IMP-Telecommunications, Ltd. · • Prominent Serbian embedded systems design house • Spin-off...
Transcript of IMP-Telecommunications, Ltd. · • Prominent Serbian embedded systems design house • Spin-off...
http://www.imptelecom.com
March, 2015
Business Model Presentation
Company Profile
IMP-Telecommunications, Ltd. Embedded Systems Design House
About Us
• Prominent Serbian embedded systems design house
• Spin-off company of Michael Pupin Institute (IMP), established in 1997
• 42 employees (27 in core development team)
• Proven know-how to develop prototypes based on customer’s idea
• Experienced embedded systems design team
• Focus on quality and manufacturability
• ISO 9001 and CMMI Level 2 company
Business Offering
• Contract R&D
• Consulting
• Conceptual designs and evaluation boards/proofs of concept
• Original Design Manufacturer (ODM) business model
• Licensing of proprietary IP
• Southeastern European R&D offshore destination
• Outstanding quality/cost ratio (value for money)
“Perfection in Embedded Design” Concept
• One stop shop (turnkey design)
• Electronic products development know-how
• Providing COMPLETE, ready for manufacturing solutions to customer
• Industrial design and design for EMC
• Automated test systems development
• Full competence in each phase of device design
• Fast prototyping
• Network of partner development companies (ICT-Net cluster)
• Cooperation with University
“Perfection in Embedded Design” Concept
Commitment to Quality
• Certified ISO 9001 quality management system
• IT Mark quality assurance certificate
• CMMI for development level 2
• Agile development methodology (scrum-like)
• Proprietary, well-developed design verification check lists
• Strict data management and backup procedures
• Own state-of-the-art laboratory equipment
• Pre-compliance EMC lab
Project Management & QA
• Detailed WBS
• Transparent procedures
• Weekly reporting
• Costs tracking
• Milestone status meetings
• Risk management
• Requirements management
• Configuration management
Customer
Project Manager QA Manager
System
Design Team
HW Design
Team
Embedded
Software
Team
FPGA Design
Team
Mechanical
Design
Team
Test &
Verification
Team
Design for
Manufacturing
Team
Manufacturing
Technologies
• Real-time systems design
• High-speed hardware design
• DSP algorithms development
• Multirate DSP, software-defined radio
• Embedded operating systems (Linux)
• High-speed/high-density PCB Design
• Microwave circuits design
• Power supplies & power management
• Industrial control systems
• Video and multimedia systems
Open-Source Software Linux kernel
• Bootloader for custom boards (U-boot)
• Porting Linux kernel for custom boards
• Linux drivers developing, maintaining and modifying for exotic peripherals
• Full support for our own Linux BSPs
Android
• Java middleware libraries for accessing board peripherals directly from Android
• Full Java API, no need for low level NDK programming and cross-compilation
• Full support and documentation
Design for EMC
• Seven years of experience in the company
• Cooperation with Microwave Group at the University of Belgrade
• Recognized international experts with more than 30 years of experience
• World-class 3D EM field simulation experts (developed Wipl-D, Artech House)
• Extensive list of international references (DEC, Bosch, Motorola, Philips, DuPont)
• Consulting in design phase
• Debugging EMC problems
• EMC hardening
• Product certification and CE marking
Audio and Acoustics
• Cooperation with Acoustics Laboratory at the University of Belgrade
• Development of high-end audio electronics (preamps, amplifiers, power amplifiers, filters)
• Design of loudspeakers
• Audio software development (signal processing, filtering, measurement, modeling, calculations)
• Room acoustic design (studios, opera halls, theatres, chruches)
• Research projects (partial discharge in transformers)
• Audio/acoustics lab (small anechoic chamber, reverberation chamber, instruments, software)
Industrial design service
• Functional, ergonomic and aesthetic aspects of the product
• Conceptual ideas, selection of materials, visualization, 3D & physical modeling, mechanical design, prototyping
• Cooperation with award-winning Nikola Knezevic Industrial Design studio
• Listed as one of the best 40 European designers under 40 for the year 2010
• Awards: IF Design, Braun Design Competition, LG Electronic Design Competition
• Client list: HP, Toshiba, Polaroid, B&W
Automated Test Systems • Five years of experience
• Reference - own manufacturing line with capacity of 2500 devices/month
• Strategic partnership with National Instruments
• Know-how of test methodologies (in-circuit, boundary scan, self-test)
• Design for Manufacturing consultancy
• Development of test jigs
Tools & environments
• Altium Designer
• Cadence
• Mentor Graphics, HyperLynx
• Xilinx ISE, Sysgen
• Matlab
• Labview
• TI’s Code Composer Studio
• IAR Workbench, MPLAB IDE, Eclipse
• SolidWorks 3D mechanical design
Networks & Associations
• Texas Instruments DSP Third Party Developers` Network member since November 2008
• TI EMEA Design House Network Member since March 2011
• Serbian ICT Network Cluster (Board Chairman position)
Currently 14 embedded design companies in the network
Notable Projects
• STOS 3XGA Ethernet thin-client enabling three independent video outputs
• PEC State-of-the-art real-time multichannel DSP controller
• uSFP Sub-miniature 10 Gbps Fibre Channel/Ethernet transceiver
• TZ-600 Mission critical communication device improving safety and security of teleprotection applications in electric power transmission systems
• OpCard Add-on card for expanding capabilities of Motorola GP/GM300 radio
• CTU-300 Crypto telephone set and data transmission device
STOS 3XGA Basic Facts
• Ethernet thin-client for digital signage applications
• Triple-channel VESA video output (up to WXGA resolution)
• Public screen systems, video walls, transportation, control centers, expos, advertising, entertainment
• Low power consumption
• Compact form factor
• Cost-efficient solution
• Image decoding and processing
• Receiving up to three compressed video streams in overlay via UDP and background images via TCP with active resize and rotate algorithms
Complete system designed in-house for Finsoft Ltd., UK.
