Impact of Technology Scaling on Low Noise Front End Circuits
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Transcript of Impact of Technology Scaling on Low Noise Front End Circuits
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Impact of Technology Impact of Technology Scaling on Low Noise Scaling on Low Noise
Front End CircuitsFront End CircuitsPaul O’Connor, Brookhaven National Laboratory
Snowmass 2001
July 9 2001
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Charge Charge preamplifier/shaper as preamplifier/shaper as
detector front enddetector front end• Low noise is critical for many experiments
– Ageing of gas detectors– Fast, inefficient scintillators– Thin semiconductors for tracking– Position determination by interpolation– Particle ID by dE/dx
•Input: charge pulse from capacitive source•Output: filtered voltage pulse•System noise is dominated by the input transistor
•Input: charge pulse from capacitive source•Output: filtered voltage pulse•System noise is dominated by the input transistor
Q( t)Cdet
filte rID,
gmen
Cgs
CdetM 1 (W ,L) Filter
tm
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OutlineOutline• Low noise analog design in monolithic CMOS
– Preamplifier design– Shaping amplifier
• Circuit examples• MOS Scaling and CSA design
– Noise mechanisms in scaled devices– Optimum capacitive match to detector– Noise, dynamic range, and power vs. scaling length
• Interconnect issues– Detector-to-preamplifier– Front end-to-ADC
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Low Noise Analog Low Noise Analog DesignDesign
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MOS Charge Amplifier MOS Charge Amplifier DesignDesign
• Key parameters:– Cdet , Idet , Qmax (detector)
– Rate, Pdiss (system)
– fT , KF , Iin (technology)
• Key design decisions
– Cgs/Cdet
– Reset system
– Weighting function
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MOSFET Channel MOSFET Channel Thermal NoiseThermal Noise
• Drain current and its fluctuation:
in2
D
S
G
I d
White (thermal) + 1/f (interface)
White (thermal) + 1/f (interface)
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MOSFET connected to MOSFET connected to detectordetector
Cdet
in2
Q( t)
Detector
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Transform noise to inputTransform noise to input
Cdet
en2
Q( t) fC
K
g
kTe
gs
F
mn
42
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Equivalent input noise Equivalent input noise chargecharge
Cdetqn
2Q( t)
amplifier with limitedbandwidth h = tm
-
1
amplifier with limitedbandwidth h = tm
-
1
22 4in
gs
F
mm
CC
K
tg
kTENC
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• Increasing MOS size decreases noise sources while increasing transistor contribution to Cin
Device sizing for Device sizing for minimum ENCminimum ENC
detgsin CCC
22 4in
gs
F
mm
CC
K
tg
kTENC
detf/opt,f/,gs
detswopt,sw,gs
CC
CC
11
=> optimum transistor size for series white and 1/f noise:
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Optimized ENCOptimized ENC• Transistor cutoff frequency
• Key ingredients for low ENC:– low Cdet
– long tm
– short el
– Low KF
elgsTgsm /CCg
detFopt,f/
m
eldetopt,sw
CKENC
tkTCENC
1
detFopt,f/
m
eldetopt,sw
CKENC
tkTCENC
1
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Parallel noiseParallel noise
• From any noise current source connected to input:– Detector biasing resistor– Shot noise of detector leakage current– Feedback resistor
p
mpar R
kTtENC
4
p
mpar R
kTtENC
4
CdetQ( t)
in2 = 4 k T R P
in2
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Capacitive matching – Capacitive matching – composite noisecomposite noise
• Cdet = 3 pF
• tm = 1 s
• Pdiss = 1 mW
• Ileak = 100 pA
• Technology: 0.35 m NMOS
Min.
