IMI Group Presentation

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Strictly Confidential. All rights reserved by Integrated Micro-Electronics, Inc. (IMI) -- including any disposal, exploitation, reproduction, editing, distribution, as well as in the event of applications for industrial property rights. July 2011

BUILD YOUR BUSINESSWITH OUR FLEXIBLE SOLUTIONS

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A leading provider of electronics manufacturing services (EMS) and power semiconductor assembly and test services

Delivers innovative, customized, and integrated solutions of highest quality

Serves diverse marketsAutomotive, industrial, and medical electronicsCommunications, computing and renewable energy

With manufacturing presence in Asia, North America, and Europe

IMI - Integrated Micro-Electronics Inc.

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IMI, an Ayala Company

100.0%

Manila Water

• Top 5 in CRM

• Top 3 in KPO

• Top 3 in Graphics Design

• Outsourcing

Most profitable bank among peers;

leader in remittances, trust & asset

management

Pioneer in water infrastructure development

Largest and only full line property

developer in the country

53.2%

43.2%

24th of the top 50 EMS

companies in the world

33.6%

30.5%

Second largest telco company in the country

67.7%

Ayala Automotive100.0%

Largest dealership network of

Honda and Isuzu cars

nationwide

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— Power &

— Infrastructure

Ayala

New Sectors

‘EMERGING’‘CORE’

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IMI Ownership Structure

As of May 2012

For Common Shares % of Ownership

AYC Holdings, Ltd. 58.03%

Resins, Inc. 14.51%

EPIQ NV 12.12%

ESOWN Subscription 5.86%

POMS Investment PTE, LTD. 3.48%

Mitsubishi Corp. 0.73%

SiiX Corporation 0.40%

Others/Public 4.87%

Total 100%

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IMI Milestones

1980 IMI was established by Ayala Corporation and Resins Inc

1982 Expanded IC assembly business into contract manufacturing

1998 Started offering design and product development services

2001 Obtained the Philippine Quality Award level III for mastery in quality management

2005 Established global footprint through acquisition of the EMS assets of Saturn Electronics and Engineering Inc. and then Speedy-Tech Electronics Ltd.

2006 Made it to list of the top 50 EMS providers of Manufacturing Market Insider

2007 Received Circuits Assembly’s Service Excellence Award for Highest Overall Customer Ranking

2010 Listed by way of introduction on the Philippine Stock Exchange, opened 6th

manufacturing facility in China, established IMI Energy Solutions, and acquired power semiconductor company PSi Technologies, Inc.

2011 Acquired EPIQ subsidiaries in Bulgaria, the Czech Republic, and Mexico

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• Design and Engineering

• Advanced Manufacturing Engineering

• Test and Systems Development

• New Product Introduction Services

• From PCB and FPCB Assembly Services to Complete Box Build

• Low-Volume, High-Mix Manufacturing

• High-Volume Manufacturing• Power Semiconductor Assembly

and Test Solutions• Flexible Business Set-ups• Plastic Injection

• Materials Sourcing and Logistics Solutions

• Product Reliability and Failure Analysis

• Product Repair Services

IMI Complete Solutions

OEMs:Technology

R&D

Design andEngineering Manufacturing Support and

Fulfillment

OEMs:Brand

Marketing

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• Design Services• Virtual Prototyping –

Thermo-mechanical and Electrical Simulation

• Prototype Builds• Material Development

and Qualification• Test Development• New Product

Introduction Services

• Die Inspect Services• From Wafer Saw to Front-

of -Line to End-of -Line Assembly Services

• Testing Services• Caters to Power

Semiconductor Packages (Metal Can/Hermetics, TO Packages, PQFN and Power Modules)

• High Volume Manufacturing

• Materials Sourcing and Logistics Solutions

• Product Reliability and Failure Analysis

OEMs:TechnologyR&D

Design andEngineering Manufacturing Support and

Fulfillment

OEMs:Brand

Marketing

Power Semiconductor Assembly andTest Services

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Reputation

24th in Manufacturing Market Insider’s list of Top 50 EMS companies in 2011

Preferred supplier of a number of global OEMs, including Assa Abloy and Bosch

Gold Awardee for Corporate Governance from the Institute of Corporate Directors in the Philippines in 2011

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Quality Systems

International Standard Certifications include

Total Quality Management

Continuous Improvement and innovation

Quality of Supply Chain and Supplier Partnerships

Six Sigma and LEAN Manufacturing Systems

Quality Management System

Environmental Management System

Quality Management System for Automotive Applications

Quality Management System for Medical Devices

Hazardous Substance Free Process Management System

Quality Management System for Testing and Calibration Laboratories

ISO 9001:2008

ISO 14001:2004

ISO/TS 16949:2009

ISO 13485:2003

QC080000

ISO/IEC17025:2005

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IMI Revenues

0.0

100.0

200.0

300.0

400.0

500.0

600.0

IMI Group 182.1 395.0 422.1 441.1 395.5 412.3 575.5

2005 2006 2007 2008 2009 2010 2011

In Million US$

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Revenues by Customer Nationality

Rest of

Asia, 13%

EMEA*, 50%

Japan, 13%

North

America, 24%

2011 Sales: US$575.5 Million

* EMEA – Europe, Middle East and Africa

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Revenues by Market Segment

Medical, 4%

Consumer, 20%

Telecom, 19%

Multiple Markets,

15%

Computing, 6%

Automotive, 18%

Industrial, 18%

2011 Sales: US$575.5 Million

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Global Footprint

.

