Integrated Photonics for Fiber Optic Sensing Solutions · 2015. 11. 24. · 2015: First Full Wafer...
Transcript of Integrated Photonics for Fiber Optic Sensing Solutions · 2015. 11. 24. · 2015: First Full Wafer...
Integrated Photonics for
Fiber Optic Sensing Solutions
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Technobis group
Developing and providing state of the
art solutions for instruments
and modules based on
advanced technologies
Offices & Meeting Rooms (800 m2)
Assembly & testing (700 m2, ESD Compliant)
Conditioned labs for prototyping (128 m2)
Vibration isolated labs (64 m2)
Down-flow lab (28 m2)
ENGINEERING ASSEMBLY TESTING R&D VALIDATION PACKAGING INTEGRATION
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Fibre Optic Sensing technology
Integrated Photonics
Demand for high performance
Technology benefits
Technobis Fibre Technologies
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Strain
Temperature
Pressure
Humidity
Chemicals
Shape
Fibre Optic Sensing Technology Why Fibre Optics?• Totally passive
• Small size & weight
• Chemically inert, intrinsically safe
• Non-conductive, immune to EMI
• Low loss allows remote sensing
Fibre Bragg Grating
State of the Art systems:
Deminsys High Speed (20kHz, 1pm)
“ Python Medical, real-time data transfer
“ Ultra Flight Approved TRL6
Ladybug High Resolution (7kHz, 20fm)
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High Performance, High Endurance, High Reliability
High-tech Industry
High resolution strain sensing
Precision stabilization control in vacuum
Medical
Minimal invasive sensing
Steerable needle shape monitoring, vascular
sensing of pressure and temperature
Automotive Testing
High speed strain sensing
Impact deflection analysis on crash dummies
and structures
Aerospace
High reliability strain sensing
Damage detection and shape monitoring
on composite structures
Nuclear
High endurance sensing
Strain sensing in high temperature and
radiated environments
Space
High reliability sensing
Thermal mapping, displacement sensing
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Benefits from Free Space Optics to Integrated Photonics
Solid State, Smaller Sizes
Reduced Weight, Low Power, Low Costs
Hybrid Integration of Materials and Electronics
Improved Thermal and Vibration Stability
Improved Reliability
Conventional Optics Integrated Photonics
Systems Modules
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Small size
Low weight
Solid state
Low power
Thermal stability
Mechanically stable
Gator system, Next Generation FBG interrogation
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World Records
Measurement Resolution of 0.02 fmΔλ (~ 0.02 nano-strain)
Sampling Speeds up to 20MHz
100 unique FBG Sensors per single fiber (20kHz, 10fmΔλ)
ASPIC Achievements World Records & Products
1 kHz 20 kHz 80 kHz 2 MHz 20 Mhz
1 pm Grasshopper Gator
0.1 pm FlyingGator SuperGator
10 fm SpaceGator
1 fm LadyGator MediGator
0.4 fm LadyBug
Speed
R
esolu
tion
high performance
extreme performance
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Packaging in General
Thermal Management (sub-milliKelvin control)
Low-noise front-end electronics
ASPIC Design rules -> repeatability, consistent quality
Generic Packaging
Easy accessible and fast ASPIC assessment
Small pre-series possibility
Few to many electrical and optical I/O (incl. RF)
Custom Packaging
Suitable for volume production
Focus on high performance
Interfacing
Thermal stability
Cost efficient
High sensing speeds (MHz)
Extreme measurement resolutions
ASPIC packaging : a bare die will not work
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Aerospace
Smart (Reliable) Sensing & Datacom
Damage & Impact Detection
Shape Sensing
Helicopter Blade Monitoring
Example Applications
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Long-term and in-service monitoring of the condition and damage state of
vehicle systems in operation using advanced sensors that are permanently
attached to the structure.
