truly demanding devices are required

very high channel densities high radiation environment very fast readout very low mass pretty big ( CBM)

Cooperations of the GSIFAIR groups eg on Sensors FEE labs

Inputadvice from other experienced communities searched for

One example Planned are in-kind contributions from Finland to FAIR with rad-hard silicon strip detectors (incl RD39-RD50

expertise)

JM Heuser Development of silicon tracking detectors for FAIR 26

backup slides

JM Heuser Development of silicon tracking detectors for FAIR 27

n-XYTER readout ASICn-XYTER readout ASICDETNI - GSIDETNI - GSI

NameNamebull n-XYTER NNeutron - XX YY TTime and EEnergy ReadoutReadout

Front-endFront-endbull 128(32) channels charge sensitive pre-amplifier both polarities

bull 30 pF detector capacitance ENC 1000 e

bull self-triggered autonomous hit detection

bull time stamping with 1 ns resolution (needed to correlate x-y views)

ReadoutReadoutbull energy (peak height) and time information for each hit

bull data driven de-randomizing sparsifying readout

bull 32 MHz average hit ratendash 128 channel version (SiGEM) ~ 250 kHz hit channel

ndash 32 channel version (MSGC) ~ 1 MHz hit channel

JM Heuser Development of silicon tracking detectors for FAIR 28

32 MHzreadoutrate

n-XYTER Architecturen-XYTER Architecture

PreAmpPreAmp fast shaperfast shaper

peaking timefast 20 nsslow 140 ns

slow shaperslow shaper

timewalk

comp

comparatorcomparator

tokencell

timestamp

counter

tokenmanager

1 ns step

32 MHzreadoutrate

self-triggerlatch amplitudelatch timestore in FIFOs

outputdrivers

digitalFIFO

analogFIFO

peakdetectamp hold

Page 24: Johann M. Heuser  GSI Darmstadt, Germany VERTEX 2008, Utö Island , Sweden

JM Heuser Development of silicon tracking detectors for FAIR 24

Beginning STS system engineeringBeginning STS system engineering

STS ndash MVD ndash beam pipein a thermal enclosure

Extractable from the magnet for maintenance

Including infrastructure (cables optical links cooling)

12k FEE chips 6 ndash 12 kW power

FEE ASICs operation at 18V current 3600 ndash 7200 A

DAQ data rate ~30 GHz ~200 GBytes

JM Heuser Development of silicon tracking detectors for FAIR 25

SummarySummary

International accelerator facility FAIR under preparation

Unprecedented and new research opportunities in various fields for large scientific communities

Silicon detector systems will be important

Challenging

some because small research groups go into new detector dimensions

some because truly demanding devices are required

very high channel densities high radiation environment very fast readout very low mass pretty big ( CBM)

Cooperations of the GSIFAIR groups eg on Sensors FEE labs

Inputadvice from other experienced communities searched for

One example Planned are in-kind contributions from Finland to FAIR with rad-hard silicon strip detectors (incl RD39-RD50

expertise)

JM Heuser Development of silicon tracking detectors for FAIR 26

backup slides

JM Heuser Development of silicon tracking detectors for FAIR 27

n-XYTER readout ASICn-XYTER readout ASICDETNI - GSIDETNI - GSI

NameNamebull n-XYTER NNeutron - XX YY TTime and EEnergy ReadoutReadout

Front-endFront-endbull 128(32) channels charge sensitive pre-amplifier both polarities

bull 30 pF detector capacitance ENC 1000 e

bull self-triggered autonomous hit detection

bull time stamping with 1 ns resolution (needed to correlate x-y views)

ReadoutReadoutbull energy (peak height) and time information for each hit

bull data driven de-randomizing sparsifying readout

bull 32 MHz average hit ratendash 128 channel version (SiGEM) ~ 250 kHz hit channel

ndash 32 channel version (MSGC) ~ 1 MHz hit channel

JM Heuser Development of silicon tracking detectors for FAIR 28

32 MHzreadoutrate

n-XYTER Architecturen-XYTER Architecture

PreAmpPreAmp fast shaperfast shaper

peaking timefast 20 nsslow 140 ns

slow shaperslow shaper

timewalk

comp

comparatorcomparator

tokencell

timestamp

counter

tokenmanager

1 ns step

32 MHzreadoutrate

self-triggerlatch amplitudelatch timestore in FIFOs

outputdrivers

digitalFIFO

analogFIFO

peakdetectamp hold

Page 25: Johann M. Heuser  GSI Darmstadt, Germany VERTEX 2008, Utö Island , Sweden

JM Heuser Development of silicon tracking detectors for FAIR 25

SummarySummary

International accelerator facility FAIR under preparation

Unprecedented and new research opportunities in various fields for large scientific communities

Silicon detector systems will be important

Challenging

some because small research groups go into new detector dimensions

some because truly demanding devices are required

very high channel densities high radiation environment very fast readout very low mass pretty big ( CBM)

Cooperations of the GSIFAIR groups eg on Sensors FEE labs

Inputadvice from other experienced communities searched for

One example Planned are in-kind contributions from Finland to FAIR with rad-hard silicon strip detectors (incl RD39-RD50

expertise)

