Instrumentation January 22-25, 2002 San Diego, California, U.S.A IFPAC SM 2002 Sixteenth...

InstrumentationJanuary 22-25, 2002

San Diego, California, U.S.A

IFPACSM 2002Sixteenth International Forum Process

Analytical ChemistrySM

Surface Mount Technology for Surface Mount Technology for Process Analytic Sampling Systems Process Analytic Sampling Systems

Update 2002Update 2002

Steve Doe, Parker Hannifin CorporationSteve Doe, Parker Hannifin Corporation

Surface Mount Technology for Surface Mount Technology for Sample Systems: Update 2002Sample Systems: Update 2002

““Surface Mount” Definition:Surface Mount” Definition:

Component’s control function Component’s control function is detachable from its flowpath is detachable from its flowpath

functionfunction

Providing increased Providing increased servicability and flexibility servicability and flexibility

while reducing overall space while reducing overall space requirementsrequirements


Surface Mount System OptionsSurface Mount System Options

1) 1) Parker Integrated Conditioning System (PICS) w/ SP76 compliant Parker Integrated Conditioning System (PICS) w/ SP76 compliant 1½” and 2¼” elastomeric seal interfaces & industrial 1½” and 2¼” elastomeric seal interfaces & industrial componentscomponents

2) 1½” compliant interface w/ metallic seals and semiconductor 2) 1½” compliant interface w/ metallic seals and semiconductor grade & industrial components (“old” ultra-high purity grade & industrial components (“old” ultra-high purity “standard”)“standard”)

3) 13) 111//88” interface w/ metallic seals and semiconductor grade & ” interface w/ metallic seals and semiconductor grade & industrial components (emerging ultra-high purity “standard”)industrial components (emerging ultra-high purity “standard”)

4) R-Max™ stream switching interface (proprietary)4) R-Max™ stream switching interface (proprietary)

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PICS SystemPICS System Designed w/ 5 flow channels Designed w/ 5 flow channels

specifically for the majority of specifically for the majority of sample conditioning systemssample conditioning systems

Utilizes 1½” SP76 (o-ring) Utilizes 1½” SP76 (o-ring) compliant elastomeric interface compliant elastomeric interface

Incorporates larger 2¼” footprint Incorporates larger 2¼” footprint to utilize existing industrial to utilize existing industrial devices; SP76 (o-ring) compliantdevices; SP76 (o-ring) compliant

Substrate heating capability Substrate heating capability available w/ minimal developmentavailable w/ minimal development


PICS SystemPICS System Substrate assembled via bolts Substrate assembled via bolts

with tapped holes in headwith tapped holes in head

Bolt interface incorporates dowel Bolt interface incorporates dowel pin feature for alignment and pin feature for alignment and added rigidityadded rigidity

O-ring connections between O-ring connections between substrate blocks substrate blocks


1½” Interface1½” Interface 1½” Interface 1½” Interface 2¼” Interface 2¼” Interface


Std 3 channel access 5 channel accessStd 3 channel access 5 channel access 3 or 5 channel access 3 or 5 channel access


COMMON

NORMALLY CLOSED

NORMALLY OPEN

AIR

3-WAY R-max

FILTER

(1.5 CR)

H2O CELL

(1.5 CR)

FLOW CONTROLLERWITH EXTERNAL NEEDLE VALVE

UPSTREAM REFERENCE

(2.5 CL)

DOME

DOME

BPR-4000

(2.5 CL)

BACK PRESSURE REGULATOR

123

3L45

IR-4000

(2.5 CR)

PRESSURE REGULATOR

3R45

123

4 3R

33R4

a123

ANALYZERCELL

METERING VALVE1.5" SUBSTRATE

123

3R45 FLOW

CONTROLLER

23

3L4

15

1

4

2

3

(2.5 C)

2

1

3

12

(2.5 CR)

4

(1.5 CL)

TEMP. SENSOR1.5" SUBSTRATE

123L

345

TEMP

a

NeSSI SYSTEMNo. 3

H20 ANALYZER

ACTUATING AIR

ASPIRATOR

ACTUATING AIR

VENT RECOVERY

ASPIRATOR

SAMPLE IN

RTN.

RETURN HDR.

IN

9

6

BY-PASS

4

TO R-max

FROM R-max

FROM R-max

3TO R-max

1½” UHP System1½” UHP System Designed for delivery of ultra high Designed for delivery of ultra high

purity gasses used in semiconductor purity gasses used in semiconductor applicationsapplications

Recommended for detection Recommended for detection thresholds in the PPB rangethresholds in the PPB range

Utilizes metallic “C” or “W” seals at Utilizes metallic “C” or “W” seals at interfaces interfaces

Systems normally incorporate welded Systems normally incorporate welded and faceseal type fittings; departure and faceseal type fittings; departure from existing petrochem technologyfrom existing petrochem technology


1111//88” UHP System” UHP System

Same features as 1½” Same features as 1½” system, only smallersystem, only smaller

Emerging as de-facto Emerging as de-facto standard based on desires standard based on desires of leading semiconductor of leading semiconductor equipment OEM equipment OEM

Cartridge heaters availableCartridge heaters available


In full production; handle & gauge face interference’s In full production; handle & gauge face interference’s identified and in process of correctionidentified and in process of correction

Block Assembly & ManifoldingBlock Assembly & Manifolding


System ComparisonsSystem Comparisons

Block Dim’s Block Dim’s Bore DiaBore Dia Manifold CLManifold CL

PICS (S)PICS (S) 2.88x1.50x.72.88x1.50x.7 .125” .125” na na

PICS (L)PICS (L) 2.88x2.5x.752.88x2.5x.75 .125” .125” na na

1111//88”(C)”(C) 1.15x1.12x.7 1.15x1.12x.7 .180” .180” 1.40”1.40”

1½”(C)1½”(C) 1.53x1.50x.7 1.53x1.50x.7 .180” .180” 1.60”1.60”

1½”HF (C) 1.53x1.50x.71½”HF (C) 1.53x1.50x.7 .290” .290” 1.60”1.60”

1111//88”(W)”(W) 1.15x1.12x.7 1.15x1.12x.7 .157” .157” 1.40”1.40”

1½” (W) 1.53x1.50x.71½” (W) 1.53x1.50x.7 .157” .157” 1.60”1.60”


Surface Mount Technology for Sample Surface Mount Technology for Sample Systems: Update 2002Systems: Update 2002

Steve DoeSteve Doe Analytical Market Manager, Parker Hannifin CorporationAnalytical Market Manager, Parker Hannifin Corporation

- work with OEM’s, system integrators & end userswork with OEM’s, system integrators & end users

18 years experience 18 years experience

- engineering, manufacturing, operations and salesengineering, manufacturing, operations and sales

- primarily in semiconductor business segmentprimarily in semiconductor business segment

- last 2 years in process analytic segmentlast 2 years in process analytic segment

Goals over next 2 years:Goals over next 2 years:

- increase presence of Parker products in process analytic industryincrease presence of Parker products in process analytic industry

- and….and….



Enjoy family, passions, and….Enjoy family, passions, and….


……the rewards of the rewards of work and play!work and play!

Instrumentation January 22-25, 2002 San Diego, California, U.S.A IFPAC SM 2002 Sixteenth...

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Transcript of Instrumentation January 22-25, 2002 San Diego, California, U.S.A IFPAC SM 2002 Sixteenth...