International Conference - Modern avionicsInternational Conference on modular avionics...

Moscow, 29-30 October 2012

International Conference

The State and Prospects of Integrated Module

Avionics Development

Computing Systems Components Development

KOTLIN-NOVATOR JSC

International Conference on modular avionics

Kotlin-Novator JSC is actively involved in the development of electronic equipment

for civil and transport aircraft within the framework of the field of

IMA “Integrated module avionics”.

During our participation in the IMA program we developed, tested and launched

both separate modules and complete systems

which meet today’s avionics challenges.

Principles of OEC building

Open architecture

Module construction of computing systems with general distributed resources

The capability of expanding functions without modifying the hardware

Informational, functional and hardware integration

In-project software and hardware unification

The use of high-speed, up-to-date communication interfaces

Ensuring compliance with all current and future requirements


MODULES AND PRODUCTS DEVELOPED

IN COMPLIANCE WITH THE IMA

ХМС Mezzanine carrier board

CIM-3U Computer interface module

429-825 Interface module ARINC 429, ARINC 825

429-1553 Interface module ARINC 429, MIL-1553B

HSM Hub signals module

Secondary voltage source module

VPM Video processor module

Adapter module ARINC 818

RPU Remote peripheral unite

DCU Digital computing unit


TYPES OF EXECUTION MODULES

mezzanine interface module

ХМС carrier board

computing module

complies with VITA 42.0 standard requirements

interface - PCI-Express VITA 42.3

is designed for installation in a computing module and carrier

board

MEZZANINE INTERFACE MODULE


ХМС MEZZANINE CARRIER BOARD

The carrier board is designed for XMC

mezzanines with conducted heat-transfer,

constructed in compliance with the

requirements of the VITA 42 standard

integration into the platform on the basis of

VPX (VITA 46 and VITA 48.2) architecture.

The module ensures communication through

the following interfaces:

2 external ports PCI Express х4 (with

“Twisted Ring” topology support)

1 port PCI Express х4 for XMC type

mezzanine module connecting

user signals output from XMC mezzanine

to external VPX connectors in accordance

with the scheme X38s+X8d+X12d.


COMPUTING MODULE

The computing module is designed for

the construction of onboard network high-

performance computing systems

controlled by a real-time operating system

complying with the requirements of the

ARINC 653 standard.

The module is constructed on the

basis of VPX architecture (VITA 46 and

VITA 48.2) and supports the installation of

conducted heat-transfer XMC type

mezzanines executed in compliance with

the requirements of the VITA 42 standard

with user signals output from the

mezzanine to external module connectors

in accordance with the X24s+X8d+X12d

scheme.

The module has 2 AFDX channels

(ARINC 664) for integration into the

onboard network.


COMPUTER INTERFACE MODULE CIM-ЗU

The module is designed for the implementation of computing functions while controlling

on-board equipment and data input from the sensors and aircraft systems. The module

consists of a computing module with an installed XMC interface module mezzanine.

Communication interfaces3 PCI Express 1.0 channels (4х, 2х and 2х)

the interface for XMC mezzanine connection (PCI Express 4х) with user signals

output from the mezzanine to the module’s P2 connector in accordance with the

X24s+X8d+X12d scheme

2 AFDX channels (or 4 Fast Ethernet 10/100)

2 RS 232 ports

2 I2C channels

General featuresMPC8572 dual core processor, with 6000 MIPS performance

microprocessor core frequency: 1.3 GHz

2 banques with 512 Mbytes RAM DDR2 SDRAM 667 MHz each

ROM (Flash) system: 128 Mbytes

NAND Flash 4 Gbyte

magnetic RAM (MRAM): 512 Kbytes

real-time clock (RTC)


BLOCK DIAGRAM OF

THE COMPUTING MODULE


Interface module mezzanine 429-825

The module provides:

ARINC 825 (CAN) 4-channel transfer;

ARINC 429 6-channel information transmission;

information reception from 6 or 12 ARINC 429 channels;

information transmit-receive through 6 or 18 discrete signals «ground/open» (the number

of receivers and transmitters can be adjusted by software means).


Mil Std-1553B 2-channel communication;

ARINC 429 18-channel communication (6 outputs, 12 inputs);

voice messages generation and output;

12 channels of «ground/open» discrete signals (which can be configured by software

means for input/output).


reception/generation of 48 discrete signals «GROUND/OPEN»;

reception/generation of 12 discrete signals «27V/OPEN».

