HMT Heat conduction Experiments

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    Lab Session 1

    Statement:

    Investigation of Fourierslaw of heat conduction by using same material.

    Apparatus:

    Heat conduction apparatus, Brass sample.

    Theory:

    Conduction:

    Heat movement due to small molecules e.g. at microscopic level heat movement.

    When we place one end of iron rod on lighted candle and other end is on our hand

    then this end will be soon hotter as metal is good conductor of heat and electricity.

    By vibrating molecules will transfer heat to other molecules. A conduction

    phenomenon is in following order:

    Solid>Liquid>Gases

    Convection:

    Heat movement due to bulk molecules e.g. at macroscopic level of heat transfer e.g. heat transfer

    from bike engine to the environment. Drop the red color in water after some time whole water

    will get red color.

    Natural convection: When fluid coincides with cooler body then it will transfer its energy to

    cooler body its density decreases.

    Forced convection: Fan is used to increase the rate of cooling.

    Radiation:

    Inphysics,radiation is a process in whichelectromagnetic waves (EMR) travel through

    avacuum or through matter-containing media; the existence of a medium to propagate the waves

    is not required. Everybody emits radiation but radiation is from higher temperature to lower

    temperature.

    E.g. Solar radiation reaches to earth. Earth is also emitting radiation but radiation travels is from

    higher to lower temperature.

    http://en.wikipedia.org/wiki/Physicshttp://en.wikipedia.org/wiki/Electromagnetic_radiationhttp://en.wikipedia.org/wiki/Vacuumhttp://en.wikipedia.org/wiki/Vacuumhttp://en.wikipedia.org/wiki/Electromagnetic_radiationhttp://en.wikipedia.org/wiki/Physics
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    Fourier Law of Heat Conduction

    The law of heat conduction, also known asFourier's law, states that the time rate ofheat

    transfer through a material isproportional to the negativegradient in the temperature and to the

    area, at right angles to that gradient, through which the heat flows.

    For many simple applications, Fourier's law is used in its one-dimensional form. In the x-

    direction,

    Is the amount of heat transferred per unit time (in W), and

    is an oriented surface area element (in m2)

    The abovedifferential equation,whenintegrated for a homogeneous material of 1-D geometry

    between two endpoints at constant temperature, gives the heat flow rate as:

    Ais the cross-sectional surface area,

    is the temperature difference between the ends,

    is the distance between the ends.

    where Uis the conductance, in W/(m2K).

    Fourier's law can also be stated as:

    The reciprocal of conductance is resistance, R, given by:

    http://en.wikipedia.org/wiki/Joseph_Fourierhttp://en.wikipedia.org/wiki/Heat_transferhttp://en.wikipedia.org/wiki/Heat_transferhttp://en.wikipedia.org/wiki/Proportionality_(mathematics)http://en.wikipedia.org/wiki/Gradienthttp://en.wikipedia.org/wiki/Differential_equationhttp://en.wikipedia.org/wiki/Integralhttp://en.wikipedia.org/wiki/Integralhttp://en.wikipedia.org/wiki/Differential_equationhttp://en.wikipedia.org/wiki/Gradienthttp://en.wikipedia.org/wiki/Proportionality_(mathematics)http://en.wikipedia.org/wiki/Heat_transferhttp://en.wikipedia.org/wiki/Heat_transferhttp://en.wikipedia.org/wiki/Joseph_Fourier
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    Resistance is additive when several conducting layers lie between the hot and cool regions,

    because Aand Q are the same for all layers. In a multilayer partition, the total conductance is

    related to the conductance of its layers by:

    So, when dealing with a multilayer partition, the following formula is usually used:

    Calculation:

    P=5 watt

    No. Distance Temperature1 5 39.3

    2 15 39.0

    3 25 36.8

    4 35 37.5

    5 45 35.4

    6 55 34

    7 65 33

    8 75 32.6

    9 85 30.5

    30

    31

    32

    33

    34

    35

    36

    37

    38

    39

    40

    5 25 45 65 85 105

    Temperature

    Distance

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    Comments

    1) In this experiment axial heat flow would be studied.

    2) Temperature is decreasing along the length as heat transfer from the hotter body to cooler

    body.

    3) As apparatus heats up it gives error in the reading. So by increasing Power it would give

    more error.

    4) Power dont remain 5 watt throughout the experiment it varies from 5 to 5.1 watt

    5) 4th

    reading varies from the trend it may be due to power fluctuation to 5.1 watt.