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Basic Charge AmplifierBasic Charge Amplifier
Configuration based on discrete/hybrid design CMOS implementation
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Preamp Reset – Preamp Reset – RequirementsRequirements
• all charge preamplifiers need DC feedback element to discharge CF
• usually, a resistor in the M – G range is used
• monolithic processes don’t have high value resistors
• we need a circuit that behaves like a high resistor and is also
– insensitive to process, temperature, and supply variation
– low capacitance
– lowest possible noise
– linear
C de t
C F
?
Is ig I le a k
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Preamp Reset –Preamp Reset –ConfigurationsConfigurations
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Nonlinear Pole-zero Nonlinear Pole-zero CompensationCompensation
• Classical– RF ∙ CF = RC ∙CC– Zero created by RC,CC cancels
pole formed by RF, CF
• IC Version– CC = N ∙ CF
– (W/L)MC = N ∙ (W/L)MF
– Zero created by MC, CC
cancels pole formed by MF, CF– Rely on good matching
characteristics of CMOS FETs and capacitors
IN
CCCF
A1 A2
RF RC
VG
IN
CC
MC
CF
MF
A1 A2
G. Gramegna, P. O’Connor, P. Rehak, S. Hart, “CMOS preamplifier for low-capacitance detectors”, NIM-A 390, May 1997, 241 – 250.
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Integrated Shaping Integrated Shaping AmplifiersAmplifiers
• Limits the bandwidth for noise• Gives controlled pulse shape appropriate for rate• Control baseline fluctuations• Bring charge-to-voltage gain to its final value
• By its saturation characteristics, sets upper limit on Qin
• Feedback circuits give the most stable and precise shaping – At the expense of power dissipation– Poor tolerance of passives limits accuracy of the poles and zeros
• High-order shapers give the lowest noise for a given pulse width
S a lle n -K ey L o w p as s
R1 R2
C1
C2
K
B rid ged -T L o w p as s
C1
C2
M u ltip le F ee d b a ck L o w p as s
R3
R1 R2
C1
C2
1/(s+a) 1/(s+a)1/(s+a)
R1
R2
R3
R4
Follow-the-leader
Filter topologies
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Complex pole approximation Complex pole approximation to Gaussian pulse to Gaussian pulse
Shaper Pole Positions
-6
-4
-2
0
2
4
6
-10 -8 -6 -4 -2 0
MHz
Gaussian CR2RC6
Ohkawa synthesis method (Ohkawa, NIM 138 (1976) 85-92, "Direct Syntheses of the Gaussian Filter for Nuclear Pulse Amplifiers")
For given filter order, gives closest approx. to a true Gaussian
More symmetrical than CR-RCn filter of same order for same peaking time
Noise weighting functions:
I1,complex/I1,CR-RC = 1.18 series
I2,complex/I2,CR-RC = 0.81 parallel
Ohkawa synthesis method (Ohkawa, NIM 138 (1976) 85-92, "Direct Syntheses of the Gaussian Filter for Nuclear Pulse Amplifiers")
For given filter order, gives closest approx. to a true Gaussian
More symmetrical than CR-RCn filter of same order for same peaking time
Noise weighting functions:
I1,complex/I1,CR-RC = 1.18 series
I2,complex/I2,CR-RC = 0.81 parallel
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Complex shapers: advantagesComplex shapers: advantages
7th order complex
12th order CR-RCn
Equal peaking times, equal order
7th order complex
7th order CR-RCn
Equal 1% widths, equal order
7th order complex
7th order CR-RCn
Equal peaking times, equal 1% widths
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ExamplesExamples