.

.

.

.

.

.

.

Philippines

Laguna Site 3x

Cavite

Fremont, California

USA

Tustin, California

Japan

Singapore

Shenzhen 3x

Laguna 3x

Taguig

Cavite

Chongqing

Jiaxing

China

Jiaxing ChongqingShenzhen(Liantang)

Shenzhen(Fu Yong)

Shenzhen(Kuichong)

.

Chengdu

Chengdu

Taguig

.

Guadalajara, Mexico

.

Total manufacturing space of about 245,000 sq.m. in 17 sitesOver 14,000 employees worldwide (as of March 2012)

Manufacturing

Engineering

Singapore

BotevgradBulgaria

TřemošnáCzech Republic

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Sales Offices

Sales Contacts

� Philippines

� China: Shenzhen,

Jiaxing, Chengdu,

� Singapore

� Nagoya, Japan

� Germany

� France

� Bulgaria

� Czech Republic

� Tustin, CA USA

� Fremont, CA USA

� Toronto, Canada

� Guadalajara, Mexico

.

.

.

.

Europe

China

USA

Singapore

Japan

Philippines

��

�

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�

��

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FLEXIBLE SOLUTIONS

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APQP Process*

Ph. 0 – RFQ Process

Process Owner:CFT Program Manager

Program Management: CFT

Product Development CycleProduct Development Cycle

NPINPI

* Advance Product Quality Planning

Ph. 1 –Requirements Definition & Planning

Process Owner: CFT Program Manager

Ph. 2 –Product Design & Development

Process Owner: Design & Development/ Test & System Development /Value Engineering Project Manager

Ph. 3 –Process Design & Development

Process Owner: Advance Manufacturing Engineering Project Manager

Ph. 4 –Product & Process Validation

Process Owner: Manufacturing Engineer, Project Manager

Ph. 5 –Mass Production

Process Owner: Production Manager

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Supplier Quality Engineering

23 SQE teams in three continents SQE specialization in PCB, Passives, E-MechanicalZDAP (Zero Defect Action Plan) for strategic suppliers Global audit plan with process audits in different sitesSupplier development plan implementation and monitoringStandardization and centralization of supplier evaluation Supplier management controlled by AVLQuality contracts and targets with suppliers

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EMS Design & Engineering Solutions

Contract Design and Joint Development Solutions in

Power ElectronicsEmbedded SystemsCamera and Imaging SystemsLighting SystemsPower SemiconductorsShort-Range Wireless

Design ServicesHardware & Software DevelopmentMechanical DesignPrinted Circuit Board LayoutDesign for Manufacturability, Reliability, and TestabilitySimultaneous EngineeringValue EngineeringPrototyping and Pre-Certification TestingDesign of Plastic Enclosures

13Strictly Confidential. All rights reserved by Integrated Micro-Electronics, Inc. (IMI) -- including any disposal, exploitation, reproduction, editing, distribution, as well as in the event of applications for industrial property rights. July 2011Strictly Confidential. All rights reserved by Integrated Micro-Electronics, Inc. (IMI) -- including any disposal, exploitation, reproduction, editing, distribution, as well as in the event of applications for industrial property rights. July 2011

Power Design & Engineering Solutions

Contract Design and Joint Development Solutions in

Power ModulesPower QFNPower Components

Power Design ServicesMechanical DesignDesign for Manufacturability, Reliability, and TestabilitySimultaneous EngineeringValue EngineeringVirtual ProtoypingPrototyping and Pre-Certification

TestingHigh Power

Module

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EMS Advanced Manufacturing Engineering

Advanced Manufacturing Technology

Direct Chip Attach (COB, Flip Chip, and Chip on Silicon)Multi-Chip Module (MCM) and MicrosystemThermally Enhanced Direct Chip AttachAdvance Surface MetallurgiesPre-flow Underfill Process (IMI Patent)Traceless Flip Chip Technology ( IMI Patent)Substrate and Interconnect TechnologySmall Precision AssemblyTraceabilityConformal Coating & Casting equipment (selective & potting)


Power Advanced Manufacturing

Advanced Manufacturing Technology

Low Rdson Cu-Clip solutionsMulti-Chip Module (MCM) and (SiP)Thermally Enhanced Dual Cool TechnologyAdvanced Die attach (Sintering)LED packaging (IMI Patent)Ceramic Isolated TO packagesCu and Al-Ribbon bondingHigh Temperature Packages SiC/GaN technology