Interface module mezzanine 429-1553

Hub signals mezzanine HSM

MEZZANINE INTERFACE MODULES


SECONDARY VOLTAGE SOURCE MODULE

The module ensures:

27V DC voltage reception from two independent EPSA channels;

secondary feeding voltages output:

+12 V (200W);

+3.3 V (40W);

+5 V (10W);

+3.3 V_Aux (3.3W);

+12 V_Aux (12W).

support of modules feeding voltage generation during electrical power interruptions in

EPSA up to 100 ms;

primary and secondary power voltage monitoring with result output to an external indicator

unit and to the processor module via I2C bus;

independent cutoff of any secondary voltage channel in case of a «short circuit».

The secondary voltage source module is designed for generating secondary unit

feeding voltages which are included in the device components. The module was

constructed in accordance with the basic requirements of the PICMG 2.0 D3.0 standard.


XMC CARRIER BOARD MODULE

Video processor mezzanine is designed for:

generation and output of graphical information to external indicators;

input, decoding and conversion of video signals, which are displayed on external

indicators then;

installation in ARINC 818 adapter module for input/output of a graphic information via

several channels of ARINC 818 standard.

VPM components include:

Fujitsu MВ86298 “RUBY” graphic processor with the following features:

rendering performance up to 400 mln pixels/sec;

programmable shader with up to 17GFLOPs performance;

supported resolutions: 1280 x 1024 or 1400 x 1050;

the capacity to connect 2 displays;

hardware support for 2D/3D functioning of OpenGL ES 2.0 graphics;

graphic DDR2 memory with a capacity of 512 Mbytes and up to 6.4 Gbytes/sec

channel performance.


EXTERNAL LINKS OF VIDEO

PROCESSOR MEZZANINE

PCI-Express 1x bus

video output according to

ГОСТ 28406-89 (SXGA)

with a frequency of up to

140 MHz

2 DVI 1.0 video outputs

1 DVI 1.0 video input

1 LVDS video output for an

LCD panel

1 analogue input according

to ГОСТ 7845-92

(PAL/SECAM/NTSC)

DVI

MB86298PBH-GSE1 (Ruby)

PCIe 1x

LVDS

(Flat

Panel)

X5

Mezzanine connector

XMC

X6 Mezzanine connector XMC

DVI

EEPROM

64Кb

ГОСТ 28406-89

(SXGA)

DDR2

512МB

DVI

ГОСТ 7845-92

PAL/

SECAM/

NTSC


ARINC 818 ADAPTER MODULE

ARINC 818 adapter module has the following interfaces:

4 PCI Express 1.0 channels;

interface for the connection of VPM XMC-mezzanine with user signal output from the

mezzanine to the module P2 connector

two input LVDS channels for the reception of ARINC 818 signals after optical transceivers

with a frame refresh rate of 30 Hz and reception speed of up to 2.125 Gbps;

two output LVDS channels for ARINC 818 signals transmission to optical transceivers with

a frame refresh rate of 30 Hz and transmission speed of up to 2.125 Gbps;

3 switchable DVI 1.0 video outputs;

3 switchable DVI 1.0 video inputs;

1 I2C channel.

The ARINC 818 adapter module is designed for:

conversion video signal from DVI 1.0 standard and graphic information output to external

indicators in accordance with the requirements of the ARINC 818 standard;

input, decoding and conversion of ARINC 818 standard video signals into DVI 1.0 standard;

ensuring graphic information input/output via several channels of ARINC 818 standard;

generation, reception and output of graphic information in accordance with DVI 1.0, SXGA,

LVDS (Flat Panel) and ARINC 818 standards via several channels to external indicators (for

VPM mezzanine installation).


REMOTE PERIPHERAL UNIT (RPU)

The RPU is designed to operate both as a remote concentrator and a unit for processing

information coming from on-board systems and for control of on-board electronic equipment

included in the common computing network information and control systems with distributed

resources and high-speed communication channels.

General features

dust- and drop-proof container with conducted heat transfer

for 3 3U VPX modules complying with VITA 46 and VITA 48.2

standards and a multichannel secondary power supply

source;

the capability to install up to 3 high-performance processor

modules (PM-3U) with XMC-mezzanines;

ensuring output of up to 6 channels in series of ARINC 664

(AFDX) type (if 3 processor modules are installed);

ensuring output to external connectors of all user links from

the three units and their mezzanines in accordance with the

X24s+X8d+X12d scheme;

multiline programmable indicator installed on the unit body

and connected with I2C bus for parameters monitoring.