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    Lab Session 2

    Statement:

    Draw the temperature profile of a composite materials and find the overall heat transfer co-

    efficient.

    Apparatus:

    Heat conduction apparatus, 6 thermisters, Different samples of materials

    Theory:

    Composite Material:

    Composite materials are materials made from two or more constituent materials with

    significantly differentphysical orchemical properties, that when combined, produce a material

    with characteristics different from the individual components. The individual components remain

    separate and distinct within the finished structure. The new material may be preferred for many

    reasons: common examples include materials which are stronger, lighter or less expensive when

    compared to traditional materials.

    Typicalengineered composite materials include:

    Composite building materials such ascements,concrete

    Reinforced plastics such asfiber-reinforced polymer

    Metal Composites

    Ceramic Composites (composite ceramic and metal matrices)

    Heat transfer Co-efficient:

    The heat transfer coefficient or film coefficient is theproportionality coefficient between theheat

    flux and the thermodynamic driving force for the flow of heat (i.e., the temperature difference,

    T):

    q : heat flux, W/m2i.e.,thermal powerper unitarea,q= d /dA

    h: heat transfer coefficient, W/(m2K)

    T: difference in temperature between the solid surface and surrounding fluid area, K

    http://en.wikipedia.org/wiki/Physical_propertyhttp://en.wikipedia.org/wiki/Chemical_propertyhttp://en.wikipedia.org/wiki/Materials_sciencehttp://en.wikipedia.org/wiki/Cementhttp://en.wikipedia.org/wiki/Concretehttp://en.wikipedia.org/wiki/Fiber-reinforced_polymerhttp://en.wikipedia.org/wiki/Metalhttp://en.wikipedia.org/wiki/Composite_armorhttp://en.wikipedia.org/wiki/Proportional_(mathematics)http://en.wikipedia.org/wiki/Heat_fluxhttp://en.wikipedia.org/wiki/Heat_fluxhttp://en.wikipedia.org/wiki/Thermal_powerhttp://en.wikipedia.org/wiki/Areahttp://en.wikipedia.org/wiki/Areahttp://en.wikipedia.org/wiki/Thermal_powerhttp://en.wikipedia.org/wiki/Heat_fluxhttp://en.wikipedia.org/wiki/Heat_fluxhttp://en.wikipedia.org/wiki/Proportional_(mathematics)http://en.wikipedia.org/wiki/Composite_armorhttp://en.wikipedia.org/wiki/Metalhttp://en.wikipedia.org/wiki/Fiber-reinforced_polymerhttp://en.wikipedia.org/wiki/Concretehttp://en.wikipedia.org/wiki/Cementhttp://en.wikipedia.org/wiki/Materials_sciencehttp://en.wikipedia.org/wiki/Chemical_propertyhttp://en.wikipedia.org/wiki/Physical_property
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    The heat transfer coefficient hasSI units in watts per square meter kelvin: W/(m2K). Heat

    transfer coefficient is the inverse ofthermal insulance.This is used for building materials (R-

    value)and forclothing insulation.

    Q=U*A*( T)

    1/U=Resistance

    Q=A*k*( T)/( x)

    =A* T/( x/k)

    =A* T/Resistence

    1/U= ( xh/kh)+( xs/ks)+( xc/kc)

    Length Temperature Group1 Group 2 Group 3 Group 4

    P=5W P=6W P=7W P=8W

    5 T1 34 40.2 43.4 45.4

    15 T2 33.5 38.8 41.6 43.5

    25 T3 33 37.7 39.6 41.5

    65 T7 32.3 32.6 32.8 32.8

    75 T8 31.7 32.5 32.4 32.6

    85 T9 31.5 32.4 32.2 32.

    31.5

    32

    32.5

    33

    33.5

    34

    34.5

    5 25 45 65 85 105

    Temperature

    length

    Group1 P=5W

    http://en.wikipedia.org/wiki/International_System_of_Unitshttp://en.wikipedia.org/wiki/Thermal_insulancehttp://en.wikipedia.org/wiki/R-value_(insulation)http://en.wikipedia.org/wiki/R-value_(insulation)http://en.wikipedia.org/wiki/Clothing_insulationhttp://en.wikipedia.org/wiki/Clothing_insulationhttp://en.wikipedia.org/wiki/R-value_(insulation)http://en.wikipedia.org/wiki/R-value_(insulation)http://en.wikipedia.org/wiki/Thermal_insulancehttp://en.wikipedia.org/wiki/International_System_of_Units
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    32.2

