Introducing DFSR, LG-S-850L · LGCE BJ : Polarizer LG YX : ABS, SBL, EP Comp’d CPI : Li-ion...
Transcript of Introducing DFSR, LG-S-850L · LGCE BJ : Polarizer LG YX : ABS, SBL, EP Comp’d CPI : Li-ion...
Introducing DFSR, LGIntroducing DFSR, LG--SS--850L850L
October, 2011
/ Information Technology & Electronic Materials R&D
• Brief History
Introduction of LG Chem
LG Chem is the largest chemical company in Korea, and now extends its chemical expertise further into lithium-ion batteries and information & electronic materials industries.
1947 Founded Lucky Chemical Industrial Corp. 1947 Founded Lucky Chemical Industrial Corp.
Entered into
• Industrial Materials business in 1960s
• Petrochemicals business in 1970s
• Information & Electronic Materials in 1990s
1960~1990s
Corporate Spin-Off
(LG Chem, LG Life Science and LG Household &
Healthcare)
2001
Acquired LG Daesan Petrochemicals Ltd.2006 Acquired LG Daesan Petrochemicals Ltd.2006
Acquired LG Petrochemical Co., Ltd. 2007
Demerged Industrial Materials business (LG Hausys)2009
• 2010 Annual Revenue : US $ 18.1 Bil
• Workforce :16,100 employees (approx.)
Business ProfileBusiness Profile
Batteries for Mobile Applications
Batteries for Vehicle Applications
Batteries for Mobile Applications
Batteries for Vehicle Applications
Batteries
LCD Polarizer
Photosensitive Materials
OLED Materials
Toner, PCB Materials
LCD Polarizer
Photosensitive Materials
OLED Materials
Toner, PCB Materials
IT & Electronic Materials Petrochemicals & Polymers
NCC / Polyolefin
Synthetic Rubbers & Specialty Polymers
PVC
NCC / Polyolefin
Synthetic Rubbers & Specialty Polymers
PVC
Annual revenue :
USD 18.1 Bil74%
18%
8%
Toner, PCB Materials
3D Film Patterned Retarder
Toner, PCB Materials
3D Film Patterned Retarder
PVC
ABS / Engineering Plastics
Acrylates / Plasticizers
PVC
ABS / Engineering Plastics
Acrylates / Plasticizers
2010
Ochang Techno Park
Rechargeable Batteries,Display Materials,
LG Chem HQ (Seoul)
Domestic NetworkDomestic Network
8 Plants and 1 Research Park
ㅍ
Display Materials,Imaging Materials
Cheongju Complex
Electrolyte, PCM,
ICP, DFSR, DAF,Rechargeable Batteries
B
NCC, EO/EG, SM, BD, MTBE, B-1, LDPE, LLDPE, HDPE,PP, Synthetic Rubbers, PVC, VCM
Daesan Complex
Plasticizers
Gimcheon Plant
SAPResearch Park (Daejeon)
Ulsan Plant
Iksan Plant
ABS Compound,Engineering Plastics
Octanol, Butanol, Plasticizers, Acrylic Acids
Yeosu Complex
NCC, SM, LDPE, HDPE, PVC, VCM, ABS, SAN, EPS, Acrylate,OXO-alcohol, NPG, SBS, MBSSB Latex, BPA
Plasticizers
Naju Plant
Global NetworkGlobal Network
Manufacturing Subsidiaries (13) : China (9), Vietnam, India, Poland, USA
Marketing Subsidiaries (6) : China (2), USA, Brazil, Europe, India
Representative Offices (7) : Moscow, Istanbul, Ho Chi Minh City, Bangkok, Jakarta, Singapore, Tokyo
26 Subsidiaries around the world
LG DAGU : PVCLG BOHAI : VCM, EDC, C/A LGCC TJ : EP Comp’d, ABS Comp’dLG BOTIAN : SBS
LGCCI(Holding Company)LGCE BJ : Polarizer
LG YX : ABS, SBL, EP Comp’d
CPI : Li-ion Battery Cell / Pack
LGCE NJ : Polarizer, Battery
Beijing
Tianjin
Ningbo
Michigan
Poland
NanjingNew York
Frankfurt
EP Comp’d
LGCE TP : Polarizer
LGCC GZ : EP Comp’d, ABS Comp’d
LG VINA : DOP
LGPI : PS/EPS
LGCE WR : Polarizer
Polarizer, Battery
Taiwan
Guangzhou
Ho Chi Minh City
Mumbai
Poland New York
São Paulo
Hong Kong
Research Area: IT& Electronics Materials
LCD/
OLED
ApplicationsProducts
Photo Resist
Polarizer StrippersNotebook
OLED
Semiconductor
DisplayMaterials
SemiconductorMaterials
PDP Filter
OLEDMaterials
IC-Package DAF
Monitor
TV
DFSR
PDP
PrinterImagingMaterials
Materials
Color & Black Toner
Why DFSR?Why DFSR?
