Joe Incandela University of California Santa Barbara DOE Site Visit Jan 17, 2008
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J. Incandela DOE Site Visit January 17, 2008 *
Clear, robust fault signatures At UCSB we developed fixtures forMinimum noiseMaximum sensitivity
And automated Fault-Finding: Use results of many partially correlated tests to determine the type and location of faults>99.9% faults are found with 2 yProduction capacity had to be expandedUS CMS portion of project was increased 40%Ultimately needed to compress 2.5 year production schedule into a little over 1 yearRequired an enormous amount of organization, workflow analysis, failure modes analysis, etc.
There was less than 3 days downtime due to equipment failure.
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J. Incandela DOE Site Visit January 17, 2008 *
Hybrid Via OpensOpens in the power vias appeared with timeInconsistently plated
Fix: add intermediate kapton layerKaptonGlueKaptonGlue*
J. Incandela DOE Site Visit January 17, 2008 *
Module Testing: Example of a Work Flow PlanAnalyze movement of people in clean room, layout work areas to optimize efficiency, minimize interference and minimize errors.*
J. Incandela DOE Site Visit January 17, 2008 *
Begin Installing Rods March 06Two teams of 5 technicians includes 2 US technicians*
J. Incandela DOE Site Visit January 17, 2008 *
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J. Incandela DOE Site Visit January 17, 2008 *
APV25 0.25 mm IBM CMOS 128 Channels 50 ns CR-RC shaperClever sampling of charge in three intervals separated by 25 ns intervals Total charge on strip in a single 25 ns bunch crossing obtained by de-convolution of signal from impulse response of amplifier Low noise and power
192 cell analog pipelineDiff. analog data outputExpect < 3000 e noise for all detector types during CMS lifetimeRadiation Hard- Performance unchanged after 50 MRad*
J. Incandela DOE Site Visit January 17, 2008 *
Tracker Readout System
Data for all channels are readout to the Front End Driver (FED) which then appliesZero suppressionPedestals Common mode filteringClusteringReadout is analog optical*
J. Incandela DOE Site Visit January 17, 2008 *
J. Incandela, Jan. 17,2008Blue = double sidedRed = single sidedStrip lengths 10 cm (innermost) to 20 cm (outermost)
Strip pitches 80mm (innermost) to 205mm (outermost) 500 mm thick high resistivity320 mm thick low resistivitySilicon Strips*
J. Incandela DOE Site Visit January 17, 2008 *
Misalignments and PT ResolutionSingle m sample, pT=100 GeVOnly rms shifts greater than 10 mm degrade pt resolution *
J. Incandela DOE Site Visit January 17, 2008 *
Factoids
10,000,000 individual strips 78,000 APV readout chips
26,000,000 individual wirebond wires
207 m2 of silicon
100 kg of Silicon*
****Global chip failures, changes in bias current, and pinholes are the greatest concernAll occur at very low levels
~8 MIP dynamic range
Need to understand this a bit better