    33.2

    34.2

    35.2

    36.2

    37.2

    38.2

    39.2

    40.2

    41.2

    5 25 45 65 85 105

    Temperature

    Length

    Group 2 P=6W

    32.2

    34.2

    36.2

    38.2

    40.2

    42.2

    44.2

    5 25 45 65 85 105

    Temperature

    Length

    Group 3 P=7W

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    Length Temperature P=5W P=6W P=7W P=8W

    5 T1 46.8 48.6 50.6 51.3

    15 T2 46 47.4 49 50.4

    25 T3 43.5 45.3 46.6 48.5

    35 T4 43 44 45.5 46.8

    45 T5 40.7 42.1 43.4 44.6

    55 T6 39.3 41.4 42.7 43.7

    65 T7 32.9 41.4 33.6 33.9

    75 T8 32.2 33.4 38 33.1

    85 T9 32 32.6 32.6 32.6

    32

    34

    36

    38

    40

    42

    44

    46

    48

    5 25 45 65 85 105

    Temperatu

    re

    Length

    Group 4 P=8W

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    Lab Session 3

    Statement

    When area would change then investigate the heat transfer.

    Length Temperature P=5W P=6W P=7w P=8W

    5 T1 45.8 51 52.2 52.4

    15 T2 45.8 49.2 49.9 52.3

    25 T3 42.2 45.4 47.3 47.9

    65 T7 32.7 33.3 33.6 33.8

    75 T8 32.5 33 33.1 33.1

    85 T9 31.9 32.6 32.9 32.8

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    Lab Session 3

    Statement:

    Draw the temperature profile for steady state heat conduction along the radial direction for a

    cylindrical object and find k.

    Calculation:

    Ri=4mm

    Ro=55mm

    L=3mm

    No. Radii(mm) T (P=15W) T(P=17W) T(P=19W)) T(P=21W)

    1 0 38.7 40.2 40.9 41.22 4 38.7 40.2 40.9 41.2

    3 10 37 38.6 39.3 39.6

    4 20 36.4 37.2 38 38.2

    5 30 35 35.4 36.1 36.3

    6 40 33.7 33.9 34.3 34.5

    7 50 32.4 32.4 32.7 32.8

    8 55 31.75 31.5 31.8 32

    qr =

    q=15W

    L=310-3

    m

    Ri=410-3

    m

    Ro=5510-3

    m

    Ti=38.7

    To=31.75

    15

    =2k310-3[38.7-31.75]

    K=300.100W/m.k (for P=15W)

    K=328.31W/m.K (for P=17W)

    K=382.89W/m.K (for P=19W)

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    K=435.829W/m.K (for P=21W)

    30

    31

    32

    33

    34

    35

    36

    37

    3839

    40

    0 10 20 30 40 50 60

    Temperature

    Radii

    30

    32

    34

    36

    38

    40

    42

    -5 5 15 25 35 45 55

    Temp(atP=

    17W)

    Radii

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    qr =

    q=2W

    L=310-3

    m

    Ri=410-3

    m

    Ro=5510-3

    m

    Ti=38.7

    To=31.75

    30

    32

    34

    36

    38

    40

    42

    -5 5 15 25 35 45 55

    Temp(p=19W)

    Radii

    30

    32

    34

    36

    38

    40

    42

    44

    -5 5 15 25 35 45 55

    Temp(P=21W)

    Radii

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    2

    =2k310-3[38.7-31.75]

    K=39.72W/m.k (standard Aluminum oxide k=39W/m.k at 293K)

    Comments:

    1) This experiment give knowledge of heat transfer through cylindrical objects.

    2) As power is increased then temperature would rises as Temperature is directly propotional to

    energy dessipiation.

    3) As from 0-4 mm convection phenomena takes place we assume that temperature during the

    process remain constant further 4 mm is very small distance.

    4) We have thermister up to 50 mm while cylindrical object is up to 55 mm . So we draw the

    graph up to 50 mm and by line trend we take temperature corresponding to 55 mm. This is

    To.

    5) Thermal conductivity comes out to be 300-435W/m.K in experiments with applying different

    powers which is Copper(pure) at 385-386-390-401 at 293 K. Also Silver is from 401-439W/m.K at 293 K. But more chance of having that it is Copper Pure.

