Intel® Xeon® Processor7500 Series Intel® Xeon® Processor ...€¦ · The Intel Xeon Processor...

Reference Number: 323342-002

Intel® Xeon® Processor7500 Series Intel® Xeon® Processor E7-8800/4800/2800 Product FamiliesThermal and Mechanical Design Guide

April 2011

2 Thermal Mechanical Design Guide

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice.Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.The Intel Xeon Processor 7500 Series, Intel® Xeon® processor E7-8800/4800/2800 product families and LGA1567 socket may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.Intel® Turbo Boost Technology requires a PC with a processor with Intel Turbo Boost Technology capability. Intel Turbo Boost Technology performance varies depending on hardware, software and overall system configuration. Check with your PC manufacturer on whether your system delivers Intel Turbo Boost Technology.For more information, see http://www.intel.com/technology/turboboost.Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.Intel, Xeon, and the Intel logo are trademarks of Intel Corporation in the U.S and other countries.* Other brands and names may be claimed as the property of others.Copyright © 2007-2011, Intel Corporation.

Thermal Mechanical Design Guide 3

Contents

1 Introduction ..............................................................................................................91.1 References ....................................................................................................... 101.2 Definition of Terms ............................................................................................ 10

2 LGA1567 Socket ...................................................................................................... 132.1 Mechanical Requirements ................................................................................... 13

2.1.1 Attachment to Printed Circuit Board (PCB) ................................................. 132.1.2 Pad Dimensions ..................................................................................... 142.1.3 LGA1567 Socket NCTF Solder Joints.......................................................... 142.1.4 Socket Loading and Deflection Specifications.............................................. 152.1.5 Clarification of Static Compressive Load Values .......................................... 162.1.6 Critical-to-Function Interfaces .................................................................. 162.1.7 Pick-and-Place and Handling Cover ........................................................... 172.1.8 Socket Housing Material .......................................................................... 182.1.9 Socket Markings..................................................................................... 182.1.10 Solder Ball Characteristics ....................................................................... 18

2.2 Maximum Socket Temperature............................................................................ 192.3 Electrical Requirements...................................................................................... 19

3 Independent Loading Mechanism (ILM)................................................................... 213.1 Allowable Board Thickness.................................................................................. 213.2 Description of ILM Versions................................................................................. 213.3 ILM Assembly ................................................................................................... 223.4 ILM Back Plate Assembly .................................................................................... 233.5 ILM Load Specifications ...................................................................................... 243.6 ILM Cover ........................................................................................................ 24

3.6.1 HL-ILM Cover ........................................................................................ 253.6.2 LP-ILM Cover ......................................................................................... 25

3.7 Components Assembly ....................................................................................... 26

4 Processor Thermal Solutions ................................................................................... 294.1 Processor Thermal Targets ................................................................................. 294.2 Mechanical Targets ............................................................................................ 29

4.2.1 Package/Socket Stackup Height ............................................................... 304.2.2 Mechanical Parameters ........................................................................... 30

4.3 Intel Reference Design Heat Sink ........................................................................ 314.3.1 Allowable Board Thickness....................................................................... 314.3.2 Tower Heatsink Performance.................................................................... 314.3.3 Tower Heatsink Load Range..................................................................... 314.3.4 Thermal Interface Material (TIM) .............................................................. 31

4.4 Heatsink Design Considerations........................................................................... 324.5 Thermal Interface Material (TIM) Considerations.................................................... 334.6 Mechanical Considerations .................................................................................. 334.7 Structural Considerations ................................................................................... 344.8 Thermal Design Guidelines ................................................................................. 34

4.8.1 Intel® Turbo Boost Technology ................................................................ 344.8.2 Absolute Processor Temperature .............................................................. 354.8.3 Thermal Characterization Parameter ......................................................... 354.8.4 Fan Speed Control .................................................................................. 36

5 Quality, Reliability and Ecological Requirements...................................................... 395.1 Intel Reference Component Validation.................................................................. 39

5.1.1 Board Functional Test Sequence ............................................................... 39


5.1.2 Post-Test Pass Criteria.............................................................................395.1.3 Recommended BIOS/Processor/Memory Test Procedures .............................39

5.2 Heatsink Test Conditions.....................................................................................405.3 LGA1567 Socket Reliability Testing and Results......................................................425.4 Socket Durability Test ........................................................................................425.5 Ecological Requirement.......................................................................................42

A Supplier Information................................................................................................43A.1 Intel Enabling Component Suppliers .....................................................................43

B LGA 1567 Socket Mechanical Drawings ....................................................................45

C Independent Loading Assembly (ILM)Drawings and Backplate Assembly Drawings ...........................................................51

D Tower Heatsink Drawings ........................................................................................73

E Enabled Component Board Keepout Drawings ..........................................................89

F Electrical Methodology .............................................................................................97F.1 Measuring Electrical Resistance of the Jumper .......................................................97F.2 Determining Maximum Electrical Resistance ..........................................................97F.3 Inductance .......................................................................................................98

F.3.1 Design Procedure for Inductance Measurements .........................................99F.3.2 Correlation of Measurement and Model Data Inductance ............................100

F.4 Dielectric Withstand Voltage..............................................................................101F.5 Insulation Resistance .......................................................................................101F.6 Contact Current Rating .....................................................................................101

Figures

1-1 Socket Stack for the Intel® Xeon® Processor 7500 Series Platform .................................. 92-1 LGA1567 Socket with Pick and Place Cover Removed ....................................................132-2 Corner Pad Definition on board corresponding to nTCF Solder Balls .................................142-3 LGA1567 Socket Contact Numbering and NCTF Solder Joints (Shown in Gray) ..................152-4 Pick-and-Place Cover (PnP Cap)..................................................................................172-5 Recommended vias for Socket temperature measurement (shown in red) ........................193-1 High Load ILM (HL-ILM) Assembly (shown with PCB and Processor).................................233-2 Low Profile ILM (LP-ILM) Assembly (shown with PCB and Processor)................................233-3 Back Plate Assembly .................................................................................................243-4 HL-ILM Cover assembly onto HL-ILM...........................................................................253-5 LP-ILM Cover Assembly onto LP-ILM ...........................................................................263-6 Socket and Backer Plate Assembly..............................................................................273-7 ILM and Processor Assembly ......................................................................................274-1 Tower Heatsink Performance Curves for 130W..............................................................314-2 Processor Thermal Characterization Parameter Relationships ..........................................364-3 TCONTROL and Fan Speed Control .............................................................................375-1 Example Thermal Cycle - Actual Profile Will Vary...........................................................41B-1 LGA 1567 Socket Mechanical Drawing – Sheet 1 of 4.....................................................46B-2 LGA 1567 Socket Mechanical Drawing – Sheet 2 of 4.....................................................47B-3 LGA 1567 Socket Mechanical Drawing – Sheet 3 of 4.....................................................48B-4 LGA 1567 Socket Mechanical Drawing – Sheet 4 of 4.....................................................49C-1 High-Load Independent Loading Assembly (HL-ILM) Mechanical Drawing – Sheet 1 of 7.....52C-2 High-Load Independent Loading Assembly (HL-ILM) Mechanical Drawing – Sheet 2 of 7.....53C-3 High-Load Independent Loading Assembly (HL-ILM) Mechanical Drawing – Sheet 3 of 7.....54C-4 High-Load Independent Loading Assembly (HL-ILM) Mechanical Drawing – Sheet 4 of 7.....55C-5 High-Load Independent Loading Assembly (HL-ILM) Mechanical Drawing – Sheet 5 of 7.....56


C-6 High-Load Independent Loading Assembly (HL-ILM) Mechanical Drawing – Sheet 6 of 7 .... 57C-7 High-Load Independent Loading Assembly (HL-ILM) Mechanical Drawing – Sheet 7 of 7 .... 58C-8 Low-Profile Independent Loading Assembly (LP-ILM) Mechanical Drawing – Sheet 1 of 8 ... 59C-9 Low-Profile Independent Loading Assembly (LP-ILM) Mechanical Drawing – Sheet 2 of 8 ... 60C-10Low-Profile Independent Loading Assembly (LP-ILM) Mechanical Drawing – Sheet 3 of 8 ... 61C-11Low-Profile Independent Loading Assembly (LP-ILM) Mechanical Drawing – Sheet 4 of 8 ... 62C-12Low-Profile Independent Loading Assembly (LP-ILM) Mechanical Drawing – Sheet 5 of 8 ... 63C-13Low-Profile Independent Loading Assembly (LP-ILM) Mechanical Drawing – Sheet 6 of 8 ... 64C-14Low-Profile Independent Loading Assembly (LP-ILM) Mechanical Drawing – Sheet 7 of 8 ... 65C-15Low-Profile Independent Loading Assembly (LP-ILM) Mechanical Drawing – Sheet 8 of 8 ... 66C-16Backplate Assembly Drawing – Sheet 1 of 5 ................................................................ 67C-17Backplate Assembly Drawing – Sheet 2 of 5 ................................................................ 68C-18Backplate Assembly Drawing – Sheet 3 of 5 ................................................................ 69C-19Backplate Assembly Drawing – Sheet 4 of 5 ................................................................ 70C-20Backplate Assembly Drawing – Sheet 5 of 5 ................................................................ 71D-1 Tower Heatsink Drawing – Sheet 1 of 14..................................................................... 74D-2 Tower Heatsink Drawing – Sheet 2 of 14..................................................................... 75D-3 Tower Heatsink Drawing – Sheet 3 of 14..................................................................... 76D-4 Tower Heatsink Drawing – Sheet 4 of 14..................................................................... 77D-5 Tower Heatsink Drawing – Sheet 5 of 14..................................................................... 78D-6 Tower Heatsink Drawing – Sheet 6 of 14..................................................................... 79D-7 Tower Heatsink Drawing – Sheet 7 of 14..................................................................... 80D-8 Tower Heatsink Drawing – Sheet 8 of 14..................................................................... 81D-9 Tower Heatsink Drawing – Sheet 9 of 14..................................................................... 82D-10Tower Heatsink Drawing – Sheet 10 of 14................................................................... 83D-11Tower Heatsink Drawing – Sheet 11 of 14................................................................... 84D-12Tower Heatsink Drawing – Sheet 12 of 14................................................................... 85D-13Tower Heatsink Drawing – Sheet 13 of 14................................................................... 86D-14Tower Heatsink Drawing – Sheet 14 of 14................................................................... 87E-1 Enabled Component Board Keepout Mechanical Drawing –

Sheet 1 of 7 ............................................................................................................ 90E-2 Enabled Component Board Keepout Mechanical Drawing –






Sheet 7of 7 ............................................................................................................. 96F-1 Methodology for Measuring Total Electrical Resistance................................................... 97F-2 Methodology for Measuring Electrical Resistance of the Jumper ...................................... 97F-3 Inductance Measurement Fixture Cross-Section ........................................................... 99F-4 Measurement Fixture Cross-Section.......................................................................... 100

Tables1-1 Reference Documents............................................................................................... 101-2 Terms and Descriptions ............................................................................................ 102-1 Socket Loading and Deflection Specifications ............................................................... 152-2 Critical-to-Function Interface Dimensions .................................................................... 172-3 LGA1567 Electrical Requirements ............................................................................... 19


3-1 ILM Comparison Summary.........................................................................................213-2 ILM Load Specifications .............................................................................................244-1 Processor Boundary Conditions and Performance Targets...............................................294-2 Processor and LGA1567 Socket Stackup Height ............................................................304-3 Mechanical Parameters..............................................................................................304-4 TIM Specification ......................................................................................................324-5 Fan Speed Control, TCONTROL and DTS Relationship ...................................................375-1 Tower Heatsink Test Conditions and Qualification Criteria...............................................40A-1 Suppliers for the Processor Heatsink ...........................................................................43A-2 LGA1567 Socket and ILM Part Number and Supplier Contact Information .........................43A-3 Alternate Suppliers with Thermal Solutions Designed for the

Intel Xeon Processor 7500 Series................................................................................44B-1 Mechanical Drawing List ............................................................................................45C-1 Mechanical Drawing List ............................................................................................51D-1 Mechanical Drawing List ............................................................................................73E-1 Mechanical Drawing List ............................................................................................89


Revision History

§

Document Number

Revision Number Description Revision Date

323342 001 • Public release March 2010

323342 002 • Update Intel® Xeon® processor E7-8800/4800/2800 product families April 2011


Introduction

1 Introduction

This document provides guidelines for the design of thermal and mechanical solutions for the Intel® Xeon® processor 7500 series and the Intel® Xeon® processor E7-8800/4800/2800 product families. Both processors are compatible with the LGA1567 Socket (Chapter 2) and the ILM (Chapter 3). Both processors adhere to the same thermal specifications found in the Intel® Xeon® Processor E7-8800/4800/2800 Product Families Datasheet, Volume 1 and Intel® Xeon® Processor 7500 Series Datasheet, Volume 1 (see Table 1-1, “Reference Documents”). Thermal solutions designed for the Intel Xeon processor 7500 series will also be compatible with Intel Xeon processor E7-8800/4800/2800 product families (Chapter 4). The components described in this document include:

• The processor thermal solution (heatsink) and associated retention hardware

• The LGA1567 socket, Independent Loading Mechanism (ILM) and back plate

The goals of this document are:

• To assist board and system thermal mechanical designers

Figure 1-1. Socket Stack for the Intel® Xeon® Processor 7500 Series Platform

Introduction


• To assist designers and suppliers of processor heatsinks

Thermal profiles and other processor specifications are provided in Intel® Xeon® Processor E7-8800/4800/2800 Product Families Datasheet, Volume 1 and Intel® Xeon® Processor 7500 Series Datasheet, Volume 1.

1.1 ReferencesMaterial and concepts available in the following documents may be beneficial when reading this document.

Notes:1. Document numbers indicated in Location column are subject to change. See IBP [http://tigris.intel.com/

scripts-edk/viewer/UI_UpdateDesignKits.asp?edkID=7281&ProdID=21201&CatID=0] for the most up-to-date collateral list.

1.2 Definition of Terms

Table 1-1. Reference Documents

Document Doc# Notes

Intel® Xeon® Processor 7500 Series Datasheet, Volume 1 323340-001 1

Intel® Xeon® Processor 7500 Series Mechanical Model 323530-001 1

Intel® Xeon® Processor 7500 Series Thermal Model 323531-001 1

Intel® Xeon® Processor E7-8800/4800/2800 Product Families Datasheet, Volume 1 of 2

325119-001 1

Intel® Xeon® Processor E7-8800/4800/2800 Product Families Datasheet, Volume 2 of 2

325120-001 1

Intel® 7500, 7510, and 7512 Scalable Memory Buffer Thermal/Mechanical Design Guidelines

322828-002 1

Table 1-2. Terms and Descriptions (Sheet 1 of 2)

Term Description

Bypass Bypass is the area between a passive heatsink and any object that can act to form a duct. For this example, it can be expressed as a dimension away from the outside dimension of the fins to the nearest surface.

DTS Digital Thermal Sensor reports a relative die temperature as an offset from TCC activation temperature.

FSC Fan Speed Control

IHS Integrated Heat Spreader: a component of the processor package used to enhance the thermal performance of the package. Component thermal solutions interface with the processor at the IHS surface.

ILM Independent Loading Mechanism provides the force needed to seat the 1567-LGA land package onto the socket contacts.

LGA1567 socket The processor mates with the system board through this surface mount, 1567-land socket.

PECI The Platform Environment Control Interface (PECI) is a one-wire interface that provides a communication channel between Intel processor and chipset components to external monitoring devices.

ΨCA Case-to-ambient thermal resistance parameter (psi). A measure of thermal solution performance using total package power. Defined as (TCASE – TLA) / Total Package Power. Heat source should always be specified for Ψ measurements.

ΨCS Case-to-sink thermal characterization parameter. A measure of thermal interface material performance using total package power. Defined as (TCASE – TS) / Total Package Power.


Introduction

§

ΨSA Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal performance using total package power. Defined as (TS – TLA) / Total Package Power.

TCASE The case temperature of the processor, measured at the geometric center of the package substrate (not the IHS).

TCASE_MAX The maximum case temperature as specified in a component specification.

TCC Thermal Control Circuit: Thermal monitor uses the TCC to reduce the die temperature by using clock modulation and/or operating frequency and input voltage adjustment when the die temperature is very near its operating limits.

TCONTROL Tcontrol is a static value below TCC activation used as a trigger point for fan speed control.

TDP Thermal Design Power: Thermal solution should be designed to dissipate this target power level. TDP is not the maximum power that the processor can dissipate.

Thermal Monitor A power reduction feature designed to decrease temperature after the processor has reached its maximum operating temperature.

Thermal Profile Line that defines case temperature specification of a processor at a given power level.