LED package

P-QFN package

P-CompHermetic package

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EMS Manufacturing Solutions

Flexible PCBA

Aluminum PCBA

Ceramic PCBA

Flip Chip On Flex

Chip-On-Board

Chip-On-flex

Chip-On-Glass

Chip-Scale Packaging

Hybrid Module PCBA

PCBA with Multiple BGA SMT

Selective and Robotic Soldering

PCB & FPCB Assembly

QFP/SOP

Connectors

BGA Package Size

45 x 45 mm

90 x 100 mm

54 x 54 mm

Smallest Component Size

Chip0402

01005 ready

QFP Lead Pitch0.40

0.30 mm ready

Connector Lead Pitch 0.40 mm

BGA/CSP Bump Pitch 0.50 mm

BGA/CSP Bump Diameter 0.30 mm

Flip Chip Bump Pitch 0.16 mm

Flip Chip Bump Diameter 0.07 mm

Largest Component

Complete Box Build

Cleanroom Operations

With 144 SMT Lines as of Mar 2012


Power Manufacturing Solutions

TO220 2/3/5/7 leads

TO247 2/3 leads

T0252 2/3 leads

TO264 2/3leads

TO257/58 Hermetics

SOT227

P-QFN 3x3, 3.3x3.3, 5x6

P-QFN system in package (SiP)

SSPM IGBT Modules

Hybrid TO packages

Full-pack TO packages

Lead-frame and DBC Assembly

Cu Bonding

Sintering

Rapid Prototyping

up to 3mil wire

high rel die attach

RnD line

High Volume Core Processes

Wafer Sawing 4mil min01005 ready

Solder Die attach Lead and lead free

Reflow (standard & Vacuum) void free soldering

Cu-Clip power connection Low Rdson

Au and Al bonding wire and ribbon

Transfer molding Green

Saw singulation , Trim & Form flexible POD

Advanced Processes

Complete Box Build

Customized packages on request

30mio device/week capacity30mio device/week capacity

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Injection Molding Capabilities

State-of-the-art injection Molding and drying machines

Horizontal injection press

Vertical bi-injection press

Injects most of the engineering resins : PA, PBT, POM, PET, PC, PP

High precision thin wall focus mineral and glass fiber filled material injection capability

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Plastic Injection Capabilities

From 50 to 850 tons

Injection, Over-molded, and Optical Plastics Parts

Decorating, Painting, and Laser Graving

Functional and Cosmetic

Tool Shop ServicesDesign and Manufacturing of MoldsPartnerships for Inserts

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Test and Systems Development

Co-development of test specifications concurrent to new product development

Design for testability and flexibility for product revisions

Turnkey hardware design and assembly

Parallel test solutions for high volume manufacturing

Software development and upgrades

Test documentation

Training and 24x7 manufacturing support

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Reliability, Failure Analysis, and Calibration

Reliability EngineeringAccelerated testing to determine

product:• Life Expectancy• Warranty• Reliability

Failure AnalysisData analysis and identification of

failure cause as well as preventive measures

Calibration ServiceOffer services on the following:

• Thermometry• Electrical equipment• Metrology

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MARKET SEGMENT

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Automotive Electronics

Experience

• Automotive Camera • PCBA for Electronic Stability Program (ESP)• Tire Pressure Sensor PCBA• Car Windshield Temperature and Humidity Sensor• Electronic Power Steering (EPS) Rotor Position Sensor (RPS) • PCBA for Headlight• Switch Controller for Main Light• Communication Power PCBA• Body Control Module (BCM) • Antenna Receiver / DAB Tuner • Powertrain Control Solutions• Semiconductors used in Electric Drive/ Hybrid Electric Vehicles• Fuel Management• Pump Driver• Steering Wheel Control Device• Cockpit Control Device• Audio Processor• Plastic Injection

Key Capabilities

Electronics Manufacturing Services

(EMS) including

• Automotive Camera Platform • Sensors & Imaging Contract Design• Power Electronics• COB Manufacturing• Product Miniaturization• DFM and DFT• Test Equipment Development• Rigid Printed Circuit Board Assembly• Flex Printed Circuit Assembly• Flip Chip Process • Automatic Pin Insertion• Simultaneous Engineering• ISO/TS 16949:2002 Certified Lines• Critical Part Monitoring (CPM) • Reject Profile Analysis (RPA) • Parts Average Test (PAT) • Statistical Bin Analysis• RoHS Compliant Lines

