Industry Electronics Assembly

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Industrial applications require materials

solutions that can meet the everchanging

demands for high reliability and improved

performance. With decades of materials

development expertise, Henkel offers a wide

range of assembly and protection materials

for challenging industrial and consumer

electronics environments. We also offer

advanced conformal coatings to be used in

protecting electronics circuits from moisture,

chemicals and other contaminants. But, we

haven’t stopped there, with an unyielding

commitment to sustainability, Henkel has

developed materials that not only deliver

the high reliability required, but also address

the needs of our environment. Halogen-

free, lead-free, solvent-free and low-VOC

materials are all part of our portfolio and

our ongoing promise to be environmentally

responsible. All these innovative solutions

will enable manufacturers to introduce

products faster to market and improve

production effi ciency.

Industry Electronics Assembly

Overview

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Encapsulant

High Temperature

Resistant

ECCOBOND 104A/B

ECCOBONDA316-48

Thermal Conductivity

ECCOBOND282

LOCTITE384

ECCOBONDTE3530

LOCTITE 3873

LOCTITE 315

LOCTITE 3874

LOCTITE 5404

ECCOBONDA312-20

LOCTITE3129

ECCOBOND E3200

LOCTITE3128

LOCTITE3220

LOCTITE3905

Low Temperature

Curing

ECCOBOND2332

ECCOBONDG757

ECCOBONDG500

ECCOBONDG757HF

ECCOBONDG500HF

ECCOBONDG909

Ferrite Bonding

ECCOBOND UV300

LOCTITE3108

LOCTITE352

LOCTITE3523

LOCTITE3106

LOCTITE3552

LOCTITE3703

UV Curing

ABLEBOND 969-1

HYSOL QMI 529HT

ECCOBOND CT-4042-1 A/B

Crystal Oscillator

ThermalConductive

STYCAST 2851FT

Loctite 5406

General Purpose

HysolEO1016

STYCAST A312-20

STYCASTE1070

High Temperature

Resistant

STYCASTW66/CAT17M-1

ECCOBOND 104A/B

HYSOL EE1087/HD0243

Low Viscosity

HYSOL ES1901

HYSOL ES1902

HYSOL ES2500

HYSOL US2350

Low Dielectric Strength

STYCAST1090/CAT9

HYSOL ES1300

HYSOL ES1301

HYSOL ES2205

General Purpose

HYSOL EO1000

HYSOL EO1002

STYCAST2057/CAT9

STYCAST2651MM/CAT9

STYCAST2651-40/CAT9

ThermalConductive

HYSOL EE1087/HD3404

STYCAST1495K

STYCAST2850FT/CAT9

STYCAST5954

STYCASTE2534FR/

CAT11

Flame Retardancy

HYSOL EE1068/HD3404

HYSOL ES1004

STYCAST2651-40FR/

CAT9

STYCAST2850FT-FR/

CAT9

STYCASTXT5038-6A/

B100

HighTemperature

HYSOL EO1058

HYSOL EO1088

STYCAST906-1

STYCAST933-48

STYCASTA316-48

STYCASTG508-1

Catalyst

CATALYST 9

CATALYST 11

CATALYST 14

CATALYST 15

CATALYST 15LV

CATALYST 17

CATALYST 23LV

CATALYST 24LV

CATALYST 27-1

CATALYST 28

CATALYST 30

CATALYST 43

Adhesive

Conformal Coating

ECCOCOATPC355-1

ECCOCOATU7510-1

ECCOCOATUV7993

HYSOLPC18M

HYSOLPC28STD

HYSOLPC40-UM

HYSOLPC62

HYSOL3900

LOCTITE 5293

LOCTITE 5296

Industry Electronic Assembly

COB

HysolEO1086

HysolEO1016

HysolEO1061

ECCOBOND UV300

HysolE-214HP

Flexibility

HYSOL ES2207

HYSOL US1152

STYCAST5954

STYCASTU2500

Adhesives

Industry Electronics Assembly

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PRODUCTCURE

SCHEDULESVISCOSITY

(Cps)

THERMAL CONDUCTIVITY

(W/mK)

