ConfidentialNovember 2008 1

Nordiko Technical Services Limited

500/550 Nest Business Park

Martin Road

Havant

Hampshire PO9 5TL

United Kingdom

Corporate Member

Confidential 1

Location 50° 51’ 54.67”, 0° 58’ 15.49”

Nordiko Technical Services

Limited

Nest Business Park

500 m2 (5,380 ft2)

70 m2 (750 ft2) cleanroom

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Introduction

Nordiko Limited Founded in 1972.

Sputtering - magnetron and RF diode sputtering.

Ion Beam technology - introduced in 1989.

First commercially available RF ion source.

Ion Beam Deposition.

Ion Beam Milling.

Nordiko Limited Acquired by Shimadzu Corporation 1998.

Shimadzu decided to close Nordiko in 2003.

•Nordiko Technical Services Limited - May 2003.

• Acquired by Anelva Corporation - June 2005.

• Anelva 100% owned subsidiary of NEC.

• NEC sold Anelva to Canon - October 2005.

• Bought out Canon - October 2011.

Ion MillingI can tell you from personal experience that not only does the

Nordiko Ion Source outperform the Veeco in terms of etch rate and

etch uniformity, the Nordiko source design /technology outperforms

Veeco with regards to maintenance intervals. The Veeco ion source

requires maintenance about two times per week, where the Nordiko

Source will go weeks or months in comparable production

environments.

I was the Headway Technology Equipment Engineer for the Veeco

ion mills in the very beginning, then later at Read-Rite. While

working at Read-Rite I was also responsible for the Veeco and

Nordiko Ion Beam Deposition systems. I've not been responsible for

the Nordiko ion mills, but I know the few who have and they agree,

the Nordiko system far outperforms in all categories.

Kevin Potts

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5

Alpha 120Liner Load Lock Version

15, 20, or 25 cm ion source

150 mm wafer capability

MESC standard interface

Wafer Handling Platform

Random access

vacuum elevator

150 mm wafer

capbility

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7000 Etch - Oxidation Rectangular chamber with full

aperture access door.

Single axis substrate table

providing on-axis wafer rotation,

continuous, 0 to 60 rpm.

25 cm RF ion source.

Filamentless neutraliser.

Shutter.

Magnetically levitated turbomolecular pump, 1400 l.s-1.

Dry mechanical roughing pump.

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Ion Beam Preclean

7100 Ion Beam Pre-clean

25 cm RF excited ion source

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7500 Ion Mill

36 cm ion

source

Neutraliser

Rotary Work Table

Wafer Clamp

200 mm wafer SIMS Probe

Ion Beam Etching

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7500 - Ion Mill - 200 mm

7500 Ion Mill for INL Braga - delivered February 2011

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SIMS - end point detection

Data courtesy of INL Braga

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RF Ion Source

FeaturesRF ion source.

Filamentless current neutralisation.

Magnetically confined glow discharge.

Embedded DC HT feedthroughs.

Good maintenance access.

Sources 5, 10, 15, 20, 25, 30 and 36 cm.

Benefits13.56 MHz plasma excitation.

High efficiency sources.

Rapid process qualification.

High performance beam accelerator.

Reliable operation in Oxygen.

Precision - Control.

+ve-ve

RF ion source

plasma bridge neutraliser

accelerator

ion beam

AcceleratorTriode.

Graphite or

Molybdenum

grids.

Stainless steel

support rings.

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Ion Source and Neutraliser

15 cm Ion Source Mk IIIRF excited.

Proven technology.

Production engineered.

Triode AcceleratorMolybdenum grids.

Robust.

Simple assembly.

Compact NeutraliserDC excited.

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Ion Extraction - Child-Langmuir

I = α a

D (

)

2

V 3/2

ex

4πε0

9

2

e m √

a = aperture radius

m = ion mass (amu)

V = V + V -+

D = electrode separation

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Triode Accel - Decel Extraction

+

+

+

-

-

glow

discharge

Vp

Vex = Vp + V+ + ∣V-∣

Eg:

Vp = 20

V+ = 500

V- = 1500

Vbeam = 520

V=0

V=2000

Accel Decel Output Beam

Vbeam = Vp + V+ + (V- - V-)

Vbeam = Vp + V+

Vbeam ≃ V+

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Rotary Substrate Table

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FeaturesDual Axis Table

Rotation on sample axis.

Rotation to provide a variable inclination to the ion beam

or material deposition flux. Configurable for different

wafers/substrate sizes 150 to 300 mm.

Water cooled table.

OptionsHigh speed rotation, 1000 rpm.

Substrate heating.

Magnetic field projection, in the plane of the substrate.

Water cooled table.

Substrate cooling is key for pattern transfer in milling.

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Random access vacuum cassette load lock/s.

Standard 25 wafer cassette.

Optical sensors for slide out detection.

Optical sensors for cassette mapping.

700 l.s-1 turbomolecular pump.

30 m3.hr-1 dry mechanical pump.

Combined vacuum gauge covering he range from

atmosphere to 1E-08 Torr.

VAT series 02.

VAT series 62 pipeline isolation valve.

Vacuum Cassette Load Lock

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Static cassette load lock.

Static four (4) wafer cassette.

Vertical travel of the transfer arm (35 mm) is used to pick

from four wafer slots within a static cassette.

Common vacuum environment to the robot transfer chamber.

No isolation valve between the load lock and the transfer

chamber.

700 l.s-1 turbomolecular pump.

28 m3.hr-1 dry mechanical pump.

Combined vacuum gauge covering he range from

atmosphere to 1E-08 Torr.

VAT series 02.

VAT series 62 pipeline isolation valve.

Ideal for research applications where small batches are often

processed

Vacuum Load Lock - Static Cassette

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Transfer Chamber

Transfer chamber.

Six port or Eight port.

Six port; two load ports and four

process ports.

Eight port; two load ports and six

process ports.

Optical sensors for wafer

tracking.

700 l.s-1 turbomolecular pump.

30 m3.hr-1 dry mechanical pump.

Three axis robot.

SCARA style - single end

effector.

Rotary vacuum seal, magnet

fluid feedthrough.

Z-axis seal, edge welded

bellows.

Aligner.

Optical CCD aligner.

Operates in concert with the robot.

Wafer centre alignment ±0.25 mm.

Angular alignment ±0.1 degree.

Control Automation System

FeaturesSystem is not a PLC.

• Modular computer with industrial I/O.

• Intel micro-processor.

• OS is Windows CE.

• HMI on a separate PC.

InstallationsFourteen installations.

• Three new systems +.

• Eleven field retro-fits.• Ten in USA.

• One in Japan. ⎬production tools.

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Control Automation System

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FeaturesCPU - only Ethernet &

COM1 ports.

• No video, no keyboard,

no mouse.

• Networked PC for user

interface, HMI.

• Flash storage, no

rotating hard disc.

• Low power CMOS - no

fans.

• Serial, digital & analogue

I/O modules.

• No back-plane - I/O

modules build the bus.

• Intelligent

Instrumentation.