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Charge Amplifier based Charge Amplifier based on Silicon MOSFET on Silicon MOSFET
(1967)(1967)
V. Negro et al., “A Guarded Insulated Gate Field Effect Electrometer”, IEEE Trnas. Nucl. Sci. Feb. 1967, 135 – 142
J.B. McCaslin, “A Metal-Oxide-Semiconductor Electrometer Ionization Chamber”, UCRL-11405 (1964)
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Spectroscopy amplifier Spectroscopy amplifier (1989)(1989)
Technology 3.0 m CMOSPower Supply +/- 5VChip size 2.5 x 2.5 mmChannels 1Cdet 300 - 1000 pFReset external resistorShaping CR-RC4, 1.6 sENC 3800 + 4.1 e-/pFPower dissipation 96 mW
Z. Chang, W. Sansen, Low-Noise Wide-Band Amplifiers in Bipolar and CMOS Technologies, Kluwer 1991 Ch. 5
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Preamp-shaper for Preamp-shaper for cathode strip chambercathode strip chamber
LP(A3)
Preamp Compensation 1st Pole5.12 MHz
2nd-orderLowpass
5.24 MHzQ = .5234H0 = 1.67
LP(A4)
2nd-orderLowpass
5.63 MHzQ = .6098H0 = 1.22
BP(A5)
2nd-orderBandpasss
6.51 MHzQ = .8549H0 = 3.0
DRIVER(A6)
Class ABOuput Buffer
Gain = 2
1.2 pF
4.8 pF
1.45 pF
31K 0.928.8
0.928.8
4X
• Detector: cathode strips of 0.5m MWPC with 50 pF CDET
• Charge interpolation to 1/100 of the strip pitch• Fast (70 ns), 7th order bipolar shaping for charged particle
tracking in high rate environment
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Preamp-shaper for cathode strip Preamp-shaper for cathode strip chamberchamber
200 100 0 100 200 300 4001
0.5
0
0.5
1
Time (ns)
Vou
t
Pulse Shape simulated (solid red line) and measured (blue dotted line)
0
0.5
1
1.5
2
2.5
0 200 400 600
Qin (fC)
Vo
ut
(V)
N oise vs. inpu t capacitance
S im u la ted : M easured : o
0 20 40 60 80 100 1201000
1500
2000
2500
3000
3500
Cd (pF)
ENC
(rm
s e-)
470 pF
100 UNLOADED
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Time Expansion Chamber & Time Expansion Chamber & Transition Radiation Transition Radiation
Detector Preamp/ShaperDetector Preamp/Shaper
• 1m MWPC with
20 pF CDET
• Fast (70 ns) shaping for charged particle tracking
• Dual gain outputs for measurement of dE/dx and Transition Radiation
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TEC-TRD Preamp/ShaperTEC-TRD Preamp/Shaper
Block Diagram Die Layout
X-ray Response
A. Kandasamy, E. O’Brien, P. O’Connor, W. VonAchen, “A monolithic preamplifier-shaper for measurement of energy loss and transition radiation” IEEE Trans. Nucl. Sci. 46(3), June 1999, 150-155
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Drift Detector Drift Detector PreamplifierPreamplifier
• Used with ultra-low capacitance silicon drift detector, Cdet < 0.3 pF
• Preamp only, used with external shaper
• Purpose: explore lowest noise possible with CMOS
• Reset system: MOS transistor with special bias circuit to achieve stable, > 100 G equivalent resistance
Detector
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Drift detector Drift detector preamplifier – simplified preamplifier – simplified
schematicschematic
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Drift Detector & CMOS Drift Detector & CMOS PreamplifierPreamplifier
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Drift detector preamplifier – Drift detector preamplifier –
resultsresults
• Spectra of 241Am and 55Fe taken with 5mm Si drift detector and CMOS X-ray preamplifier. Detector and circuit cooled to -75 C.
