IEEE COMCAS 2017 COMCAS 2017 CFP 09.01.2017.pdf · research results, and industry experience in the...
Transcript of IEEE COMCAS 2017 COMCAS 2017 CFP 09.01.2017.pdf · research results, and industry experience in the...
Communications and Sensors5G systems & millimeter wave propagationCognitive Radio & Spectral SharingCommunications SecurityFirst Responder/Military Communications Green Communication Internet of Things Long Range Low Power Networks Micro/Pico/Femtocell Devices and Systems MIMO Antenna Systems for Communications Modulation & Signal Processing TechnologiesOn-Body and Short Range Communications Radio over Fiber & Optical/Wireless Convergence Sensor Networks and TechnologiesSoftware-Defined Radio & Multiple Access Space-Time Coding and Systems
Antennas, Propagation, and ScatteringSmart Antennas, Beamforming and MIMOWave Propagation and Channel ModelingWave Scattering and RCSNanoEM, Plasmonics, and ApplicationsMetamaterials, FSS and EBGEM Field Theory and Numerical TechniquesEM Interference & Compatibility, SISpectrum Management and MonitoringELF, RF, µWave, mmW and THz Measurements
Signal Processing (SP) and ImagingMicrowave Imaging and TomographyAcoustic/Sonar Imaging and TechniquesRadar SP and Imaging, SAR, ATR MIMO SP for RadarGround and Foliage Penetration SystemsSignal Acquisition and Sensor ManagementDF, Emitter Location, Elint, Array Processing Target Detection, Identification and TrackingData FusionTime Domain and UWB SP
Summary Submission: April 20, 2017Acceptance Notification: July 5, 2017 Full Paper Submission: September 4, 2017
RF/MW Devices and Circuits, RFICsSolid-State Devices, RFICs µWave, mmW and Sub-mmW Circuits/Technologies Nano and THz Devices/TechnologiesMicrowave PhotonicsPassive Components and CircuitsFilters and MultiplexersFerroelectrics, RF MEMS, MOEMS, and NEMSActive Devices and CircuitsRF Power Amplifiers and DevicesTunable and Reconfigurable Circuits/Systems Analog/Digital/Mixed RF Circuits Circuit Theory, Modeling and ApplicationsInterconnects, Packaging and MCM CAD Techniques for Devices and CircuitsEmerging TechnologiesThermal Management for Devices
Microwave Systems, Radar, Acoustics Aeronautical and Space Applications RFID Devices/Systems/ApplicationsAutomotive/Transportation Radar & CommunicationsEnvironmentally Sensitive (“Green”) DesignUWB and Multispectral Technologies & SystemsEmerging System ArchitecturesModelling Techniques for RF SystemsRadar Techniques, Systems and ApplicationsSonar Systems and ApplicationsWireless Power Transfer & Energy HarvestingTerahertz Systems Biomedical Engineering Advances in MRI: Technology, Systems and ApplicationsMedical RF, MW & MMW Applications and DevicesMedical Imaging and Image Processing
Call for Papers
Important Deadlines
For more information visit:
www.comcas.orgEmail: [email protected] Organizing CommitteeConference Chair:Shmuel AusterElta Systems Ltd, Israel.IEEE AP/MTT Chapter Chair
Technical Program Chair:Amir BoagTel Aviv University, Israel
Technical Program Co-Chairs:Stephen B. WeinsteinCTTC, USACaleb FultonUniv. of Oklahoma, USAOren EliezerPhazr, Texas, USALance M. KaplanUS Army ARL, USAAleksey DyskinTechnion, Israel Reuven ShavitBen-Gurion University, IsraelOfer BarneaTel Aviv University, Israel
Publications Chair:Benjamin EpsteinECS Inc., USA
Global Administration:James RautioSonnet Software USA
Exhibition Co-ChairsOren HagaiInterlligent, Israel
Tali Pe’erAnalog Devices, Israel
Students and Young Professionals:Aleksey Dyskin Technion, Israel
Yiftach RichterBar Ilan University, Israel
Treasurer:Robert C. ShapiroIEEE ComSoc
Electronic Submissions Chair and Co-chair:Benjamin EpsteinECS Inc., USAMatthias RudolphBTU Cottbus, Germany
Local Arrangements Chair:Itai VollerAEAI, Israel
Publicity Chair and Co-ChairsCarl SheffresMicrowave Journal, USAPat HindleMicrowave Journal, USAGary LerudeMicrowave Journal, USASherry HessNI/AWR, USAAntti LautanenNI/AWR, FinlandTushar SharmaUniversity of Calgary, Canada
Members at Large:Barry S. PerlmanIEEE MTT SocietyDouglas N. ZuckermanIEEE Communications Society
Advisor:Paz Itzhaki-WeinbergerIWC Ltd, Israel
All submitted papers will be peer reviewed. Accepted papers will be published in the COMCAS 2017
Proceedings, which will be submitted for inclusion to IEEE Xplore®.
For author’s instructions and further information, see www.comcas.org.Secretariat:
Ortra Ltd.Tel-Aviv, IsraelTel: +972-3-6384444 Fax: +972-3-6384455Email: [email protected]
COMCAS 2017 continues the tradition of providing an international, multidisciplinary forum for the exchange of ideas, research results, and industry experience in the areas of microwave/RF/mm-wave engineering, communications, antennas, solid state circuits, electronic devices, engineering in medicine, radar, sonar and electronic systems.
The technical program includes invited talks by international experts and contributed papers and will be complemented by a large industrial exhibition.
IEEE COMCAS 2017International Conference on Microwaves, Communications, Antennas and Electronic SystemsDavid Intercont inental Hotel 13-15 November 2017 Tel Aviv, I s rae l
Papers are solicited in a wide range of topics:
www.comcas.org