TIM Thermal Interface Material: The thermally conductive compound between the heatsink and the processor case. This material fills the air gaps and voids, and enhances the transfer of the heat from the processor case to the heatsink.

TLA The measured ambient temperature locally surrounding the processor. The ambient temperature should be measured just upstream of a passive heatsink or at the fan inlet for an active heatsink.

TSA The system ambient air temperature external to a system chassis. This temperature is usually measured at the chassis air inlets.

U A unit of measure used to define server rack spacing height. 1U is equal to 1.75 in, 2U equals 3.50 in, and so forth.

Table 1-2. Terms and Descriptions (Sheet 2 of 2)

Term Description

Introduction



LGA1567 Socket

2 LGA1567 Socket

This section describes a surface mount, LGA (Land Grid Array) socket intended for Intel Xeon Processor 7500 Series and Intel Xeon processor E7-8800/4800/2800 product families. The socket provides I/O, power and ground contacts. The socket contains 1567contacts arrayed about a cavity in the center of the socket with lead-free solder balls for surface mounting on the motherboard.

The socket has 1567 contacts with 1.016 mm X 1.016 mm pitch (X by Y) in a 52x46 grid with 32x24 grid depopulation in the center of the array and selective depopulation elsewhere.

The socket must be compatible with the package (processor) and the Independent Loading Mechanism (ILM). The design includes a back plate which is integral to having a uniform load on the socket solder joints. Socket loading specifications are listed in Section 2-1.

See Appendix A for LGA1567 Socket supplier information and part numbers.

2.1 Mechanical Requirements

2.1.1 Attachment to Printed Circuit Board (PCB)The socket will be attached to the motherboard via its 1567 contact solder balls. There are no additional external methods (that is, screw, extra solder, adhesive, and so on) to attach the socket to the motherboard.

Figure 2-1. LGA1567 Socket with Pick and Place Cover Removed

LGA1567 Socket


In installed condition, the socket is sandwiched between the processor package and the system board. An independent loading mechanism (ILM) will apply a static compression load, as described in this chapter.

2.1.2 Pad DimensionsThe system board must have a solder pad array matching socket BGA. Recommended solder pads are circular with a diameter of 0.45 mm (18 mils). They can be a combination of metal defined (MD) and solder mask defined (SMD).

Intel recommends that pads under the nCTF joints be solder mask defined (SMD). These are shown as the 8 corner pads at each of the 4 corners (marked in green in Figure 2-2) and should have a 26 mil Cu pad size.

Also see Section 2.1.3.

2.1.3 LGA1567 Socket NCTF Solder JointsIntel has defined selected solder joints of the socket as non-critical to function (NCTF) when evaluating package solder joints post environmental testing. The signals at NCTF locations are typically redundant ground or non-critical reserved, so the loss of the solder joint continuity at end of life conditions will not affect the overall product functionality. Figure 2-3 identifies the NCTF solder joints.

Figure 2-2. Corner Pad Definition on board corresponding to nTCF Solder Balls


LGA1567 Socket

2.1.4 Socket Loading and Deflection SpecificationsTable 2-1 provides load and board deflection specifications for the LGA1567 Socket. These mechanical limits should not be exceeded during component assembly, mechanical stress testing, or standard drop and shipping conditions. All dynamic requirements are under room temperature conditions while all static requirements are under 100 °C conditions.

Figure 2-3. LGA1567 Socket Contact Numbering and NCTF Solder Joints (Shown in Gray)

BMBLBKBJBHBGBFBEBDBCBBBAAYAWAVAUATARAPANAMALAKAJAHAGAFAEADACABAAYWVUTRPNMLKJHGFEDCBA

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46

Table 2-1. Socket Loading and Deflection Specifications (Sheet 1 of 2)

ParameterSI Units English Units

NotesMin Max Unit Min Max Unit

Static Compressive per Contact 15 38 gf 0.53 1.34 ozf 1

Static Pre-Load Compressive 289 623 N 60 140 lbf 2

Static Total Compressive 578 934 N 110 210 lbf 3

Dynamic Compressive 588 N 132 lbf 4

LGA1567 Socket


Notes:1. The compressive load applied by the package on the LGA contacts to meet electrical performance. This

condition must be satisfied throughout the life of the product.2. The load applied by the ILM onto the socket through the processor package.3. The total load applied by both the ILM and the heatsink onto the socket through the processor package.4. Quasi-static equivalent compressive load applied during the mechanical shock from heatsink, calculated

using a reference 600g heatsink with a 25G shock input and an amplification factor of 3 (600g x 25G x 3 = 99 lbf). This specification can have flexibility in specific values, but the ultimate product of mass times acceleration should not exceed this value. Intel reference system shock requirement for this product family is 25G input as measured at the chassis mounting location.

5. Maximum allowable strain below socket BGA corners during transient loading events (i.e., slow displacement events) which might occur during board manufacturing, assembly or testing. See the LGA1567 BFI Strain Guidance Sheet. Contact your CQE for this datasheet.

6. See Section 2.3 for more details. Reference Table 4-3, “Mechanical Parameters”.

2.1.5 Clarification of Static Compressive Load ValuesThe minimum Static Pre-Load Compressive value listed in Table 2-1, “Socket Loading and Deflection Specifications” is the force provided by the ILM and should be sufficient for rudimentary continuity testing of the socket and/or board. This load value will not ensure normal operation throughout the life of the product. Please see Table 3-2, “ILM Load Specifications”.

The minimum Static Total Compressive value listed in Table 2-1, “Socket Loading and Deflection Specifications” will ensure socket reliability over the life of the product and that the contact resistance between the processor and the socket contacts meets the values outlined in Table 2-3, “LGA1567 Electrical Requirements”.

Please refer to Section 4.2 for a more thorough description of load distribution for the various ILMs and heatsinks.

2.1.6 Critical-to-Function InterfacesCritical-to-function (CTF) dimensions for motherboard layout and assembled components’ interface to the socket are identified in Table 2-2. The CTF values are detailed on the socket drawing, which is provided in Appendix B. All sockets manufactured must meet the specified CTF dimensions. These dimensions will be verified as part of the validation process.

Note: Unless otherwise specified, interpret dimensions and tolerances in accordance with ASME Y14.5M-1994. Dimensions are in millimeters.

Board Transient Strain 5

Board Deflection under socket solder ball array under Maximum Static Compressive Load

62 mil boards

0.30 mm 0.012 in. 6

70 mil to 120 mil boards

0.25 mm 0.010 in.

Table 2-1. Socket Loading and Deflection Specifications (Sheet 2 of 2)




LGA1567 Socket

Note: *Dimensions are to be measured post SMT.

2.1.7 Pick-and-Place and Handling CoverTo facilitate high-volume manufacturing, the socket shall have a detachable cover to support the vacuum type Pick and Place system. The cover could also be used as a protective device to prevent damage to the contact field during motherboard assembly and handling. The cover design shall meet or exceed the applicable requirements of SEMI S8-0999, Safety Guidelines for Ergonomics/Human Factors Engineering of Semiconductor Manufacturing Equipment. The removal and replacement of the cover shall not cause any possible damage to the socket body, contact pins or the cover itself.

Table 2-2. Critical-to-Function Interface Dimensions

Description Sheet/Zone

Socket Package Alignment Cavity Length * D91065 rev 2, Sheet 2, Zone G6 and G7

Socket Package Alignment Cavity Width * D91065 rev 2, Sheet 2, Zone F5

Socket Height (from Package Seating Plane to MB after Reflow) *

D91065 rev 2, Sheet 2, Zone A3

Seating Plane Co-planarity * D91065 rev 2, Sheet 2, Zone C4

Through Cavity Length D91065 rev 2, Sheet 2, Zone D6 and D7

Through Cavity Width D91065 rev 2, Sheet 2, Zone E8

Through Cavity X-Position D91065 rev 2, Sheet 2, Zone D6 and D7

Through Cavity Y-Position D91065 rev 2, Sheet 2, Zone E8

Stand-Off Gap (Solder Ball to Stand-Off) D91065 rev 2, Sheet 2, Zone C4

Solder Ball Feature Relating True Position D91065 rev 2, Sheet 2, Zone C1

Solder Ball Co-planarity D91065 rev 2, Sheet 2, Zone B3

Contact Height Above Seating Plane * D91065 rev 2, Sheet 2, Zone A4 and A5

Contact True Position * D91065 rev 2, Sheet 2, Zone C5

Contact Co-Planarity* D91065 rev 2, Sheet 2, Zone B4 and B5

Figure 2-4. Pick-and-Place Cover (PnP Cap)

LGA1567 Socket


2.1.8 Socket Housing MaterialThe socket housing material should be of thermoplastic or equivalent, UL 94 V-0 flame rating, temperature rating, and design capable of maintaining structural integrity following a temperature of 260°C for 40 seconds, which is typical of a reflow/rework profile for solder material used on the socket. The material must have a thermal coefficient of expansion in the XY plane capable of passing reliability tests rated for an expected high-operating temperature, mounted on HTg FR4-type motherboard material. The creep properties of the material must be such that the mechanical integrity of the socket is maintained for the use condition outlined in Chapter 5.

2.1.9 Socket MarkingsAll markings required in this section must withstand a temperature of 260°C for 40 seconds, which is typical of a reflow/rework profile for solder material used on the socket, as well as any environmental test procedure outlined in Chapter 5, without degrading.

2.1.9.1 Name

LF-LGA1567 (Font type is Helvetica Bold – minimum 6 point (or 2.125 mm)).

Note: This mark shall be stamped or laser marked into the sidewall of the stiffener plate on the actuation lever side.

Manufacturer’s insignia (font size at supplier’s discretion).This mark will be molded or laser marked into the top side of the socket housing.

Both socket name and manufacturer’s insignia will be visible when first seated on the motherboard.

2.1.9.2 Lot Traceability

Each socket will be marked with a lot identification code to allow traceability of all components, date of manufacture (year and week), and assembly location. The mark must be placed on a surface that is visible after the socket is mounted on the motherboard. In addition, this identification code must be marked on the exterior of the box in which the unit is shipped.

2.1.9.3 Pin 1 Identification

The socket will have markings identifying Pin 1. This marking will be represented by a clearly visible triangular symbol in the location specified.

2.1.10 Solder Ball Characteristics

2.1.10.1 Number of Solder Balls

Total number of solder balls: 1567.

2.1.10.2 Material

Lead free solder alloy having a melting point temperature of 217°C maximum (for example, SnAgCu) and be compatible with Immersions silver surface finish with SnAg/SnAgCu solder paste.


LGA1567 Socket

2.2 Maximum Socket TemperatureThe power dissipated within the socket is a function of the current at the pin level and the effective pin resistance. To ensure socket long term reliability, Intel defines socket maximum temperature using a via on the underside of the motherboard. Exceeding the temperature guidance may result in socket body deformation, or increases in thermal and electrical resistance which can cause a thermal runaway and eventual electrical failure. The guidance for socket maximum temperature is listed below:

• Via temperature under socket < 96 °C

The recommend via used for temperature measurement is defined by K22 - H25. See Figure 2-5.

The socket maximum temperature is defined at Thermal Design Current (TDC). In addition, the heatsink performance targets and boundary conditions of Table 4-1 and Table 4-2 must be met to limit power dissipation through the socket. To measure via temperature:

1. Drill a hole through the back plate at the specific via defined above. 2. Thread a T-type thermocouple (36 - 40 gauge) through the hole and glue it into the

specific via on the underside of the motherboard.

3. Once the glue dries, reinstall the back plate and measure the temperature.

2.3 Electrical RequirementsLGA1567 electrical requirements (see Table 2-3) are measured from the socket-seating plane of the processor (end of the contacts) to the socket solder ball attach at the motherboard. All specifications are maximum values (unless otherwise stated) for a single socket contact, but includes effects of adjacent contacts where indicated. Socket inductance includes exposed metal from mated contact to the PCB land array.

Reference Appendix F for the methodology used to determine these values.

Figure 2-5. Recommended vias for Socket temperature measurement (shown in red)

Table 2-3. LGA1567 Electrical Requirements (Sheet 1 of 2)

Parameter Value Notes

Maximum Mutual Capacitance, C <0.33 pF The capacitance between two contacts

Dielectric Withstand Voltage > 360 Volts RMS

Insulation Resistance > 800 mΩ

LGA1567 Socket


§

Contact Resistance, total at End of Life (EOL), 26 °C.

≤ 15.2 mΩ The socket contact resistance target is derived from the resistance of each chain minus resistance of shorting bars divided by number contacts within the daisy chain. The bulk resistance of the contact metal body, and interface resistance to the package LGA lands are included.This LLCR target applies with 1% failure rate at 60% confidence interval among all measured chains of the whole population being tested.

Contact Bulk Resistance, at 26 °C ≤ 9.5 mΩ Resistance of each contact as measured from tip to tip. Interface resistances are excluded. FEA model using minimum conductivity value can be used in lieu of measurement.

Contact Bulk Resistance Increase ≤ 3 mΩ The bulk resistance increase per contact from 24°C to 100°C

Total Loop Inductance, Loop <3.9 nH The inductance calculated or measured for a pair of two adjacent contacts, considering one forward conductor and one return conductor.These values must be satisfied at the worst-case socket contact height (that is, minimum deflection) in assembled configuration

Mated partial mutual inductance, L < 0.95 nH The inductance on a contact due to any single neighboring contact.

Differential return loss < -13 dB Measurements/simulations conditions:1. Termination impedance: 90 Ohm, differential2. Test structure overview will be provided later3. All details of Frequency domain S parameters specs will be provided in later revision

Differential Insertion loss < |-0.6 dB|

Cross-talk < -25 dB

Measurement frequency(s) for Contact-to-Contact inductance.

1 GHz Linear region (usually found at higher frequency ranges)

Measurement frequency(s) for Contact-to-Contact capacitance.

400 MHz Capacitively dominated region (usually the lowest measurable frequency)

Table 2-3. LGA1567 Electrical Requirements (Sheet 2 of 2)

Parameter Value Notes

Therrmal Mechanical Design Guide 21

Independent Loading Mechanism (ILM)

3 Independent Loading Mechanism (ILM)

The Independent Loading Mechanism (ILM) provides the force needed to seat the 1567-Land LGA package (i.e., processor) onto the socket contacts. The ILM is physically separate from the socket body. The ILM consists of two major components, the ILM cover and the back plate, that will be procured as a set from the enabled vendors. The assembly of the ILM is expected to occur after the socket is surface mounted. The exact assembly location is dependent on manufacturing preference and test flow. See the Manufacturing Advantage Service collateral for this platform for additional guidance.

The ILM has two critical functions:

• Deliver the force to seat the processor onto the socket contacts

• Distribute the resulting load evenly through the socket solder balls

3.1 Allowable Board ThicknessThe components described in this document (namely ILM, back plate and heatsink) will support board thickness in the range of 1.8 - 3.0 mm (0.072" - 0.118"). Boards (PCBs) not within this range may require modifications to the back plate and heatsink retention. Please contact the component suppliers for modifications (see Appendix A, “Intel Enabling Component Suppliers”).

3.2 Description of ILM VersionsThere are two versions (SKUs) of ILM for the Nehalem-EX processor. The first version (as described in Rev 1.0 and previous) has been renamed to High-Load ILM (HL-ILM). The second version of the ILM, called the Low Profile ILM (LP-ILM), has important differences. The Low Profile ILM was developed to eliminate the need for a pedestal on the processor heatsink. An unavoidable trade-off is a reduction in the applied load by the Low Profile ILM. This requires that heatsink solutions implementing the LP-ILM will need to increase the load applied to the top of the IHS. Another requirement for heatsinks implementing the LP-ILM will be two small pockets in the heatsink bottom to clear the fingers which touch the top of the IHS. A summary of these differences is articulated in the following table.

Table 3-1. ILM Comparison Summary (Sheet 1 of 2)

High Load ILM (HL-ILM)

Low Profile ILM(LP-ILM)

ILM Applied LoadFILM

Min. 80 lbf / 400 N 60 lbf / 289 N

Max 140 lbf / 623 N 105 lbf / 467 N

Heatsink Applied Load 1

FHEATSINK Min. 30 lbf / 178 N 50 lbf / 289 N

Max 70 lbf / 311 N 105 lbf / 467 N


22 Therrmal Mechanical Design Guide

Notes:1. See Table 4-3, “Mechanical Parameters”, for more information on heatsink applied loads for each ILM

implementation.2. See Table 2-1, “Socket Loading and Deflection Specifications”, for Static Total Compressive Load values.

Socket load is the addition of the ILM and Heatsink applied load according to the equation: FILM + FHEATSINK = FSOCKET

A picture of each ILM version is shown in Figure 3-1 and Figure 3-2.

Both ILM versions will be “build to print” from Intel controlled drawings. See Appendix C for drawings.

See Appendix A, “Intel Enabling Component Suppliers” for ILM supplier information and part numbers.

