Innovation...Discovery...Education…Achievement…Networking Second BoG Meeting of IEEE CPMT in...

Innovation...Discovery...Education…Achievement…Networking

Second BoG Meeting of IEEE CPMT in 2004

Report on Global Conferences

Ricky Lee

VP-Conferences

Dallas, Texas, USA

November 6, 2004


Outline of Presentation

• Summary of 2004 Conferences

• 2004 Winter Highlights

• Conferences in Japan

• Asian ECTC

• European ECTC


Summary of 2004 Conferences

Conference Title Time Location Sponsorship

International IEEE Confer on Asian Green Electronics (AGEC)

January 5-9 Shenzhen, China 20% over 100

2004 IEEE/CPMT 20th Semiconductor Thermal Measurement & Management Symposium (SEMI-THERM)

March 9-11 San Jose, CA, USA 100%

1st International Workshop in Nano Bio-Packaging (NanoBioPack)

March 22-23 Atlanta, GA, USA 50%/50%

5th International Symposium on Quality Electronic Design (ISQED)

March 22-24 San Jose, CA, USA 50%/50%

9th International Symposium & Exhibition on Advanced Packaging Materials

March 24-26 Atlanta, GA, USA 50%/50%

2004 IEEE/SEMI Advanced Semiconductor Manufacturing Conference & Workshop (ASMC)

May 4-6 Boston, MA, USA25%(CPMT)/25%/50%

8th IEEE Workshop on Signal Propagation on Interconnects (SPI)

May 9-12Heidelberg, Germany 50%/50%



Conference Title Time Location Sponsorship 5th International Conference on Thermal, Mechanical and Thermo-mechanical Simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

May 9-12 Brussels, Belgium (semi-Tech)

27th International Spring Seminar on Electronics Technology (ISSE)

May 13-16 Sofia, Bulgaria 50%/50%

54th Electronic Components & Technology Conference (ECTC)

June 1-4 Las Vegas, ND, USA 50%/50%

9th Intersociety Conference on Thermal and Thermomechanical Phenomenoa in Electronic Systems (ITHERM)

June 1-4 Las Vegas, ND, USA 100%

7th IEEE International Academic Conference on Next Generation Microsystem Packaging Research and Education

June 28-30 Shanghai, China 20% over 100

6th IEEE Conference on High Density Microsystem Design and Packaging and Failure Analysis (HDP)

June 30-July 3 Shanghai, China 20% over 100

29th International Electronics Manufacturing Technology Symposium (IEMT, collocated with SEMICON West)

July 14-16 San Jose, CA, USA 50%/50%

http://cpmt.org/iemt/



Conference Title Time Location Sponsorship

2004 Electronics Goes Green (EGG) September 6-8 Berlin, Germany (pay service charge)

4th International IEEE Conference on Polymers andAdhesives in Microelectronics and Photonics (Polytronic)

September 12-15 Portland, OR, USA 50%/50%

2004 IEEE Holm Conference on Electrical Contacts (HOLM)

September 20-23 Seattle, WA, USA 100%

7th VLSI Packaging Workshop of Japan (VLSI) and 2004 Electrical Design of Advanced Packaging andSystems (EDAPS)

November 30 - December 2

Kyoto, Japan 20% over 100/50

6th International Conference on Electronic Materials & Packaging (EMAP)

December 5-7 Penang, Malaysia 20% over 100

6th Electronics Packaging Technology Conference (EPTC)

December 8-10 Singapore (pay 20% of surplus)

USA: 10, Asia: 6, EU: 4, Total: 20


2004 Winter Highlights

• 7th VLSI Workshop/EDAPS2004, Nov. 30-Dec. 2, Kyoto, Japan

• 6th EPTC, Dec. 8-10, Singapore

• 6th EMAP, Dec. 5-7, Penang, Malaysia


Conferences in Japan

ICEP will pay an administration fee of USD3,000/JPY300,000 to CPMT.

SPJWS will pay an administration fee of USD1,000/JPY100,000 to CPMT.

VLSI is not settled yet.

Polytronics 2006 may be held in Japan.