JM Heuser Development of silicon tracking detectors for FAIR 26

backup slides

JM Heuser Development of silicon tracking detectors for FAIR 27

n-XYTER readout ASICn-XYTER readout ASICDETNI - GSIDETNI - GSI

NameNamebull n-XYTER NNeutron - XX YY TTime and EEnergy ReadoutReadout

Front-endFront-endbull 128(32) channels charge sensitive pre-amplifier both polarities

bull 30 pF detector capacitance ENC 1000 e

bull self-triggered autonomous hit detection

bull time stamping with 1 ns resolution (needed to correlate x-y views)

ReadoutReadoutbull energy (peak height) and time information for each hit

bull data driven de-randomizing sparsifying readout

bull 32 MHz average hit ratendash 128 channel version (SiGEM) ~ 250 kHz hit channel

ndash 32 channel version (MSGC) ~ 1 MHz hit channel

JM Heuser Development of silicon tracking detectors for FAIR 28

32 MHzreadoutrate

n-XYTER Architecturen-XYTER Architecture

PreAmpPreAmp fast shaperfast shaper

peaking timefast 20 nsslow 140 ns

slow shaperslow shaper

timewalk

comp

comparatorcomparator

tokencell

timestamp

counter

tokenmanager

1 ns step

32 MHzreadoutrate

self-triggerlatch amplitudelatch timestore in FIFOs

outputdrivers

digitalFIFO

analogFIFO

peakdetectamp hold

Page 26: Johann M. Heuser  GSI Darmstadt, Germany VERTEX 2008, Utö Island , Sweden

JM Heuser Development of silicon tracking detectors for FAIR 26

backup slides

JM Heuser Development of silicon tracking detectors for FAIR 27

n-XYTER readout ASICn-XYTER readout ASICDETNI - GSIDETNI - GSI

NameNamebull n-XYTER NNeutron - XX YY TTime and EEnergy ReadoutReadout

Front-endFront-endbull 128(32) channels charge sensitive pre-amplifier both polarities

bull 30 pF detector capacitance ENC 1000 e

bull self-triggered autonomous hit detection

bull time stamping with 1 ns resolution (needed to correlate x-y views)

ReadoutReadoutbull energy (peak height) and time information for each hit

bull data driven de-randomizing sparsifying readout

bull 32 MHz average hit ratendash 128 channel version (SiGEM) ~ 250 kHz hit channel

ndash 32 channel version (MSGC) ~ 1 MHz hit channel

JM Heuser Development of silicon tracking detectors for FAIR 28

32 MHzreadoutrate

n-XYTER Architecturen-XYTER Architecture

PreAmpPreAmp fast shaperfast shaper

peaking timefast 20 nsslow 140 ns

slow shaperslow shaper

timewalk

comp

comparatorcomparator

tokencell

timestamp

counter

tokenmanager

1 ns step

32 MHzreadoutrate

self-triggerlatch amplitudelatch timestore in FIFOs

outputdrivers

digitalFIFO

analogFIFO

peakdetectamp hold

Page 27: Johann M. Heuser  GSI Darmstadt, Germany VERTEX 2008, Utö Island , Sweden

JM Heuser Development of silicon tracking detectors for FAIR 27

n-XYTER readout ASICn-XYTER readout ASICDETNI - GSIDETNI - GSI

NameNamebull n-XYTER NNeutron - XX YY TTime and EEnergy ReadoutReadout

Front-endFront-endbull 128(32) channels charge sensitive pre-amplifier both polarities

bull 30 pF detector capacitance ENC 1000 e

bull self-triggered autonomous hit detection

bull time stamping with 1 ns resolution (needed to correlate x-y views)

ReadoutReadoutbull energy (peak height) and time information for each hit

bull data driven de-randomizing sparsifying readout

bull 32 MHz average hit ratendash 128 channel version (SiGEM) ~ 250 kHz hit channel

ndash 32 channel version (MSGC) ~ 1 MHz hit channel

JM Heuser Development of silicon tracking detectors for FAIR 28

32 MHzreadoutrate

n-XYTER Architecturen-XYTER Architecture

PreAmpPreAmp fast shaperfast shaper

peaking timefast 20 nsslow 140 ns

slow shaperslow shaper

timewalk

comp

comparatorcomparator

tokencell

timestamp

counter

tokenmanager

1 ns step

32 MHzreadoutrate

self-triggerlatch amplitudelatch timestore in FIFOs

outputdrivers

digitalFIFO

analogFIFO

peakdetectamp hold

Page 28: Johann M. Heuser  GSI Darmstadt, Germany VERTEX 2008, Utö Island , Sweden

JM Heuser Development of silicon tracking detectors for FAIR 28

32 MHzreadoutrate

n-XYTER Architecturen-XYTER Architecture

PreAmpPreAmp fast shaperfast shaper

peaking timefast 20 nsslow 140 ns

slow shaperslow shaper

timewalk

comp

comparatorcomparator

tokencell

timestamp

counter

tokenmanager

1 ns step

32 MHzreadoutrate

self-triggerlatch amplitudelatch timestore in FIFOs

outputdrivers

digitalFIFO

analogFIFO

peakdetectamp hold