Smart Sensing
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Smart Sensing
Light
Source
Divider
1:N
Interrogator
Switch
1:N
Interrogator
Switch
1:N
Interrogator
Interrogator
Single Module
Sensing System
Concept
Damage Detectionhigh speed, high resolution,
time-inteleaved
Shape Sensinglow speed, low resolution, time-
interleaved
Impact detectionhigh speed, high resolution
continuous
Load Monitoringlow speed, high resolution,
continuous
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Redundancy / Time-Interleaved Multiplexing
Datacomm Integration, Sync locking mechanism
One Single Module fits the mentioned features and all relevant performances
Smart (Reliable) Sensing and Datacom
ASPIC based FBG interrogator device design with integrated datacommunication capability
Sensing/datacomm device #1 Sensing/datacomm device #2
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Damage Detection / Impact Detection (TAPAS/SARISTU)
damage
Interrogator & Sensor development
(a.o. stringer debonds, impact damage, delaminations, crack growth)
• Embedding of sensors • Impact monitoring
• Frequency analysis • Load, strain, temperature and humidity
Composite panel
Modal behavior
Damage (delamination, debondig, …) Change in modal behavior Analysis (NLR) detects and identifies damage
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Morphing trailing edge
Shape control
Fibre optic based sensing beams
Morphing Structures - Shape Monitoring (SARISTU)
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Test Results
Highspeed (20kHz)
32 sensors simultaneously
0% dataloss
Graph:
Conventional Strain Gage -> blue
FBG sensor -> yellow & red
Helicopter Blade Monitoring (BOEING)
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Medical Applications
Haptic Feedback Grasper
Minimal Invasive Biopsy Needle
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Reducing applied grasping force
Offering visco-elastic tissue feeling
Ergonomic pistol hand grip
Shorter learning curve
The First Haptic Feedback Grasper
FROIForce-Reflecting Operative Instrument
“An instrument with feeling
allows a surgeon to work with
more accuracy”
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Steerable MRI compatible robotic instruments
with precise force sensing for accurate tissue
characterization and dexterous navigation in
percutaneous interventions
Minimal Invasive Biopsy Needle
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Company Highlights
Technology Roadmap
Achievements
Chip manufacturing
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Market Focus
Aeronautics & Space
High-Tech Industry
Medical System
Application Focus
Damage & Impact Detection
Integration of Sensing & Datacomm
Thermal Mapping of Structures
Shape Sensing
Smart Structure Concepts
Other: Gyroscope, BOTDR, Multi-Cavity
Technology Focus
High Performance (FBG) Sensing
Discrimination Strain /Temperature
Design of minimal SHM sensor networks
Technology Roadmap
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ASPIC Technology Highlights & Factsheet
Patents
1 patent by Technobis
1 patent with Customer (ASML)
2 patents pending by Technobis
3 patents pending with Customers
ASPIC Timeline
2008: ASPIC activities (Jeppix, Paradigm)
2009: ASPIC design support
2012: First ASPIC
2013: ASPIC tft-fos design with Bright Photonics
2015: First Full Wafer Runs (HHI and SmartPhotonics)
Facilities
2013: Down-flow chamber
2014: New Facilities
2014: Two vibration-isolated test labs
Multiple ASPIC platforms
InP, SOI, TriPleXTM
Most foundries
IME, CEA-LETI, SmartPhotonics
HHI, OclaroPackaging & Package Design
Close cooperation with Tyndall Institute
New BU; Technobis ipps
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58 chip designs, multiple test structures and 2500 chips !
Run : Europic, HHI
Description : MZI
# Designs : 2
# Chips : 5
Run : LETI
Descripotion : Tests, MZI
# Designs : 1
# Chips : 42
Run : JePPIX
Description : MZI
# Designs : 1
# Chips : 4
Run : Paradigm, Oclaro
Description : Gator
# Designs : 1
# Chips : 4
Run : Lionix
Description : Interposer
# Designs : 1
# Chips : 5
Run : GPICSFab
Description : Tests, Grasshopper, Ladybug, Dragonfly, Ant
# Designs : 4
# Chips : 17
Run : Paradigm, HHI
Description : Gator
# Designs : 4
# Chips : 8
Run : IME
Description : MZI
# Designs : 2
# Chips : 8
Run : Testrun, HHI
Description : SOA Test
# Designs : 1
# Chips : 1
Run : Smartphotonics SP9
Description : Test structures, SOA
# Designs : 3
# Chips : 17
Run : Lionix
Description : Dividers, Interposers
# Designs : 6
# Chips : 162
Run : Paradigm, HHI
Description : Grasshopper, Ladybug, Casgator, Test Structures
# Designs : 3
# Chips : 12
Run : Paradigm, Oclaro
Description : Ant
# Designs : 1
# Chips : 42
Run : Leti
Description : Ring Resonator
# Designs : 1
# Chips : 2
Run : Smartphotonics SP10
Description : Gator, MWL, Grasshopper
# Designs : 4
# Chips : 58
Run : Smartphotonics SP11
Description : Grasshopper, Ladybug, Ladygator, SOA
# Designs : 6
# Chips : 153
Run : Jeppix, HHI
Description : Chiroptera, Grasshopper, Ladybug
# Designs : 3
# Chips : 36
Run : Paradigm, HHI
Description : BOTDR
# Designs : 4
# Chips : 12
Run : Lionix
Description : AWG
# Designs : 1
# Chips : 4
Run : Spitfire 1
Description : Chip 6, 7
# Designs : 2
# Chips : 300
Run : Smartphotonics SP13
Description : LuckyChip
# Designs : 1
# Chips : 8
Run : Actphast, Full Wafer, HHI
Description : Grasshopper, Ladybug, Ladygator, CasGator, Gator, Ant, SOA, Chiroptera
# Designs : 10
# Chips : 86
2012
2013
2014
2015
InP SOI TriplexTM
Run : Spitfire 2
Description : Chip 19
# Designs : 1
# Chips : 1500
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Thank you for your attention