STOS 3XGA Challenges
• High-speed video hardware design
• Optimization of image processing algorithms on DM64x platform
• Design of application software to assure maximum utilization of resources
• Assuring robust EMC performance
• 24/7 work cycle
• Cost optimization
• Design for manufacturing
• Establishing of production line and automated test procedures
• Specialized test jig design
• Mechanical design
PEC System Basic Facts • Power Electronic Controller
• Multi-board configuration
• CPU board, Digital IO board, Analog IO board and Power Board
• High processing power (4800 MIPS floating-point DSP)
• 16 optical IO channels (10 Mbps each) on Digital IO board
• 16 analog channels (100 kSps) on Analog IO board
• 256 digital channels, 128 analog channels total
• 1500 pages of documentation
• Full design verification and manufacturing procedures
System concept, design and prototyping done fully in-house under custom
development contract.
PEC System Basic Facts 2
• Packet-based data transfer in the system
• 10 us processing cycle
• 6.4 Gbps LVDS communication backbone
• FPGA-based communication switches and interfaces
• High reliability hardware with automatic hardware malfunction detection and protection mechanisms
• Completely separated real-time DSP and system control/management
• Fully redundant industrial 150 W power supply
• Management and monitoring subsystem
• Industrial temperature and EMC environment
uSFP 10 Gbps Transceiver
• Goal: To develop industry’s smallest 10 Gbps LC optical transceiver
• Challenge 1: Fit electronic and electro-optical components in such small space
• Challenge 2: Design hardware for 10 Gbps performance
• Challenge 3: Find suitable high-speed interconnection solution
• Challenge 4: Devise robust mechanical design
• Challenge 5: Cost optimization
An ODM project done in cooperation with TagOn, UK.
uSFP Transceiver - Solution
• Compact design: 13 x 10.5 x 27 mm
• Fully SFP compatible on the electrical interface
• Six-layer rigid-flex board
• Microwave design – signal integrity simulation
• The smallest components available (0201 passive, 3x2 mm controller, uBGA)
• Thin PCB interposer used as connector solution
• 10 Gbps test and evaluation boards developed
uSFP - Casing Prototype
• Made according to 3D STEP model
• Electro-mechanical co-design applied during entire development cycle
• Die-cast metal body
• Lid and cage made from 0.25 mm tin plate
• Precise manufacturing – 20 um tolerance
• Electrical connection via 0.5 mm pitch interposer
TZ-600 Basic Facts
• Communication solution for teleprotection applications in power transmission systems
• Hard real-time system
• Designed for 24/7 operation
• Fast, reliable, and secure
• Modular and programmable interfaces including long-range optical
• DSP technology
• Extremely short command transmission time
• Versatile power supply
Own design, manufacturing and sales.
TZ-600 CPU control unit
• Processing board based on TMS320C5471 dual-core processor
• Embedded Linux ported on ARM7 core
• DSP/BIOS on C54x core
• Separate graphical user interface board based on MSP430
• File system and RDBMS
• Web server for monitoring and maintenance
• Event log function
CTU-300 Basic Facts
• Provides ciphered full-duplex voice and data transmission over analogue telephone lines
• Telephone functions: caller ID, call list, phonebook, country settings, ringer settings etc.
• Simple and intuitive graphical user interface
• Speakerphone option
• Power supplies: mains, 9V DC and built-in Ni-MH battery
• USB computer interface for programming and data communication
• Fast erasure of crypto algorithm
• Full protection against tampering
• Based on TMS320C5410A DSP
Developed and manufactured for Serbian government.