3.3 ILM AssemblyThe ILM is an assembly of a load plate, a frame, and a lever. Four fasteners secure the ILM frame to the backer plate.

All pieces in the ILM assembly, except the frame and fasteners, are fabricated from stainless steel and plated where appropriate. The frame is made from high-strength steel. The fasteners are fabricated from a high-carbon steel. The frame provides the hinge locations for the load lever and load plate.

The ILM design ensures that once installed onto the baseboard and secured to the backer plate, the only features touching the board are the captive fasteners. The nominal gap of the frame to the board is ~1 mm.

When the load plate is closed, compressive load is applied onto the processor package from the top of the IHS at two points. See load plate “dimpled” features shown in Figure 3-1. The reaction force from closing the load plate is transmitted to the frame and through the captive fasteners to the backer plate. Some of the load is passed through the socket body to the board, inducing a slight compression on the solder joints.

Socket Static Total Compressive Load 2FSOCKET

Min. 110 lbf / 578 N

Max 210 lbf / 934 N

Thermal resistance impact (C/W) 0.022 0 (baseline)

Heatsink required features 2.5mm pedestal 2 pockets (~14x12x2.5mm)

Table 3-1. ILM Comparison Summary (Sheet 2 of 2)


Low Profile ILM(LP-ILM)



3.4 ILM Back Plate AssemblyThe back plate consists of a flat steel back plate with four internally threaded inserts for ILM attach, and two inserts for heatsink attach. The inserts are press fit into the back plate. A cavity is located at the center of the plate to allow access to the baseboard test points and backside capacitors. An insulator is pre-applied to prevent shorting the board.

Figure 3-1. High Load ILM (HL-ILM) Assembly (shown with PCB and Processor)

Figure 3-2. Low Profile ILM (LP-ILM) Assembly (shown with PCB and Processor)



Both versions of the ILM (the LP-ILM and the HL-ILM) are compatible with this back plate.

3.5 ILM Load SpecificationsThe HL-ILM is designed to achieve the minimum Socket Static Pre-Load Compressive load specification. The thermal solution (heatsink) should apply additional load to achieve the Socket Static Total Compressive load (see Table 2-1, “Socket Loading and Deflection Specifications”). The heatsink load will be applied to the IHS (Integrated Heat Spreader). The dual-loading approach is represented by the following equation:

FILM + FHEATSINK = FSOCKET

The ILM static load targets are given in Table 3-2.

3.6 ILM CoverTo provide additional protection to during manufacturing and handling, an ILM Cover is available to help mitigate damaging socket contacts. The ILM cover provides protection until a processor is installed.

Figure 3-3. Back Plate Assembly

Insulator

Heatsink attach points (x2)

ILM attach points (x4)

Cavity

Table 3-2. ILM Load Specifications

ParameterSI Units (N) English Units (lbf)

NotesMin Max Min Max

HL-ILM Static Compressive Load 356 623 80 140 Nominal load = 467 N / 105 lbf

LP-ILM Static Compressive Load 267 467 60 105 Nominal load = 334 N / 75 lbf



There are several versions developed that snap into the ILM. Please see Table A-2, “LGA1567 Socket and ILM Part Number and Supplier Contact Information” for ordering information.

There is an ILM Cover for each version of ILM.

3.6.1 HL-ILM CoverThe HL-ILM Cover cannot coexist with the LGA1567 Pick and Place Cover as shown in Figure 3-4. Meaning that the operator will need to remove the Socket Cap in order to install the ILM Cover. Please see Table A-2, “LGA1567 Socket and ILM Part Number and Supplier Contact Information”.

3.6.2 LP-ILM CoverThe LP-ILM Cover cannot coexist with the LGA1567 Pick and Place Cover as shown in Figure 3-5. In fact, the LGA1567 Pick and Place Cover (Socket Cover) will not physically fit under the LP-ILM load plate once closed. Please see Table A-2, “LGA1567 Socket and ILM Part Number and Supplier Contact Information”.

Figure 3-4. HL-ILM Cover assembly onto HL-ILM



3.7 Components Assembly The Intel Xeon processor 7500 series thermal mechanical solution assembly begins with surface mounting the LGA1567 socket onto the baseboard. The remaining steps assume the socket is already surface-mounted:

1. Back Plate and ILM Installation:

The standoff pattern on the backer plate also acts as a key-in feature. Align the backer plate standoff pattern to the baseboard’s hole pattern before mating the backer plate to the baseboard.

Before installing the ILM, be sure that it is already assembled with the lever and the fasteners. The ILM fastener pattern also acts as a key-in feature. Align the ILM fastener pattern to the baseboard hole pattern. Tighten the fasteners with the matching torque driver set to ~8 in-lbf [0.9 N.m]. Verify that the ILM and the backer plate are properly installed. There should be a uniform gap between the ILM and the base board, and virtually no gap between the backer plate and the baseboard.

2. Processor Installation:

Release the ILM lever to access the LGA1567 socket. Carefully remove the socket cover to avoid damaging the socket contacts. Inspect the socket for contact damage or foreign materials. Orient the processor such that the processor pin1 faces the same direction as the socket pin1. Carefully place the processor on the socket and verify that it is seated properly. Two side protrusions on the socket will prevent the package from resting flat on the socket if the processor is not properly aligned to the socket. Close the ILM cover and secure the lever.

For more detailed installation instructions as well as recommendations on board manufacturing, please download the Intel® Xeon® Processor 7500 Series-based Platform Manufacturing Advantage Service document found on http://learn.intel.com (please input code: ME709).

Figure 3-5. LP-ILM Cover Assembly onto LP-ILM



.

§

Figure 3-6. Socket and Backer Plate Assembly

Figure 3-7. ILM and Processor Assembly


Processor Thermal Solutions

4 Processor Thermal Solutions

This section describes the design guidelines for Intel® Xeon® processor 7500 Series thermal solutions. Also included are the Intel reference heatsink design specifications.

Intel’s reference thermal solutions which were designed for the Intel® Xeon® Processor 7500 series will also be compatible with Intel® Xeon® processor E7-8800/4800/2800 product families thermal specifications.

4.1 Processor Thermal TargetsTable 4-1 provides thermal boundary conditions and performance targets for both the Intel Xeon Processor 7500 series and the Intel Xeon processor E7-8800/4800/2800 product families. These values should guide thermal solution design.

Notes:1. Local ambient temperature of the air entering the heatsink.2. Estimated performance for each heatsink based on the form factor, technology, material, and boundary

conditions. These estimates are not necessarily the thermal performance targets needed to meet processor thermal specifications. Please see Intel® Xeon® Processor 7500 Series Datasheet, Volume 1 and Intel® Xeon® Processor E7-8800/4800/2800 Product Families Datasheet, Volume 1 for processor thermal specifications.

3. Defined as (TCASE_MAX - TLA) / TDP4. Airflow through the heatsink fins with zero bypass. Max target for pressure drop (ΔP) measured in inches H2O.5. Reference system configuration. 1U = 1.75”.6. Dimensions of heatsink do not include socket or processor. 7. Passive heatsinks with Honeywell* PCM45F

4.2 Mechanical Targets Thermal solutions should be designed to meet the mechanical requirements described in this section.

Keep in mind that the heatsink retention will need to apply additional load in order to achieve the minimum Socket Static Total Compressive load (see Table 2-1, “Socket Loading and Deflection Specifications”). This load should be distributed over the IHS (Integrated Heat Spreader). The dual-loading approach is represented by the following equation.

Table 4-1. Processor Boundary Conditions and Performance Targets

Parameter Value

Altitude, system ambient temp

Sea level, 35oC

TDP 95W 105W 130W

TLA1 42oC 42oC 45oC

ΨCA2 0.255 oC/W 0.206 oC/W 0.185 oC/W

ΨCA_MAX3 0.295 oC/W 0.210 oC/W 0.185 oC/W

Airflow4 12.6 CFM @ 0.34” ΔP 28 CFM @ 0.25” ΔP 36 CFM @ 0.20” ΔP

System height (form factor)5

1U 2U 4U

Heatsink volumetric6 90 x 90 x 26.5mm 90 x 90 x 51mm 100 x 70 x 102.5mm

Heatsink technology7 Cu base, Al fins Cu base, Al fins Cu/Al base / Al fins / heatpipes



FILM + FHEATSINK = FSOCKET

Values for the Heatsink applied loads are given in Table 4-3.

4.2.1 Package/Socket Stackup HeightTable 4-2 provides the stackup height of a processor and LGA1567 socket with processor fully seated on the socket seating plane.

Notes:1. This data is provided for information only, and should be derived from: (a) the height of the socket seating

plane above the motherboard after reflow, given in Appendix B, “LGA 1567 Socket Mechanical Drawings”, (b) the height of the package, from the package seating plane to the top of the IHS, and accounting for its nominal variation and tolerances that are given in Intel® Xeon® Processor 7500 Series Datasheet, Volume 1 and Intel® Xeon® Processor E7-8800/4800/2800 Product Families Datasheet, Volume 1.

4.2.2 Mechanical Parameters

Notes:1. In the case of a discrepancy, the most recent datasheets supersede targets listed in the above table.2. These specifications apply to uniform compressive loading in a direction perpendicular to the IHS top surface.3. This is the minimum and maximum static force that can be applied by the heatsink and retention solution to maintain the

heatsink and processor interface.4. This specification applies for either thermal retention solutions that prevent baseboard deflection or for the Intel reference

thermal solution.5. Dynamic loading is defined as an 11 ms duration average load superimposed on the static load requirement.6. An experimentally validated test condition used a heatsink mass of acceleration measured on a shock table with a dynamic

amplification factor of 3. This specification can have flexibility in specific values, but the ultimate product of mass times acceleration should not exceed this validated dynamic load.

Table 4-2. Processor and LGA1567 Socket Stackup Height

Integrated Stackup Height (mm)From Top of Board to Top of IHS

7.599 ± 0.50 mm

Table 4-3. Mechanical Parameters



Thermal Solution Mass (includes retention) g 1.32 lbm 4

Heatsink Applied Static Compressive Load (High Load ILM implementation)

133 311 N 30 70 lbf 2,3

Heatsink Applied Static Compressive Load (Low Profile ILM implementation)

222 467 N 50 105 lbf 2,3

Heatsink Applied Dynamic only Compressive load 445 N 100 lbf 2,5,6

Processor Static Compressive Load N 210 lbf 1

Processor Tensile Load 155 N 35 lbf 1

Processor Torque Load 7.9 N-m 70 lbf-in 1

Processor Shear Load 356 N 80 lbf 1



4.3 Intel Reference Design Heat Sink

4.3.1 Allowable Board ThicknessThe Tower heat sink described in Section 4.3 will support board thickness in the range of 1.8 - 3.0 mm (0.072" - 0.118"). Boards (PCBs) not within this range may require modifications to the back plate and heatsink retention. Please contact suppliers for modifications (see Appendix A, “Intel Enabling Component Suppliers”).

4.3.2 Tower Heatsink PerformanceSee Appendix D for detailed drawings of the Tower (4U) reference heatsink. Figure 4-1 shows thermal resistance (ΨCA) and pressure drop (ΔP) for the 4U heatsink versus the airflow provided. Best-fit equations are provided to prevent errors associated with reading the graph. They are:

• ΔP = (2.407 x 10-05) * CFM2 + (4.526 x 10-03) * CFM

• ΨCA NU = 0.1431 + 1.9451*CFM-1.0719

4.3.3 Tower Heatsink Load RangeThe Tower Heatsink was thermally validated for the load range of 40 lbf to 70 lbf. This is different than the Heatsink Applied Static Compressive Load range listed in Table 4-3, “Mechanical Parameters” (that is, 30 lbf to 70 lbf) and may have a small effect on the heatsink performance.

4.3.4 Thermal Interface Material (TIM)Honeywell PCM45F material was chosen for the Intel reference design. This material will be pre-applied onto the Tower heatsink pedestal.

Figure 4-1. Tower Heatsink Performance Curves for 130W



The recommended size ensures adequate coverage at the interface between the processor IHS and heatsink pedestal.

Refer to the TIM manufacturer’s guidelines for specifications and handling instructions.

4.4 Heatsink Design ConsiderationsTo remove the heat from the processor, three basic parameters should be considered:

• The area of the surface on which the heat transfer takes place – Without any enhancements, this is the surface of the processor package IHS. One method used to improve thermal performance is to attach a heatsink to the IHS. A heatsink can increase the effective heat transfer surface area by conducting heat out of the IHS and into the surrounding air through fins attached to the heatsink base.

• The conduction path from the heat source to the heatsink fins – Providing a direct conduction path from the heat source to the heatsink fins and selecting materials with higher thermal conductivity typically improves heatsink performance. The length, thickness, and conductivity of the conduction path from the heat source to the fins directly impact the thermal performance of the heatsink. In particular, the quality of the contact between the package IHS and the heatsink base has a higher impact on the overall thermal solution performance as processor cooling requirements become strict. Thermal interface material (TIM) is used to fill in the gap between the IHS and the bottom surface of the heatsink, and thereby improves the overall performance of the thermal stackup (IHS-TIM-Heatsink). With extremely poor heatsink interface flatness or roughness, TIM may not adequately fill the gap. The TIM thermal performance depends on its thermal conductivity as well as the pressure load applied to it. Refer to Section 4.5 for further information on the TIM between the IHS and the heatsink base.

• The heat transfer conditions on the surface upon which heat transfer takes place – Convective heat transfer occurs between the airflow and the surface exposed to the flow. It is characterized by the local ambient temperature of the air, TLA, and the local air velocity over the surface. The higher the air velocity over the surface, the more efficient the resulting cooling. The nature of the airflow can also enhance heat transfer via convection. Turbulent flow can provide improvement over laminar flow. In the case of a heatsink, the surface exposed to the flow includes the fin faces and the heatsink base.

An active heatsink typically incorporates a fan that helps manage the airflow through the heatsink.

Passive heatsink solutions require in-depth knowledge of the airflow in the chassis. Typically, passive heatsinks see slower air speed. Therefore, these heatsinks are typically larger (and heavier) than active heatsinks due to the increase in fin surface necessary to meet a required performance. As the heatsink fin density (the number of fins in a given cross-section) increases, the resistance to the airflow increases; it is

Table 4-4. TIM Specification



TIM Size 24 x 33 by

0.43 thick

mm 0.94 x 1.30 by

0.017 thick

in. Dimensions applies to Honeywell* PCM45F p/n: 95367

PCM45F Activation Load N 28 lbf Load required to meet min. TIM pressure (15 psi)



more likely that the air will travel around the heatsink instead of through it, unless air bypass is carefully managed. Using air-ducting techniques to manage bypass area is an effective method for maximizing airflow through the heatsink fins.

4.5 Thermal Interface Material (TIM) ConsiderationsThermal Interface Material between the processor IHS and the heatsink base is necessary to improve thermal conduction from the IHS to the heatsink. Many thermal interface materials can be pre-applied to the heatsink base prior to shipment from the heatsink supplier without the need for a separate TIM dispense or attachment process in the final assembly factory.

All thermal interface materials should be sized and positioned on the heatsink base in a way that ensures that the entire area is covered. It is important to compensate for heatsink-to-processor positional alignment when selecting the proper TIM size.

When pre-applied material is used, it is recommended to have a protective cover. Protective tape is not recommended as the TIM could be damaged during its removal step.

Thermal performance usually degrades over the life of the assembly and this degradation needs to be accounted for in the thermal performance. Degradation can be caused by shipping and handling, environmental temperature, humidity conditions, load relaxation over time, temperature cycling or material changes (most notably in the TIM) over time. For this reason, the measured TCASE value of a given processor may increase over time, depending on the type of TIM material.

4.6 Mechanical ConsiderationsNote: Determining the performance for any thermal/mechanical solution is the responsibility

of the customer.

An attachment mechanism must be designed to support the heatsink because there are no features on the LGA1567 socket on which to directly attach a heatsink. In addition to holding the heatsink in place on top of the IHS, this mechanism plays a significant role in the performance of the system, in particular:

• Ensuring thermal performance of the TIM applied between the IHS and the heatsink. TIMs, especially those based on phase change materials, are very sensitive to applied pressure: the higher the pressure, the better the initial performance. TIMs such as thermal greases are not as sensitive to applied pressure. Refer to Section 4.2.2 for information on trade-offs made with TIM selection. Designs should consider the possible decrease in applied pressure over time due to potential structural relaxation in enabled components.

• Ensuring system electrical, thermal, and structural integrity under shock and vibration events. The mechanical requirements of the attachment mechanism depend on the weight of the heatsink and the level of shock and vibration that the system must support. The overall structural design of the baseboard and system must be considered when designing the heatsink attachment mechanism. Their design should provide a means for protecting LGA1567 socket solder joints, as well as preventing package pullout from the socket.