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Industrial Electronics

Key Capabilities

Electronics Manufacturing Services (EMS) including

• Low-Volume / High-Mix Manufacturing• Power Supply Design• Sensor & Imaging Contract Design• Mechanical Enclosure Design• DFM and DFT• Test Equipment Development• Rigid Printed Circuit Board Assembly• Automatic Pin Insertion• COB (Au & Al Wires)• Complete Box Build• Medium to High Power Discrete Packages

and Process • Power Modules• RoHS Compliant Lines

Experience

• Automated Meter Reading (AMR)• Security Device• Electronic Door Access System• Smart Card • Point Of Sales System• Printer Control Board• Power Amplifier• DC-DC Power Converter • Engine Controllers• Welding Machine Inverter• Motor Drivers for Conveyor• Fan Motor Control Board• Computer Numerical Control (CNC) Control Board• Main Power Supplies for LED Street Lighting • Modules for Renewable Energy Generation,

Transmission and Conversion

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Medical Electronics

Experience

• Flat Panel Imaging Equipment • Auto Body Contouring Imaging Equipment• Dental Imaging System • Defibrillator Component• Concealed Hearing Aid• Biomedical and Laboratory Equipment• Centrifuge Control Board• Fitness Equipment Control Board

Key Capabilities


• Low-Volume / High-Mix Manufacturing• Product Design Co-development• DFM and DFT• Product Miniaturization• Rigid Printed Circuit Board Assembly• Flex Printed Circuit Assembly• Flip Chip On Flex Assembly• COB including Die Attach of Imager Die• ISO 13485:2003 Certified Lines

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Communications Electronics

Key Capabilities

Flexible Electronics Manufacturing Services (EMS) including

• Design for Manufacturability• Product Miniaturization• Pre-certification Testing• Test Equipment Development• Rigid Printed Circuit Board Assembly• COB with Die Attach of Imager Die & Al Wires• Complete Box Build• Repair Services• RoHS Compliant Lines• Power QFN• Powermite

TM

• Power Management (IC) Discrete Packaging, e.g., 5-7L TO-220, TO-263, TO-252, and Powerflex

TM

Experience

• Back Panel for Telecommunication Board• Fiber to the “X” (FFTx) systems• Booster Amplifier• GPON (Gigabit Passive Optical Network) Systems • Wireless Security System• Base Station Power Supply• Digital Station Control Board• Power Transistors for amplifiers in cellular base stations• Power Conversion ICs in adapters and chargers for cell

phones and cordless phones• DC Port and USB Port Protection for cell phones and satellite

radio peripherals

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Computing and Storage Devices

Key CapabilitiesFlexible Electronics Manufacturing

Services (EMS) including• Product Miniaturization • Test Equipment Development• Rigid Printed Circuit Board Assembly• Flex Printed Circuit Assembly• Flip Chip Process• Mechanical and Optical Precision Assembly• Complete Box Build• RoHS Compliant Lines• Power QFN• PowermiteTM

• Power Management (IC) discrete packaging, e.g., 5-7L TO-220, TO-263, TO-252, and PowerflexTM

Experience

• CD/Combo Drive• DVD Drive• Blu-Ray Disc Drive • Hard Disk Drive• Solid State Drives• Printer Sensor• Printer Control Board• Multi-Function Copier Machine• DVD Recorder Power Supply• Power Supplies for Servers, PCs,

Notebooks, and Netbooks• Over-voltage Protection for HDD and DC

Port Protection for Keyboard Mouse

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Consumer Electronics

Key Capabilities

Flexible Electronics Manufacturing Services (EMS) including

• Cost-Effective High-Volume Manufacturing • Firmware Development• Mechanical Enclosure Design• Low Profile Switch Mode Power Supplies• Pre-certification Testing• Test Equipment Development• Flip Chip Process• Automatic Pin Insertion• Complete Box Build Assembly• Low to High Power Outline Packages• Small to Large Outline Packages• Specialized Interconnect Process for Product

Power Requirements• Plastic Injection

Experience

• Ultrasonic Toothbrush• Hybrid IC• Gas Ignitor and Re-Ignitor• Air-Conditioning (HVAC) Controller• Projector Lamp Drivers• Refrigerator and Cooker Hood Control Board• Power Management & Home Appliance for Lighting Control• Household Metering Device• Bluetooth Headset• Electric Drive Control for Home Appliances• Main Power Supply for Flat-panel TV• Power Supply for Game Consoles and Entertainment Electronics• High Voltage Power Conversion ICs in Adapters and Chargers for

Personal Electronics• Garage Door Control• Programmable Timer• Pressure Cooker Modules• Steamer Controller Modules• Washing Machine controllers• Coffee Machine

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Renewable Energy

Key Capabilities


• PV Module or Panel Design/Co-Development

• Materials Qualification

• Process Development

• Prototyping

• Panel Testing and Certification (with RETC) Low-Volume Manufacturing of Engineering or Marketing Samples

• 2.3 MW Low Volume Capacity (in Fremont, CA , USA)

• 30-60MW High Volume Capacity (in Jiaxing, China)

• Development of Solar Inverters (in Singapore)

