HPC Futures The technology challenges · HPC Futures The technology challenges Jonathan Follows...
Transcript of HPC Futures The technology challenges · HPC Futures The technology challenges Jonathan Follows...
HPC FuturesThe technology challenges
Jonathan FollowsSTFC Daresbury Laboratory
Tuesday April 17th, [email protected]
Background
• This presentation results from an internal PRACE “deliverable” in which an analysis of the likely challenges and implications for high performance computing based on technology trends with likely applicability in the 2012-2015 time period was performed.
The road to Exascale
The challenges
• Energy• Memory• Interconnect• Cooling• Operating system• Hardware reliability• Application reliability
• Management• Processor• Packaging• Storage• File system• Archive• Application
Extrapolations to Exascale
The energy challenge
• 500MW target for 1Eflop/s system using current technology– 200MW compute– 150MW memory– 150MW communication
• To get to 50Gflop/s/W• Today the Blue Gene/Q prototype is
~2Gflop/s/W
The cooling challenge
• Liquid cooling, especially warm water cooling, 45 degree Celsius inlet temperature?
• Not just cooled rear doors on racks – direct liquid cooling of processor and memory chips
• Reduce processor clock speed to reduce cooling requirement
• 3-D stacking of components may require microfluidics technologies to cool
The hardware reliability challenge
• Mean time between failure must be reduced• “System on a Chip” reduces the number of
chips in a system• Additional redundancy points – more
processor cores both for yield and reliability
The application reliability challenge
• Today’s applications do not cater for failure of system components
• Will tomorrow’s applications have to?• Or will tomorrow’s systems transparently
migrate applications away from failing components?
The processor challenge
• CMOS technology got us to 2-5GHz• Increasing power by increasing number of
cores per chip from here on• 100MW “brute force rather than elegance” of
huge complex multi-core processors today• Future low power, low clock speed embedded
technologies– GPUs and other accelerators– FPGAs
The application challenge
• Heterogeneity and multi-level programming techniques: all of– MPI– OpenMP– OpenCL
• Resilience and how to cater for failure• New programming languages
– Partitioned global address space (PGAS) languages such as co-array Fortran are slowly developing
– Easier models for code development but require maturity and better hardware support for good performance
Things we will see by 2015• 15nm fabrication• New memory
technologies• More many-core chips• Many low-power floating
point cores• Field Programmable Gate
Arrays• Configurable silicon
• System-on-chip• Network-on-chip• CPU+FPU integration• New interconnect
technologies• Flexible topologies• 3D stacking• Hot water cooling• Desk-side Petaflop/s
systems
Summary
• Although there are many technical challenges, Exascale systems will be built
• Applications and algorithms will require major development efforts to take advantage of these systems
• Today’s capability computing is tomorrow’s capacity computing
• Is the era of commodity HPC over, though?