Note: The load applied by the attachment mechanism must comply with the package specifications, along with the dynamic load added by the mechanical shock and vibration requirements, as identified in Table 4-3.



A potential mechanical solution for heavy heatsinks is the use of a supporting mechanism such as a backer plate or the utilization of a direct attachment of the heatsink to the chassis pan. In these cases, the strength of the supporting component can be utilized rather than solely relying on the baseboard strength. In addition to the general guidelines given above, contact with the baseboard surfaces should be minimized during installation in order to avoid any damage to the baseboard.

The Intel reference design for the Intel Xeon processor 7500 series uses such a heatsink attachment scheme. Refer to Section 4.4 for further information regarding the Intel reference mechanical solution.

4.7 Structural ConsiderationsThe mass of the tower heatsinks should not exceed 600 g.

From Table 4-3, the Dynamic Compressive Load of 100 lbf max allows for designs that exceed 600 g as long as the mathematical product does not exceed 100 lbf. Example: A heatsink of 1.5 lbm (680 g) x 35G (acceleration) x 1.9 Dynamic Amplification Factor = 100 lbf.

The heatsink limit of 600g and the use of a back plate have eliminated the need for Direct Chassis Attach retention (as used with the previous Intel® Xeon® Processor 5000 Sequence). Direct contact between back plate and chassis pan will help minimize board deflection during shock.

Placement of board-to-chassis mounting holes also impacts board deflection and resultant socket solder ball stress. Customers need to assess the shock for their designs as heatsink retention (back plate), heatsink mass and chassis mounting holes may vary.

4.8 Thermal Design Guidelines

4.8.1 Intel® Turbo Boost TechnologyIntel® Turbo Boost Technology is a new feature available on certain processor SKUs that opportunistically, and automatically allow the processor to run faster than the marked frequency if all of the following conditions are met:

1. Processor operating at Base Frequency (that is, P1 P-state) 2. Power management not active (i.e., not throttling)

3. Processor operating below its temperature limit (that is, DTS < 0)

4. Processor operating below its power and current limits (that is, < TDP and <ICC_MAX).

Heatsink performance (lower ΨCA as described in Section 4.8) is one of several factors that can impact the amount of Turbo Mode benefit. Other factors are operating environment, workload and system design.

With Turbo Mode enabled, the processor may run more consistently at higher power levels (but still within TDP), and be more likely to operate above TCONTROL, as compared to when Turbo Mode is disabled. This may result in higher acoustics.



Increased IMON accuracy may provide more Turbo Boost benefit on TDP limited applications, as compared to lower ΨCA, as temperature is not typically the limiter for these workloads. See Voltage Regulator Module (VRM) and Enterprise Voltage Regulator-Down (EVRD) 11.1 Design Guidelines (DocID: 397898) for more information regarding IMON accuracy.

4.8.2 Absolute Processor TemperatureIntel does not test any third party software that reports absolute processor temperature. As such, Intel cannot recommend the use of software that claims this capability. Since there is part-to-part variation in the TCC (thermal control circuit) activation temperature, use of software that reports absolute temperature can be misleading.

4.8.3 Thermal Characterization ParameterThe case-to-local ambient Thermal Characterization Parameter (ΨCA) is defined by:

Equation 4-1.ΨCA = (TCASE - TLA) / TDP

Where:TCASE = Processor case temperature (°C). For TCASE specification see Intel®

Xeon® Processor E7- 8800/4800/2800 Product Families Datasheet Volume 1of 2.

TLA = Local ambient temperature in chassis at processor (°C).TDP = TDP (W) assumes all power dissipates through the integrated heat

spreader. This inexact assumption is convenient for heatsink design. TTVs are often used to dissipate TDP. Correction offsets account for differences in temperature distribution between processor and TTV.

Equation 4-2.ΨCA = ΨCS + ΨSA

Where:ΨCS = Thermal characterization parameter of the TIM (°C/W) is dependent

on the thermal conductivity and thickness of the TIM.ΨSA = Thermal characterization parameter from heatsink-to-local ambient

(°C/W) is dependent on the thermal conductivity and geometry of the heatsink and dependent on the air velocity through the heatsink fins.

Figure 4-2 illustrates the thermal characterization parameters.



4.8.4 Fan Speed ControlFan speed control (FSC) techniques to reduce system-level acoustic noise are a common practice in server designs. The fan speed is one of the parameters that determines the amount of airflow provided to the thermal solution. Additionally, airflow is proportional to a thermal solution’s performance, which consequently determines the TCASE of the processor at a given power level. Because the TCASE of a processor is an important parameter in determining the long-term reliability of a processor, the FSC implemented in a system directly correlates to the processor’s ability to meet the Thermal Profile. For this purpose, the parameter called TCONTROL, as explained in the applicable datasheet, is to be used in FSC designs to ensure that the long-term reliability of the processor is met while keeping the system-level acoustic noise down. Figure 4-3 depicts the relationship between TCONTROL and FSC methodology.

Figure 4-2. Processor Thermal Characterization Parameter Relationships



The PECI temperature reading from the processor can be compared to this TCONTROL value. A fan speed control scheme can be implemented as described in Table 4-5 without compromising the long-term reliability of the processor.

There are many different ways of implementing fan speed control, including FSC-based on processor ambient temperature, FSC based on processor Digital Thermal Sensor (DTS) temperature, or a combination of the two. If FSC is based only on the processor ambient temperature, low acoustic targets can be achieved under low ambient temperature conditions. However, the acoustics cannot be optimized based on the behavior of the processor temperature. If FSC is based only on the Digital Thermal Sensor, sustained temperatures above TCONTROL drive fans to maximum RPM. If FSC is based both on the ambient and Digital Thermal Sensor, ambient temperature can be used to scale the fan RPM controlled by the Digital Thermal Sensor. This would result in an optimal acoustic performance. Regardless of which scheme is employed, system designers must ensure that the Thermal Profile specification is met when the processor Digital Thermal Sensor temperature exceeds the TCONTOL value for a given processor.

§

Figure 4-3. TCONTROL and Fan Speed Control

Thermal Profile

Tca

se

Power

TDP

Tcase_Max

Tcase @ Tcontrol

Pcontrol

Thermal Profile

Tca

se

Power

TDP

Tcase_Max

Tcase @ Tcontrol

Pcontrol

Table 4-5. Fan Speed Control, TCONTROL and DTS Relationship

Condition FSC Scheme

DTS ≤ TCONTROL FSC can adjust fan speed to maintain DTS ≤ TCONTROL (low acoustic region).

DTS >TCONTROL FSC should adjust fan speed to keep TCASE at or below the Thermal Profile specification (increased acoustic region).


Quality, Reliability and Ecological Requirements

5 Quality, Reliability and Ecological Requirements

5.1 Intel Reference Component ValidationIntel tests reference components both individually and as an assembly on mechanical test boards, and assesses performance to the envelopes specified in previous sections by varying boundary conditions.

While component validation shows that a reference design is tenable for a limited range of conditions, customers need to assess their specific boundary conditions and perform reliability testing based on their use conditions.

Intel reference components are also used in board functional tests to assess performance for specific conditions.

5.1.1 Board Functional Test SequenceEach test sequence should start with components (baseboard, heatsink assembly, and so on) that have not been previously submitted to any reliability testing.

The test sequence should always start with a visual inspection after assembly and BIOS/Processor/memory test. The stress test should then be followed by a visual inspection and then by a BIOS/processor/memory test.

5.1.2 Post-Test Pass CriteriaThe post-test pass criteria are:1. No significant physical damage to the heatsink and retention hardware. 2. Heatsink remains seated and its bottom remains mated flat against the IHS

surface. No visible gap between the heatsink base and processor IHS. No visible tilt of the heatsink with respect to the retention hardware.

3. No signs of physical damage on baseboard surface due to impact of heatsink.4. No visible physical damage to the processor package.5. Successful BIOS/processor/memory test.6. Thermal compliance testing to demonstrate that the case temperature specification

can be met.

5.1.3 Recommended BIOS/Processor/Memory Test ProceduresThis test is to ensure proper operation of the product before and after environmental stresses, with the thermal mechanical enabling components assembled. The test shall be conducted on a fully operational baseboard that has not been exposed to any battery of tests prior to the test being considered.

The testing setup should include the following components, properly assembled and/or connected:

• Appropriate system baseboard• Processor and memory



• All enabling components, including socket and thermal solution parts

The pass criterion is that the system under test shall successfully complete the checking of BIOS, basic processor functions and memory, without any errors.

5.2 Heatsink Test ConditionsThe Test Conditions provided in Table 5-1 address processor heatsink failure mechanisms only. Test Conditions, Qualification and Visual Criteria vary by customer; Table 5-1 reflects Intel requirements.

Table 5-1. Tower Heatsink Test Conditions and Qualification Criteria (Sheet 1 of 2)

Assessment Test Condition Qualification CriteriaMin

Sample Size

1) Humidity Non-operating, 500 hours, +85C and 85% R.H.

168 hours. 50% to 85% non-condensing at temperatures of 25C to 70C. Ramp rate Humidity ≤ 18% per hour; Temp. ≤ 23C per hour.

No visual defects.As verified in wind tunnel: Mean ΨCA + 3σ + offset not to exceed value in Table 4-1Pressure drop not to exceed value in Table 4-1.

12

2) Board-Level UnPackaged Shock

50G±10%; 170±10% in/sec; 3 drops per face, 6 faces.

No damage to heatsink base or pipe.No visual defects.As verified in wind tunnel:Mean ΨCA + 3σ + offset not to exceed value in Table 4-1. Pressure drop not to exceed value in Table 4-1.

12

3) Board-Level UnPackaged Vibration

5 Hz @ 0.01 g2/Hz to 20 Hz @ 0.02 g2/Hz (slope up).20 Hz to 500 Hz @ 0.02 g2/Hz (flat).Input acceleration is 3.13 g RMS.10 minutes/axis for all 3 axes on all samples.Random control limit tolerance is ±3 dB.

No damage to heatsink base or pipe.No visual defects.As verified in wind tunnel:Mean ΨCA + 3σ + offset not to exceed value in Table 4-1 Pressure drop not to exceed value in Table 4-1

12

4) First Article Inspection

Not Applicable Meet all dimensions on 5 samples.Meet all CTF dimensions on 32 additional samples with 1.33 Cpk (mean + 4σ). If samples are soft-tooled, a hard tool plan must be defined.

37

5) Shipping Media: Packaged Shock

Drop height determined by weight and may vary by customer; Intel requirement in General Supplier Packaging Spec.10 drops (6 sides, 3 edges, 1 corner)

No visual defects 1 box

6) Shipping Media: Packaged Vibration

0.015 g2/Hz @ 10-40 Hz, sloping to 0.0015 g2/Hz @ 500 Hz, 1.03 gRMS, 1 hour/axis for 3 axes

No visual defects 1 box

7) Thermal Performance

Using Tower heatsink and Tower airflow from Table 4-1 with Thermal Test Vehicle (TTV) set to 130-W output

As verified in wind tunnel:Mean ΨCA + 3σ + offset not to exceed value in Table 4-1 Pressure drop not to exceed value in Table 4-1

30 heatsinks



8) Bake Non-Operating, 110C, 1000 hours

Note: Increased duration recommended if using alternative, unqualified TIM.


12

9) Thermal Cycling

Required for heatpipe designs.Temperature range at pipe in heatsink assembly: -25C to +100C for 500 cycles.Cycle time is 30 minutes per full cycle, divided into half cycle in hot zone and half in cold zone, with minimum 1-min soak at each temperature extreme for each cycle.See Figure 5-1 for example profile.


15

10) Heat Pipe Burst

Continuously raise heat pipe temperature and record the burst/leak temperatures of final formed/shaped/flattened heatpipe, 12 heatpipes minimum.

No failures at minimum of 300C @ 20 minutes

12 pipes

11) Heatsink Mass

Design Target < 500 g Avg + 3 sigma heatsink mass < 600 g 12

12) Heatsink Load Design Targets:0.080" board = 54.3 ± 3.2lbf (Fmin = 51.1 lbf)0.118" board = 61.5 ± 4.1 lbf (Fmax = 65.6lbf)

Heatsink Load Design Targets:1.8mm (0.072") board > 40 lbf3.0mm (0.118") board < 70 lbf

12

Figure 5-1. Example Thermal Cycle - Actual Profile Will Vary

Table 5-1. Tower Heatsink Test Conditions and Qualification Criteria (Sheet 2 of 2)

Assessment Test Condition Qualification CriteriaMin

Sample Size



5.3 LGA1567 Socket Reliability Testing and ResultsIntel has conducted extensive reliability tests on the LGA1567 socket. Test conditions and results are provided in the LGA1567 Socket Validation Report. Contact Intel’s enabled socket suppliers, listed in Table A.1, “Intel Enabling Component Suppliers” on page 43, for a copy of these reports.

5.4 Socket Durability TestThe socket must withstand 30 mating cycles. Test per EIA-364, test procedure 09. Measure contact resistance when mated in 1st and 30th cycles. The package must be removed at the end of each de-actuation cycle and reinserted into the socket.

5.5 Ecological RequirementGeneral requirements: Materials used in this product must comply with customers’ Environmental Product Content Specification. The Intel specification is available at:

http://supplier2.intel.com/EHS/Environmental_Product_Content_Specification_9-16-03.doc

Material shall be resistant to fungal growth. Examples of non-resistant materials include cellulose materials, animal and vegetable based adhesives, grease, oils, and many hydrocarbons. Synthetic materials such as PVC formulations, certain polyurethane compositions (for example, polyester and some polyethers), plastics which contain organic fillers of laminating materials, paints, and varnishes also are susceptible to fungal growth. If materials are not fungal growth resistant, then MIL-STD-810E, Method 508.4 must be performed to determine material performance.

Any plastic component exceeding 25 grams must be recyclable per the European Blue Angel recycling standards.

Particular requirements: Cadmium shall not be used in painting or plating. No Quaternary salt electrolytic capacitors shall be used. Examples of prohibited caps are United Chemi-Con type: LXF, LXY, LXZ. No brominated plastics shall be used. Also, plastics heavier then 25 g must be labeled per ISO 10469 and may not contain halogenated flame retardant compounds.

Chemical Restrictions:

All components (for example: socket, TIM, heatsink) must be 'halogen-free'; that is, they are assembled without the intentional use of halogen in the raw materials and these elements are not intentionally present in the end product.

• IEC 61249-2-21

— 900 ppm maximum chlorine — 900 ppm maximum bromine — 1500 ppm maximum total halogens

• IPC-4101B

— 900 ppm maximum chlorine — 900 ppm maximum bromine — 1500 ppm maximum total halogens

§


Supplier Information

A Supplier Information

A.1 Intel Enabling Component SuppliersCustomers can purchase Intel reference thermal solution components from the suppliers listed in Table A-1.

See Appendix D for drawings.

The Intel reference thermal solution has been validated per the criteria outlined in Chapter 5.

Customers can purchase the LGA1567 Socket and ILM components from suppliers listed in Table A-2.

See Appendix B for LGA1567 Socket drawings. See Appendix C for ILM drawings.

Table A-1. Suppliers for the Processor Heatsink

Component Description/Part Number

Development Suppliers Supplier Contact Info

Thermal Interface Material

PCM45F / 95367 Honeywell Judy Oles (Customer Service)[email protected] 509-252-8605Andrew S.K. Ho (APAC)[email protected] (852) 9095-4593Andy Delano (Technical)[email protected] 509-252-2224

Processor Heatsink - HL-ILM implementation

Tower Heatsink (with PCM45F)Intel P/N: E45309-007 CCI P/N: 0008053206

Chaun-Choung Technology Corp. (CCI)

Monica Chih12F, No.123-1, Hsing-De Rd., Sanchung, Taipei, Taiwan, R.O.C. Tel. +886 (2) 2995-2666 x1131Fax: +886 (2) [email protected]

Sean [email protected](408) 768-7629

Table A-2. LGA1567 Socket and ILM Part Number and Supplier Contact Information (Sheet 1 of 2)

Item Intel Foxconn Lotes Tyco


E42426-001 PT44L11-4301 ACA-ZIF-084-K01

High Load ILM Cover (HL-ILM) only

G12449-001 012-1000-5838 ACA-ZIF-103-P01

High Load ILM Assembly (HL-ILM)(includes E42426-001 and G12449-001)

G14941-001 PT44L21-4311 ACA-ZIF-126-Y01

mailto:[email protected]

Supplier Information


The Alternate Processor Heatsink Solutions listed in Table A-3 have been verified to meet Intel’s requirements except as noted. Customers must evaluate performance against their own product requirements.