Experience

• PV Panel Assembly• PV Co-Design & Development• PV Panel High Volume Mfg.• PV Panel Platform• PV Inverter Platform• Inverter Electronics

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IMI SITES OVERVIEWS

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IMI Bulgaria – Botevgrad Overview

Map:

Site: Botevgrad, Bulgaria

Location: 60km from Sofia International Airport 45 min by car

Address: Integrated Micro-Electronics Bulgaria Industrial Zone "Microelektronika" P.O. 662140 Botevgrad, Municipality of BotevgradSofia District, Bulgaria

Contact Numbers: Tel: +359.72.36.83.00

Fax: +359.72.36.82.46

Site Details | Botevgrad

Date Founded 1998

Footprint 23,778 sq.m. (about 255, 944 sq.ft.)

Headcount 1,183 employees

Markets Served Automotive, Industrial, Consumer Electronics

Site Capabilities PCBA: SMT, COB/COF/ IC Encapsulation, Pin Through Hole, Automatic Pin Insertion, Wave Soldering, Selective Soldering System, BGA, X-ray, Nitrogen Equipment, Protective Coating, ICT/ FCT Test, Thermopaste Dispensing, AOI, Plastic Injection, Embedded Toolshop, Overmoulding, Box build: Mechanical Design and Assembly,

Experience Wiper Systems, Steering Wheel Controls, Cockpit Control Devices, Dashboard Elements; Truck Opening Systems, Security Devices, ECU Modules, Sensors for Cars, Steering Sensors, Control Unit Panels, Audio Processors; Power Management, Remote Control, Fuel Management, RF Modules, Lighting Control Devices, Programmable Timers, Pressure Cooker Modules, Steamer Controller Modules, Washing Machine Controllers, Coffee Machines

Certifications ISO/ TS 16949, ISO 9001, ISO 14001

Botevgrad

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IMI China - Shenzhen (Liantang) Overview

Map:

Site: China, Shenzhen (Liantang)

Location: 55km from Hong Kong International Airport;around 75min by car

Address: Shenzhen Speedy-Tech Electronics Co., Ltd.Speedy-Tech Industrial Building, Area 7 of Liantang Industrial Zone, Luo Hu, Shenzhen P.R.C. 518004

Contact Numbers: Tel: +86.25708382

Fax: +86.25708019

Site Details | Shenzhen (Liantang)

Date Founded 1988

Footprint 18,600 sq. m. (about 200,208 sq. ft)


Markets Served

Communication, Backplane Wireless Metering & Wireless Security System

Site Capabilities

Turnkey & Consignment, HMLV & LMHV, SMT & PTH lines, BGA & COB, X-ray, AOI, ICT, Functional Testing, Test Development: H/W & S/W PCBA Assembly & Full System Box Build, New Product Introduction (NPI) Center; Central Warehouse, Logistics Services, D&D Center

Experience Back Panel for Telecommunication Board, Fiber Optic Product, POA Product, Wireless Security System, RF Metering

Certifications ISO9001:2000, ISO14001:1996, TL9000

Liantang

KuichongFuyong

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IMI China - Shenzhen (Kuichong) Overview

Map:

Site: China, Shenzhen (Kuichong)

Location: 95km from Hong Kong International Airport; around 1hr 40min by car

Address: Shenzhen Speedy-Tech Electronics Co., Ltd.Building A-3 & 4, Benkang Industrial Zone, Jinye Road Kuichong Town, Longgang District, Shenzhen, P.R.C


Fax: +86.89773068

Site Details | Shenzhen (Kuichong)

Date Founded 2004

Footprint 18,000 sq. m. (about 193,750 sq. ft )


Markets Served Computing, Consumer for Switching Mode Power Supply

Site Capabilities Turnkey & Consignment, HMLV & LMHV, SMT & PTH lines, BGA & COB, X-ray, AOI, ICT, Functional Testing, Test Development: H/W & S/WPCBA Assembly & Full System Box Build, New Product Introduction (NPI) Center; Central Warehouse, Logistics Services

Experience Switching Mode Power Supply, BMP for Communication, Bluetooth Headset, DAB (Digital Audio Broadcast) Module / IR (Internet Radio) WiFi Module, Air Conditioning Control Board, Gas Ignitor, Power Management & Home Appliance for Lighting Control

Certifications ISO9001:2000, ISO14001:1996, ISO/TS16949, ANSI/ESD S20.20

Liantang

KuichongFuyong

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IMI China - Shenzhen (Fuyong) Overview

Site Details | Shenzhen (Fuyong)

Date Founded 2007


Headcount 832 employees

Markets Served

Communication, Industrial

Site Capabilities

Turnkey & Consignment, HMLV & LMHVSMT & PTH lines, BGA & COB, X-ray, AOI, ICT, Functional Testing, Test Development: H/W & S/W, PCBA Assembly & Full System Box Build, New Product Introduction (NPI) Center; Central Warehouse, Logistics Services