Asian ECTC

1. The Singapore Rel/CPMT/ED Chapter (the Chapter) welcomes the co-sponsorship of CPMT Society in order to grow the EPTC conference. 2. CPMT Society agrees to make EPTC the most prominent conference in Region 10. CPMT Society will do its best to coordinate other CPMT sponsored conferences in the same Region so that the time conflict

with EPTC can be avoided. 3. CPMT Society will publicize and promote EPTC in its websites, newsletters, transactions and brochures without charge. CPMT Society will also assist EPTC in matters such as the Book Broker program, soliciting exhibitors, short course lecturers, keynote speakers, sponsors, participants, papers, etc.4. The EPTC Organising Committee will have full control in the running of the conference. All final decisions relating to the organisation, budget and expenditure will lie solely with the EPTC Organising Committee. CPMT Society reserves the right to review the budget and to make suggestions.5. For EPTC2004, the surplus share of CPMT Society shall be 20% of the net surplus of the conference before tax. The publication under the Book Broker program shall be co-sponsored 50%/50% by the CPMT Society and the Chapter.6. All current and future assets derived from the surplus of EPTC are the property of Singapore Rel/CPMT/ED Chapter. While the CPMT Society may participate in the surplus in the percentage agreed, the ownership of EPTC always rests entirely with the Singapore Rel/CPMT/ED Chapter. 7. No conference seed money will be required of CPMT Society.8. EPTC will help promote the CPMT Society and its objectives and encourage membership.9. To avoid a gap, a joint-review should be carried out soon after EPTC2004, to explore a longer term agreement.


European ECTC

BackgroundMany small niche microsystems and microelectronics packaging related, financially or technically

co-sponsored conferences in Europe:

• VLSI Workshop, Ireland, Malta, focused on system level packaging

• Polytronik, Germany, Hungary, France/Schwitzerland focused on materials

• Micromat, Germany focused on micromaterials

• Eurosim, France, focused on simulation and modelling

• SPI, focused on signal propagation on interconnects, IEEE

• ISSE, focused on microelectronics packaging and education

• Smart Card Workshop, Berlin Germany

• Flip-Chip, CSP and Wafer Level Packaging Workshop, Berlin, Germany, on advanced packaging

• Green Electronics Packaging, Norway focused on Green Electronics

• Electronics goes green, Germany

• EMPC (IMAPS, moving location, every 2 years, same topics as ECTC)


Proposal

• Organization of the conference using the US ECTC conference model

• Get help on management and administrative infrastructure support from CPMT such as web-based abstract submission system, paper selection system etc.

• Every other year in September starting from 2006• The conference title is “European ECTC”• Financial sponsorship 50%/50% sharing between IEEE CPMT

Society and the local organization

European ECTC

In order to create a cohesive merging place for conference program, exhibition, short courses and workshops and networking in Europe, the following is proposed ---------

European ECTC Organization

Steering CommitteeSteering Committee

Executive CommitteeExecutive Committee

Advanced Packaging committee

Materials and Processing committee

Optoelectronics committee

Manufacturing Technology committee

Microsystems Technology committee

Electrical Modelling committee

Thermal-Mechanical Modelling comm.

Emerging Technologies committee

Quality and Reliability comm.

Passive Components committee

Poster committee

Short courses committee

Steering Committee

• Chair: CPMT President• Member: CPMT VP-Conferences• Member: Representative of CPMT BOG from Europe No 1• Member: Representative of CPMT BOG from Europe, No 2• Member: Representative of CPMT BOG from Europe, No 3• Member: Last conference chair

Functions:• Decision about the locations for the next two coming conferences• Appointing the next coming assistant program chair• Definition of the rules of conference

European ECTC


European ECTC 2006

Motion #1: To approve 50% sponsorship of the 1st European ECTC, tentatively scheduled for 5-7 September 2006 at Dresden, Germany

• General Chair: Klaus-Jürgen Wolter• Treasurer: Thomas Zerna• Program Chair: Chris Bailey (European-ECTC 2008, London)• Assistant Program Chair: Li-Rong Zheng (European-ECTC 2010, Stockholm)• Arrangement Chair: Martin Oppermann• Short Course Chair: Johann Nicolics• Publications Chair: Markus Detert

2006 Executive Committee

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