§

Low Profile ILM Assembly (LP-ILM)

E56700-001 PT44L12-4301

Back Plate E42477-001 PT44P11-4301 DCA-HSK-149-K01

LGA1567 Socket E34291-001 PE156727-5241-01F 2040636-1

Contact Info

Julia [email protected]. (408) 919-61781688 Richard Ave.Santa Clara, CA 95050USA

Cathy [email protected]. 86-20-84686519No.15, Wusyun StreetAnle DistrictKeelung City, 20446Taiwan

Gretchen Troutman [email protected]. 717-986-5241PO Box 3608 Harrisburg, PA 17105-3608 USA

Table A-3. Alternate Suppliers with Thermal Solutions Designed for the Intel Xeon Processor 7500 Series

Component Description/Part Number Development Suppliers Supplier Contact Info

Processor Heatsink - LP-ILM implementation

1.5U Aluminum embedded heatpipe Part number: 321879(Verified to meet load targets in Table 4-1)

Aavid Thermalloy Chris Chapman (USA)70 Commercial St. Suite 200Concord, NH 03301603 [email protected]

George Lee (Taiwan)14F-4, No 79, Hsin Tai Wu Rd., Sec, 1Hsichin, Taipei Hsien, Taiwan ROC+886 (2) 2698-9888 ext. [email protected]


1U Copper skived Part number Q129(Verified to meet load targets in Table 4-1 and thermal targets in Table 4-3)

Dynatron Corporation (Top Motor/Dynaeon)

Ian Lee 41458 Christy Street Fremont, CA 94538 510-498-8888 x137 [email protected]

Lang Pai510-498-8888 [email protected]


Tower Heatsink050234 Rev05(Verified to meet load targets in Table 4-1 and thermal targets in Table 4-3)

Aavid Thermalloy Chris Chapman (USA)70 Commercial St. Suite 200Concord, NH 03301603 [email protected]

George Lee (Taiwan)14F-4, No 79, Hsin Tai Wu Rd., Sec, 1Hsichin, Taipei Hsien, Taiwan ROC+886 (2) 2698-9888 ext. [email protected]

Table A-2. LGA1567 Socket and ILM Part Number and Supplier Contact Information (Sheet 2 of 2)

Item Intel Foxconn Lotes Tyco

mailto:[email protected]


LGA 1567 Socket Mechanical Drawings

B LGA 1567 Socket Mechanical Drawings

Table B-1 lists the mechanical drawings included in this appendix.

Table B-1. Mechanical Drawing List

Drawing Description Figure Number

“LGA 1567 Socket Mechanical Drawing – Sheet 1 of 4” Figure B-1






Figure B-1. LGA 1567 Socket Mechanical Drawing – Sheet 1 of 4



§


Independent Loading Assembly (ILM) Drawings and Backplate Assembly Drawings

C Independent Loading Assembly (ILM)Drawings and Backplate Assembly Drawings

Table C-1 lists the mechanical drawings included in this appendix.

Table C-1. Mechanical Drawing List


“High-Load Independent Loading Assembly (HL-ILM) Mechanical Drawing – Sheet 1 of 7”

Figure C-1


Figure C-2


Figure C-3


Figure C-4


Figure C-5


Figure C-6


Figure C-7

“Low-Profile Independent Loading Assembly (LP-ILM) Mechanical Drawing – Sheet 1 of 8”

Figure C-8


Figure C-9


Figure C-10


Figure C-11


Figure C-12


Figure C-13


Figure C-14


Figure C-15

“Backplate Assembly Drawing – Sheet 1 of 5” Figure C-16







Figure C-1. High-Load Independent Loading Assembly (HL-ILM) Mechanical Drawing – Sheet 1 of 7

8 7 6 5

4 3 2

H G F E D C B A

8 7 6 5

4 3 2 1

H G F E D C B A

CC

4X

PRESS COLLAR NUT

FLUSH TO ILM FASTENER

7.6 0-0.1

THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS

MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.

REVISION HISTORY

ZONE

REV

DESCRIPTION

DATE

APPROVED

-A

PRELIMINARY RELEASE

07/18/07

DL

01

INITIAL RELEASE

04/21/08

DL

E6

02

UPDATED CAD MODELS, ADDED NUT HEIGHT DIMENSION

07/28/09

DL

03

CHANGED PART NUMBER TO E42426-002

12/22/09

JK

04

ADDED INTEL PART MARKING LOCATION

12/22/09

JK

05

ADDED 6 TO FASTENER HEIGHT DIMENSION

01/05/10

JK

E42426

105

DWG. NO

SHT.

REV

DEPARTMENT

R2200 MISSION COLLEGE BLVD.

P.O. BOX 58119

SANTA CLARA, CA 95052-8119

PTMI

TITLE

NEHALEM EX ILM FRAME

ASSEMBLY

SIZE

DRAWING NUMBER

REV

A1

E42426

05

SCALE: 2

DO NOT SCALE DRAWING

SHEET 1 OF 1

SEE NOTES

SEE NOTES

FINISH

MATERIAL

DATE

APPROVED BY

07/18/07

J KALISZEWSKID

ATE

CHECKED BY

07/18/07

D. LLAPITAN

DATE

DRAWN BY

07/18/07

D. LLAPITAN

DATE

DESIGNED BY

UNLESS OTHERWISE SPECIFIED

INTERPRET DIMENSIONS AND TOLERANCES

IN ACCORDANCE WITH ASME Y14.5M-1994

DIMENSIONS ARE IN MILLIMETERS

ALL UNTOLERANCED LINEAR

DIMENSIONS ±.25

ANGLES ±0.5

THIRD ANGLE PROJECTION

PARTS LIST

DESCRIPTION

PART NUMBER

ITEM NO

QTY

ILM TOP ASSEMBLY

E42426-002

TOP

SOCKET-B,FASTENER,COLLAR

D80118-004

14


E42420-002

21

NEHALEM EX ILM LOAD PLATE

E42422-001

32

NEHALEM EX ILM LOAD LEVER

E42423-001

41

NEHALEM EX ILM FASTENER

E42424-002

54

NOTES; UNLESS OTHERWISE SPECIFIED:

1. REFERENCE DOCUMENTS

ASME Y14.5M-1994 - STANDARD DIMENSION AND TOLERANCES

164997 - INTEL MARKING STANDARD

99-0007-001 - INTEL WORKMANSHIP STANDARD

18-1201 - INTEL ENVIRONMENTAL PRODUCT CONTENT SPECIFICATION FOR

SUPPLIERS & OUTSOURCED MANUFACTURERS (FOUND ON

EHS WEBSITE - https://supplier.intel.com/static/EHS/)

2. FEATURES NOT SPECIFIED ON DRAWING SHALL BE CONTROLLED BY 3D CAD

DATABASE.

3. MATERIAL: MAY USE INTEL ENGINEERING APPROVED EQUIVALENTS.

ALL SUBSTANCES IN THIS PART MUST CONFORM TO INTEL ENVIRONMENTAL

PRODUCT SPECIFICATION (BS-MTN-0001).

4. ASSEMBLY MUST COMPLY WITH INTEL WORKMANSHIP STANDARD (99-0007-001).

ASSEMBLY SHALL BE FREE OF OIL AND DEBRIS.

5 MARK INTEL ASSEMBLY PART NUMBER APPROXIMATELY WHERE SHOWN PER

INTEL MARKING STANDARD (164997) WITH THE FOLLOWING INFORMATION.

A) PART NUMBER E42426-002

6 INDICATES CRITICAL TO FUNCTIOIN DIMENSION (CTF)

7 MARK VENDOR ASSEMBLY INFORMATION APPROXIMATELY WHERE SHOWN PER


A) ASSEMBLY VENDOR ID

B) DATE CODE

5

6

SCALE 2

SCALE 2

SEE DETAIL A

HINGE ATTACHMENT

12

34

5

7

DETAIL A

SCALE 4

SECTION C-C




8 7 6 5

4 3 2

H G F E D C B A

8 7 6 5

4 3 2 1

H G F E D C B A

AA

BB

R CORP.

2X 11.95�#0.25

63.2�#0.25

2X

5.29�#0.2

2X85�$

75.68�#0.01

2�

#0

31.83

31.83

71.67



REVISION HISTORY

ZONE

REV

DESCRIPTION

DATE

APPROVED

-A

PRELIMINARY RELEASE

07/18/07

DL

BINCREASED BEND REDIUS FOR VERTICAL WALLS.

09/13/07

DL

PG2,

C3

01

INITIAL RELEASE- REDUCED FORM

DEPTH TO 2.0MM

04/21/08

DL

02

MODIFIED DATUM PLANES, ADDED DATUM POINTS

WIDENED HINGE FEATURES

07/01/09

DL

03

MOVED DATUM A

08/04/09

DL

04

ADDED PAGE 3.

09/23/09

DL

05

REVISED INSPECTION DIMENSIONING

12/08/09

JK

06

5.29 �# 0.2 WAS 5.29 �# 0.25, ADDED 6

3 PLACES

12/17/09

JK

E42422

106

DWG. NO

SHT.

REV

DEPARTMENT

2200 MISSION COLLEGE BLVD.

P.O. BOX 58119


TMI

TITLE NEHALEM EX ILM LOAD PLATE

SIZE

DRAWING NUMBER

REV

A1

E42422

06

SCALE: 2.5


SHEET 1 OF 3

SEE NOTES

SEE NOTES

FINISH

MATERIAL

DATE

APPROVED BY

07/18/07

J KALISZEWSKI

DATE

CHECKED BY

07/18/07

D. LLAPITAN

DATE

DRAWN BY

07/18/08

D. LLAPITAN

DATE

DESIGNED BY





TOLERANCES AS SPECIFIED


9




UL1439 - UL SHARP EDGE TESTING


A29419 - INTEL TOLERANCE STANDARD FOR SHEETMETAL

C25432 - INTEL COSMETIC SPEC FOR SHEETMETAL.




2. FEATURES NOT SPECIFIED ON DRAWING AND FEATURES WITHOUT SPECIFIED

TOLERANCE SHALL BE CONTROLLED BY 3D CAD DATABASE, AND SHALL

CONFORM TO SHEETMETAL TOLERANCE STANDARD (A29419).

3. MATERIAL: MAY USE INTEL ENGINEERING APPROVED EQUIVALENT.



A) TYPE:301 STAINLESS STEEL 1.5MM �#.08

B) CRITICAL MECHANICAL PROPERTIES:

TENSILE YIELD STRENGTH (ASTM D638) >= 758 MPa

MODULUS OF ELASTICITY (ASTM D638) >= 193 GPa

C) PLATING: NONE.

4. THIS PART HAS CLASS U COSMETIC REQUIREMENTS UNLESS OTHERWISE

NOTED. SPECIFIED SURFACES MUST COMPLY WITH COSMETIC REQUIREMENTS

PER INTEL INTEL COSMETIC SPEC FOR SHEETMETAL (C25432).

PART SHALL BE FREE OF OIL AND DEBRIS.

5. BAG AND TAG WITH THE FOLLOWING INFORMATION.

(NOTE PRIORITY IN ORDER LISTED)

A) SUPPLIER PART NUMBER

B) INTEL PART NUMBER E42422-001

c) DATE CODE

6 CRITICAL TO FUNCTION DIMENSION (CTF).

7. BURR HEIGHTS SHALL NOT EXCEED 10% OF MATERIAL THICKNESS PER

UL1439 AND 99-0007-001 - INTEL WORKMANSHIP STANDARD.

8. SHARP CORNERS MUST BE CHAMFERED, OR ROUNDED TO 0.25MM (.010") RADIUS.

9 PUNCH DIRECTION.

10 COINING REQUIRED ON SPECIFIED EDGES.

6

6

6

2X 1.70

10

SECTION A-A

SECTION B-B

SEE DETAIL A

A

SEE DETAIL B

SEE DETAIL C

SEE DETAIL A

SEE DETAIL B

SEE DETAIL C

A1

A2

A3

A1A2

A3

C1

B

A

B

A

A




H G F E D C B A

H G F E D C B A

8 7 6 5

4 3 2

8 7 6 5

4 3 2 1

0.59

5�$

1.515

0.75 MIN X 45�$

0.71�#0.1

2.32

1.21�#0.1



E42422

206

DWG. NO

SHT.

REV

DEPARTMENT


P.O. BOX 58119


-

SIZE

DRAWING NUMBER

REV

A1

E42422

06

SCALE: 6


SHEET 2 OF 3

6

6

DETAIL A

SCALE 20

DETAIL B

SCALE 15

DETAIL C

SCALE 12

A3

C1

A1

A2

0.1

ABC

A

A

A




H G F E D C B A

H G F E D C B A

8 7 6 5

4 3 2

8 7 6 5

4 3 2 1



E42422

306

DWG. NO

SHT.

REV

DEPARTMENT


P.O. BOX 58119


-

SIZE

DRAWING NUMBER

REV

A1

E42422

06

SCALE: 5


SHEET 3 OF 3

A



L


8 7 6 5

4 3 2

H G F E D C B A

8 7 6 5

4 3 2 1

H G F E D C B A

R CORP.

42

2X 70

4X

5.5�#0.1

48

6.6�#0.12

2X 6.25

82�#0.25

1.15�#0.25

0.842�#0.25

66.8�#0.25

16�#0.12

26�#0.12

C

B

A

A



REVISION HISTORY

ZONE

REV

DESCRIPTION

DATE

APPROVED

APRELIMINARY RELEASE

07/18/07

D.L.

BINCREASED BEND RADIUS FOR MAJOR

VERTICAL WALLS. REMOVED SEMI

SHERICAL FORMS.

09/13/07

D.L.

C4,E4

01

INITIAL RELEASE- THRU HOLE FOR

LEVER DECREASED. LOADPLATE

CATCH TAB RADIUS DECREASED.

04/21/08

DL

G5

02

CHANGED HOLE DIAMETER TO 5.5MM.

06/06/08

D.L.

E4

F4

03

MODIFIED LEVER OPENING WIDTH AND STOP TAB.

MODIFIED LEVER HOLE OPENING AND LEVER CATCH TAB.

08/19/08

D.L.

E4,F1

E2

D8

B4

04

MODIFIED DATUMN SCHEME, NOTE 8, AND 16, 66.8

TOLERANCES.MODIFIED HINGE HOLE LOCATION. ADDED

COSMETIC MARKING

10. ADDED CHAMFERS TO

TOP EDGES. ADDED LEVER RETENTION CUTOUT

04/13/09

D.L.

C3

05

MOVED BOTTOM TAB

12/08/09

JK

C3

06

CREATED -002 PART, SHORTENED LEVER CATCH TAB.

12/22/09

JK

E42420

106

DWG. NO

SHT.

REV

DEPARTMENT


P.O. BOX 58119


TMI

TITLE


SIZE

DRAWING NUMBER

REV

A1

E42420

06

SCALE: 2.5


SHEET 1 OF 1

SEE NOTES

SEE NOTES

FINISH

MATERIAL

DATE

APPROVED BY

07/18/07

J KALISZEWSKI

DATE

CHECKED BY

07/18/07

D. LLAPITAN

DATE

DRAWN BY

07/18/07

D. LLAPITAN

DATE

DESIGNED BY







PARTS LIST

DESCRIPTION

PART NUMBER

ITEM NO

QTY

LS ILM FRAME

E42420-002

TOP

9







C25432 - INTEL COSMETIC SPEC FOR SHEETMETAL










A) TYPE: SK7, 1065, S50C, OR CHSP60PC 1.2MM+/- 0.05 THK.




C) PLATING: ELECTROLYTIC NICKEL PLATED.

D) HEAT TREATING: NONE








B) INTEL PART NUMBER (E42420-002)

c) DATE CODE




8. SHARP CORNERS AND EDGESMUST BE ROUNDED OR CHAMFERED TO 0.25MM MAX,

9 PUNCH DIRECTION.

10 APPLY PIN 1 INDICATOR IN THIS AREA.

6

10

6

6

6

SCALE 3

SCALE 2

0.15

ABC




13

45

67

8

BCD A

12

34

56

78

BCD A2200 MISSION COLLEGE BLVD.

P.O. BOX 58119


R

5

1.57

7.6 0

-0.1

1.5 MAX

E42424

103

DWG. NO

SHT.

REV

SHEET 1 OF 1


SCALE: 12:1

03

E42424

DREV

DRAWING NUMBER

SIZE

NEHALEM EX ILM FASTENER

TITLE

-

DEPARTMENT

SEE NOTES

SEE NOTES

FINISH

MATERIAL

--

DATE

APPROVED BY

--

04/21/08

J. KALISZEWSKI

DATE

CHECKED BY

04/21/08

D. LLAPITAN

DATE

DRAWN BY

04/21/08

D. LLAPITAN

DATE

DESIGNED BY







REVISION HISTORY

ZONE

REV

DESCRIPTION

DATE

APPR

-01

INITIAL RELEASE

04/21/08

D.L.

C3

02

CHANGED HUT HEIGHT TO 7.6MM.