• External 2.4 s shaping.• ENC = 13 e- rms.• Noise without detector: 9 e-
P. O'Connor et.al., "Ultra Low Noise CMOS Preamplifier-shaper for X-ray Spectroscopy", NIM A409 (1998), 315-321
241Am55Fe
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D. Lynn et al., “A 240 channel thick film multi-chip module for readout of silicon drift detectors”, NIM A439 (2000), 418 - 426
SVT 240-channel Multi-SVT 240-channel Multi-Chip ModuleChip Module
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PROJECT Hi-res. Spectroscopy
RHIC – PHENIX RHIC – STAR LHC – ATLAS Industry Partnership
NSLS – HIRAX Units
DETECTOR Si drift Time Expansion Chamber
Silicon Vertex Tracker
Cathode Strip Chamber
CdZnTe gamma ray detector
Si Pixel
Function Preamp Preamp/ Shaper Preamp/ Shaper Preamp/ Shaper Preamp/ Shaper Preamp/ Shaper/Counter
CDET 0.3 30 3 50 3 1.5 pF Peaking Time
2400 70 50 70 600:1200:2000:4000
500:1000:2000:4000
ns
Gain 10 2.4:12 – 10/ 25 40:70:90 4 30:50:100:200 750:1500 mV/ fC Power 10 30 3.8 33 18 7 mW/ channel ENC 10 1250 400 2000 100 24 rms electrons Dynamic Range
1250 4600 700 1900 5600
Technology CMOS 1.2 um CMOS 1.2 um Bipolar 4 GHz CMOS 0.5 um CMOS 0.5 um CMOS 0.35 um Input Transistor
PMOS 150/ 1.2 um
NMOS 4200/ 1.2 um
NPN 10 uA
NMOS 5000/ 0.6 um
NMOS 200/ 0.6 um
PMOS 400/ 0.4 um
Reset Scheme
Compensated PMOS, > 1G
Polysilicon, 75 k
Nwell, 250 k
Compensated NMOS, 30 M
Compensated PMOS
Compensated NMOS
No. Channels
6 8 16 24 16 32
Die Size 7.3 15 8 20 19 16 mm2
BNL Preamp/Shaper ICs, BNL Preamp/Shaper ICs, 1995 - 20011995 - 2001
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• Preamplifier reset• High order filters• Programmable pulse
parameters• Circuit robustness:
– Self-biasing– Low-swing,differential I/O– Circuits tolerant to
variations in • Temperature• Process • Power supply• DC leakage current• Loading
• Preamplifier reset• High order filters• Programmable pulse
parameters• Circuit robustness:
– Self-biasing– Low-swing,differential I/O– Circuits tolerant to
variations in • Temperature• Process • Power supply• DC leakage current• Loading
Practical amplifier Practical amplifier considerationsconsiderationsPulse vs. Temperature
0 2x10 -6 4x10 -6 6x10 -6 8x10 -6
0.0
0.5
1.0
1.5
2.0Programmable Dual Stage N=24x6C
in1.5pF, Q
det10fC
Sig
nal [
V]
Time [s]
Gain variation
0 2x10 -6 4x10 -6 6x10 -6 8x10 -6
0.0
0.5
1.0
1.5
2.0
2.5
D ual S tage N = 24x6C
IN 3pF
QIN
11fCG ain 200m V/fCI
det 250pA 70nA
Out
put
Sig
nal [
V]
T im e [s]
Pulse vs. I leak
0.0 3.0x10-6
6.0x10-6
9.0x10-6
1.2x10-5
1.5x10-5
0.0
0.5
1.0
1.5
2.0
2.5
Programmable Dual StageC
IN 1.5pF, Q
DET 12fC
Cha
nnel
Out
put [
V]
Time [s]
Peaking time variation
G. De Geronimo et al., “A generation of CMOS readout ASICs for CZT detectors", IEEE Trans. Nucl. Sci. 47, Dec. 2000, 1857 - 1867
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MOS Scaling and MOS Scaling and Charge Amplifier Charge Amplifier
DesignDesign
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Scaling issuesScaling issues
• Fundamental device noise mechanisms– Hot electron effects– New process steps effect on 1/f noise– Gate tunnelling current
• Change of the current-voltage characteristics– Increase of weak inversion current– Mobility decrease– Velocity saturation– Drain conductance (device intrinsic DC gain)
• Power supply scaling
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Series white noiseSeries white noise
• Parameter = gm * Rn
• Some models predict >> 1 for short channel devices
• At moderate inversion and low VDS, remains in the range 0.8 < < 1.4
• Shallow junctions increase S/D series resistance => noise
0.3 0.5 0.7 0.9 1.1 1.3 1.5
Lmin [um]
0.5
1.0
1.5
2.0
0.7 um0.5 um0.35 um0.25 um
TECHNOLOGY:
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1/f noise in submicron 1/f noise in submicron CMOSCMOS
• Processes with n+/p+ poly gates and retrograde wells create surface-channel PMOS – PMOS 1/f noise to become more like NMOS?