VOLUME RESISTIVITY

(OHM.CM)ONE-COMPONENT TWO-COMPONENT

CHEMISTRY CURING CONDITION

SELF-SHIMMINGEPOXY ACRYLIC SILICONE HEAT CURE

ROOM TEMP. CURE WITH ACTIVATOR

ECCOBOND282

30 min.@ 150oC 625,000 1.30 1.0x1015 • • •ECCOBOND

TE353030 min. @ 100oC 60,000 2.30 1.0x1015 • • •

LOCTITE 315

24-72 hrs. @ 20oC 605,000 0.81 1.3x1012 • • • •LOCTITE

38424-72 hrs. @ 20oC 550,000 0.76 1.3x1012 • • •

LOCTITE 3873

24-72 hrs. @ 20oC 400,000 1.25 4.3x1014 • • • •LOCTITE

387424-72 hrs. @ 20oC 325,000 1.25 4.3x1014 • • •

LOCTITE 5404

10 min. @ 150oC Paste 0.95 2.9x1014 • • • •

Adhesives for Thermal Conductivity Application Chart

PRODUCTCURE

SCHEDULESVISCOSITY

(Cps)OPERATING

TEMPERATURE

VOLUME RESISTIVITY

(OHM.CM)ONE-COMPONENT TWO-COMPONENT

CHEMISTRY CURING CONDITIONFOR Pb-FREE

REFLOW APPLICATIONEPOXY SILICONE HEAT CURE

ROOM TEMP. CURE WITH ACTIVATOR

ECCOBOND 104A/B

3 hrs. @ 150oC N/A -25 to 230oC 1x1015 • • • •ECCOBOND

A316-4830 min. @ 100oC 50,000 -40 to 180oC 1x1015 • • •

Adhesives for High Temperature Resistant Application Chart

Adhesives

Industry Electronics Assembly

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PRODUCTCURE

SCHEDULESVISCOSITY

(Cps)

TENSILE LAP SHEAR

( N.mm-2 )APPEARANCE Tg(°C) CTE α 1 (ppm/°C) ONE-COMPONENT TWO-COMPONENT EPOXY LOW OUTGASSING HIGH RELIABILITY

ECCOBONDA312-20

30 min.@ 100°C 20,000 12 Al BLACK N/A N/A • •ECCOBOND

E320020 min.@ 100°C 150,000 N/A LIGHT TAN N/A N/A • •

LOCTITE3128

20 min.@ 80°C 17,0007

EpoxyglassBLACK 45 40 • • •

LOCTITE3129

5-10 min.@ 80°C 4,20015.4

EpoxyglassBLACK 35 47 • • •

LOCTITE3220

5-10 min.@ 80°C 2,50020.4

EpoxyglassBLACK 26 61 • • • •

LOCTITE3905

15 min. @ 100°C 18,50014.2

Epoxyglass BLACK 134 58 • • • •

Adhesives for Low Temperature Curing Application Chart

Adhesives for Crystal Oscillator Application Chart

PRODUCTCURE

SCHEDULESVISCOSITY

(mPa.s)DIE SHEAR STRENGTH

(Kg.f)Tg(°C) ONE-COMPONENT TWO-COMPONENT

FOR VERTICAL

TYPE

FOR HORIZONTAL

TYPE

LOW OUTGASSING

ABLEBOND 969-1

60 min. @ 200°C (oven) 15,000 1,700 psi Au/Au 236 • • •ECCOBOND

CT-4042-1 A/B5 min. @ 150°C 68,000 71 95 • •

HYSOL QMI 529HT

30 min. @ 200oC (oven) 18,500 57 Ag/Cu N/A • • •

Adhesives

Industry Electronics Assembly AD

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PRODUCTCURE

SCHEDULESVISCOSITY

(Cps)

TENSILE STRENGTH LAP SHEAR AL-AL

(PSI)