07/28/09

D.L.

03

CHANGED PART NUMBER TO E42424-002

12/22/09

JK












2. INTERPRET DIMENSIONS PER ASME Y14.5M-1994.

FEATURES NOT SPECIFIED ON DRAWING SHALL BE CONTROLLED BY 3D CAD

DATABASE, AND SHALL CONFORM TO A TOLERANCE OF +/- 0.375MM (.015").

IF PROVIDED, MEASUREMENTS SHOULD REFERENCE DATUM

-A- PRIMARY,

DATUM -B- SECONDARY, AND

-C- TERTIARY.




A) TYPE: LOW CARBON STEEL

B) CRITICAL MECHANICAL PROPERTIES

�HARDEN AND TEMPER IF USING INTERFERENCE FIT ASSEMBLY DESIGN.

�FINISH: ZINC PLUS CLEAR CHROMATE PER (ASTM B633) COLORLESS.

4. PART MUST COMPLY WITH INTEL WORKMANSHIP STANDARD (99-0007-001).





B) DATE CODE

C) MATERIAL TYPE


7. SHARP CORNERS MAY BE CHAMFERED, OR ROUNDED TO 0.25MM (.010") RADIUS.

8. DEBURR ALL SHARP EDGES.

9 ASSEMBLY FEATURES DEFINED BY VENDOR. MATES WITH COLLAR (P/N D80118)

6

6

6

6 POINT T-20 DRIVE

HEAD DEPTH 2MM MIN

PARTIAL THREAD TAP IN TOOL RECESS OK

R 0.25 MAX

9

INTERNAL THREAD

NO. 6-32 UNC

6MM DEEP MIN




8 7 6 5

4 3 2

H G F E D C B A

8 7 6 5

4 3 2 1

H G F E D C B A

R CORP.

72.8�#0.25

3.75�#0.05

R TYP

1.29�#0.2

75.35�#0.25

()

31.5�$

4.46�#0.1

4.1�#0.35

15.5�#0.5

5.2�#0.2

29.98�#0.2

14.44�#0.2

10.56�#0.2

90�$+1�$

-3�$

(2.5) 0.1



REVISION HISTORY

ZONE

REV

DESCRIPTION

DATE

APPROVED

-A

PRELIMINARY RELEASE

07/18/07

DL

G5,G201

INITIAL RELEASE -WIRE DIAMETER

AND CAM ANGLE FINALIZED.

04/21/08

D.L.

C5

G8 02

MODIFIED NOTE 2

REMOVED DATUMN REFERENCES

CHANGED CAM DIMENSION TO 10.56

04/13/09

D.L.

E42423

102

DWG. NO

SHT.

REV

DEPARTMENT


P.O. BOX 58119


TMI

TITLE NEHALEM EX ILM LOAD LEVER

SIZE

DRAWING NUMBER

REV

A1

E42423

02

SCALE: 3


SHEET 1 OF 1

SEE NOTES

SEE NOTES

FINISH

MATERIAL

DATE

APPROVED BY

07/18/07

J KALISZEWSKID

ATE

CHECKED BY

07/18/07

D. LLAPITAN

DATE

DRAWN BY

07/18/07

D. LLAPITAN

DATE

DESIGNED BY



















A) TYPE:

2.5 SUS 304


�TENSILE YIELD STRENGTH (ASTM D638) >= 1.3 GPa

�ULTIMATE YIELD STRENGTH (ASTM D638) >= 1.6 GPa

�MODULUS OF ELASTICITY (ASTM d638) = 193 GPa

�FINISH: NONE


NOTED. PART SHALL BE FREE OF OIL AND DEBRIS.




B) DATE CODE

C) MATERIAL TYPE


7. SHARP CORNERS MUST BE CHAMFERED, OR ROUNDED TO 0.25MM (.010") RADIUS.

8 FEATURE TO BE DEFINED BY MANUFACTURER AS EITHER TWO 90

�$ BENDS OR FULL RADIUS.

6

6

6

6

8



Figure C-8. Low-Profile Independent Loading Assembly (LP-ILM) Mechanical Drawing – Sheet 1 of 8

13

45

67

8

BCD A

12

34

56

78


P.O. BOX 58119


R

02

PRELIMINARY RELEASE FOR TOOLING

01/16/09

03

RELEASE FOR TOOLING

02/13/09

C HANES

E56700

104

DWG. NO

SHT.

REV

SHEET 1 OF 1


SCALE: 1

04

E56700

DREV

DRAWING NUMBER

SIZE

LGA1567 LOW PROFILE ILM ASSY

TITLE

-

DEPARTMENT

SEE NOTES

SEE NOTES

FINISH

MATERIAL

11/17/08

CHRIS HANES

DATE

APPROVED BY

-DAVID LLAPITAN

11/17/08

NEAL ULEN

DATE

CHECKED BY

11/17

J KALISZEWSKI

DATE

DRAWN BY

11/17/08

J KALISZEWSKI

DATE

DESIGNED BY





.X �# 0.5

.XX �# 0.25

.XXX �# 0.125

ANGLES ± 1.0


PARTS LIST

DESCRIPTION

PART NUMBER

ITEM NO

QTY

ILM TOP ASSEMBLY

E56700-001

TOP

SOCKET-B,FASTENER,COLLAR

D80118-004

14

LGA1567 LOW PROFILE ILM FRAME

E56107-001

21

LGA1567 LOW PROFILE ILM LOAD LEVER

E56145-001

31

LGA1567 LOW PROFILE ILM DUST COVER

E56700-002

41

LGA1567 LOW PROFILE ILM LOAD PLATE

E58504-001

51

LGA1567 LOW PROFILE ILM FASTENER

E60232-001

64

REVISION HISTORY

ZONE

REV

DESCRIPTION

DATE

APPR

-01

PROTOTYPE RELEASE

11/17/08

C HANES

04

ADDED -002 DUST COVER

08/25/09













DATABASE.

3. MATERIAL: MAY USE INTEL ENGINEERING APPROVED EQUIVALENTS.



4. ASSEMBLY MUST COMPLY WITH INTEL WORKMANSHIP STANDARD (99-0007-001).

ASSEMBLY SHALL BE FREE OF OIL AND DEBRIS.

5 MARK ASSEMBLY PART APPROXIMATELY WHERE SHOWN PER



B) ASSEMBLY VENDOR ID

C) DATE CODE


4X

4X

6

SCALE 2

SCALE 2

SEE DETAIL HINGE ATTACHMENT

SCALE 2

4

5

3

1

2

DETAIL HINGE ATTACHMENT

SCALE 4

4X ASSEMBLE COLLAR NUT FLUSH TO ILM FASTENER

FINISHED HEIGHT OF 5.755mm TO BOTTOM OF FASTENER HEAD




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8 7 6 5

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F

F

AA

DD

E

E



E58504

105

DWG. NO

SHT.

REV

DEPARTMENT


P.O. BOX 58119


PTMI

TITLE

LGA1567 LOW PROFILE LOAD PLATE

SIZE

DRAWING NUMBER

REV

A1

E58504

05

SCALE: 2.000


SHEET 1 OF 4

SEE NOTES

SEE NOTES

FINISH

MATERIAL

11/17/08

CHRIS HANES

DATE

APPROVED BY

11/17/08

D LLAPITAN

11/17/08

NEAL ULEN

DATE

CHECKED BY

11/17/08

J KALISZEWSKI

DATE

DRAWN BY

11/17/08

J KALISZEWSKI

DATE

DESIGNED BY


REVISION HISTORY

ZONE

REV

DESCRIPTION

DATE

APPR

-01

PROTOTYPE RELEASE

11/14/08

C HANES

4F/2

02

ADDED ROUND TO BOTTOM OF REACTION FLANGE

11/26/08

C HANES

03

SEVERAL CHANGES TO CTFs - PRELIMINARY TOOLING RELEASE

01/16/09

F7/2

04

ADDED 3.14 DIM AND CTF - PRELIMINARY TOOLING RELEASE

01/19/09

05

TOOLING RELEASE

02/27/09

C HANES

H

H GG

CC

C

31.58

69.97

31.58

80�$ 0-5�$

2X

6�#0.3

B63.6�#0.1

11.33�#0.25

A

A

A







C25432 - INTEL COSMETIC SPEC FOR SHEETMETAL.










A) TYPE:301 STAINLESS STEEL 1.5MM �#.08 6




C) PLATING: NONE.








B) INTEL PART NUMBER E58504-001

c) DATE CODE




8. BREAK ALL SHARP CORNERS, EDGES AND BURRS TO 0.1mm MAX.

9 PUNCH DIRECTION.

10. UNSPECIFIED SURFACES TO BE FLAT WITHIN 0.125MM PER 25.4MM (.005"/INCH).

11 COINING REQUIRED ON ENTIRE INSIDE EDGE.

11

9

6

SCALE 3.000

SECTION F-F

SEE DETAIL A

SHT 3

SEE DETAIL B

SHT 3

SECTION A-A

SEE DETAIL C

SHT 3

SEE DETAIL A

SHT 3

SEE DETAIL B

SHT 3

SEE DETAIL C

SHT 3

C1

A1

A2

A3




H G F E D C B A

H G F E D C B A

8 7 6 5

4 3 2

8 7 6 5

4 3 2 1



E58504

205

DWG. NO

SHT.

REV

DEPARTMENT


P.O. BOX 58119


PTMI

SIZE

DRAWING NUMBER

REV

A1

E58504

05

SCALE: 2.000


SHEET 2 OF 4

0.13

ABC

0.1

A

C

C

1.05

1.25�$

1.05

20.58

64.53

24.36�#0.1

A

A

6

6

SECTION D-D

SCALE 8.000

SECTION E-E

SCALE 8.000




H G F E D C B A

H G F E D C B A

8 7 6 5

4 3 2

87

65

43

21



E58504

305

DWG. NO

SHT.

REV

DEPARTMENT


P.O. BOX 58119


PTMI

SIZE

DRAWING NUMBER

REV

A1

E58504

05

SCALE: 2.000


SHEET 3 OF 4

0.13

AB

2.4�$

C

0.41

0.82

33.3

4.16

0.5�#0.1

0.5�#0.1

13.58�#0.05

11.33�#0.13

2.58

A

A

A

6

DETAIL A

SCALE 12.000

DETAIL B

SCALE 12.000

DETAIL C

SCALE 12.000

2X

C1

A1




H G F E D C B A

H G F E D C B A

8 7 6 5

4 3 2

87

65

43

21



E58504

405

DWG. NO

SHT.

REV

DEPARTMENT


P.O. BOX 58119


PTMI

SIZE

DRAWING NUMBER

REV

A1

E58504

05

SCALE: 2.000


SHEET 4 OF 4

REQUIRED BOW IN INDICATED DIRECTION

0.3

0.1

REQUIRED BOW IN INDICATED DIRECTION

0.2

0.0

A

A

SECTION H-H

SCALE 8.000

SECTION G-G

SCALE 8.000




8 7 6 5

4 3 2

H G F E D C B A

8 7 6 5

4 3 2 1

H G F E D C B A



E56145

103

DWG. NO

SHT.

REV

DEPARTMENT


P.O. BOX 58119


PTMI

TITLE

LGA1567 LOW PROFILE LOAD LEVER

SIZE

DRAWING NUMBER

REV

A1

E56145

03

SCALE: 1.000


SHEET 1 OF 1

SEE NOTES

SEE NOTES

FINISH

MATERIAL

11/17/08

CHRIS HANES

DATE

APPROVED BY

11/17/08

D LLAPITAN

11/17/08

NEAL ULEN

DATE

CHECKED BY

11/17/08

J KALISZEWSKI

DATE

DRAWN BY

11/17/08

J KALISZEWSKI

DATE

DESIGNED BY





.X �# 0.5

.XX �# 0.25

.XXX �# 0.125

ANGLES ± 1.0


REVISION HISTORY

ZONE

REV

DESCRIPTION

DATE

APPR

-01

PROTOTYPE RELEASE

11/14/08

C HANES

02

20�$ WAS 6�$ - PRELIMINARY TOOLING RELEASE

01/15/09

03

CLEANED UP DIMENSIONS - RELEASE FOR TOOLING

01/27/09

C HANES

13.87�#0.5

15.01+0.5

0

30.26�#0.5

R MAX TYP

1.29

6.5�#0.05

72.8�#0.5

10.03�#0.5

0.1

()

2.5

65.92�#0.5

10.4�#0.5

4.72�#0.1

()

20�$













-A- PRIMARY,


-C- TERTIARY.




A) TYPE:

2.5 �# 0.08 SUS 304

6


�TENSILE YIELD STRENGTH (ASTM D638) >= 1.3 GPa

�ULTIMATE YIELD STRENGTH (ASTM D638) >= 1.6 GPa

�MODULUS OF ELASTICITY (ASTM d638) = 193 GPa

�FINISH: NONE


NOTED. PART SHALL BE FREE OF OIL AND DEBRIS.




B) DATE CODE

C) MATERIAL TYPE




9 FEATURE TO BE DEFINED BY MANUFACTURER AS EITHER TWO 90

�$ BENDS OR FULL RADIUS.

6

6

6

SCALE 2.000

SCALE 2.000




A

4

B

3

CD

43

21

A

2

C

1

D


P.O. BOX 58119


R

01/16/09

03

REDIMSIONED FOR RELEASE FOR TOOLING

02/13/09

1�#0.1

1.5 MIN

5.755�#0.05

9

5�#0.1

7�#0.1

E60232 1 03DWG. NO SHT. REV

THIS DRAWING CONTAINS INTEL CORPORAT

ION CONFIDENTIAL INFORMATION. IT IS

DISCLOSED IN CONFIDENCE AND ITS CONT

ENTS

MAY NOT BE DISCLOSED, REPRODUCED, DI

SPLAYED OR MODIFIED, WITHOUT THE PRI

OR WRITTEN CONSENT OF INTEL CORPORAT

ION.

SHEET 1 OF 1


SCALE: 10.000

03

E60232

CREV

DRAWING NUMBER

SIZELGA1567 LOW PROFILE ILM FASTENER

TITLE

PTMI

DEPARTMENT

SEE NOTES

SEE NOTES

FINISH

MATERIAL

11/17/08

CHRIS HANES

DATE

APPROVED BY

11/17/08

D LLAPITAN

11/17/08

NEAL ULEN

DATE

CHECKED BY

09/09/08

J KALISZEWSKI

DATE

DRAWN BY

09/09/08

J KALISZEWSKI

DATE

DESIGNED BY


REVISION HISTORY

ZONE

REV

DESCRIPTION

DATE

APPR

-01

PROTOTYPE RELEASE

11/17/08

C HANES

02

PRELIMINARY RELEASE FOR TOOLING

C HANES















A) TYPE: LOW CARBON STEEL


�HARDEN AND TEMPER IF USING INTERFERENCE FIT ASSEMBLY DESIGN.

�FINISH: ZINC PLUS CLEAR CHROMATE PER (ASTM B633) COLORLESS.






B) DATE CODE

C) MATERIAL TYPE




9 ASSEMBLY FEATURES DEFINED BY VENDOR. MATES WITH COLLAR (P/N D80118-004)

6 POINT T-20 DRIVE

HEAD DEPTH 2MM MIN

PARTIAL THREAD TAP IN TOOL RECESS OK

6

9

INTERNAL THREAD

NO. 6-32 UNC

4 MM DEEP MIN



Figure C-16. Backplate Assembly Drawing – Sheet 1 of 5

13

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7

6



§


Tower Heatsink Drawings

D Tower Heatsink Drawings

Table D-1 lists the mechanical drawings included in this appendix.

Table D-1. Mechanical Drawing List


“Tower Heatsink Drawing – Sheet 1 of 14” Figure D-1
















4

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A

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[.0

2]

AC

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C

10

0.0

00

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25

3.9

37

±.0

04

[]

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41

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10

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00

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X[4

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(26

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5)

[1.0

55

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(19

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6)

[.7

64

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10

50

.00

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9]

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00 [.0

98

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2X

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00 [.2

56

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10

16

.00

0[.

63

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MIN

IMU

M

FIN

TO

FIN

PIT

CH

1.2

63

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25

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17

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NO

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01

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LE

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X H

EA

T S

INK

: A

L F

IN (

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01

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NE

HA

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X H

EA

T S

INK

: A

L F

IN (

TO

P)

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01

643

NE

HA

LE

M-E

X H

EA

T S

INK

: C

U B

AS

EE

42882-0

01

71

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HA

LE

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T S

INK

: C

U H

EA

T P

IPE

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01

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IS

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SE

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CO

NF

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NC

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AY

NO

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6

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6

6

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6

13

13

SE

CT

ION

A

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11

N6

SU

RF

AC

E F

INIS

HO

N E

NT

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IN

DIC

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SU

RF

AC

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2

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ST

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FT

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AN

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10

12

9

11

1

2 1

0

11

12

9

1

1

1

1

2

.10

0 [

.00

3]




34

56

78

BCD A

12

34

56

78

BCD A

E42889

13

DWG. NO

SHT.