Experience Power Communication Industry Power Unit

Certifications ISO9001:2000, ISO14001:1996, TL9000

Map:

Site: China, Shenzhen (Fuyong)

Location: 4.4km from Shenzhen - Baoan Airport; 15-20 min by car

Address: Shenzhen Speedy-Tech Electronics Co., Ltd.Building No. 1 Technological Park, Tang Wei,Fuyong Town, Bao'an District, Shenzhen P.R.C


Fax: +86.89773068

Liantang

KuichongFuyong

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IMI China - Jiaxing Overview

Site Details | Jiaxing

Date Founded 2002



Markets Served Consumer, Industrial, Automotive, Computing, Communication

Site Capabilities Turnkey & Consignment, HMLV & LMHV, SMT & PTH lines, BGA & COB, X-ray, AOI, ICT, Functional Testing, Test Development: H/W & S/W, PCBA Assembly & Full System Box Build, New Product Introduction (NPI) Center; Central Warehouse, Logistics Services

Product Examples Projection TV Lamp Driver & LCD Projector Driver,RFID Door Lock, Receiver for High Performance GPS Module, Controller for Automotive Engine; Car Diagnosis Control Board, Headlight PCBA; Refrigerator Temperature Sensor, Blood Pressure Measuring Device PCBA, Window Lift, Mirror, Sunroof, Main Light PCBA

Certifications ISO9001:2000, ISO14001:1996, ISO/TS16949, Sony GP, QC80000

Map:

Site: China, Jiaxing

Location: 140km from Pudong International Airport; 1.5hr to 2hr by car

Address: Speedy-Tech Electronics (Jiaxing) Co., Ltd.Speedy-Tech Building, Bld 1-3, No. 688.Heping Road, Industrial Park, Jiaxing City, Zhejiang, P.R.C.

Contact Numbers: Tel: +86.573.82224999

Fax: +86.573.82210558

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IMI China - Chongqing Overview

Map:

Site: China, Chongqing

Location: 19km from Chongqing Jiangbei International Airport; around 35min by car

Address: Speedy-Tech Electronics (Chong Qing) Co. Ltd.Venus Building, No.60, Starlight Avenue, Hi-Tech Development Park Northern New District,Chongqing, P.R.C.


Fax: +86.023.67889879

Site Details | Chongqing

Date Founded

2005



Markets Served

Telecom, Automotive, Consumer, Industrial Computer Peripherals

Site Capabilities

Consignment, HMLV, SMT & PTH Lines, BGA, X-ray, AOI, PCBA Assembly & Full System Box Build, New Product Introduction (NPI) Center; Central Warehouse, Logistics Services

Experience TV BOXSmart Meter

Certifications ISO 9001:2000

43


IMI China - Chengdu Overview

Map:

Site: China, Chengdu

Location: 20km from Chengdu Shuangliu International Airport; around 35min by car

Address: Speedy-Tech Electronics (Cheng Du) Co. Ltd. Muwei Industrial Park, Huanghe Road, XinduDistrict Industrial East, Chengdu City, Sichuan, P.R.C.


Fax: +86.028.83958566

Site Details | Chengdu

Date Founded 2010



Markets Served

Communication, Industrial

Site Capabilities

Turnkey & Consignment, HMLV & LMHVSMT & PTH Lines, BGA & COB, X-ray, AOI, ICT, Functional Testing, Test Development: H/W & S/WPCBA Assembly & Full System Box BuildNew Product Introduction (NPI) Center, Central Warehouse, Logistics Services

Experience Communication PowerIndustry Power Unit


44


IMI Czech Republic – Třemošná Overview

Map:

Site: Třemošná, Plzeňská, Czech Republic

Location: 100km from Prague International airport, 1hour 20min by car

Address: Integrated Micro-Electronics Czech Republic S.R.O.Plzeňská 1067, Třemošná 330 11Czech Republic

Contact Numbers: Tel: +420.377.88.26.11

Fax: +420.377.88.26.10

Site Details | Třemošná

Date Founded 1991

Footprint 7,740 sq.m. (about 83,313 sq. ft)


Markets Served

Automotive, Industrial, Consumer Electronics

Site Capabilities

PCBA: SMT, Pin Through Hole, Automatic Pin Insertion, Wave Soldering, UltraSonic Welding, Selective Soldering System, BGA, Protective Coating, RF Testing, ICT/ FCT Test, AOI, Mechanical Assembly

Experience Power Management, Led, Remote Control, Fuel Management, Pump Driver, Current Sensor, Seating Controls, Garage Door Control

Certifications ISO/ TS 16949, ISO 9001, ISO 14001

Tremosna

45


IMI Mexico – Guadalajara Overview

Map:

Site: El Salto, Guadalajara, Mexico

Location: 6km from Guadalajara International Airport10min by car

Address: Integrated Micro-Electronics México, S.A.P.I. de C.V.Calle 4 Poniente No. 10560Parque Industrial El Salto C.P.45680, El Salto, Jalisco, México

Contact Numbers: Tel: +52.33.4777.1500

Fax: +52.33.4777.3263

Site Details | Guadalajara

Date Founded 1996

Footprint 18,000 sq. m. (about 193 750 sq.ft.)