• Shallow junctions required for scaled processes limit the thermal budget – hence gate process will have reduced post-oxidation anneal and higher trap density, higher 1/f
• For ultrathin gates new dielectrics with higher trap densities will be used (nitrided, halogenated, H2 annealed)
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1/f noise and hot 1/f noise and hot carrier stresscarrier stress
• Hot carrier stress generates new oxide/interface traps.
• 1/f noise more sensitive than change in static parameters:
– gm -10%
– (1/f) +400%
• Worse for shorter channel lengths• A device engineered for
"acceptable" degradation of Vth and gm may show unacceptable increase in 1/f noise over the same period.
• The operating point of the device will determine the stability of the long-term 1/f noise
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Gate tunneling currentGate tunneling current
• Gate current expected to
increase 100 – 200 x per
generation below 0.18 m
• Jox ~ 100 A/cm2 projected for Lmin
= 0.1 m generation with
nitrided SiO2
• Considered tolerable for digital
circuits (total gate area per chip
~ 0.1 cm2)
• Typical CSA input FET would
have IG ~ 1 - 10 A; ENCp ~
2000 - 7000 rms e- at 1 sec SiO2 gate leakage current (Lo et al., Electron Dev. Letters 1997)
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Departure from square-Departure from square-law characteristicslaw characteristics
• Submicron devices are less often operated in strong inversion, square-law region.
• Influences behavior of series white thermal noise
• Square-law devices have
minimum series noise when Cgs =
Cdet /3
• For other regions of operation, minimum noise can be for larger
or smaller values of Cgs
10-3 10-2 10-1 100 101 102 103
ID/W [A/m]
10-6
10-5
10-4
10-3
10-2
gm
[S
]
0.18 um0.6 um2.0 um
STRONG INVERSION
(SQUARE LAW)
TECHNOLOGY:
VELOCITY
SATURATION
WEAK
INVERSION
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Generalized capacitive Generalized capacitive matching conditionmatching condition
Cdet / ID Ratio
Region of operation
Optimum capacitive match
C
I vD sat
det 6
2
Velocity saturated
Cgs = Cdet
6 62
2 2
L
nkT q
C
I vD sat
( )det
Strong-inversion
square-law
Cgs = Cdet / 3
C
I
L
nkT qD
det
( )
6 2
2 Weak
inversion boundary
CL I
C nkT qgsD
2 2
2det ( )
– Drain current = constant
– Ratio of Cgs to Cdet determined by Cdet/Id:
P. O’Connor, G. De Geronimo, “Prospects for Charge Sensitive Amplifiers in Scaled CMOS”, NIM-A accepted for publication
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Capacitive match vs. scaling Capacitive match vs. scaling – mixed white, 1/f and – mixed white, 1/f and
parallel noiseparallel noise• Cdet = 3 pF, tm = 1 s, Pdiss = 1 mW, Ileak = 100 pA
2 m NMOS2 m NMOS 0.5 m NMOS0.5 m NMOS 0.1 m NMOS0.1 m NMOS
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Noise vs. scaling for mixed Noise vs. scaling for mixed white, 1/f, and parallel noisewhite, 1/f, and parallel noise
0.1 1.0Lmin [um]
101
102
103
EN
Cm
in [
rms
ele
ctro
ns]
a
b
c
d
Noise vs. scaling Optimum gate width vs. scaling
4 detector scenarios
for scaling study
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Noise and Power vs. ScalingNoise and Power vs. Scaling
0.1 1.0Lmin [um]
0.01
0.1
1
10
100
Po
we
r [m
W]
d
a
b
c
0.1 1.0Lmin [um]
101
102
103
EN
Cm
in [
rms
ele
ctro
ns]
a
b
c
d
Noise vs. scaling
(power held constant)
Power vs. scaling
(noise held constant)
4 detector scenarios
for scaling study
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Dynamic Range vs. scalingDynamic Range vs. scaling