REV

SHEET 1 OF 1


SCALE: 1:1

3E42889

DREV

DRAWING NUMBER

SIZENEHALEM-EX HEAT SINK: AL FIN (TOP)

TITLE


P.O. BOX 58119


R

PTMI

DEPARTMENT

SEE NOTES

SEE NOTES

FINISH

MATERIAL

mm/dd/yy

X

DATE

APPROVED BY

mm/dd/yy

X

mm/dd/yy

X

DATE

CHECKED BY

05/17/07

C. BEALL

DATE

DRAWN BY

8/21/07

C. BEALL

DATE

DESIGNED BY



IN ACCORDANCE WITH ASME Y14.5-1994

DIMENSIONS ARE IN MM

TOLERANCES:

.X

0.5 Angles

0.5

.XX

0.25

.XXX

0.125


PARTS LIST

DESCRIPTION

PART NUMBER

ITEM NO

QTY

NEHALEM-EX HEAT SINK: AL FIN (TOP)

E42889-001

TOP

REVISION HISTORY

ZONE

REV

DESCRIPTION

DATE

APPROVED

-01

RELEASE FOR TOOLING

4/24/08

JK

C3

02

.963 was 1.00

05/16/08

JK

C3

03

.963 was 1.00 (OTHER SIDE OF FIN)

05/21/08

JK



1

A

A

BC

80.000

3.150

[]

12 100.000

3.937

[]

.300

.012

[]

12 70.000

2.756

[]

4X .963

.038

[]

6X .963

.038

[]

10.000

.394

[]

35.000

1.378

[]

2X

5.200

.205

[]

11 MAX

50.000

1.969

[]

11 2X MAX50.000

1.969

[]

11

MINIMUM

16.000

.630

[]

TYP

8.00

.32

[]

TYP

12.00

.47

[]

NOTES: UNLESS OTHERWISE SPECIFIED:



UL 94 - UL FLAMABILITY TESTING

99-0007-001 - INTEL WORKMANSHIP STANDARD - SYSTEMS MANUFACTURING




2. 3D PART MODEL IS PER ENGINEERING BILL OF MATERIAL. DIMENSIONS CALLED OUT

ON THE

DRAWING SHALL CONFORM TO THE DEFAULT TOLERANCE BLOCK UNLESS OTHERISE

SPECIFIED. THE 3D MODEL SHALL CONTROL ALL FEATURES OF THIS PART NOT

DEFINED

ON THE DRAWING. MODEL TO BE INTERPRETED USING DATUM A (PRIMARY), DATUM B

(SECONDARY), AND DATUM C (TERTIARY) PER THE DRAWING CALLOUT.

3. MATERIAL: MAY USE INTEL ENGINEERING APPROVED EQUIVALENT

A) TYPE: ALUMINUM ALLOY (REPORT ALLOY IN FAI STUDY)

B) THICKNESS: 0.3MM (.012") THICK

C) MINIMUM THERMAL CONDUCTIVITY: 205 W/mK

4. BURR HEIGHTS SHALL NOT EXCEED 10% OF MATERIAL THICKNESS.

5. THIS DRAWING TO BE USED IN CORRELATION WITH SUPPLIED 3D DATABASE FILE.

ALL DIMENSIONS AND TOLERANCES ON THIS DRAWING TAKE PRECEDENCE OVER

SUPPLIED FILE.

6. PART TO BE FLAT WITHIN 0.15mm.

7. BEND RADII 0.125mm (.005") MINIMUM.

8. CRITICAL TO FUNCTION DIMENSION (CTF)

MEASURED

9. BREAK ALL SHARP EDGES

10. ALL SUBSTANCES IN THIS PART MUST CONFORM TO INTEL ENVIRONMENTAL PRODUCT

SPECIFICATION BS-MTN-0001.

11 HEAT PIPE INTERFACE FEATURES TO BE CONTROLLED BY SUPPLIER, AND SHOULD

FIT IN SPECIFIED REGION.

12 INDICATED DIMENSION DESCRIBES MAXIMUM SIZE. SUPPLIER MAY REDUCE FIN

WEIGHT BY REMOVING MATERIAL FROM CORNERS OF THE FIN.

2

1

3




34

56

78

BCD A

12

34

56

78

BCD A

E42888

12

DWG. NO

SHT.

REV

SHEET 1 OF 1


SCALE: 1:1

2E42888

DREV

DRAWING NUMBER

SIZENEHALEM-EX HEAT SINK: AL FIN (MID)

TITLE


P.O. BOX 58119


R

PTMI

DEPARTMENT

SEE NOTES

SEE NOTES

FINISH

MATERIAL

mm/dd/yy

X

DATE

APPROVED BY

mm/dd/yy

X

mm/dd/yy

X

DATE

CHECKED BY

05/17/07

C. BEALL

DATE

DRAWN BY

8/21/07

C. BEALL

DATE

DESIGNED BY





TOLERANCES:

.X

0.5 Angles

0.5

.XX

0.25

.XXX

0.125


PARTS LIST

DESCRIPTION

PART NUMBER

ITEM NO

QTY

NEHALEM-EX HEAT SINK: AL FIN (MID)

E42888-001

TOP

REVISION HISTORY

ZONE

REV

DESCRIPTION

DATE

APPROVED

-1

RELEASE FOR TOOLING

4/23/08

JK

2.963 WAS 1.00 (2X)

05/20/08

JK



1

RIGHT

FRONT

TOP

FRONT

A

RIGHT

TOP

A

BC

80.000

3.150

[]

12 100.000

3.937

[]

.300

.012

[]

12 70.000

2.756

[]

4X .963

.038

[]

4X .963

.038

[]

10.000

.394

[]

35.000

1.378

[]

11 2X

MAX

50.000

1.969

[]

11

MAX

50.000

1.969

[]

11

MINIMUM

16.000

.630

[]

TYP

8.00

.32

[]

TYP

12.00

.47

[]










ON THE



DEFINED










SUPPLIED FILE.




MEASURED








1

2

3

4

5




34

56

78

BCD A

12

34

56

78

BCD A

E42887

12

DWG. NO

SHT.

REV

SHEET 1 OF 1


SCALE: 1:1

2E42887

DREV

DRAWING NUMBER

SIZE

NEHALEM-EX HS: AL FIN (BOTTOM)

TITLE


P.O. BOX 58119


R

PTMI

DEPARTMENT

SEE NOTES

SEE NOTES

FINISH

MATERIAL

mm/dd/yy

X

DATE

APPROVED BY

mm/dd/yy

X

mm/dd/yy

X

DATE

CHECKED BY

8/20/07

C. BEALL

DATE

DRAWN BY

8/22/07

C. BEALL

DATE

DESIGNED BY





TOLERANCES:

.X

0.5 Angles

0.5

.XX

0.25

.XXX

0.125


PARTS LIST

DESCRIPTION

PART NUMBER

ITEM NO

QTY

NEHALEM-EX HEAT SINK: AL FIN (BASE)

E42887-001

TOP

REVISION HISTORY

ZONE

REV

DESCRIPTION

DATE

APPROVED

-1

RELEASE FOR TOOLING

4/23/08

JK

2.963 WAS 1.00 (2X)

05/20/08

JK



X

RIGHT

FRONT

TOP

FRONT

A

RIGHT

TOP

A

CB

12 70.000

2.756

[]

12 100.000

3.937

[]

13.000

.512

[]

80.000

3.150

[]

THICK

.300

.012

[]

4X .963

.038

[]

4X .963

.038

[]

10.000

.394

[]

35.000

1.378

[]

11 50.000

1.969

[]

11 50.000

1.969

[]

TYP

8.00

.32

[]

TYP

12.00

.47

[]










ON THE



DEFINED










SUPPLIED FILE.




MEASURED








1

2

3

4




34

56

78

BCD A

12

34

56

78

BCD A

AA

E42883

11

DWG. NO

SHT.

REV

SHEET 1 OF 1


SCALE: 1:1

1E42883

DREV

DRAWING NUMBER

SIZE

NEHALEM-EX HEAT SINK: CU HEAT PIPE

TITLE


P.O. BOX 58119


R

PTMI

DEPARTMENT

SEE NOTES

SEE NOTES

FINISH

MATERIAL

mm/dd/yy

X

DATE

APPROVED BY

mm/dd/yy

X

mm/dd/yy

X

DATE

CHECKED BY

05/17/07

C. BEALL

DATE

DRAWN BY

8/21/07

C. BEALL

DATE

DESIGNED BY





TOLERANCES:

.X

0.5 Angles

0.5

.XX

0.25

.XXX

0.125


PARTS LIST

DESCRIPTION

PART NUMBER

ITEM NO

QTY

NEHALEM-EX HEAT SINK: CU HEAT PIPE

E42883-001

TOP

REVISION HISTORY

ZONE

REV

DESCRIPTION

DATE

APPROVED

-1

RELEASED FOR TOOLING

4/23/08

JK



NOTES UNLESS OTHERWISE SPECIFIED:

1. HEAT PIPE INTERFACE FEATURES TO BE CONTROLLED BY SUPPLIER.

2. HEAT PIPE GEOMETRY TO BE CONTROLLED BY SUPPLIER TO MEET ASSEMBLY PRINT

REQUIREMENTS.

3. HEAT PIPE BASE MATERIAL: MAY USE INTEL ENGINEERING APPROVED EQUIVALENT

A) TYPE: COPPER ALLOY (REPORT ALLOY IN FAI STUDY)

B) MINIMUM THERMAL CONDUCTIVITY: 390 W/mK

C) WICK: SINTERED POWDER

SECTION A-A




13

45

67

8

BCD A

12

34

56

78

BCD A

E42882

12

DWG. NO

SHT.

REV

SHEET 1 OF 1


SCALE: 1:1

2E42882

DREV

DRAWING NUMBER

SIZE

NEHALEM-EX HEAT SINK: CU BASE

TITLE


P.O. BOX 58119


R

PTMI

DEPARTMENT

SEE NOTES

SEE NOTES

FINISH

MATERIAL

mm/dd/yy

X

DATE

APPROVED BY

mm/dd/yy

X

mm/dd/yy

X

DATE

CHECKED BY

05/17/07

C. BEALL

DATE

DRAWN BY

8/21/07

C. BEALL

DATE

DESIGNED BY





TOLERANCES:

.X

0.5 Angles

0.5

.XX

0.25

.XXX

0.125


PARTS LIST

DESCRIPTION

PART NUMBER

ITEM NO

QTY

NEHALEM-EX HEAT SINK: CU BASE

E42882-001

TOP

REVISION HISTORY

ZONE

REV

DESCRIPTION

DATE

APPROVED

-1

RELEASE FOR TOOLING

4/23/08

JK

2PEDESTAL CORNER RADIUS IS 0.5MM WAS 4MM

6/13/08

JK



X

.100 [.003]

B

C

A

B

A

C

B

C

2.500

.098

[]

26.000

1.024

[]

35.000

1.378

[]

R.50.02

[]

()

2.500

.098

[]









07-070-SHS - ADDENDUM FOR SOLDER ON HEATSINKS


ON THE



DEFINED




A) TYPE: COPPER ALLOY (REPORT ALLOY IN FAI STUDY)


4. PART TO BE CAST, EXTRUDED, MACHINED, OR A COMBINATION.

IF PART IS CAST, REFER TO THE FOLLOWING REQUIREMENTS:

A) DEGATE: .13 MM [.005 IN] MAXIMUM

B) FLASH & MISMATCH .13 MM [.005 IN] MAXIMUM

C) SINK .13 MM [.005 IN] MAXIMUM

D) EJECTOR MARKS: FLUSH TO MINUS .00 MM/-.25 MM [.000 IN/-.010 IN]


MEASURED

6 FINISH: MAY USE ENGINEERING APPROVED EQUIVALENT.

A) INDICATED SURFACES PER INTEL 99-0007-001, CLASS A.

B) INDICATED SURFACES PER INTEL 99-0007-001, CLASS B.

C) UNSPECIFIED SURFACES PER INTEL 99-0007-001, CLASS C.

D) TEXTURE INDICATED SURFACES PER MT-11020.

E) FINISH INDICATED SURFACES PER SPI D-2.

F) SURFACES WITH NO TEXTURE TO BE IN THE RANGE OF SPI B-2 TO SPI C-2.

G) NO TEXTURE.

7 HEAT PIPE AND ALUMINUM BASE INTERFACE FEATURES TO BE CONTROLLED BY SUPPLIER.

7

7

N6 SURFACE FINISH

ON ENTIRE INDICATED

SURFACE

3

1

2




34

56

78

BCD A

12

34

56

78


P.O. BOX 58119


R

3/25/09

311.5 WAS 10.5, ADD SURFACE FINISH TO BOTTOM OF C'BORE

04/22/09

X

80.000

[3.150]

9 90.500

[3.563]

9 70.000

[2.756]

57.000

[2.244]

10.100

[.398]

4.000

[.157]

B

4.500

.177

[]

C

4.500

.177

[]

A

A

2X (

X 0.500 DEEP)

N7 SURFACE FINISH ON BOTTOM OF RECESS

11.50

.45

[]

E42881

15

DWG. NO

SHT.

REV

SHEET 1 OF 1


SCALE: 2:1

5E42881

DREV

DRAWING NUMBER

SIZE

NEHALEM-EX HEAT SINK: AL BASE

TITLE

PTMI

DEPARTMENT

SEE NOTES

SEE NOTES

FINISH

MATERIAL

mm/dd/yy

X

DATE

APPROVED BY

mm/dd/yy

X

08/20/07

KALISZEWSKI

DATE

CHECKED BY

8/20/07

C. BEALL

DATE

DRAWN BY

8/20/07

C. BEALL

DATE

DESIGNED BY





TOLERANCES:

.X �# 0.5 Angles �# 0.5�$

.XX �# 0.25

.XXX �# 0.125


PARTS LIST

DESCRIPTION

PART NUMBER

ITEM NO

QTY

NEHALEM-EX HEAT SINK: AL BASE

E42881-002

TOP

REVISION HISTORY

ZONE

REV

DESCRIPTION

DATE

APPROVED

-1

RELEASE FOR TOOLING

04/23/08

JK

2ADDED

10.5MM X 0.5MM DEEP C'BORE ON BOTTOM OF PART

B4

4N7 FINISH WAS N6

08/10/09

5ON NOTE 3 ADDED "ADC10".

MINIMUM THERMAL CONDUCTIVITY WAS 205 W/mK

MINIMUM THERMAL CONDUCTIVITY IS 100W/mK

12/1/9

GPG












ON THE



DEFINED




A) TYPE: ALUMINUM ALLOY: ADC10 (REPORT ALLOY IN FAI STUDY)


4. PART TO BE CAST, EXTRUDED, MACHINED, OR A COMBINATION.

IF PART IS CAST, REFER TO THE FOLLOWING REQUIREMENTS:

A) DEGATE: .13 MM [.005 IN] MAXIMUM

B) FLASH & MISMATCH .13 MM [.005 IN] MAXIMUM

C) SINK .13 MM [.005 IN] MAXIMUM

D) EJECTOR MARKS: FLUSH TO MINUS .00 MM/-.25 MM [.000 IN/-.010 IN]


MEASURED

6 FINISH: MAY USE ENGINEERING APPROVED EQUIVALENT.

A) INDICATED SURFACES PER INTEL 99-0007-001, CLASS A.

B) INDICATED SURFACES PER INTEL 99-0007-001, CLASS B.

C) UNSPECIFIED SURFACES PER INTEL 99-0007-001, CLASS C.

D) TEXTURE INDICATED SURFACES PER MT-11020.

E) FINISH INDICATED SURFACES PER SPI D-2.

F) SURFACES WITH NO TEXTURE TO BE IN THE RANGE OF SPI B-2 TO SPI C-2.

G) NO TEXTURE.

7. ROUNDS REQUIRED FOR FINAL PRODUCTION CAST PART.

NOT REQUIRED FOR PROTOTYPE ORDER

8 HEAT PIPE AND CU CORE INTERFACE FEATURES TO BE CONTROLLED BY SUPPLIER.

9 INDICATED DIMENSION DESCRIBES MAXIMUM VOLUME. SUPPLIER MAY

REMOVE MATERIAL FROM BASE TO REDUCE WEIGHT

10 INDICATED POCKET FEATURE IS FOR WEIGHT REDUCTION. THESE FEATURES ARE

A SUGGESTION ONLY. SUPPLIER MAY CHANGE POCKETS WITH INTEL PTMI APPROVAL.

