Integrated Circuit Design and Fabrication Dr. Jason D. Bakos.
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Transcript of Integrated Circuit Design and Fabrication Dr. Jason D. Bakos.
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Integrated Circuit Design and Fabrication
Dr. Jason D. Bakos
![Page 2: Integrated Circuit Design and Fabrication Dr. Jason D. Bakos.](https://reader035.fdocuments.us/reader035/viewer/2022062516/56649d805503460f94a653d0/html5/thumbnails/2.jpg)
Mar 31, 2007 2
Elements
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Mar 31, 2007 3
Semiconductors
forward biasreverse bias
+ + +
+ + +
- - -
- - -P-N junction
+ -- ++ + +
+ + +
- - -
- - -
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Mar 31, 2007 4
MOSFETs
body/bulk
GROUND
NMOS PMOS
channelshorter length, faster transistor
(dist. for electrons)
body/bulk
HIGH
positive voltage (Vdd)
negative voltage (rel.
to body) (GND)
- - - + + +
+ + + - - -
current current
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Mar 31, 2007 5
Logic Gates
AY inv NAND2
NOR2
BAY
BAY A Y
0 1
1 0
A B Y
0 0 1
0 1 1
1 0 1
1 1 0
A B Y
0 0 1
0 1 0
1 0 0
1 1 0
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Mar 31, 2007 6
IC Fabrication
• Inverter cross-section
field oxide
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Mar 31, 2007 7
Layout
3-input NAND
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Mar 31, 2007 8
IC Fabrication
Furnace used to oxidize (900-1200 C)
Mask exposes photoresist to light, allowing removal
HF acid etch
piranha acid etch
diffusion (gas) or ion implantation (electric field)
HF acid etch
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Mar 31, 2007 9
IC Fabrication
Heavy doped poly is grown with gas in furnace (chemical vapor deposition)
Masked used to pattern poly
Poly is not affected by ion implantation
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Mar 31, 2007 10
IC Fabrication
Metal is sputtered (with vapor) and plasma etched from mask
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Mar 31, 2007 11
Cell Library (Snap Together)
Layout
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Mar 31, 2007 12
Synthesized and P&R’ed MIPS Architecture
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Mar 31, 2007 13
Feature Size
• Shrink minimum feature size…– Smaller L decreases carrier time and increases current– Therefore, W may also be reduced for fixed current
– Cg, Cs, and Cd are reduced
– Transistor switches faster (~linear relationship)
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Mar 31, 2007 14
Minimum Feature Size
Year Processor Speed Process
1982 i286 6 - 25 MHz 1.5 m
1986 i386 16 – 40 MHz 1.5 - 1 m
1989 i486 16 - 133 MHz .8 m
1993 Pentium 60 - 300 MHz .6 - .25 m
1995 Pentium Pro 150 - 200 MHz .5 - .35 m
1997 Pentium II 233 - 450 MHz .35 - .25 m
1999 Pentium III 450 – 1400 MHz .25 - .13 m
2000 Pentium 4 1.3 – 3.8 GHz .18 - .065 m
2005 Pentium D 2.66 – 3.6 GHz .09 - .065 m
2006 Core 2 1.06 – 3 GHz .065 m
Upcoming milestones:
45 nm (Xeon 5400 Nov. 2007),
32 nm (2009-2010), 22 nm (2011-2012), 16 nm (2013)
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Mar 31, 2007 15
Integration Density Trends (Moore’s Law)
Pentium Core 2 Duo (2007) has ~300M transistors
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Mar 31, 2007 16
Microarchitectural Parallelism
• Parallelism => perform multiple operations simultaneously
– Instruction-level parallelism• Execute multiple instructions at the same time• Multiple issue• Out-of-order execution• Speculation
– Chip multiprocessing• Execute multiple threads at the same time on one CPU• Execute multiple threads at the same time on multiple processors