Hikvision Intelligent Thermal Network Camera (DS-2TD2166 ...

©2020 by System Plus Consulting | SP20574 Hikvision Intelligent Thermal Network Camera (DS-2TD2166-15 V1) | Sample 1

22 Bd Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr

REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT

Hikvision Intelligent Thermal Network Camera (DS-2TD2166-15 V1)

Dig deep into Hikvision’s AI-powered thermal network camera for security applicationsSP20574 - SYSTEM report by Benjamin PUSSATCost Analysis : Benjamin Pussat, David Le Gac, Florian RousseauLaboratory : Youssef El Gmili, Véronique Le Troadec, Nicolas RadufeDecember 2020 – Sample

http://www.systemplus.fr/


Table of Contents

Overview / Introduction 4

o Executive Summary

o Main Chipset

o Supply Chain

o Specifications

o Block Diagram

o Reverse Costing Methodology

Company Profile 15

o Hikvision

Teardown Analysis 21

o Views and Dimensions of the System

o System Opening

o Electronic Boards

✓ Top Side – High Resolution photos

✓ Top Side – PCB markings

✓ Top Side – Main components markings

✓ Top Side – Main components identification

✓ Top Side – Other components markings

✓ Top Side – Other components identification

✓ Bottom Side – High Resolution photos

✓ Bottom Side – PCB markings

✓ Bottom Side – Main components markings

✓ Bottom Side – Main components identification

✓ Bottom Side – Other components markings

✓ Bottom Side – Other components identification

o xxxxxxxxx 17µm Microbolometer

o Lens Module

Cost Analysis 156

o Accessing the BOM

o PCB Cost

o ICs Cost

o Mechanicals Cost

o BOM Cost – Main Electronic Board

o BOM Cost - Mechanicals

o Material Cost Breakdown by Sub-Assembly

o Material Cost Breakdown by Component Category

o Accessing the Added Value (AV) cost

o Electronic Board Manufacturing Flow

o Details of the Main Electronic Board AV Cost

o Details of the System Assembly AV Cost

o Added-Value Cost Breakdown

o Manufacturing Cost Breakdown

Estimated Manufacturer Price Analysis 209

o Estimation of the Manufacturer Price

Feedbacks 200

System Plus Consulting Services 214


Overview / Introductiono Executive Summaryo Block Diagramo Reverse Costing

Methodologyo Glossary

Company Profile & Supply Chain

Teardown Analysis

Cost Analysis

Manufacturer Price Analysis

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Executive Summary

This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the DS-2TD2166-15 V1Thermal Network Camera supplied by Hikvision (website).

For the calculations, for each reference, we estimate the following parameters :

Manufacturing quantity : 100,000 units

Manufacturing years: 2020

Manufacturing country : China

Manufacturer Reference Description

IRAY RTD6171MR Microbolometer 640x512 pixel (17µm Pitch) 60Hz (Analog Output), SMD

INTEL 5CEFA4U19I7N IC, FPGA Cyclone V 550MHz 224I/O, FBGA484

MICRON MT41K128M16JT-125:K TR IC, SDRAM 2Gb (128Mx16) 800MHz 13.75ns, TFBGA96

MAXIM MAX1978ETM+T IC, Temperature Controller for Peltier Module, TQFN48

HISILICON HI3519 V111 IC, SoC for Professional HD IP Camera, BGA523

MOVIDIUS MA2450 IC, Vision Processor Unit 2x32Bit RISC Proc. 4Gb LPDDR3, BGA270

SAMSUNG K4A8G165WB-BCRC IC, DDR4 DRAM 8Gb (512Mx16) 2400Mbps, FBGA96

Main Chipset

The main chipset summarizes the main integrated circuit functions found in the system.

https://www.hikvision.com/fr/products/Thermal-Products/Security-thermal-cameras/Bullet-series/DS-2TD2166-15-V1/





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Specifications – DS-2TD2166-15 V1 Camera

Source : Hikvision.com

https://www.hikvision.com/en/products/Thermal-Products/Security-thermal-cameras/Bullet-series/DS-2TD2166-15-V1/





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Block Diagram - HiSilicon Hi3519 Overview

Image Signal Processing





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RTD6171MRMicroblometer

Block Diagram (1/2)