1.E+03
1.E+04
1.E+05
1.E+06
0.1 1 10
Lmin [um]
Dyn
amic
Ran
ge a
c
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InterconnectInterconnect
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Cost of InterconnectCost of Interconnect
ISSCC 2000
digital
analog
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Interconnect issues in Interconnect issues in monolithic front endsmonolithic front ends
• Detector – preamplifier– Lowest possible capacitance– Maintain small form factor– Ease of assembly
• Front end – ADC– Efficient use of expensive “analog” interconnect
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TEC Front-End CardTEC Front-End Card
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Make the chip a part of Make the chip a part of the detectorthe detector
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diffusion isochron“photo” diode
metal
n+
nwell
pwell
poly
Make the detector part of Make the detector part of the chipthe chip
VDD
RE_SEL
ROW_SEL
CO
LU
MN
LIN
E
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What goes between the What goes between the preamp/shaper and the preamp/shaper and the
ADC?ADC?• Experimental needs differ
– number of channels
– occupancy
– rate
– trigger
• Usually, its too expensive to put an ADC per channel
• Anyway the ADC would usually not be doing anything useful
– Occupancy < 100%, so no events most of the time in most
channels
• What is the most efficient way to use the ADC(s)?
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Analog Sampling and Analog Sampling and MultiplexingMultiplexing
Track/Hold
Inputs
Select
MultiplexedOutput
SamplingCapacitor
...
...
AMPLEX, VIKING, etc.
Track-and-Hold Architecture
Sampling C loc ks
Inputs
Selec tChannel
MultiplexedOutput
SamplingCapac itors
...
...
A nalog M em ory based on S witched C apacitor A rray
...
...
...
...
Track-and-hold(triggered systems)
Analog memory(non-triggered)
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New Peak Detector and New Peak Detector and DerandomizerDerandomizer
• Self-triggered• Self-sparsifying• New 2-phase configuration
allows rail-to-rail operation, eliminates offsets– absolute accuracy ~ 0.2%– to within 300 mV of rails
• Two or more peak detectors in parallel can be used to derandomize events– If a second pulse arrives before
the readout of the first pulse in Pd-a, it is detected and stored on Pd-b.
S1
S3
M 1
Vdd
Vout
Voff +
C
Vh
S2 VgV in
A
-
+
Pd-a
Pd-b
LogicV in AD C
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First experimental First experimental resultsresults
0 20 40 60Time, us
READ
PDD OUT
PDD IN
PK FND
Accuracy of single PD PD/D response to randompulse train (241Am on CZT)
G. DeGeronimo, P. O’Connor, A. Kandasamy, “Analog Peak Detect and Hold Circuits Part 2: The Two-Phase Offset-Free and Derandomizing Configurations”, NIM-A submitted for publication
-15
-10
-5
0
5
0.1 1 10Peaking Time (s)
Err
or
in p
eak
hei
gh
t (m
V)
0.5 V1.0 V2.0 V2.5 V
0.2%
200 kHz fixed
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Conclusions Conclusions • Today’s CMOS technology can be used to
make low noise front ends whose performance is nearly as good as the best discrete units
• In the future, increasing device cutoff frequency and gate oxide quality will help improve noise BUT
– Potentially serious increases in 1/f noise and gate current may accompany new process sequences
– Low supply voltage will hamper high dynamic range
• Increasing attention will have to be paid to interconnect at the technology, circuit, and architecture levels