SHORE HARDNESS

ONE-COMPONENT

TWO-COMPONENT

CURING CONDITIONHALOGEN FREE FLEXIBILITY

HIGH ADHESION STRENGTH

THIN BOND LINE THICKNESS

UV FOR SMD TYPE

HEAT CUREUV PLUS HEAT

CURE

ECCOBOND2332

20 min. @ 150°C 75,000 2,960 75D • • •ECCOBOND

G50020 min. @ 150°C Paste 2,500 86D • •

ECCOBONDG500HF

5 min. @ 175°C Paste 2,558 85D • • •ECCOBOND

G75745 min. @ 140°C Paste 1,500 35D • • •

ECCOBONDG757HF

20 min. @ 160°C Paste 1,740 44D • • • •ECCOBOND

G90920 min. @ 150°C Paste 5,800 78D • • •

ECCOBOND UV300

20 min. @ 110°C + 5sec @

80W/cm² @ 365 nm5,000 2,755 80D • • •

HysolE-214HP

40 min. @ 120°C 1,150,000 4,880 85D • • •

Adhesives for Ferrite Bonding Application Chart

Adhesives

Industry Electronics Assembly AD

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PRODUCTVISCOSITY

(Cps)SHORE

HARDNESS

TENSILE LAP SHEAR

(PSI)

TACK FREE DEPTH OF CURE CHEMISTRY KEY SUBSTRATE CURE

FLEXIBILITY INLINE PROCESSINGTIME

(sec)CURING

CONDITION DEPTH(MM)

TIME AT CURING

CONDITION

ACRYLATED URETHANE

MODIFIED ACRYLATE

• EXCELLENT FOR SUBSTRATE MARKED○APPLICABLE FOR SUBSTRATE MARKED

UV VISIBLE LIGHT HEAT ACTIVATOR

POLYCARBONATE

THERMO PLASTIC

THERMOSET PLASTIC METAL GLASS

ECCOBOND UV300

6,000 80D19MPaAl-Al

580W/cm² @ 365 nm

2.55sec @

80W/cm² @ 365 nm

• • • ○ • ○ • •LOCTITE

35219,500 60D

2,400STEEL - GLASS

2050mW/cm² @ 365 nm

530sec @

50mW/cm² @ 365 nm

• ○ ○ ○ • • • • • •LOCTITE

31065,000 53D

3,392PC-PC

N/A N/A 220sec @

30mW/cm² @ 220 nm

• • • ○ ○ ○ • • •LOCTITE

31085,100 72A

2,090PC-PC

N/A N/A 420sec @

100mW/cm²@ 365 nm

• ○ • • ○ ○ • •LOCTITE

352320,000 70D

2,755STEEL - GLASS

20100mW/cm² @ 365 nm

215sec @

100mW/cm² • ○ ○ ○ • • • •LOCTITE

3552200 83D

4,800PC-PC

1085mW/cm² @ 400 nm

610sec @

200mW/cm² • • ○ ○ ○ ○ •LOCTITE

370325,000

2,600PC-PC

N/A N/A 425 sec @

30mW/cm² @ 365 nm

• • ○ ○ ○ ○ • • •

Adhesives for UV Curing Application Chart

Conformal Coatings

Industry Electronics Assembly

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PRODUCTCURE

SCHEDULESVISCOSITY

(Cps)

DIELECTRIC STRENGTH

(V/mil)

TEMPERATURE RANGE

ONE-COMPONENT

TWO-COMPONENT

CHEMISTRY CUREVOC FREE

FLUORESCENCE

MIL STANDARD

UL CERTIFICATION

ACRYLICS POLYURETHANES SILICONESURETHANE ACRYLATES

HEAT UV RT

ECCOCOAT PC355-1

60 mins. @ 80°C 300 N/A @-40°C-130°C • • •ECCOCOAT

U7510-12.5 hrs. @ 25°C 2,750 N/A @-30°C-130°C • • •

ECCOCOAT UV7993

5 secs.UV + 4 days @ RT

120 1,200 @-40°C-105°C • • • • • 94 V-1

HYSOL PC18M

2 hrs @ 60°C 350 1,200Continuous up to

110°C • • • • •HYSOL

PC28STD2 hrs @ 60°C 35 1,500

Continuous up to 110°C • • •

HYSOL PC40-UM

30 secs.UV + 3 days @ RT

500 N/A @-40°C-135°C • • • • • 94 V-0

HYSOL PC62 45 mins. @ 75°C 50 2,000 @-40°C-125°C • • • • 94 V-0

HYSOL 3900

24 hrs. @ 22°C Aerosol 1,652 @-40°C-125°C • • • • 94 V-1

LOCTITE 529360 secs.UV +

7 days @ 22°C600 406 N/A • • • • 94 V-0

LOCTITE 5296 7 mins.@ 125°C 200 524 @-40°C-200°C • • • •

Conformal Coatings Application Chart

Encapsulants - One-Component

Industry Electronics Assembly

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PRODUCT CURE SCHEDULES VISCOSITY(Cps) APPEARANCE SHORE HARDNESS ONE-COMPONENT TWO-COMPONENTCHEMISTRY