Peltier ModuleInfrared

Light

5CEFA4U19I7NFPGA Cyclone V550MHz 224I/O

MT41K128M16JT-125:K SDRAM 2Gb 800MHz

MT25QL256ABA1EW9-0SIT :K Flash NOR 256Mb 133MHz

Crystal Unit 27MHz

Crystal Unit 50MHz

REF5025IDGKRPrecision Voltage Reference 2.5V 0.05% 3ppm/°C

SP3232EEN-L RS232 Transceiver

Board 7

Board 2

Board 1Board 3

TMP75AIDRG49-12Bit

Temperature Sensor

LT3042IDD Linear Regulator

20V 200mA

LT3042IDD Dual ADC 14-Bit

25Mps

LT1994IMS8 Differential

Amplifier 70MHz

ADS1112IDGSRADC 16-Bit

With On Board Reference

LT3042IDD Linear Regulator

20V 200mA

NTC/PTC Thermistor

AD8605ARTZ-REEL General Purpose

Amplifier

MAX1978ETM+TTemperature

Controller for Peltier Module

Signal Conditioning/Amplifying

Data To Board 4 (SoC)

AD5645RBRUZQuad 14-Bit DAC

with On-Chip Reference

TCR2EF18 LDO Regulator 1.8V

200mA

DC PowerFrom Board 4

He

at

Re

sist

or

Len

s M

od

ule

PowerFrom Board 4

Shutter

An

alo

g O

utp

ut

DRV8837DSGR H-bridge Driver

1.8A

The block diagram of the Thermal Network Camera is estimated in the following schematics:


Overview / Introduction


Teardown Analysis

Cost Analysis


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Electronic components (ASIC/ASSP)

Supplier : N/A

PCBs

Manufacturing Country : ChinaPCBs manufacturer(s) : SUN & LYNN, SUZHOU CIRCUIT, CCTC, JXPCB, OWNLON, PCBGALAXY

Mechanicals (Plastics/Metal)

Manuf. country : ChinaMechanicals manufacturer: N/A

PCB assembly & tests

Assembly country : ChinaProduct assembler : Hikvision

Final product assembly

Assembly country : ChinaProduct assembler : Hikvision

Final product functional test

Assembly country : ChinaProduct tester : Hikvision

- In order to deliver a manufacturing price, we propose a simplified supply chain as below. For each section, assumptions about manufacturer or manufacturing country can be made if no information about manufacturing is founded (PCB, mechanicals, etc).

Supply chain

Electronic components (General)

Suppliers : Intel / HiSilicon / Micron / Samsung Analog Devices / Texas Instruments / Hirose / - Confirmed information (S+C)

- Not confirmed information (S+C)

- No information

COLOR LEGEND :

N/A - Not Applicable

Packaged Microbolometer

Manuf. country : ChinaMicrobolometer manufacturer: IrayDie Supplier : Raytron

http://www.sl-pcb.net/PCBStrengthSubList-55.html

http://www.suzhoucircuit.com/scsb/pcbapp/

http://www.cctc-pcb.com/cctc_en/index.php/article/about

http://en.jxpcb.com/

http://en.ownlon.com/index.html

http://www.pcbgalaxy.com/

https://www.hikvision.com/content/dam/hikvision/en/marketing/image/about-us/quality/Hikvision%20Quality%20White%20Paper.pdf



http://www.infiray.com/

http://en.raytrontek.com/




Teardown Analysis o Views & Dimensionso System Openingo Electronic Boardo Microbolometero Lens Module

Cost Analysis


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Global View

Global views of the Thermal Network Camera

Total Weight: 1910 g





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Views and Dimensions Total Weight: 1910 g

10

5 m

m

323mm

10

5 m

m





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System Opening

System disassembly





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Electronic Board 1 – Top Side – Angled View – High Resolution Photo

PCB Characteristics : Material : FR4 Layers number : 4 Dimensions : 40mm x 40mmTotal Thickness : 1.45mm External copper thickness : 35µm(+10µm) Internal copper thickness : 35µmFinishing : HASL Lead Free Drilling holes number : 213 Drilling diameters : 300µm / 1mm / 2.4mm





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INTEL5CEFA4U19I7N

IC, FPGA Cyclone V 550MHz 224I/O,

FBGA484Datasheet

DIODES INCAP2822CKBTR-G1

IC, High-Side Power Switch 1.5A,

SOT23-5Datasheet

HIROSEDF12(5.0)-50DP-0.5V(86)

Connector Header Board-to-Board 50-Position 0.5mm

Pitch, SMDDatasheet

MICRONMT41K128M16JT-125:K TRIC, SDRAM 2Gb (128Mx16)