DFSRLiquid type PSR
Technical Issues:
• Surface Flatness for Chip Mounting
• Warpage Problem of Thin Core
• Registration of Smaller SRO
• SR Plugging of Narrow Pitch Circuit
• Crack Resistance
• Halogen Free, Less Solvent
* PSR: Photosensitive Solder Resist, DFSR: Dry Film type photosensitive Solder Resist
7~8 ㎛ surface roughness < 3 ㎛ surface roughness
Manufacturing ProcessManufacturing Process
Oven Release film lamination
PhotosensitiveCoating materials
Carrier film
Carrier Film (PET)
Photosensitive Film
Release Film (PE)
Width mm 495*
㎛Photosensitive Film ㎛ 15, 20, 25, 30, 35
Carrier Film ㎛ 25
Release Film ㎛ 28
* The film width can be altered on special request
DFSR ProcessDFSR Process
UV ExposureVacuum LaminationPre-bonding
UV
Post Cure DevelopmentPost UV Exposure
UV
UV
UV
LGC DFSR Development ConceptLGC DFSR Development Concept
ResinFormulationTechnology
Toughening Agent
For Crack Damping
Crosslinking Density
Improvement
Technology
Developability Thermal Stability Mechanical Stability Resin Flow ControlInterfacial Adhesion
Control
OR
Bead Mill 3-Roll Mill
FillerDispersionTechnology
Roller
Knife Out
Conditions
SR Thickness : 25 ㎛
SRO Formation & SR PluggingSRO Formation & SR Plugging
Φ80 ㎛ SRO 130㎛ (Mask 130㎛) L/S=44㎛/44㎛ (150mJ/cm2)
DevelopabilityThermal Stability
Mechanical Stability
Resin Flow Control
Interfacial Adhesion Control
Conditions
SR Thickness : 25 ㎛Core Thickness : 0.06tBlind Via Diameter : Φ125 ㎛ Core
Pattern Plugging
Dimple < 1um
< SRT & Flatness>
Photo Patterning & ENIG EvaluationPhoto Patterning & ENIG Evaluation
250 ㎛ 200 ㎛ 150 ㎛ 100 ㎛ 80 ㎛ 60㎛
X 300 X 1000
•Visual Inspection after ENIG : There is no color changing, haloing, & pattern striping
Before ENIG After ENIG
ENIG
TEST
•Adhesion test after ENIG: There is no plucking after tape test
Before ENIG After ENIG TEST
Storage Stability TestStorage Stability Test
0 hr
(Φ 88.9 μm)
6 hr
(Φ 87.3 μm)
12 hr
(Φ 87.9 μm)
24 hr
(Φ 89.3 μm)
36 hr
(Φ 89.7 μm)
48 hr
(Φ 88.5 μm)
SR Flatness Analysis (from Customer Evaluation)SR Flatness Analysis (from Customer Evaluation)
q DFSR thickness: 23㎛- The order of adhesion strength: LG DFSR > A = B = C
Measurement Data & Image [Unit : ㎛]
No. Test Item S/R Data
Average1 2 3
1Pattern
Flatness
LG-S-850L 0.4189 0.2718 0.3436 0.3448
DFSR A 0.5548 0.6912 0.6101 0.6187
LG-S-850L 1.3044 1.1472 1.3708 1.27412
Via hole
Flatness
LG-S-850L 1.3044 1.1472 1.3708 1.2741
DFSR A 1.2173 1.0116 1.0747 1.1012
S/R Pattern Via hole