SMALL MASS POTTING UL CERTIFICATION EPOXY SILICONE

HYSOL EO1016 20 min.@ 150°C 58,000 BLACK 86D • • 94 V-0

STYCAST A312-20 30 min.@ 100°C 20,000 BLACK 80D • •STYCAST E1070 20 min.@ 150°C 3,000 BLACK 86D • • •

PRODUCT CURE SCHEDULE VISCOSITY(Cps) APPEARANCE SHORE HARDNESS THERMAL CONDUCTIVITY (W/m·K) ONE-COMPONENT TWO-COMPONENTCHEMISTRY

EPOXY SILICONE

STYCAST 2851FT 2 hrs. @ 100°C 85,000 BLACK 94D 1.44 • •LOCTITE 5406 1 week @ 22°C/40%RH PASTE OPAQUE WHITE 40A 0.70 • •

Encapsulants for General Purpose Application Chart

Encapsulants for Thermal Conductive Application Chart

Encapsulants for COB Application Chart

PRODUCT CURE SCHEDULES VISCOSITY(Cps)TENSILE LAP SHEAR(psi)

APPEARANCE SHORE HARDNESS Tg(°C) CTE α1(ppm/°C) ONE-COMPONENT TWO-COMPONENT EPOXY UL CERTIFICATION

HYSOL EO1016 30 mins. @ 100°C 58,000 3,660 BLACK 86D 126 46 • • 94 V-0

HYSOL EO1061 13 mins. @ 121°C (gel time) 32,500 N/A BLACK N/A 125 40 • •HYSOL EO1086 30 min.@ 150°C 45,000 N/A BLACK 90D 127 33 • •

PRODUCT CURE SCHEDULES VISCOSITY(Cps) COLORORERATING

TEMPERATURESHORE HARDNESS

THERMAL CONDUCTIVITY (W/m·K)

CTE α 1(ppm/°C) ONE-COMPONENT TWO-COMPONENT EPOXY PB-FREE UL CERTIFICATION

HYSOL EO1058 2 hrs. @ 140°C 50,000 BLACK -40 to 180°C 90D 0.42 24 • •HYSOL EO1088 30 mins. @ 150°C 62,000 BLACK -40 to 180°C 88D 0.60 35 • • •STYCAST 906-1 2 hrs. @ 125°C 190,000 BLACK -40 to 180°C 90D 0.86 N/A • •STYCAST 933-48 150 mins. @ 120°C 150,000 BLACK -40 to 180°C 85D N/A 38 • •

STYCAST A316-48 30 mins. @ 100°C 50,000 BLACK -40 to 180°C 86D 0.40 55 • •STYCAST G508-1 30 mins. @ 160°C 27,000 BLACK -40 to 180°C 85D 0.60 N/A • • 94 V-0

Encapsulants for High Temperature Resistant Application Chart

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Encapsulants - Two-Component

Industry Electronics Assembly

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PRODUCT

VISCOSITY(Cps)CURE

SCHEDULE

THERMAL CONDUCTIVITY

(W/m·K)

SHOREHARDNESS

ONE-COMPONENT

TWO-COMPONENT

CHEMISTRYHALOGEN

FREEUL

CERTIFICATION RESIN HARDER MIXED EPOXY SILICONE

HYSOL EE1087/HD3404

50,000 25 29,000 24 hrs. @ 25°C 1.00 87D • •STYCAST

1495K/CAT23LV45,000 25 10,000 24 hrs. @ 25°C 1.00 90D • •

STYCAST 2850FT/CAT9

225,000 93 58,000 16-24 hrs. @ 25°C 1.25 96D • •STYCAST

595455,000 15,000 35,000 4 hrs. @ 65°C 1.15 85A • •

STYCAST E2534FR/CAT11

350,000 N/A N/A 16 hrs. @ 75°C 1.20 90D • • • 94 V-0

Encapsulants for Thermal Conductive Application Chart

Encapsulants for Flame Retardancy Application Chart

PRODUCT

VISCOSITY(Cps)CURE

SCHEDULES

THERMAL CONDUCTIVITY

(W/m·K)

