ITherm 2019 CFP Conference Version · •Shock, Drop and Vibrational Analysis •TSV / 3D...
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18 th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems ITherm 2019 is the leading international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages, and systems. ITherm 2019 will be held along with the 69 th ECTC 2019, at The Cosmopolitan of Las Vegas. Joint registrations will be available at a discounted rate. All papers will be peer reviewed and published in the ITherm proceedings. Student first authors will have the opportunity to apply for ITherm travel grants in order to make an oral presentation and participate in a Student Poster and Networking Session. In addition to paper presentations and vendor exhibits, ITherm 2019 will have panel discussions, keynote lectures by prominent speakers, invited Tech Talks, and professional short courses. Original papers are solicited in the following general areas of interest (but not limited to): ITherm provides an opportunity for industrial and university participation in the form of financial support to ITherm 2019. All contributors will be given strong recognition both onsite and in the conference materials. Program Inquiries To: Dr. Vadim Gektin, Program Chair, [email protected] Prof. Justin A. Weibel, Vice Program Chair, [email protected] Call for Abstracts Join the ITherm LinkedIn Group https://www.linkedin.com/groups/8650280 Component-Level Thermal Management • Transistor Technology • 2.5D / 3D Packaging • Embedded Cooling • Hotspot and Impingement Cooling • Thermal Interface Materials and Heat Spreaders • Thermoelectric and Peltier Devices • Heat Pipes, Vapor Chambers and Thermosyphons • Single / Two-phase Cold Plates and Heat Sinks • RF and Power Electronics • LEDs and Photovoltaics • Pulsed Power Dissipation System-Level Thermal Management • Air Cooling Techniques and Heat Exchangers • Liquid Cooling Solutions • Immersion Cooling and Refrigeration • Pumps, Compressors, Fans and Blowers • Phase Change Materials • Automotive, Batteries and Thermal Storage • Mobile and Internet of Things • Telecommunication Systems • Space and Aerospace • Data Center Thermal Management Prof. Jeffrey C. Suhling, General Chair, [email protected] ITherm Website: http://ieee-itherm.net/ Abstracts Due: September 3, 2018 Mechanics & Reliability • Thermo-Mechanical Modeling and Simulation • Mechanics and Reliability of Solder Joints and Interconnects • Materials Characterization, Processing, and Constitutive Models • Failure Mechanics, Fatigue, and Damage Modeling • Measurement of Deformations, Strains and Stresses • Shock, Drop and Vibrational Analysis • TSV / 3D Reliability and Packaging • Mechanics in Assembly and Manufacturing • Applied Reliability and Failure Analysis • Process-Structure-Property Relations / Multi-Scale Analyses • Accelerated Stress Testing and Modeling • Lifetime Prognostics and Condition Monitoring Emerging Technologies and Fundamentals • Boiling / Evaporation / Condensation • Convection in Microchannels, Microgaps & Jets • Pulsating / Oscillating and Non-Conventional Heat Pipes • Thermal Transport in Nanotechnologies • Novel Materials and Fabrication Techniques • Measurement and Instrumentation Techniques • Numerical Methods, Nano-to-Macro Scale • Experimental Methods, Nano-to-Macro Scale • Prognostic Health Management and Reliability Analysis • Flexible Electronics • Additive Manufacturing May 28 – 31, 2019 Cosmopolitan of Las Vegas Las Vegas, NV, USA Important Dates Deadline for Abstracts: Sept. 3, 2018 Notification of Acceptance: Oct. 15, 2018 Draft Paper Submission: Dec. 17, 2018 Reviews Returned: Feb. 4, 2019 Final Paper Submission: Mar. 4, 2019
Transcript of ITherm 2019 CFP Conference Version · •Shock, Drop and Vibrational Analysis •TSV / 3D...
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18th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
ITherm 2019 is the leading international conference for scientific and engineering exploration of thermal, thermomechanical andemerging technology issues associated with electronic devices, packages, and systems. ITherm 2019 will be held along with the 69thECTC 2019, at The Cosmopolitan of Las Vegas. Joint registrations will be available at a discounted rate. All papers will be peer reviewedand published in the ITherm proceedings. Student first authors will have the opportunity to apply for ITherm travel grants in order tomake an oral presentation and participate in a Student Poster and Networking Session. In addition to paper presentations and vendorexhibits, ITherm 2019 will have panel discussions, keynote lectures by prominent speakers, invited Tech Talks, and professional shortcourses. Original papers are solicited in the following general areas of interest (but not limited to):
ITherm provides an opportunity for industrial and university participation in the form of financial support to ITherm 2019. All contributors will be given strong recognition both onsite and in the conference materials.
Program Inquiries To:Dr. Vadim Gektin, Program Chair, [email protected]
Prof. Justin A. Weibel, Vice Program Chair, [email protected]
Call for Abstracts
Join the ITherm LinkedIn Grouphttps://www.linkedin.com/groups/8650280
Component-Level Thermal Management
• Transistor Technology• 2.5D / 3D Packaging• Embedded Cooling• Hotspot and Impingement Cooling• Thermal Interface Materials and Heat Spreaders• Thermoelectric and Peltier Devices• Heat Pipes, Vapor Chambers and Thermosyphons• Single / Two-phase Cold Plates and Heat Sinks• RF and Power Electronics• LEDs and Photovoltaics• Pulsed Power Dissipation
System-Level Thermal Management
• Air Cooling Techniques and Heat Exchangers• Liquid Cooling Solutions• Immersion Cooling and Refrigeration• Pumps, Compressors, Fans and Blowers• Phase Change Materials• Automotive, Batteries and Thermal Storage• Mobile and Internet of Things• Telecommunication Systems• Space and Aerospace• Data Center Thermal Management
Prof. Jeffrey C. Suhling, General Chair, [email protected] Website: http://ieee-itherm.net/
Abstracts Due: September 3, 2018
Mechanics & Reliability• Thermo-Mechanical Modeling and Simulation• Mechanics and Reliability of Solder Joints and Interconnects• Materials Characterization, Processing, and Constitutive Models• Failure Mechanics, Fatigue, and Damage Modeling• Measurement of Deformations, Strains and Stresses• Shock, Drop and Vibrational Analysis• TSV / 3D Reliability and Packaging• Mechanics in Assembly and Manufacturing• Applied Reliability and Failure Analysis• Process-Structure-Property Relations / Multi-Scale Analyses• Accelerated Stress Testing and Modeling• Lifetime Prognostics and Condition Monitoring
Emerging Technologies and Fundamentals• Boiling / Evaporation / Condensation• Convection in Microchannels, Microgaps & Jets• Pulsating / Oscillating and Non-Conventional Heat Pipes• Thermal Transport in Nanotechnologies• Novel Materials and Fabrication Techniques• Measurement and Instrumentation Techniques• Numerical Methods, Nano-to-Macro Scale• Experimental Methods, Nano-to-Macro Scale• Prognostic Health Management and Reliability Analysis• Flexible Electronics• Additive Manufacturing
May 28 – 31, 2019Cosmopolitan of Las Vegas
Las Vegas, NV, USA
Important DatesDeadline for Abstracts: Sept. 3, 2018Notification of Acceptance: Oct. 15, 2018Draft Paper Submission: Dec. 17, 2018Reviews Returned: Feb. 4, 2019Final Paper Submission: Mar. 4, 2019
https://www.linkedin.com/groups/8650280http://ieee-itherm.net/