800MHz 13.75ns, TFBGA96

Datasheet

MICRONMT25QL256ABA1EW9-0SIT TR

IC, Flash NOR Memory 256Mb (32Mx8) 133MHz SPI,

WFDFN8Datasheet

Electronic Board 2 – Top Side – Main Components Identification

https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/hb/cyclone-v/cv_51001.pdf

https://www.diodes.com/assets/Datasheets/products_inactive_data/AP2822.pdf

https://www.hirose.com/product/document?clcode=CL0537-0721-0-86&productname=DF12(3.0)-10DP-0.5V(86)&series=DF12&documenttype=Catalog&lang=en&documentid=D31693_en

https://www.mouser.fr/datasheet/2/671/2Gb_1_35V_DDR3L-1283747.pdf

https://media-www.micron.com/-/media/client/global/documents/products/data-sheet/nor-flash/serial-nor/mt25q/die-rev-a/mt25q_qljs_l_256_aba_0.pdf





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Electronic Board 7 – Top Side – Angled View – High Resolution Photo





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RTD6171MR 17µm Microbolometer - Disassembly

Microbolometer Die (Vanadium Oxyde)+

ROIC Dis (Silicon)

Germanium Window with Filters (both Sides)

25x23.5x1.2mm

Getter

Thermoelectric Cooler18.4x18x3.5mm

Package





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Lens Module – EDX Analysis – Lens 1 & Aluminum Case

Germanium

Aluminum




Teardown Analysis

Cost Analysiso Assessing the BOMo PCB Costo IC Costo Mechanicals Costo BOM Cost – Electronicso BOM Cost – Mechanicalso Material Cost Breakdowno Added-Value Costo Manufacturing Cost


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PCB Cost – Electronic Board 4

Copper foils 0.1256$ 23.3%

Prepregs 0.1198$ 22.3%

Cores 0.2660$ 49.4%

Material overheads 0.0269$ 5.0%

Total substrate cost 0.5383$ 30.8%

Lamination 0.0295$ 3.3%

Mechanical drilling 0.1606$ 18.2%

Desmear 0.0059$ 0.7%

V-Scoring 0.0120$ 1.4%

Routing 0.0154$ 1.7%

Imaging 0.2597$ 29.4%

PTH metalization 0.1882$ 21.3%

Soldermask 0.0376$ 4.3%

Finishing 0.1187$ 13.4%

Electrical tests 0.0292$ 3.3%

AVI 0.0108$ 1.2%

Visual inspections 0.0078$ 0.9%

Final Quality Control 0.0034$ 0.4%

Packing 0.0042$ 0.5%

Total Process Costs 0.8830$ 50.5%

Quantity factor 1.07

Total Manufacturing Cost 1.5208$ 87.0%

Warranty -$

Indirect OH 0.0304$ 1.7%

Direct OH -$

SG&A 0.0456$ 2.6%

Profit 0.1521$ 8.7%

Estimated Price 1.75$ per board

2020

Cost

Substrate costs

Process costs

Selling price

2020

Cost

2020

Cost




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The circuit includes 1 Silicon die assembled into the package.

Die + parts of the substrate.(X-Ray top view)

Component opening(Top view)

Die + parts of the substrate.(X-Ray side view)

Estimation of the cost of the HISILICON HI3519 V111




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Estimation of the Main blocks: Digital, Analog, SRAM, ROM.Estimation of the Technology: CMOS 28nm, 10 Metal layers, 2 Polysilicon layers.Lithography steps : 46Wafer fab unit: TSMC Fab 15 – wafers 300mm, located in Taichung, Taiwan.

Note : a specific and complete analysis of the technology of the dies should confirm these hypothesis but a such analysis is not included in this report.

Die dimensions: 6.13mm x6.07mm = 37.21mm²Pad number : 1424

Die markings





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BOM Cost – Electronic Board Board 1

Electronic Board 1

Quantity: 100 000

Date: 2020 TOTAL PURCHASING COST PER ARTICLE: 6.86$

Part reference Article qty Description Package Pin nb Manufacturer Datasheet Side Unit cost Total cost

B4B-ZR-SM4-TFT(LF)(SN) 1 unit Connector Header Wire-to-Board 4-Pos i tion 1.5mm Pitch SMDSMD 4 JST http://www.js t-mfg.com/product/pdf/eng/eZH.pdf1 0.1634$ 0.1634$