SHORE HARDNESS

ONE-COMPONENT

TWO-COMPONENT

CHEMISTRYHigh Tg

UL CERTIFICATIONRESIN HARDER MIXED EPOXY URETHANES

HYSOL EE1068/HD3404

30,000 25 14,000 24 hrs. @ 25°C 0.40 90D • • 94 V-0

HYSOL ES1004

30,000 550 26,0002 hrs. @ 80°C + 2 hrs. @ 150°C

N/A 88D • • • 94 V-0

STYCAST 2651-40FR/CAT9

30,000 90 8,000 16-24 hrs. @ 25°C 0.55 87D • • 94 V-0

STYCAST 2850FT-FR/CAT11

200,000 35-60 @ 65°C 65,000 16 hrs. @ 80°C 1.23 94D • • 94 V-0

STYCAST XT5038-6A/B100

8,000 400 3,400 24 hrs. @ 25°C 0.43 85D • • 94 V-0

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Encapsulants - Two-Component

Industry Electronics Assembly

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Encapsulants for High Temperature Resistant Application Chart

Encapsulants for Flexibility Application Chart

PRODUCTCURE

SCHEDULESVISCOSITY

(Cps)ORERATING TEMPERATURE

SHORE HARDNESS

ONE-COMPONENT TWO-COMPONENT EPOXY PB-FREE

STYCAST W66/CAT17M-1

3 hrs. @ 100°C 15,000 -40 to 230°C 85D • •ECCOBOND

104A/B1 hrs. @ 200°C N/A -25 to 230°C 90D • • •

HYSOL EE1087/HD0243

2 hrs. @ 80°C+ 2 hrs. @ 150°C

25,000 UP TO 180°C 90D • •

PRODUCTVISCOSITY(Cps)

CURE SCHEDULES

DIELECTRIC STRENGTH

(V/mil)

THERMAL CONDUCTIVITY

(W/m·K)

SHORE HARDNESS

Tg(°C) CTE α 1 (ppm/°C)ONE-

COMPONENTTWO-

COMPONENTCHEMISTRY UL

CERTIFICATION RESIN HARDER MIXED EPOXY SILICONE URETHANESHYSOL ES2207

14,000 180 8,800 24 hrs. @ 25°C 1,000 N/A N/A N/A 66.3 • • 94 V-0

HYSOL US1152

60 650 45024 hrs. @ 22 to

30°C1,001(20mils) 0.18 30A -52 79 •

STYCAST 5954

55,000 15,000 35,000 4 hrs. @ 65°C 450 1.15 85A -120 150 • •STYCAST

U250012,500 50 6,000 24 hrs. @ 25°C N/A 0.50 70-75A -53 130-180 • •

PRODUCTVISCOSITY(Cps) CURE

SCHEDULE

DIELECTRIC STRENGTH

(V/mil)

THERMAL CONDUCTIVITY

(W/m·K)

SHORE HARDNESS

CTE α 1(ppm/°C)ONE-

COMPONENTTWO-

COMPONENTCHEMISTRY UL

CERTIFICATION RESIN HARDER MIXED EPOXY SILICONE URETHANES

HYSOL ES1000 45,000 9,000 25,000 36-48 hrs. @ 25°C 1,100 0.42 75D 95 • • 94 HB

HYSOL ES1002 28,000 6,300 19,500 36-48 hrs. @ 25°C 1,135 0.64 88D 66 • • 94 V-0

STYCAST 2057/CAT9 5,500 90 4,000 16-24 hrs. @ 25°C 400 0.64 85D 50 • •STYCAST 2651MM/CAT9 35,000 90 14,000 16-24 hrs. @ 25°C 450 0.60 88D 53 • •STYCAST 2651-40/CAT9 32,500 90 10,000 16-24 hrs. @ 25°C 450 N/A 80D 48.3 • •

