ISI BGA Reballing Process September 2012

www.isipkg.com

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Founded in 1987 Advanced electronic design and manufacturing facility in the U.S. 200 full-time employees, including 70 with engineering degrees, and 9 technicians 25+ patents Broad and diversified manufacturing capabilities Thousands of solutions designed Millions of products shipped each year Subsidiaries: Nallatech and Innovative Integration

ISI Company Overview

Pioneered Next Level Integration by blending high density packaging with advanced interconnect technologies to quickly deliver optimized modular solutions

Multi-discipline approach improves performance, reduces size and cost, and accelerates time-to-market

Delivering Next Level Integration

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The Need for Reballing Components

Lead-free is not compatible with a tin-lead assembly process; likewise tin-lead is not compatible with a lead-free assembly process

Industry is predominantly supplying lead-free packages

Customers need to reball components to alloy that is compatible with the rest of its assembly process

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ISI Solution: Reballing

ISI has an advanced process for removing and reballing solder spheres that is compatible to the assembly process criteria, whether it requires: Tin-lead (Sn63Pb37 eutectic) Lead-free Or any specialty alloys

Qualified by leading commercial, military and aerospace companies Processes are tailored to each part. Specific control parameters are clearly

defined and indicated for: Handling Production Controls for temperature Humidity ESD protection Ball size/position tolerance specifications Automation Cleanliness Inspection Repackaging

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ISI Certification and Statement Of Work

All processes done in accordance with IPC/JEDEC

J-STD sensitivity levels.

The component temperature exposure is minimized during the ball

removal process.

All parts are reballed using a custom temperature

profile in a nitrogen environment.

Parts are 100% optically inspected to ensure the

device meets the specifications for flatness

and co-planarity.

ISI Reball Certification

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ISI Certification and Statement Of Work

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Reballing Process Flow

Packaging: either customer supplied, JEDEC trays or tape and reel per EIA-481 with nitrogen purged dry pack bags

Final inspection per QAP

True position, co-planarity and flatness are measured using Nikon Nexis or RVSI model LS6000

Part marking available per customer specifications on request

Post ball attach cleaning procedures are monitored and measured using an Ionograph

Reflow solder profiles customized for each component

Reballing utilizes high accuracy assembly tooling for ball placement

Deballing process is specified based on the component

Moisture Sensitivity Level (MSL) requirements are observed and followed

Incoming inspection procedures per Quality Assurance Procedures (QAP)

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Reballing Flux Dispense

Ekra Screen Printer

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Reballing

Ball Placement

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Reflow Ovens Integrated Electronic Assembly

Sikama Conduction Convection Oven

Heller Reflow Ovens

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Inspection and Test

Ionograph Cleanliness Testing

Nikon Automated Optical Inspection

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Automated Optical Inspection

RVSI 100% Automated Optical Inspection

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Operations and Quality

ISO 9001:2008 certified ISO certified since July 2000 ITAR Registered Comprehensive Quality and Process Controls Material traceability In-process controls Automated test, measurement, and inspection systems All work is performed at the ISI facilities in Camarillo, CA

ITAR registered

North American

facilities ISO9001:2008 certified by Perry

Johnson Registrars

IPC Class III compliant soldering Certified IPC Specialist inspectors and key operators

In-house Certified IPC Trainer

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The ISI Difference

ISIs reballing process has been audited and approved for production by several Tier 1 defense suppliers

ISI process is designed and optimized to minimize stress on IC

100% automated optical assembly of reballed components

ISI has reballed over 1,000,000 components Any pitch, any package, any quantity Fast turn-around conversion of any alloy to any alloy

including Pb-free to Sn/Pb Get a reballing quote in less than 24 hours

Thank you! For more information, please visit www.isipkg.com

Copyright 2012 Interconnect Systems, Inc. All rights reserved.