Introduction to Semiconductor Manufacturing Technology...
Transcript of Introduction to Semiconductor Manufacturing Technology...
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Introduction to SemiconductorManufacturing Technology
Chapter 1, Introduction
Hong Xiao, Ph. D.
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Hong Xiao, Ph. D. www2.austin.cc.tx.us/HongXiao/Book.htm 2
Objective
After taking this course, you will able to
• Use common semiconductor terminology
• Describe a basic IC fabrication sequence
• Briefly explain each process step
• Relate your job or products to semiconductormanufacturing process
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Topics
• Introduction
• IC Device and Design
• Semiconductor Manufacturing Processes
• Future Trends
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Introduction
• First Transistor, AT&T Bell Labs, 1947
• First Single Crystal Germanium, 1952
• First Single Crystal Silicon, 1954
• First IC device, TI, 1958
• First IC product, Fairchild Camera, 1961
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First Transistor, Bell Lab, 1947
Photo courtesy:AT&T Archive
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John Bardeen, William Shockley and Walter Brattain
Photo courtesy: Lucent Technologies Inc.
First Transistor and Its Inventors
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First IC Device Made by Jack Kilbyof Texas Instrument in 1958
Photo courtesy: Texas Instruments
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First Silicon IC Chip Made by RobertNoyce of Fairchild Camera in 1961
Photo courtesy: Fairchild Semiconductor International
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Moore’s Law
• Intel co-founder Gorden Moore notice in 1964
• Number of transistors doubled ever 12 monthswhile price keeping unchanged
• Slowed down in the 1980s to every 18 months
• Amazingly still correct, likely to keep until2010.
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Moore’s Law, Intel’s VersionTransistors
10K
100K
1M
10M
1975 1980 1985 1990 1995
4040 8080
8086 80286
80386
80486Pentium
Pentium III
1K2000
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IC Scales
Integration level Abbreviation Number of devices on a chip
Small Scale Integration SSI 2 to 50
Medium Scale Integration MSI 50 to 5,000
Large Scale Integration LSI 5,000 to 100,000
Very Large Scale Integration VLSI 100,000 to 10,000,000
Ultra Large Scale Integration ULSI 10,000,000 to 1,000,000,000
Super Large Scale Integration SLSI over 1,000,000,000
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Road Map Semiconductor Industry
1995 1997 1999 2001 2004 2007
Minimum feature size (µm) 0.35 0.25 0.18 0.13 0.10 0.07DRAMBits/chip 64 M 256 M 1 G 4 G 16 G 64 GCost/bits @ volume(millicents) 0.017 0.007 0.003 0.001 0.0005 0.0002MicroprocessorTransistors/cm2 4 M 7 M 13 M 25 M 50 M 90 MCost/Transistor @ volume(millicents) 1 0.5 0.2 0.1 0.05 0.02ASICTransistors/cm2 2 M 4 M 7 M 13 M 25 M 40 MCost/Transistor @ volume(millicents) 0.3 0.1 0.05 0.03 0.02 0.01Wafer size (mm) 200 200 200 -
300300 300 300 –
400 (?)
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Feature Size and Wafer Size
Chip made with 0.35 µmtechnology
with 0.25 µmtechnology
with 0.18 µmtechnology
300 mm
200 mm
150 mm
Chipor die
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Smallest Known Transistor Madeby NEC in 1997
Ultra shallow junctions
Lower gateUpper gate
Source Drain
Dielectric
n+ n+
P-type substrate
0.014 micron lower gate width Photo courtesy: NEC Corporation
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Limit of the IC Geometry
Size of the atom
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Limit of the IC device
• Atom size: several Å
• Need some atoms to form a device
• Likely the final limit is around 100 Å or0.01 micron.
• About 30 silicon atoms
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IC Design: First IC
Photo courtesy: Texas Instruments
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IC Design:CMOS Inverter
Metal 1, AlCu
P-Epi
P-Wafer
N-WellP-Well
PMD
p + p +n +n +
W
Metal 1Contact
P-well N-well Polycide gate and local interconnection
N-channel active region•N-channel Vt•N-channel LDD•N-channel S/D
P-channel active region•P-channel Vt•P-channel LDD•P-channel S/D
Shallow trench isolation (STI)
Vss
Vdd
NMOS PMOS
Vin
Vout
STI
(a)
(b)
(c)
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CMOS inverter layout Mask 1, N-well Mask 2, P-well
Mask 3, shallow trench isolation Mask 4, 7, 9, N-Vt, LDD, S/D Mask 5, 8, 10, P-Vt, LDD, S/D
Mask 6, gate/local interconnection Mask 11, contact Mask 12, metal 1
IC Design: Layout and Masks of CMOS Inverter
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Mask/Reticle
Quartz substrate
Chrome patternPellicle Phase shift coating
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A Mast and a Reticle
Photo courtesy: SGS Thompson
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Wafer Process Flow
Materials
Design
Masks
IC Fab
Test
Packaging
Final Test
ThermalProcesses
Photo-lithography
EtchPR strip
ImplantPR strip
Metallization CMPDielectricdeposition
Wafers