BM04B-GHS-TBT(LF)(SN)(N) 1 unit Connector Header Wire-to-Board 4-Pos i tion 1.5mm Pitch SMDSMD 2 JST http://www.js t-mfg.com/product/pdf/eng/eGH.pdf1 0.1193$ 0.1193$

CAPACITOR MLCC 0402 10% 15 unit Capacitor Ceramic 0402 10% 0402 2 1 0.0010$ 0.0150$


CAPACITOR MLCC 0805 10% 7 unit Capacitor MLCC 0805 10% 0805 2 1 0.0030$ 0.0210$


DS-2TD2166-15 V1 - PCB1 1 unit PCB FR4 40x40x1.4mm 4-Layer (35µm INT / 35µm EXT) HASL LF Finishing 0 0.2600$ 0.2600$

FH12-36S-0.5SH(55) 1 unit Connector FFC 36-Pos i tion 0.5mm Pitch R/A SMD SMD 2 HIROSE https ://www.hirose.com/product/document?clcode=&productname=&series=FH12&documenttype=Catalog&lang=en&documentid=D31648_en1 0.8736$ 0.8736$

FH19C-8S-0.5SH(10) 1 unit Connector FFC 8-Pos i tion 0.5mm Pitch R/A SMD SMD 8 HIROSE https ://media.digikey.com/pdf/Data Sheets/Hirose PDFs/FH19C_FH19SC_Series .pdf1 0.3775$ 0.3775$

FIXED INDUCTOR 3X3X1.3MM SMD 2 unit Fixed Inductor 3x3x1.3mm SMD SMD 2 1 0.0801$ 0.1602$

MMCX-R-PC(40) 1 unit Connector MMCX Receptacle 50 Ohm TH TH 5 HIROSE https ://www.hirose.com/product/document?clcode=CL0339-0019-2-40&productname=MMCX-LP-066(40)&series=MMCX&documenttype=Catalog&lang=en&documentid=D49710_en1 1.0540$ 1.0540$

MP2161GJ-Z 2 unit IC, Step-Down Converter 6V 2A, SOT23-8 SOT23-8 8 MONOLITHIC POWER SYSTEMShttps ://www.monol i thicpower.com/en/documentview/productdocument/index/vers ion/2/document_type/Datasheet/lang/en/sku/MP2161/document_id/4501 0.2817$ 0.5634$

MPQ2314GJ-Z 1 unit IC, Step-Down Converter 24V 2A, SOT23-8 SOT23-8 8 MONOLITHIC POWER SYSTEMShttps ://www.monol i thicpower.com/en/documentview/productdocument/index/vers ion/2/document_type/Datasheet/lang/en/sku/MPQ2314/document_id/964/1 0.7134$ 0.7134$

MS0420-3R3M 1 unit Fixed Inductor 3.3µH 20% 2.5A SMD SMD 2 COILMX https ://datasheet.lcsc.com/szlcsc/1912111437_COILMX-MS0420-3R3M_C380155.pdf1 0.1078$ 0.1078$

RESISTOR CHIP 0402 5% 14 unit Res is tor Chip 0402 5% 0402 2 1 0.0008$ 0.0112$


SMBJ6.0CA 1 unit Diode TVS Bidirectional 6V 10.3V SMB SMB (DO-214AA) 2 BOURNS https ://www.bourns .com/docs/Product-Datasheets/SMBJ.pdf1 0.0605$ 0.0605$

SRN5040TA-100M 2 unit Fixed Inductor 10µH 10% 2.2A SMD SMD 2 BOURNS https ://www.bourns .com/docs/Product-Datasheets/SRN5040TA.pdf1 0.1303$ 0.2606$

SS1P4-M3/85A 1 unit Diode Schottky 40V 1A DO-220AA DO-220AA 2 VISHAY https ://www.vishay.com/docs/88935/ss1p3.pdf1 0.4492$ 0.4492$

TPS563209DDCR 1 unit IC, Step-Down Regulator 17V 3A, SOT23-6 SOT23-6 6 TEXAS INSTRUMENTS http://www.ti .com/l i t/ds/syml ink/tps563209.pdf1 0.1283$ 0.1283$

TPS61170DRVR 1 unit IC, High-Voltage Boost Converter 18V 2A, WDFN6 WDFN6 6 TEXAS INSTRUMENTS http://www.ti .com/l i t/ds/syml ink/tps61170.pdf1 0.5727$ 0.5727$