LG-S-850L
× 1,000DFSR A
SR Contact Angle AnalysisSR Contact Angle Analysis
- Contact angle Measurement and Surface Energy
■ Measurement data [Unit : ˚ ]
No. Test Item S/RData
Average1 2 31 2 3
1 Contact Angle LG-S-850L 64.521 66.013 68.166 66.2
2 Surface Energy LG-S-850L 35.778 35.658 35.849 35.8
■ Measurement Image
S/R 1 2 3
×1,000
LG-S-850L
SR Surface Energy Analysis - upon baking and plasma treatment
Process Condition LG-S-850L DFSR A
Process Code Condition
FumeSurface Energy
Color Change Fume
Surface Energy
Color Change
TOC (ppm)
(Nm/m)(Yes
/No)
TOC (ppm)
(Nm/m)(Yes
/No)
Bake B1 125℃, 60min 5.5 59.2 No 6.9 55.8 No
90
Plasma(Ar) P1Power 300W, Time 120sec,
Gas 200sccm- 62.9 No - 62.8 No
Bake B2 125℃, 120min 11 59.6 No 13 59.1
Plasma(Ar) P2Power 300W, Time 300sec,
Gas 200sccm- 66.6 No - 69.1 No
Plasma(Ar) P3Power 400W, Time 400sec,
Gas 200sccm- 76.4 No - 77.3 No
Bake B3 175℃, 120min 107 67.1 No 76 61.4 No
1. Pasma (Ar): 200 sccm appliedSurface Energy
0
10
20
30
40
50
60
70
80
90
B1 P 1 B2 P 2 P 3 B3
Nm
/m
DFSR A
LG-S-850L2. Fume Analysis: Purge & Trap-GC/MSD
3. Surface Energy Analysis:
- Sessile drop technique,
- Probe: water and CH2l2
4. TOC: total organic content
Die Shear Test (from Customer Evaluation)
Die Shear Test- Shear ave. > 40kg, good destruction mode- No big shear change before and after PCT
LEG1 LEG2 LEG3 LEG4
SR A(DFSR) B(Ink) C(DFSR) LG DFSR
* unit: g
SR A(DFSR) B(Ink) C(DFSR) LG DFSR
Surface treatment Plasma [Ar]
Before PCT 43,725 52,731 48,223 54,373
After PCT 51,928 48,858 44,180 51,572
Destruction Mode All Good All Good All Good All Good
70000
Die sheer TEST result (before PCT)
70000
Die sheer TEST result (after PCT)
LEG4LEG3LEG2LEG1
60000
50000
40000
30000
20000
10000
0
LEG No.
Sh
ea
r Fo
rce
LEG4LEG3LEG2LEG1
60000
50000
40000
30000
20000
10000
0
LEG No.
Sh
ea
r F
orc
e
EMC Shear Test (from Customer Evaluation)EMC Shear Test (from Customer Evaluation)
EMC Molding Shear Test- The order of adhesion strength: LG DFSR > A = B = C- No big shear change before and after PCT
LEG1 LEG2 LEG3 LEG4
SR A(DFSR) B(Ink) C(DFSR) LG DFSR
Surface treatment Plasma [Ar]
Before PCT 16,794 21,130 17,998 25,962
After PCT 18,669 19,969 19,556 26,009
Destruction Mode All Good All Good All Good All Good
30000
EMC molding sheer test result (before PCT)
30000
EMC molding sheer test result (after PCT)
LEG4LEG3LEG2LEG1
25000
20000
15000
10000
5000
LEG No.
Sh
ea
r Fo
rce
LEG4LEG3LEG2LEG1
25000
20000
15000
10000
5000
LEG No.