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    Lab Session 5

    Statement:

    Investigation of thermal contact for study heat conduction (k,A same0

    Apparatus

    Conduction apparatus, Thermister apply axially, Conducting Paste

    Theory:

    Conducting Paste

    Thermal paste is a very high heat conductive paste that is used between two objects (usually a

    heat sink and a CPU/GPU) to get better heat conduction. It fills in all those microscopicimperfections on the heat sink and CPU/GPU that can trap air in them and cause a loss in the

    heat sinks performance. Air is a very poor conductor of heat. Thermal Interface Materials (TIM)can be up to a 100 times greater conductor of heat than air.

    However, thermal paste is not near as good of a conductor as copper. Thus, too much thermal

    paste will hinder a heat sinks ability to cool properly.

    This is an exaggerated view of what these microscopic imperfections would look like. All the

    white area would represent the air pockets, and this is what the TIM would fill in. It wouldn't be

    such a gap like this, but this just an example to give you a rough idea of what it would look like.

    If you could have a perfectly flat heatsink base, and CPU, you would not need thermal paste. But

    it is impossible to do so, and thats why we need thermal paste.

    Types of thermal paste

    There are essentially three types of thermal pastes:

    Metal based

    Ceramic based

    Silicon based

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    Metal-based

    These pastes have lots of little metal particles in the grease that have a high thermal

    conductivity. One disadvantage of this type of paste is that it is also electrically conductive as

    well, which can cause a problem, more on this later.

    Ceramic-based

    TIMs are -based pastes, but the difference is minimal (1-3C). These consist of some form of

    thermally conductive material with lots of little ceramic particles. The advantage of ceramic-

    based pastes is that they do not conduct electricity.

    Silicon-basedTIMs are usually what thermal pads that come on stock heat sinks are made of.

    These work well, but nowhere near to what other pastes will. Usually they come with coolingkits.

    http://www.techpowerup.com/articles/134/images/thermalpaste4.jpghttp://www.techpowerup.com/articles/134/images/thermalpaste2.jpghttp://www.techpowerup.com/articles/134/images/thermalpaste.jpghttp://www.techpowerup.com/articles/134/images/thermalpaste4.jpghttp://www.techpowerup.com/articles/134/images/thermalpaste2.jpghttp://www.techpowerup.com/articles/134/images/thermalpaste.jpghttp://www.techpowerup.com/articles/134/images/thermalpaste4.jpghttp://www.techpowerup.com/articles/134/images/thermalpaste2.jpghttp://www.techpowerup.com/articles/134/images/thermalpaste.jpg
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    Calculation

    No. Length(mm) Temperature(P=6W) Temperature(P=7W)

    1 5 41.1 41.3

    2 15 40.5 40.2

    3 25 39.4 39.54 35 38.1 37.9

    5 45 38 38.1

    6 55 34.4 35

    7 65 33.8 34.3

    8 75 32.9 33.6

    9 85 33 33.1

    32

    33

    34

    35

    36

    37

    38

    39

    40

    41

    42

    5 25 45 65 85 105

    Temp(P=6W)

    Length(mm)

    32

    33

    34

    35

    36

    37

    38

    39

    40

    41

    42

    0 20 40 60 80 100

    Temp

    (7W)

    Length(mm)

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    Comments:

    1. Conducting paste is used to conduct heat between space in between two metal.

    2. In space air is entrapped as air is a bad conductor of heat and electricity.

    3. So, by applying conducting paste we remove the vacuum in between two metal.

    Lab Session 6

    Statement:

    Investigation of thermal heat resistance on the temperature profile for steady state heat

    conduction (k, A same)

    Apparatus

    Insulation Paper, Consucting apparatus, 9 thermister attach axially

    Calculation

    No. Length(mm) Temperature(P=5W)

    1 5 40.4

    2 15 39.5

    3 25 39.2

    4 36 35.2

    5 46 34.7

    6 56 34.2

    7 66 33.4

    8 76 33.39 86 32.8

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    Comments:

    1. Experiment helps us to study the affect of resistance in the flow of heat.

    2. We take the resistance as 1mm . When we see temperature after resistance then temperature

    drops from 39.2 to 34.7. This sudden decrease in temperature is represented by slope.

    3. This shows that paper is a bad conductor of heat and electricity.

    4.

    32

    33

    34

    35

    36

    37

    38

    39

    40

    41

    0 20 40 60 80

    Temperature

    Length