CTU-300 Challenges
• Providing real-time ciphered voice service over dial-up connection (custom data protocol, synchronization)
• Short time required for initialization of crypto connection
• Voice coding technology
• Acoustic and line echo canceling
• Advanced encryption algorithms
• Implementing GUI on MSP430
• Advanced power management
• Mechanical design
OpCard Basic Facts
• Add-on card for expanding capabilities of Motorola GP/GM300 two-way radios (voice scrambler and VHF/UHF radio modem)
• Card controls properties of radio channel, transmitter and receiver, audio signal, and user interface (keyboard and display)
• Excellent EMC immunity and sound quality
• Downloadable firmware (over the air)
• Design based on TMS320F206 DSP
Own development, manufacturing and distribution.
OpCard Challenges
• Offensive RF environment
• Mechanical design
• Robustness
• Voice scrambling algorithms
• Real-time operating software
• PCB requirements:
– Six-layered printed circuit board with buried vias
– High level of integration
Current Development - Qseven board Why Qseven standard?
• To enable the features of latest 45nm mobile chipsets and processors.
• To provide the ability to use the successful Computer- On- Module concept for mobile embedded applications.
• To support the latest graphic standards such as DisplayPort and HDMI.
• Small form factor for easy integration (70 mm x 70 mm).
What is special about Qseven?
• Legacy free – only new serial buses are defined
• Flexibile graphics – current graphic standards are supported
• Embbeded API – Software interface for easy Interchangeability
Features:
• High-performance TI ARM/DSP solutions
• High level of peripherals integration
• High-speed DDR3 SDRAM memory
• Cutting-edge Sitara/Integra/DaVinci processor
Texas Instruments’ Netra processors deliver:
• Dramatic BOM cost reduction trough integration
• Increase overall system performance
• DSP can more efficiently handle complex tasks
• ARM is free to process applications
Our First Qseven board
Qseven module – based on Netra TI SoC
• ARM Cortex-A8 core (up to 1.5 GHz)
• C674x DSP (fixed/floating point @ 1.5 GHz)
• Rich set of peripherals
• 1 GB dual-port DDR3 SDRAM memory
• Gbit Ethernet
• PCIe
• 2 x SATA 3.0
• 5 x USB 2.0
• 3D graphics engine (SGX530, 27 Mpoly/sec)
• 1080p HD video output
• Up to 8 GB NAND Flash
• 9 W maximum power consumption on board
Interfaces:
• 5 x USB 2.0 host ports
• 1 x USB 2.0 client port
• 1 x PCIe 1.1
• 1 x Gbit Ethernet port
• HDMI video output
• LVDS display connection (Open LDI)
• Camera port (feature connector)
• High definition audio
• Dual SATA 2.0 interface
• SD/MMC card interface
• SPI interface
• ACPI power management signals
Qseven - Features and Interfaces
• Android 2.3 – IMP-Telecommunications – FREE
• Full BSP available from March 2012
• SysLink (Link between DSP and ARM) availability
• Linux, Open Source – IMP-Telecommunications – FREE
• BSP available from March 2012
• GA available from June 2011
• Windows Embedded 7.0 – TI – FREE
• Beta BSM available from March 2011 (ARM only)
• SysLink (Link between DSP and ARM) availability
• C6EZAccel and C6EZRun – TI – FREE
• Includes pre-optimized DSP libraries for digital filtering, complex math and image enhancement and analysis
Qseven - Software
• High-end Test and Measurement (Signal/Waveform Generation and Analyses)
• Machine/Industrial Vision (Automated
Inspection, Identification) • Biological Vision (e.g. Cell-sorting and
Analysis) • Tracking and Control (Avionics/Guidance, Radar/Sonar, Solar Tracking) • Multi-channel full HD Video Encode/Decode,
Transcode/Transrate (DaVinci)
Qseven – End Applications
The goal of the project:
• Implement and sell specific hardware/software development platform for Android community
• Optimized for use in home automation, machine control and similar applications
• Enabling Android applications to use standard/legacy interfaces like RS232, RS485, CAN, digital I/Os and other.
Features:
• ARM Cortex A8 @ 1.5 GHz
• 1 GB RAM memory
• 7” Touchscreen display
• Ethernet, Wi-Fi, Bluetooth, GSM
• 4xUSB, SD card
• Camera, audio
• RS232, RS485
• CAN
• Digital I/Os
• Analog inputs
• PWM outputs
Android with wires
• Open source
• Rich and innovate user interface
• Easy applications development
• Internet access, communications
• More than 80.000 available applications
• Market share: 40 %
• Expansion of Android OS on new vertical markets
• Multimedia, smart houses, automotive industry, white goods, …
Why Android?
The End
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