CAPACITOR MLCC 0805 10% 2 unit Capacitor MLCC 0805 10% 0805 2 2 0.0030$ 0.0060$


DF12-50DS-0.5V(86) 1 unit Connector Receptacle Board-to-Board 50-Pos i tion 0.5mm Pitch, SMDSMD 50 HIROSE https ://www.hirose.com/product/document?clcode=CL0537-0721-0-86&productname=DF12(3.0)-10DP-0.5V(86)&series=DF12&documenttype=Catalog&lang=en&documentid=D31693_en2 0.4522$ 0.4522$

DMP3098L-7 1 unit Trans is tor MOSFET P-Channel 30V 3.8A SOT23 SOT23 3 DIODES INC https ://www.diodes .com/assets/Datasheets/ds31447.pdf2 0.0462$ 0.0462$

P6SMB18CA 1 unit Diode TVS 15.3V 25.5V SMB SMB (DO-214AA) 2 BOURNS https ://www.bourns .com/docs/Product-Datasheets/P6SMB.pdf2 0.0839$ 0.0839$


SP3232EEN-L 1 unit IC, RS-232 Transceiver 3.0V to 5V, SO16 SO16 16 MAXLINEAR https ://www.maxl inear.com/ds/sp3222e_sp3232e.pdf2 0.2655$ 0.2655$




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Step n° Step name Step Code Inline step? Side Auto/Manual Step Time (s) Equipment number Equip. Price (USD) Remark

1 Material preparation MP No - M 30s / reference 1 5,000

2 Storage buffer SB Yes - - 5s / board 1 20,000

3 PCB Cleaning C Yes - A 7s / panel 1 20,000

4 Stencil printing SP Yes 2 A 17.6s / panel 1 75,000

5 Solder paste inspection SPI Yes 2 A 10.1s / panel 1 110,000

6 Pick and place SMT x4 P&P Yes 2 A 45k SMT/hour 4 450,000 x4

7 Automated optical inspection AOI Yes 2 A 11.8s / panel 1 170,000

8 Reflow RF Yes 2 A 240s Cycle 1 125,000


10 Storage buffer SB Yes - - 5s / board - 20,000

11 Automated X-Ray Inspection AXI No 2 A 37s / panel 1 400,000

12 Storage buffer SB Yes - - 5s / board 1 - Same machine as step n°2

13 PCB Cleaning C Yes - A 7s / panel 1 - Same machine as step n°3

14 Stencil printing SP Yes 1 A 17.6s / panel - - Same machine as step n°4

15 Solder paste inspection SPI Yes 1 A 10.1s / panel 1 - Same machine as step n°5

16 Pick and place SMT x4 P&P Yes 1 A 45k SMT/hour 4 - Same machines as step n°6

17 Automated optical inspection AOI Yes 1 A 11.8s / panel - - Same machine as step n°7

18 Reflow RF Yes 1 A 240s Cycle - - Same machine as step n°8

19 Automated optical inspection AOI Yes 1 A 11.8s / panel - - Same machine as step n°9

20 Storage buffer SB Yes - - 5s / board 1 - Same machine as step n°10

21 Automated X-Ray Inspection AXI No 1 A 37s / panel 1 - Same machine as step n°11

22 In-situ test ICT No 1+2 A 45.7s / panel 1 200,000


24 Automatic THT Insertion ATI Yes 1 A 45s / panel 1 200,000

25 Selective Wave Soldering SWS Yes 1 A 240s Cycle 1 180,000



28 Depaneling DP No 1+2 A 25s / panel 1 120,000

29 Functional test FCT No 1+2 A 25s / board 1 300,000

30 Board conditioning BC No - M 5s / board 1 3,000

Panel size : 4 Boards Total equipment price : $ 4,128,000

Details of Electronic Board 4 Added-Value (AV) Cost

Details of the Electronic Board assembly process.




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Added-Value Cost Breakdown

The Total Assembly Cost, including the calibration and functional tests, is estimated to$5.70.

