Http:// Terrence E. Zavecz [email protected] Weir TR Temporal and Sequential Data Analysis and...

http://www.TEAsystems.com

Terrence E. Zavecz [email protected]

Weir TRTemporal and Sequential Data Analysis and Performance Matching Interfaces ofThermal, Probe and CD Uniformity data

Data Loading speed increase 5x to 8x Improved wafer modeling Improved intra-site data interpolation Wafer-Contour plot speed improvement 12x to 20x

Improvements with Release 2.0

http://www.TEAsystems.com - 2Yield Enhancement thru ModelingTEA SystemsTEA Systems

Product Features Weir TR Sequence & Weir TR Matching

o Requires Weir TR version 2.0 or later.o Product has two interfaces

Weir TR; Sequence AnalysisTime dependent analysis of Temperature or

any metrology variableDerives critical phase elements of the cycle

Weir TR: MatchingTwo dataset/system matching of

Thermal-to-Thermal Thermal-to-Metrology Metrology-to-Metrology

Can use Weir TR Temporal Analysis calculated variablesExample:

Cumulative-Energy vs feature sizeMatch any metrology, probe or sequence data

Weir TRRange response by sensor over time

Weir TR: MatchingTemperature-to-BCD Feature


Weir TR Time Response Analysis Data sources

Accept sequenced or time based data from any metrology source

Clean-Track, Develop & In-line Data

Scanner log and metrology

Metrology & Probe Data

CD-SEM and Scatter

Wafer & Substrate Sensor

Weir PW Process Derived Analyses &

Variables


Weir TR Temporal AnalysisProduct Features

Weir TR; Temporal Analysis Time or Sequence dependent analysis of Temperature or any metrology variable Automated time-phase deconvolution of constant and rise/fall segments Energy or (Time* Temperature) calculation with temperature threshold Local velocity or rate-calculations of rate of local change with time Automated whole-substrate or individual sensor response Critical cycle-point analysis Substrate contour mapping/vectoring

Matrix display Single time-slice Animation of contour response Variables used and derived include temperature, rate-of-change, acceleration-of-

change, Energy, Cumulative Energy

Sensor change-rate vs Temperature


Thermal response ranges

Displays variation at each sensor relative to average temperature of wafer


Average times for each phase

Data is saved in Weir Data Workbook

Phase Period Type TimeStart TimeEnd TimeDelta TempStart TempEnd TempDelta Energy (deg*sec) Ramp (deg/sec)1 Constant 10.0 1063.1 1053.1 319.8 279.5 -40.3 2.740E+05 -0.04032 Constant 1078.1 1223.4 145.3 280.0 282.0 2.0 4.090E+04 0.01563 Rise 1238.4 1396.9 158.4 285.3 340.3 55.0 5.120E+04 0.35244 Constant 1411.9 1905.0 493.1 340.7 341.7 1.1 1.680E+05 0.00275 Rise 1920.0 2053.4 133.4 344.5 381.6 37.1 4.960E+04 0.28606 Constant 2068.4 2275.0 206.6 381.3 379.5 -1.8 7.850E+04 -0.00957 Rise 2290.0 2380.3 90.3 383.3 395.1 11.9 3.540E+04 0.15758 Constant 2395.3 2560.0 164.7 395.1 394.5 -0.7 6.500E+04 -0.0036


Automated Phase Deconvolution

Statistics show four thresholds which are plotted as yellow-filled squares.

Range of data across wafer @ time is plotted by blue circles

Max Temp

Min Temp

Phase change

Range


Critical phase evaluation by sensor point

Customize the sampling or graphic to zoom-in on time/sequence critical segments


Cumulative Energy

Integrated energy at each sensor shown and the phase in which it

occurred Graphics are provided by:

Sensor/phase Rise time/sensor & phase Substrate Response as a

function of Radius

Integrated energy at each sensor shown and the phase in which it

occurred Graphics are provided by:

Sensor/phase Rise time/sensor & phase Substrate Response as a

function of Radius

Graphics selection interface tabs


Temperature Mean, Rise, Phase Length, Start Value


Local Rate Change Variation

Local Rate Change plotted at 8 times over critical final rise

Notice initial rise on left side of wafer at 2295 seconds with a slope range from 0.217 to 0.256 dec/sec

rise


Vector/Contour mapping of user selected time-slices

Three vector plots of accumulated energy


Local Acceleration, Temperature & Rate-of-Change

Data taken at 2370 seconds


Localized Rise/Fall Plot vs Variable

Details process-critical response to any variable such as temperature

Raw Temp vs Time Cycle

Mouse-zoomed response at critical

settling point


Threshold Analysis data

Data from the “RiseTimesPhase” worksheet for 16 sensors Transition points are marked on the thermal curve as black squares with a yellow center (previous slide) Data stored on Weir TR Spreadsheet in data workbook