Sh
ea
r Fo
rce
SR Thickness MeasurementSR Thickness MeasurementSR Thickness MeasurementSR Thickness Measurement
Unit L1 L2 L3 L7 L8 L9 L11 L12 L13 L17 L18 L19 L21 L22 L23 L27 L28 L29Condition
ü SR thickness change has been measured at various vacuum lamination condition
ü Pre-Treatment:
Vacuum Lamination → UV Exposure→ Post cure → X-section → Optical Measurement
Unit L1 L2 L3 L7 L8 L9 L11 L12 L13 L17 L18 L19 L21 L22 L23 L27 L28 L29
Temp ℃
Vacuum hpa
Vacuum Press Mpa
Vacuum Time sec
Temp ℃ 60 70 80 60 70 80 60 70 80 60 70 80 60 70 80 60 70 80
Press kgf/cm2
Time sec 10
80
2 3
0.2 0.30.2 0.3Vacuum
70
2 3
10
Press
Condition
2 3
0.2 0.3
60
8
(1) Test Material: DFSR : LG-S-850L 25㎛, Core Material: 500GA 0.15T, T/T
(2) Vacuum Lamination Condition:
Vacuum Part: Vacuum, Slap down condition fixed (10sec),
Press Part: Press & Time fixed (8kg, 10sec)
(3) UV Exposure & Development: 400mJ/㎠ (under mylar film), 60sec
(4) Post Cure: 160℃, 1 hour
SR Thickness measurement @CuSR Thickness measurement @Cu
22
23
24
25
Film
Thic
kness (
um
)
L9
16
17
18
19
20
21
LEGL1 L2 L3 L7 L8 L9 L11
L12L13
L17L18
L19L21
L22L23
L27L28
L29
Vacuum Lamination Variation
Film
Thic
kness (
um
)
L12
ü SR thickness depends on the vacuum lamination condition
ü SRT can be estimated by applying Cu etch ratio and by SR thickness reduction
upon various process
Vacuum Lamination Variation
Characteristics
ItemLG Chem
Unit & Condition LG–S-850L
Thickness ㎛ 25
SRO resolution Φ, ㎛ 50
Tg (TMA) ℃ 116
CTE (a1/a2) ppm/ppm 47/ 148CTE (a1/a2) ppm/ppm 47/ 148
Tensile Strength MPa 51
Elongation % 3.2
Modulus MPa 3056
Water Absorption 85 ℃, 85%, 24hr, % 0.5~0.6
Solder Resistance 260℃, 10 sec, 3 cycle Pass
Td (TGA) 5% weight Loss 342.7℃
NaOH 10wt%, 30 min Pass
* The above data has been taken from our lab test results and it is not the end property of the product.
Chemical
Resistance
HCl 10wt%, 30 min Pass
H2SO4 10wt%, 30 min Pass
IPA, 30 min Pass
PCT121℃, 100%, 2.1atm, 100hr
(146℃, 100%, 4.2atm, 24hr)Pass
Reliability Test at PKG level (from Customer Evaluation)
Item Unit & ConditionTest
ResultsComment
s
Precondition85℃/60% RH/168
HRspass
JEDEC LEV2
* Applied PKG: MCP, FC, FBGA LG DFSR-S-850L
PreconPrecondition
HRspass
LEV2
Pressure Cooker Test
w/ precondition
121℃, 2.1atm, 100% RH
312 HRs
pass
Temperature Cycle Test
w/ precondition
-65℃ ~ +150℃,
1000 Cyclespass
Condition C
High Temperature
Storage Test w/ precondition
150℃
1000 HRspass
85/85
/24
precondition1000 HRs
85℃/85 %RH Test
w/ Bias + precon
85℃/85 %RH
168 HRspass TC 500
Cycles
We will provide the solution for…We will provide the solution for…
Solution for Thin PCB
-Thin SR (thickness: ≤15㎛)
- Lower SRT (≤7㎛) & SRR (≤5~7㎛)
Solution for fine patterning
- Smaller SRO (≤50㎛)
- Contact & Direct Imaging
Solution for Warpage Control
- Lower SR thickness
- Lower CTE (<50ppm/℃)
Solution for Heat dissipation Bring Variety in Green World
- Heat dissipation filler
- New resin system
Bring Variety in Green World
- Color tunable DFSR