Encapsulants for General Purpose Application Chart

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Encapsulants - Two-Component

Industry Electronics Assembly

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Encapsulants for Low Viscosity Application Chart

Encapsulants for Low Dielectric Stength Application Chart

PRODUCT

VISCOSITY(Cps)CURE

SCHEDULES

DIELECTRIC STRENGTH

(10 mils, V/mil)

SHORE HARDNESS

ONE-COMPONENT TWO-COMPONENTCHEMISTRY

UL CERTIFICATIONRESIN HARDER MIXED EPOXY URETHANES

HYSOL ES1901

1,900 2,800 2,400 24 hrs. @ 25°C N/A 55D • •HYSOL ES1902

4,700 50 290 24 hrs. @ 25°C 1,390 80D • •HYSOL ES2500

11,000 170 1,500 16 hrs. @ 25°C 410 70D • • 94 HB

HYSOL US2350

13,000 55 2,400 12-24 hrs. @ 23°C 954(20mils) 85A • •

PRODUCT

VISCOSITY(Cps)CURE

SCHEDULES

DIELECTRIC STRENGTH

(10 mils, V/mil)

DIELECTRIC CONSTANT (1kHz, 23°C)

SHORE HARDNESS

Tg(°C) CTE α 1(ppm/°C)ONE-

COMPONENTTWO-

COMPONENTEPOXY

CRACK RESISTANTRESIN HARDER MIXED

STYCAST 1090/CAT9

135,000 93 30,000 16-24 hrs. @ 25°C N/A 2.70 (1mHz) 80D N/A N/A • •HYSOL ES1300

220,000 36,000 85,000 3 hrs. @ 120°C 1,340 (20 mils) 3.81 94D 81 50 • • •HYSOL ES1301

10,500 750 1,6004 hrs. @ 110°C or

2 hrs. @ 125°C1,096 3.62 90-95D 112 67 • •

HYSOL ES2205

80,000 550 25,0002 hrs. @ 80°C + 2 hrs. @ 150°C

1,400 4.40 80-85D 132 54 • •

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Industry Electronics Assembly

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Catalysts for Two - Component Encapsulants

CATALYST CURE SCHEDULESVISCOSITY

(mPa.s)

AMOUNT OF CATALYST USED IN RELATION TO

CATALYST 9

APPEARANCE POT LIFESERVICE TEMPERATURE (°C)

CHEMICAL RESISTANT

PHYSICAL STRENGTH

HIGH TEMPERATURE PERFORMANCE

THERMAL SHOCK

CONTINUOUS INTERMITTENT

CATALYST 9 16-24 hrs. @ RT 90 1.00 Amber 45 mins 130 150 • •

CATALYST 112 hrs. @ 100°C+ 4 hrs. @ 150°C

47 1.20 Tan to dark brown 4 hrs 180 200 • • • •

CATALYST 143 hrs. @ 150°C

+3-16 hrs @ 180°C

Powder 2.50 White 24 hrs 180 200 • •

CATALYST 15 16-24 hrs. @ RT 30 Pa.s 7.0-21.1 Black 2 hrs 90 120

CATALYST 15LV 16-24 hrs. @ RT 10 Pa.s 3.50-14.00 Black 2 hrs 65 90

CATALYST 173 hrs. @ 120°C+2 hrs @ 150°C+16 hrs @ 175°C

Slurry 2.80 Blue-grey 24 hrs 230 260 •

CATALYST 23LV 16-24 hrs. @ RT 25 2.00 Water-white to slight amber

1 hrs 105 120 •

CATALYST 24LV 8-16 hrs. @ RT 35 2.00 Water-white to slight amber

30 mins 105 120 •

CATALYST 27-1 4 hrs. @ 120°C 275 1.75 Brown 2 hrs 175 200 • • •

CATALYST 28 4 hrs. @ 120°C 275 1.75 Brown 2.5-3 hrs 175 200 • • •

CATALYST 30 24 hrs. @ RT 80 2.70 Slight amber 1 hrs 90 120

CATALYST 43 16-24 hrs. @ 65°C 50 0.75 Amber 40 mins 205 •

Catalysts

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