Markets Served Automotive, Industrial, Consumer Electronics

Site Capabilities PCBA: (Pb & LF): SMT, AOI, Pin Through Hole (Pin Insertion, Radial/Axial), Wave Soldering (Hot Bar and Selective), Protective Coating, ICT/ FCT Test Plastic Injection : from 50 to 850T + Vertical Bi-injection (220T)/Individual Dryers for every Machine, supported by Embedded Toolshop(CNC, EDM,...) and 3D Inspection CMM Box built : Customized Operations for PCBA and Plastic Box assembly

Experience 98% Automotive Oriented PCBA: Flex Boards, LEDs, Pin Paste, Sensors with Strict Tolerances on Positioning, Power Management, Injected Molded Plastics; Functional: Cosmetic, Optical and Over Molded Plastic Parts; Development of Molds, Partnerships for Inserts and Painting + Laser Graving Parts.

Certifications ISO/ TS 16949, ISO 14001, ISO 9001/9002

46


IMI Philippines - Laguna Overview

Map:

Site: Biñan, Laguna

Location: 47km from Ninoy Aquino International Airport;around 45min by car

Addresses: Integrated Micro-Electronics, Inc.Site 1 - North Science AvenueSite 2 - 103 Trade Ave corner Technology Ave, Phase 4Special Export Processing Zone, Laguna TechnoparkBiñan, Laguna, Philippines


Site Details | Biñan, Laguna

Date Founded 1980

Footprint 96,182 sq. m. (about 1,035,294 sq.ft.)


Markets Served

Automotive, Computing, Industrial, Medical, Consumer Electronics and Communications

Site Capabilities

DFM, NPI, Test & System Dev’t, SMT (inc. In-line SP-AOI, Post-Reflow AOI, X-ray), ICT, FCT, PCBA & Box-Build Assembly, COB (inc.DA of Imager Die), COF, Al Wirebonding, Robotic & selective wave soldering, ACF & Hotbar (Flex to rigid board), Heat stake & ultrasonic weld for plastic enclosureClass 10k Facility w/ Class 100 Laminar Flow Hood, LVHM and HVLM

Experience Automotive Camera, Electronic Power Steering (EPS) Rotor Position Sensor (RPS), Car Windshield Temperature and Humidity Sensor, Advanced Warning System Camera, HDD, DVD/RW, Hybrid IC, Transistors, Voice Coil Motor, Gyroscope, Accelerometer, Power Amplifier, Electronic Door Access System,Hearing Aid, etc.

Certifications ISO 9001:2008, ISO 14001:2004, ISO/TS16949:2009, ISO 13485:2003, QC080000, ISO/IEC 17025:2005

Site 1 Site 2

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IMI Philippines - Cavite Overview

Site Details | Cavite

Date Founded 1991

Footprint 2,350 sq.m.(about 25,295 sq.ft.)


Markets Served Industrial, Medical

Site Capabilities

SMT & PTH lines, BGA, X-ray; ICT, Functional Testing, PCBA Assembly & Full System Box Build, New Product Introduction (NPI) Center, LVHM

Product Examples

Switch Mode Power Supply, Industrial Inkjet Printers, Wind Turbine Controllers, Siren Amplifiers, Remote Controls, Motor Controllers, Hearing Diagnostic Equipment, Dental Diagnostic and X-ray Equipment, Chemical Analysis and Clinical Mixers, Intraoral Dental Camera

Certifications ISO 9001:2008, ISO 14001:2004, ISO 13485:2003

Map:

Site: Cavite, Philippines

Location: 20km from Ninoy Aquino International Airport; around 45min by car

Address: Speedy-Tech Phils. Inc.Block 16 Phase IV PEZA, Rosario, Cavite Philippines 4106


Fax: +63.46.4370537

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PSi Technologies - Taguig OverviewSite Details | Taguig City

Date Founded 1988

Footprint 8,607 sq.m. (about 92,651 sq. ft)


Markets Served Industrial , Automotive , Consumer , Computer and Communications

Site Capabilities Customer Specific Quality Requirements, e.g., Critical Part Monitoring (CPM), Reject Profile Analysis (RPA), Parts Average Test (PAT), and Statistical Bin Analysis, Medium to High Power Discrete Packages and Process including Large Diameter Wire Bonding, Miniaturized Power Packaging - Power QFN, PowermiteTM and Process - Cu Clip and Au Wire/Al Wire Bond, High Reliability Hermetic Packages - Metal Cans and Ceramic Packages

