ISS - KICP Workshops
Transcript of ISS - KICP Workshops
JEM-EUSO(2017)
(2013)
(2014)
JEM-EUSO (2017)
1. Ground-EUSO: Test at Telescope Array site. (2013)
2. EUSO-BALLOON 3 Balloon flights from Canada (French Space Agency CNES) 2014-
The EUSO program
2
Optical system protoype
2.65 m
1.5 m
large diameter Fresnel lenses manufactured in Japan and tested in the US at the University of Alabama (Huntsville) and at MSFC (NASA)
Tested performances meet already the requirements (or are close to it)
Spot size is 2.5 mm!
5
3rd groove surface roughness measurement
Electrical noise
RMS surface roughness requirement : < 0.0200um (=20nm)
Lens precision: 20 nm
Focal Surface Mechanics
Volume for Electronics (167 x 128 x 130)
PDM Frame
EC Base64 channel MAPMT
FS Structure – Front view
Three element support, (note sphericity)
Photo Detector Module 2304 channels
137 PDMs in the FS – 315 kchannels
2.5 m
Simulations by K. Shinozaki
Sicily seen from EUSO •Simulation of UV light•Environmental monitoring
11
Simulations by K. Shinozaki
Sicily seen from EUSO •Simulation of UV light•Environmental monitoring
10^20 eV shower
11
UltraViolet fluorescence emission
Cherenkov light
Time
250 µs
Signal of a proton shower (1020eV, 60 deg)
12
PMT development• Collaboration with Hamamatsu
M64• Reduction of size• Improvement of Quantum
efficiency• Improvement of uniformity of
response • Each of the 137 PDM boxes
houses 36 PMTs, 64 channels each
Miniaturization of dynodes
Hamamatsu PhotonicsUltra Bialkali ZB0765 Average: (24.4 ± 1.8)%
UV Filter 14
5760 PMT – 300kch
1440 PMT
143 PDM
20 PDM
1 MPU
•300 Kchannels•Strongly parallel and hyerarchical structure•Intrinsic redundancy
36 channel UBA PMT
ISS
LVDS to CCBTexas DSP (21 links)
Lidar
Lid operations
Infrared Camera
Detector block
CPU blockDAQ Control block
ISS
LVDS to CCBTexas DSP (21 links)
Lidar
Lid operations
Infrared Camera
Piggyback board:
Custom Pin to Pin connector
IDAQ FPGA with links
Detector block
CPU blockDAQ Control block
CPUISS
LVDS to CCBTexas DSP (21 links)
Lidar
Lid operations
Infrared Camera
Piggyback board:
Custom Pin to Pin connector
IDAQ FPGA with links
Detector block
CPU blockDAQ Control block
CPUISS
PCI BUS 32 bit
MASS MEMORY STORAGE(Temporary 1-2 Gbyte)
LVDS to CCBTexas DSP (21 links)
Lidar
Lid operations
Infrared Camera
Piggyback board:
Custom Pin to Pin connector
IDAQ FPGA with links
Detector block
CPU blockDAQ Control block
CPU
CAN bus: HK control Housekeeping and
slow control Board
ISS
PCI BUS 32 bit
MASS MEMORY STORAGE(Temporary 1-2 Gbyte)
LVDS to CCBTexas DSP (21 links)
Lidar
Lid operations
Infrared Camera
Piggyback board:
Custom Pin to Pin connector
IDAQ FPGA with links
Detector block
CPU blockDAQ Control block
CPU
CAN bus: HK control Housekeeping and
slow control Board
ISS
PCI BUS 32 bit
MASS MEMORY STORAGE(Temporary 1-2 Gbyte)
LVDS to CCBTexas DSP (21 links)
Lidar
Lid operations
Infrared Camera
Temperature Boards, FS
VoltageCurrent
Detector movement (nadir/tilted)
Piggyback board:
Custom Pin to Pin connector
IDAQ FPGA with links
Detector block
CPU blockDAQ Control block
CPU
CAN bus: HK control Housekeeping and
slow control Board
ISS
PCI BUS 32 bit
MASS MEMORY STORAGE(Temporary 1-2 Gbyte)
LVDS to CCBTexas DSP (21 links)
Lidar
Lid operations
Infrared Camera
HV setting DC/DC activationCooling
Star Sensor
Temperature Boards, FS
VoltageCurrent
Detector movement (nadir/tilted)
Piggyback board:
Custom Pin to Pin connector