Temperature variation


Separate window display of Thermal variation

Matrix view Animation also

provided


Weir TR MatchingProduct Features

Weir TR; Matching Match any two Temporal/Metrology/Log sources Match Bake, Temperature,Cumulative Energy ,

Process etc uniformity Infinitely-Variable Rotation and Notch Alignment

Controls Features Includes:

Automated data culling Histograms, contour, vector, XY, etc plots. Individual time-slice or integrated analysis Model across-wafer variation User-customized graphics Easy plot/copy into reports/html interfaces Reports and data stored in standardized workbook

format

Across-Wafer ModeledBottom CD Variation

Across two Bake Plates

(Scatter data)


Weir TR Time Response Analysis Data sources

Any metrology, sequenced or log based data

Clean-Track, Develop & In-line Data

Scanner log and metrology

Metrology & Probe Data

CD-SEM and Scatter

Wafer & Substrate Sensor

Weir PW Process Derived Analyses &

Variables

Weir TR Temporal Analysis Variables


Basic Operation of Weir TR Matching

Wafers from two separate bake plates shown

Provides a basic visual & statistical match comparison

Covariance matching over time/space

Compare static or sequential data For example; Bottom

CD to Temperature or Cumulative Energy on the substrate


Variable Culling

BCD based culling removed 309 data points to properly display wafer-graphic shown on left

Easily removed Intra-Field variation and improves accuracy

Original BCD data distribution

Command used to generate histogram

And then apply the wafer model


Individual graphics

Comparison of BCD variation for wafers generated on two separate hot-plate Post Exposure Bakes


Variation by X-location on wafer

Vector

Contour

Radial

XY Horizontal

XY Vertical

VS Time/sequence

Data here not modeled, this is raw data


Modeled wafer variation

BCD Modeled variation due to slow across-wafer changes Data from two bake plates


BCD wafer fit to temperature

Response as a function of X position on the wafer On-Wafer Temperature at 135.52 sec vs final Wafer-Modeled BCD 2nd order line fitted to each dataset using mouse interface


Weir TR calculated Cumulative Energy and BCD Variation

Contour grid (left) can be turned on/off


Thermal-Time Cycle & BCD Information


Thermal Energy & wafer-modeled BCD Problem

OnWafer probe and CD-SEM oriented wafer differently

Left=Thermal vector plot Right= Scatter-tool

Contour


Thermal rotated by –135 degrees

Data Rotation interface allowed thermal data to be rotated by –135 degrees to provide improved alignment


PEB and feature- BCD as contour plots Weir TR calculated

Accumulated Energy from PEB cycle matched to BCD variation

Performed after rotation


Radial Variation


Horizontal Variation: Temperature vs BCD modeled


Modeled Comparison of Temperature & Top CD (TCD)

Analysis used the BCD variable to remove “poor” metrology Any variable such as

MSE, TCD, BARC, SWA etc can be used to cull data


Thermal and Feature DistributionsTemperature @ 30 sec BARC SWA2 (Side Wall Angle)

Bottom Feature Size (BCD)Top Feature Size (TCD)SWA1 (Side Wall Angle)

http://www.TEAsystems.com

Terrence E. Zavecz [email protected]

Weir TR: MatchingThermal Response Comparison of two hot plates

Comparison of two separate PEB bake plates


Time sequence for two bake plates


Timed Response of Temperature


Temperature response at curve peak


Temperature at 148.77 Sec


Horizontal variation across plate

Hot-plate comparison for two PEB sequences Temperature variation at 148.77 seconds Fitted curves up to 4th order can be mouse-added to plots


Total cumulative Energy @ end of cycle


Summary Two very-unique companion products are offered

Weir TR – Time/Sequence Response Analysis software Weir TR – Matching for any sequence, probe or metrology data

Weir TR: Time Response Goes beyond thermal sensor software provided by OnWafer & SensArray Automated

Sequence Phase extraction Process-Energy Injection calculation Localized Rise/Fall calculation & plotting Individual phase and sensor analysis

Vector, histogram and XY plots of any time/sequence slide Matrix, Animation and visualization plots

Weir TR: Matching Matching software for Critical Features and metrology elements

Similar to historic overlay matching methods Includes ability to match time/sequenced data

Such as Post-Exposure Bake, scanner logs, OnWafer & SensArray data Match

Time-to-time Time-to-Feature distribution Feature-to-Feature

Automated Data culling Wafer Model Data Rotational Alignment

Http:// Terrence E. Zavecz [email protected] Weir TR Temporal and Sequential Data Analysis and...

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