DCU BUILT UPON IMA MODULES

DCU is a multi-function computing system working under the control of a

real-time operating system, which complies with the requirements of the ARINC

653 standard and ensures resolution of a vast range of tasks of automatic

control of an aircraft, functional subsystems data processing, etc.

Today the DCU is applied within navigation and flight facilities,

navigation systems and Radar Systems control.


COMMUNICATIONS CHANNELS

DCU

ARINC 429 44 24

ARINC 825

ARINC 429

4 RS-2322

MIL 1553B / ARINC 708 2 / 4 «Ground / Open»48

«27 В/ОБРЫВ»12ARINC 664 2

2 voice commandsARINC 818 2

Discrete channels

«Ground/Open»

«27V/Open»

ARINC 743A interruptions

Series channels

АRINC 429

ARINC 664 (AFDX)

MIL 1553B / ARINC 708(A)

ARINC 825 (CAN)

ARINC 818

RS-232


PRINCIPLES OF ARCHITECTURE CONSTRUCTION

VITA 46, VITA 48 and VITA 48.2 standards compliance

PCI-Express x4 interface arranged with “Twisted Ring” topology

horizontal installation of up to 6 functional modules

3U VPX functional modules support complying with the requirements of the

VITA 48.2 and VITA 46 standards from both self-design projects and other

manufacturers

Slot 6 Slot 5

Slot 4 Slot 3

Slot 2

Slot 1

PCI-E

PCI-E

PCI-E

PCI-E

PCI-E

PCI-E


DCU Architecture

Converter

ARINC 818

XMC

Carrier

Board

Processor

ModulePower Supply

Backplane 1

Backplane 2

Mezzanine

«429-1553»

XMC

Carrier

Board

Mezzanine

«429-1553»

XMC

Carrier

Board

Mezzanine

«429-825»

XMC

Carrier

Board

Mezzanine

«429-825»

Mezzanine

«Video-

processor»

Mezzanine

«Hub

sygnals»

PCI-Exspress

X1

PCI-Exspress

X1

PCI-Exspress

X1PCI-Exspress

X1PCI-Exspress

X1

PCI-Exspress

X1

PCI-Exspress

X4

PCI-Exspress

X4

PCI-Exspress

X4PCI-Exspress

X4

PCI-Exspress

X4

PCI-Exspress

X4


DCU DESIGN FEATURES

dust- and drop-proof container with conducted heat transfer for 6 3U VPX modulescomplying with VITA 46 and VITA 48.2 standards and multichannel secondary powersupply source

external connectors are located on the side opposite to the side where units areinstalled, which ensures convenience while failing on-board modules replacement

multiline programmable indicator installed on the unit body and connected with I2Cbus for parameters monitoring

DCU outside dimensions (170 х 215 х 265) mm

DCU weight does not exceed 12 kg

2 backplanes with a sandwich-type connection based on Molex high-frequencyconnectors

external backplane is for the installation of external connectors of MIL 38999 type IIIseries with on-line editing to the printed circuit board

internal backplane is for ensuring connections in accordance with VITA 46.4standard requirements


KOTLIN-NOVATOR

CJSC SOFTWARE

Basic SW developed by Kotlin-Novator CJSC

includes the following components:

The Board Support Package (BSP) for the module ensures starting initialization of the

hardware core and includes processor card device drivers

Application SW Loader ensures download and update of the module’s SW application via

RS232 or Ethernet channels

Periphery drivers ensure control over the function of the devices included in a module

Instrumental SW supports module devices testing

The basic SW is developed for a specific operating system

(for example, VxWorks® AE653 (Wind River Systems developments)).

Basic SW:

ensures application user SW functioning together with the OS

is developed according to open architecture standards and provides interface specification

for the access to it’s functions

supports POSIX standard; due to the openness of the basic SW interface specification,

application user SW platform independence is ensured.


KOTLIN-NOVATOR JSC

Naberezhnaya Obvodnogo Kanala 14,

Saint Petersburg, Russia, 192019

phone (812)718-68-70, (812)718-68-75

fax (812)718-68-70

e-mail: [email protected]

www.kotlin-novator.ru

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