Product Examples Low-Medium Power Packages - TO 220 Fpak 2/3L; PowerFlex 2/3/5/7L, TO252 / TO251, TO 263 2/3/5L; 3 x 3 mm QFN, 3.3 x 3.3mm QFN ; 5x6mm QFNMedium-High Power Packages: SOT 93 3L, TO 247 3L, TO 264 3/5L, SOT 227, SP3, DRF, ARF

Certifications ISO 9001:2001, TS 16949:2002, ISO 14001, Mil-PRF-38535, ANSI ESD S2020

Map:

Site: Taguig City, Philippines

Location: 20km from the Ninoy Aquino International Airport;around 35min by car

Address: PSi Technologies, Inc.Food Terminal Inc. Special Economic ZoneElectronics Avenue, Taguig City, Philippines 1633


Fax: +63.2.8384648

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PSi Technologies - Laguna Overview

Site Details | Calamba, Laguna

Date Founded 1999

Footprint 6,968 sq.m. (about 75,000 sq. ft.)


Markets Served

Industrial , Automotive , Consumer , Computer and Communications

Site Capabilities

Power Management (IC) Discrete Packaging, e.g., 5 - 7L TO-220, Diversified Packaging - from Low to High Power and Small to Large Outline

Product Examples

Small Signal Packages - SOT 223 3L Low-Medium Power Packages - SOT 82 Low-Medium Power Packages - TO 220 2/3/5/7L

Logistics Customs Clearance (24x7) Import & Export. Full Warehousing Function:-Receiving, Storage, Kitting, Customer Delivery. Transportation, Customs Compliance

Certifications ISO 9001:2001, TS 16949:2002, ISO 14001, ANSI ESD S2020

Map:

Site: Calamba, Laguna, Philippines

Location: 50km from Ninoy Aquino International Airport; around 1hr by car

Address: PSi Technologies Laguna, Inc.Lot No. B2-5, Carmelray Industrial Park IIBrgy Tulo, Calamba, Laguna 4027 Philippines


Fax: +63.49.5080194

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IMI Singapore Overview

Site Details | Singapore

Date Founded 1985



Markets Served Industrial, Medical

Site Capabilities

SMT & PTH Lines, BGA, AOI, X-ray; ICT, Functional Testing, Test Development: H/W & S/W; PCBA Assembly & Full System Box Build; Central Warehouse, Logistics Services, HMLV

Experience High Speed Impact Printers, Thermal Printers, Wire Bonding Equipment PSU, Infant Tag System, Portable Dental Equipment

Certifications ISO 9001:2008, ISO 14001:2004, ISO 13485:2003

Map:

Site: Singapore

Location: 42km from Changi Int'l Airport;around 40min by car

Address: Speedy-Tech Electronics Ltd. Speedy-Tech Industrial Building20 Kian Teck Lane Singapore 627854


Fax: +65.62626668

Kian Teck Drive

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IMI USA - Tustin Overview

Site Details | Tustin CA

Date Founded Feb 1, 2005 acquisition by IMI



Markets Served Automotive, Medical, Industrial

Site Capabilities

Engineering Development and Prototype Manufacturing Center, Full Range of Assembly Capabilities with focus on Precision Assembly, SMT, COB FCOF, Process Development

Experience Automotive Image Sensor Modules, Hearing Aid Assemblies, Industrial MCM, Industrial Printer


Map:

Site: Tustin, CA., USA

Location: 5km from the Orange County, Santa Ana Airport; around 10min by car

Address: IMI USA Inc.14312 Franklin Avenue, Tustin, CA 92780


Fax: +1.714.838-8787

52


IMI Energy Solutions - Fremont Overview

Site Details | Fremont CA

Date Founded 2010



Market Served Renewable Energy

Site Capabilities

PV Module or Panel Design/co-Development (Material Qualification, Process Development), Solar Panel Testing and Certification, Solar Panel Prototyping Development, Low-Volume Manufacturing, Inverter Platform, EMS and Test Services for Control Electronics of Solar Systems.

Experience PV Panels

Certifications IEC 61215, IEC 61730, UL 1703

Map:

Site: IMI Energy Solutions, Fremont, CA.

Location: 21km from San Jose International Airport; around 23min by car

Address: IMI Energy Solutions 46453 Landing Parkway Fremont, CA 94538


Fax: +1.510.7709937

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Corporate Social Responsibility

Environmental Protection

IMI Energy SolutionsEnvironment, Health, and Safety (EHS) ProgramHazardous Substance Process Management System (HSPM)

Community InvolvementVolunteerism for Education, Environment, and Entrepreneurship ProgramsMedical Missions

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IMI, Your Preferred Partner

Innovative, comprehensive solutions within one company

Technology/engineering orientation

Proven track record of serving global OEMs

LVHM and HVLM manufacturing capabilities

Flexible business set-ups

Financial stability

55


THANK YOU

IMI Group Presentation

Documents

Transcript of IMI Group Presentation