IDAQ FPGA with links
Detector block
CPU blockDAQ Control block
CPU
CAN bus: HK control Housekeeping and
slow control Board
ISS
PCI BUS 32 bit
MASS MEMORY STORAGE(Temporary 1-2 Gbyte)
LVDS to CCBTexas DSP (21 links)
Lidar
Lid operations
Infrared Camera
HV setting DC/DC activationCooling
Star Sensor
Temperature Boards, FS
VoltageCurrent
Detector movement (nadir/tilted)
Piggyback board:
Custom Pin to Pin connector
IDAQ FPGA with links
Detector block
CPU blockDAQ Control block
1553 connection:
Telecommand
Alive information
CPU
CAN bus: HK control Housekeeping and
slow control Board
ISS
PCI BUS 32 bit
MASS MEMORY STORAGE(Temporary 1-2 Gbyte)
LVDS to CCBTexas DSP (21 links)
Lidar
Lid operations
Infrared Camera
HV setting DC/DC activationCooling
Star Sensor
Temperature Boards, FS
VoltageCurrent
Detector movement (nadir/tilted)
Piggyback board:
Custom Pin to Pin connector
IDAQ FPGA with links
Detector block
CPU blockDAQ Control block
1553 connection:
Telecommand
Alive information
FDDI / Ethernet ConnectionDownlink data Redundant Time, GPS
Time
GPS info
Attitude info
CPU
CAN bus: HK control Housekeeping and
slow control Board
ISS
PCI BUS 32 bit
MASS MEMORY STORAGE(Temporary 1-2 Gbyte)
Downlink to ISSStorage on Hard Disk
LVDS to CCBTexas DSP (21 links)
Lidar
Lid operations
Infrared Camera
HV setting DC/DC activationCooling
Star Sensor
Temperature Boards, FS
VoltageCurrent
Detector movement (nadir/tilted)
Piggyback board:
Custom Pin to Pin connector
IDAQ FPGA with links
Detector block
CPU blockDAQ Control block
1553 connection:
Telecommand
Alive information
FDDI / Ethernet ConnectionDownlink data Redundant Time, GPS
Time
GPS info
Attitude info
JEM-EUSO DAQ – CURRENT Electronic System scheme
FEE
ASIC+FPGA
Count
137 PDM Control Board
FPGA
Track Trigger
Cluster Control Board
FPGA
Fine Trigger
CPU
TelemetryInterfaces
137 Boards 20 Board
1CCB1PDM9EC
140 GB/s (FS)
PhotoDetector Modules
3*10-3 compression
1 PDM 36 x 64 channels
PMT
1936 36-3lay 6
1
1
1
36
300kch1,287 EC
2 Board
137 PDM20 CCB
1 CPU1 CLOCK
1GPS½ Housekeeping
storage
137 PDM New design
10-3 compression 297 kbit/s 3 Gbyte/day (downlink)
Storage on SSD will give factor 3-5, up to 10 Gbyte/dayReturn with Soyuz or Dragon
TA EUSO DAQ – CURRENT Electronic System scheme
FEE
ASIC+FPGA
Count
PDM Control Board
FPGA
Track Trigger
Cluster Control Board
FPGA
Fine Trigger
CPUSpacewire
Clock Board GPS
Data StorageSoftware
TelemetryInterfaces
1 Boards
1CCB1PDM9EC
1GB/s (FS)
PhotoDetector Modules
4*10-3 compression no compression
1 PDM 36 x 64 channels
PMT
2036 36-3lay 6
1
1
1
36
2304ch9 EC
2 Board
1 PDM1 EC BOARD
2 PMT 1 CCB
1 CPU1 CLOCK
1GPS½ Housekeeping
storage
3Mbyte/s 10 Gbyte/hour
Most dataStored on SSD 17 GB/hour (save all stream)
• 3 different PCBs:
• First one (EC DYNODE board) allows to reroute half of the dynodes of 1 MAPMT so that they are aligned perpendicularly to the others. It covers the 4 MAPMTs.
• Second one (EC ANODE board) covers one MAPMT but has dimensions reduced allowing a flex pcb to get out. It is used to collect signal from the anodes and send them to the ASICs.
• Third one (EC HV board) covers one MAPMT. It welcomes the dynodes and supplies the HV (up to 1000 V) to the EC-dynode board which transmits it to the 4 MAPMTs.
Per EC unit:• 1 EC-DYNODE board• 4 EC-ANODE boards• 1 EC-HV boards
UV filter
MAPMTMAPMT MAPMT
Flexible pcb toward EC-back
HV cables toward HV box21
Reminder: EC-front unit
Central column