The System assembly+tests represent 45% of the Total Added Value Cost

System44%

Electronic Board 3

6%

Electronic Board 1

4%

Electronic Board 2

8%

Electronic Board 4

26%

Electronic Board 5

2%

Electronic Board 6

8%

Electronic Board 7

2%

Assembly Cost Breakdown

System

Electronic Board 3

Electronic Board 1

Electronic Board 2

Electronic Board 4

Electronic Board 5

Electronic Board 6

Electronic Board 7 Microbolometer

Lens Module / Mechanicals

Power Supply/RS232 TRX

FPGA/SDRAM/Flash NOR

Main DC Power Supplies/DRAM/Vision CPU/HD Camera CPU/Ethernet PHY/RS3232 TRX

Micro SD Card Connector

AC/DC Conversion

Microbolometer

Peltier/Analog Measurement Microbolometer

Microbolometer

Microbolometer

AI / Power Supply

AI / Power Supply

Ai / Power Supply

Name Fonction Main Block

Microbolometer

ASSEMBLY

COST%

2.54$ 45%

0.21$ 4%

0.48$ 8%

0.34$ 6%

1.47$ 26%

0.10$ 2%

0.44$ 8%

0.11$ 2%

5.70$ 100%TOTAL

Electronic Board 6

Electronic Board 7

Electronic Board 4

Electronic Board 5

Electronic Board 2

Electronic Board 1

Electronic Board 3

SP20574 - SYSTEM - Hikvision DS-2TD2166-15

V1 Thermal Network Camera

System




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Estimation of the Manufacturer Price

The bill of material (BOM) cost is estimated to $781.74 for the system.

To this, we must add some scrap costs and component supplying costs to obtain the totalmaterial cost of $828.65.

The assembly cost is estimated to $5.70, so the manufacturing cost is $834.35.

With estimated costs of R&D, G&A and Profit, the average manufacturer price of Hikvisioncan be estimated at $1574.25 when using the estimated economic parameters ofHikvision.

M à J

M à JScrap Supplying R&D G&A Profit

1.00% 5.00% 10.00% 16.00% 21.00%

2020 100 000 China $781.74 $7.82 $39.09 $828.65 $5.70 $834.35 $157.43 $251.88 $330.59 $1 574.25

Estimated

Manufacturer

Price

HikVision

YearAnnual

Quantity

Manufacturing

Location

Material

Cost

Total Material

Cost

Assembly

Cost

Manufacturing

Cost




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MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT

IMAGING• Thermal Imagers and Detectors 2020• Cameras and Computing for Surveillance and Security 2020• Status of CMOS Image Sensor Industry 2020

REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING

IMAGING• IRay Technology 12µm and 17µm Thermal Sensors• FLIR Boson – a small, innovative, low power, smart

thermal camera core

https://www.i-micronews.com/products/cameras-and-computing-for-surveillance-and-security-2020/

https://www.i-micronews.com/products/thermal-imagers-and-detectors-2020/

https://www.i-micronews.com/products/cameras-and-computing-for-surveillance-and-security-2020/

https://www.i-micronews.com/products/status-of-cmos-image-sensor-industry-2020/

https://www.systemplus.fr/reverse-costing-reports/iray-12%c2%b5m-and-17%c2%b5m-thermal-sensors/

https://www.systemplus.fr/reverse-costing-reports/flir-boson-a-small-innovative-low-power-smart-thermal-camera-core/

https://www.systemplus.fr/reverse-costing-reports/iray-12%c2%b5m-and-17%c2%b5m-thermal-sensors/

https://www.systemplus.fr/reverse-costing-reports/flir-boson-a-small-innovative-low-power-smart-thermal-camera-core/

https://www.i-micronews.com/products/thermal-imagers-and-detectors-2020/




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About System Pluso Company serviceso Contact

Business Models Fields of Expertise

Custom Analyses(>130 analyses per year)

Reports(>60 reports per year)

Costing Tools

Trainings




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Contact

www.systemplus.fr

NANTESHeadquarters

FRANKFURT/MAINEurope Sales Office

LYONYOLE HQ

TOKYOYOLE KK

GREATER CHINAYOLE

KOREAYOLE

Headquarters22 bd Benoni Goullin44200 NantesFRANCE+33 2 40 18 09 [email protected]

Europe Sales OfficeLizzie LEVENEZFrankfurt am MainGERMANY+49 151 23 54 41 [email protected]

Asia Sales OfficeTakashi ONOZAWATokyoJAPANT : +81 804 371 [email protected]

Mavis WANGTAIWANT :+886 979 336 809CN: [email protected]

America Sales OfficeSteve LAFERRIEREWESTERN UST : +1 310 600 [email protected]

Chris YOUMANEASTERN US & CANADAT : +1 919 607 9839 [email protected]

CORNELIUSYOLE Inc.

mailto:[email protected]



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