8

8

10

1

2 3



4





A

4

B

3

CD

43

21

A

2

C

1

D E41829 1 2DWG. NO SHT. REV




ENTS




ION.

SHEET 1 OF 1


SCALE: 3.000

2E41829

CREV

DRAWING NUMBER

SIZE

NEHALEM EX LOAD SPRING

TITLE


P.O. BOX 58119


R

PTMI

DEPARTMENT

SEE NOTES

SEE NOTES

FINISH

MATERIAL

04/11/08

JK

DATE

APPROVED BY

--

DATE

CHECKED BY

04/11/08

JK

DATE

DRAWN BY

-

DATE

DESIGNED BY





TOLERANCES:

.X

0.3 Angles

0.5

.XX

0.20

.XXX

0.127


PARTS LIST

DESCRIPTION

PART NUMBER

ITEM NO

QTY

MUST BE LEFT HAND WOUND

E41829-001

TOP

REVISION HISTORY

ZONE

REV

DESCRIPTION

DATE

APPR

-1

RELEASE FOR TOOLING

04/23/08

JK

2CHANGED SPRING ID AND OD TO AGREE WITH LEE SPRING

05/21/08

JK

PITCH2.503

0.0985

[]

1.473

0.0580

[]

25.400

1.0000

[]

8.563

0.200

0.3371

0.0078

[]

5.777

0.2274

[]

NOTES:

1. THIS DRAWING TO BE USED IN CONJUNCTION WITH SUPPLIED

3D DATABASE. ALL DIMENSIONS AND TOLERANCES ON THIS

DRAWING TAKE PRECEDENCE OVER SUPPLIED DATABASE.

2. PRIMARY DIMENSIONS STATED IN MILLIMETERS.

[BRACKETED] DIMENSIONS STATED IN INCHES.

3. LEE SPRING P/N: LHL 375b-01 OR EQUIVALENT

SPRING RATE: K=15.8 +/- 0.87 N/MM [K = 90.0 +/- 5.0 LBF/IN]

4 SOLID HEIGHT: 14.98 MM [0.59 IN]

WIRE DIAMETER: 1.473 MM [0.058 IN]

TOTAL COILS: 10

ACTIVE COILS: 8.1

ENDS: GROUND & CLOSED

TURN: LEFT HAND (AS SHOWN IN VIEWS)

MATERIAL: MUSIC WIRE, ASTM A228 OR JIS-G-3522

FINISH: ZINC PLATED

OTHER GEOMETRY: PER THIS DRAWING

4 CRITICAL TO FUNCTION DIMENSION

4

4

4 4




13

45

67

8

BCD A

12

34

56

78


P.O. BOX 58119


R

2X 3.226

[0.1270]

33.700

[1.3268] 6.797

[0.2676]

2X 0.740

[0.0291]

5.50

[0.217]

4.20

[0.165]

3.50

[0.138]

2.00

[0.079]

R0.20

0.008

[]

7.00

[0.276]

6.00

[0.236]

102.00

[4.016]

E41616

15

DWG. NO

SHT.

REV

SHEET 1 OF 1


SCALE: 1.000

5E41616

DREV

DRAWING NUMBER

SIZE

NEHALEM EX HS SCREW

TITLE

-

DEPARTMENT

SEE NOTES

SEE NOTES

FINISH

MATERIAL

DATE

APPROVED BY

--

04/08/08

C. BEALL

DATE

CHECKED BY

04/08/08

KALISZEWSKI

DATE

DRAWN BY

04/08/08

C. BEALL

DATE

DESIGNED BY





TOLERANCES:

.X �#0.5 Angles �# 1.0�$

.XX �# 0.25

.XXX �# 0.127


PARTS LIST

DESCRIPTION

PART NUMBER

ITEM NO

QTY

SCREW

E41616-003

TOP

REVISION HISTORY

ZONE

REV

DESCRIPTION

DATE

APPR

-1

RELEASE FOR TOOLING

04/23/08

JK

2ADDED CALLOUT FOR #2 PHILLIPS RECESS

05/29/08

JK

3REVISED SLOT DIMENSIONS (2X)

09/04/08

JK

4CHANGED LOWER SLOT FORM 3.23mm TO 3.30mm.

KEPT UPPER SLOT 3.23mm.

10-30-09

GPG

5CHANGED LOWER SLOT FROM 3.30mm TO 3.226mm

12-1-09

GPG













-A- PRIMARY,


-C- TERTIARY.




A) TYPE:18-8 STAINLESS STEEL; AISI 303, 304, 305; JIS SUS304;

B) PLATING: NONE

C) HEAT TREATING: MINIMUM TENSILE STRENGTH 60,000 PSI;

TORQUE TO FAILURE SHALL BE NO LESS THAN 20 IN-LBF.



FINISH: UNSPECIFIED SURFACES MUST CONFORM WITH CLASS C REQUIREMENTS.




5

5

5

5

5

SCALE 2.000

SCALE 2.000

SEE DETAIL A

#2 PHILLIPS

RECESS

SECTION A-A

SEE DETAIL B

DETAIL A

SCALE 4.000

M3 x 0.5

THREAD

DETAIL B

SCALE 4.000

4

4




A

4

B

3

CD

43

21

A

2

C

1

D

AA

2200 M

ISS

ION

CO

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GE

BLV

D.

R

P.O

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OX

58119

SA

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A C

LA

RA

, C

A 9

5052-8

119

4.5

3

10

.25

8.2

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1.0

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5°

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TH

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NF

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TE

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NO

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D, R

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DU

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WR

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CO

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SH

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DR

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ABCD

43

A

2

C

1

D

AA


P.O. BOX 58119


R

4.53

10.25

8.25

1.00

1.00

X 45�$

.500





ENTS




ION.

SHEET

1OF

1DO

NOT

SCALE

DRAWING

SCALE

8000

1E85130

CREV

DRAWING NUMBER

SIZE

RTNR, E-RING, NEHALEM EX

TITLE

-

DEPARTMENT

SEENOTES

SEENOTES

FINISH

MATERIAL

DATE

APPROVED BY

--

DATE

CHECKED BY

10-30-09

G.GORDON

DATE

DRAWN BY

10-30-09

G.GORDON

DATE

DESIGNED BY





TOLERANCES:

.X �# .25 Angles �# .5�$

.XX �# .20

.XXX �# .125


PARTS LIST

DESCRIPTION

PART NUMBER

ITEM NO

QTY

RTNR, E-RING, NEHALEM EX

E85130-001

TOP

REVISION HISTORY

ZONE

REV

DESCRIPTION

DATE

APPR

-1

RELEASE FOR SILVER PRODUCTION BUILD.

10-30-09

GPG









DATABASE. IF PROVIDED, MEASUREMENTS SHOULD REFERENCE DATUM

-A- PRIMARY, DATUM

-B- SECONDARY, AND

-C- TERTIARY.




A) TYPE 303S OR 303Se STAINLESS STEEL (CONDITION B)

B) PLATING: NONE



FINISH: UNSPECIFIED SURFACES MUST CONFORM WITH CLASS C REQUIREMENTS.



5

5

5

SECTION A-A




A

4

B

3

CD

43

21

A

2

C

1

D


P.O. BOX 58119


R

0.635�#0.051

.0250�#.0020

[]

7.92

.312

[]

3.175+0.026

-0.077

.1250+.0010

-.0030

[]





ENTS




ION.

SHEET 1 OF 1


SCALE: 12

3E53884

CREV

DRAWING NUMBER

SIZE

E-RING

TITLE

PTMI

DEPARTMENT

SEE NOTES

SEE NOTES

FINISH

MATERIAL

DATE

APPROVED BY

--

09/04/08

C. BEALL

DATE

CHECKED BY

09/04/08

JK

DATE

DRAWN BY

09/04/08

C. BEALL

DATE

DESIGNED BY




DIMENSIONS ARE IN INCHES

TOLERANCES:

.X �# 0.50 Angles �# 0.5�$

.XX �# 0.25

.XXX �# 0.10


PARTS LIST

DESCRIPTION

PART NUMBER

ITEM NO

QTY

E-RING

E53884-002

TOP

REVISION HISTORY

ZONE

REV

DESCRIPTION

DATE

APPR

-01

INITIAL RELEASE

09/04/08

JK

02

ADDED OPTIONAL NICKEL PLATING FINISH

07/27/09

03

REMOVED OIL DIP AS AN OPTION. NICKEL PLATING ONLY.

REMOVED NOTE 4. ADDED SK7 IN MATERIAL CALLOUT.

11-3-09

GPG

NOTES:

1. THIS DRAWING TO BE USED IN CONJUNCTION WITH SUPPLIED

3D DATABASE. ALL DIMENSIONS AND TOLERANCES ON THIS

DRAWING TAKE PRECEDENCE OVER SUPPLIED DATABASE.

2. PRIMARY DIMENSIONS STATED IN MILLIMETERS.

[BRACKETED] DIMENSIONS STATED IN INCHES.

3. MATERIAL: SK7 COLD ROLED HIGH CARBON STEEL. MUST MEET 84 KSI MIN TENSILE

STRENGTH.

FINISH - NICKEL PLATED.

4. REMOVED.

5 CRITICAL TO FUNCTION DIMENSION

5

5



§


Enabled Component Board Keepout Drawings

E Enabled Component Board Keepout Drawings

Table E-1 lists the mechanical drawings included in this appendix.

Table E-1. Mechanical Drawing List


“Enabled Component Board Keepout Mechanical Drawing – Sheet 1 of 7”

Figure E-1


Figure E-2


Figure E-3


Figure E-4


Figure E-5


Figure E-6

“Enabled Component Board Keepout Mechanical Drawing – Sheet 7of 7”

Figure E-7



Figure E-1. Enabled Component Board Keepout Mechanical Drawing – Sheet 1 of 7

13

45

67

8

BCD A

12

34

56

78

BCD A2200 M

ISS

ION

CO

LLE

GE

BLV

D.

R

P.O

. B

OX

58119

SA

NT

A C

LA

RA

, C

A 9

5052-8

119

E36581

101

DW

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Electrical Methodology

F Electrical Methodology

F.1 Measuring Electrical Resistance of the JumperFigure F-1 and Figure F-2 show the proposed methodology for measuring the final electrical resistance. The methodology requires measuring LGA TV flush-mounted directly to the motherboard fixtures, so that the Land shoulder is flush with the motherboard to get the averaged jumper resistance, Rjumper. The Rjumper should come from a good statistical average of 30 package fixtures flush mounted to a motherboard fixture. The same measurements are then made with a package fixture mounted on a supplier’s socket, and both are mounted on a motherboard fixture; this provides the RTotal. The resistance requirement, RReq, can be calculated for each chain, as explained later.

Figure F-3 shows the resistance test fixtures separately and superimposed. The upper figures show the daisy chain pattern of the package and the baseboard. The bottom figure shows the two parts superimposed. There are TBD daisy chain configurations on the resistance test board. Figure F-3 shows these configurations with the number of lands per each chain and netlist. All figures are shown with the view from the top of the package.

F.2 Determining Maximum Electrical ResistanceThis section provides a guideline for the instruments used to take the measurements.

Note: The instrument selection should consider the guidelines in EIA 364-23A.

Figure F-1. Methodology for Measuring Total Electrical Resistance

Figure F-2. Methodology for Measuring Electrical Resistance of the Jumper

LGA Testboard

LGA pad

Solder resist

Shorting bar on internal routing layer

LGA Package

LGA SocketSocket contact

Socket housing

Package dielectric

+V

+I -V

-IShorting bar on

test board

LGA TV

LGA Testboard+V

+I -V

-I



• These measurements use a 4-wire technique, where the instruments provide two separate circuits. One is a precision current source to deliver the test current. The other is a precision voltmeter circuit to measure the voltage drop between the desired points.

• These separate circuits can be contained within one instrument, such as a high-quality micro-ohmmeter, a stand-alone current source and voltmeter, or the circuits of a data acquisition system.

• Measurement accuracy in Ω is specified as ± 0.1% of reading, or ±0.1 mΩ, whichever is greater. The vendor is responsible for demonstrating that their instrument(s) can meet this accuracy.

• Automation of the measurements can be implemented by scanning the chains through the edge or cable test socket using a switch matrix. The matrix can be operated by hand, or through software.

• Measure RTotal for each daisy chain of “package + socket + motherboard” unit.

• Measure Rjumper for each daisy chain of 30 “package + socket + motherboard” units. Calculate Rjumper for each daisy change (there are 303 data for each daisy chain).

• For each socket unit, calculate:

RReq is the average contact resistance for socket pin.

F.3 InductanceThe inductance measurement is completed in two steps. First, the socket is measured in an assembled configuration. A second measurement is made to subtract the fixture contribution. Figure F-3 shows a cross-section of the retention, LGA Adapter, socket, test board, and backing plate assembly. A circuit board, referred to as the LGA adapter, is used to compress the LGA socket leads during test. During test in the assembled configuration, the probes contact the surface of the LGA adapter. The test board contains a ground plane under the shorting bar. The second figure shows the measurement of the unassembled adapter. The measurement of the adapter alone is used to calibrate out the fixture contribution.

N

RRR

jumperTotalReq

−=



F.3.1 Design Procedure for Inductance MeasurementsThe measurement equipment required to perform the validation is:

• HP8753D Vector Network Analyzer* or equivalent.

• Robust Probe Station (GTL4040)* or equivalent.

• Probes: GS1250 and GSG1250 Air-Co-Planar* or equivalent.

• Calibration: Cascade Calibration Substrates* or equivalent.

• Measurement objects: Sockets, motherboards.

F.3.1.1 Measurement Steps

1. Equipment setup:a. Cables should be connected to the network analyzer and to the probes using the

appropriate torque wrench to ensure consistent data collection every time the measurement is performed.

2. Set VNA:

a. Bandwidth = 300 KHz – 3 GHz with 801 points.

b. Averaging Factor = 16.

3. Perform Open/Short/Load calibration:

a. Calibration should be performed at the start of any measurement session.

b. Create Calibration Kit if necessary for 1st time.

c. Do not perform port extension after calibration.

Figure F-3. Inductance Measurement Fixture Cross-Section

Probe

LGA Testboard

LGA SocketSocket contact

Shorting bar on test board

Solder resist

Retention

Probe

Backing Plate

LGA Adapter

Retention

ProbeProbe

LGA Adapter

Sandwich (Fixture Contribution)

Socket



4. Check to ensure calibration successfully performed.

5. Measure the inductance of the socket mounted to the motherboard fixture by probing the locations on the LGA Adapter and socket assembly.

a. Call this Lsocket assembly

b. Export data into MDS/ADS or (capture data at frequency specified in item 6 of Table 4-1).

6. Measure the inductance of the motherboard fixture by probing on the pads.

a. Call this Lsandwich

b. Measure 30 units.

c. The test board for 30 units must be chosen from different lots. Use five different lots, six units from each lot.

d. Export data into MDS/ADS or (capture data at frequency specified in item 6 of Table 4-1).

e. Calculate Lsandwich

f. For each socket unit, calculate:Lsocket = Lsocket assembly - Lsandwich

It means Lsandwich will be subtracted from each Lsocket assembly and the result will be compared with spec value for each individual socket unit.

F.3.2 Correlation of Measurement and Model Data InductanceTo correlate the measurement and model data for loop inductance, one unit of measured socket assembly (socket and shorted test fixture) and one unit of measured sandwich (shorted test fixture) will be chosen for cross-sectioning. Both units will be modeled based on data from cross sectioning using Ansoft 3D*. The sandwich inductance will be subtracted from socket assembly inductance for both measured and modeled data. This procedure results in loop inductance for socket contact. This final result can be compared with the loop inductance from the supplier model for the socket. If there is any difference between them, it will be called the de-embedded correction factor. Adding the test board to the socket and then eliminating the contribution of the fixture creates this correction factor because inductance is not linear.

Figure F-4. Measurement Fixture Cross-Section

ProbeSocket contact

Plastic Housing



F.4 Dielectric Withstand VoltageNo disruptive discharge or leakage greater than 0.5 mA is allowed when subjected to 360 V RMS. The sockets shall be tested according to EIA-364, Test Procedure 20A, Method 1. The sockets shall be tested in fully mated condition. Barometric pressure shall be equivalent to Sea Level. The sample size is 25 contact-to-contact pairs on each of four sockets. The contacts shall be randomly chosen.

F.5 Insulation ResistanceThe Insulation Resistance shall be greater than 800 MΩ when subjected to 500 V DC. The sockets shall be tested according to EIA-364, Test Procedure 21. The sockets shall be tested in fully mated condition. The sample size is 25 contact-to-contact pairs on each of 4 sockets. The contacts shall be randomly chosen.

F.6 Contact Current RatingMeasure and record the temperature rise when the socket is subjected to rate current of 0.8 A. The sockets shall be tested according to EIA-364, Test Procedure 70 A, Test Method 1.

§

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