High Speed and High Power Connector Design · 2016-04-13 · Supports various formats of 3D CAD...

CST – COMPUTER SIMULATION TECHNOLOGY | www.cst.com

High Speed and High Power

Connector Design Taiwan User Conference 2014


Introduction

High speed connector:

Electrically small

Using differential

signaling

Data rate >100Mbps

High power connector:

Static to low frequency

Carrying high current

Consideration of thermal

and mechanical effects


Typical Connector Design Workflow

Measurement Manufacture

Virtual Prototype Analysis

Optimization

Design


Connector Simulation Workflow

Pre-Processing

• 3D CAD import

• Material definition

• PCB test fixture

Solver Choice

• T-Solver

• F-Solver

Post Processing

• TDR

• TDR cross probing

• S-parameter

• Eye diagram

• SPICE / Touchstone


Material Definition – Copper Alloy

* Data taken from First Copper Technology Co., LTD.

International Annealed Copper Standard (IACS)

Copper reference conductivity 58M S/m as 100%

27% IACS conductivity 15.66M S/m


Material Definition - Substrate

* Data taken from VECTRA LCP material (E130i)

Dispersive material with Eps_r(f)

The dielectric dissipation factor or tangent of the loss

angle describes the losses

Higher order dispersion model



Pre-Processing

• 3D CAD import



Solver Choice

• T-Solver

• F-Solver

Post Processing

• TDR


• S-parameter

• Eye diagram



Solver Choice

High geometrical complexity

Broadband results

Memory efficient

Online TDR

True transient co-simulation

Electrically small structures

Narrow band frequency range

Many ports (direct solver)

Conformal mesh (curved elements)

Automatic energy based mesh adaptation



Pre-Processing

• 3D CAD import



Solver Choice

• T-Solver

• F-Solver

Post Processing

• TDR


• S-parameter

• Eye diagram



• Impedance profile in time

TDR (Time Domain

Reflectometry)

• Frequency domain

• IL and X-Talks

• SPICE Extraction S-Parameter

Connector Design Tools

What matter in connector design is “impedance”


TDR Response from Different Termination

Zo ohm termination

Short

Open

End time of TDR response shows the defined termination impedance

TDR response up to 0.5ns remains the same

independent from open or short termination


TDR Response from Different Environment

Impedance overshoot Series L discontinuity

Impedance undershoot Shunt C discontinuity

Impedance overshoot & undershoot Combination L & C


Excitation Signal

TDR

response

Step

function Gauss signal

Wideband spectrum

S-parameter results

Spectrum contains zero

amplitude

No meaningful s-parameter

)(

)()(

toi

toiZotZ

dttodtti

dttodttiZotZ

)()(

)()()(

Recommended excitation signal: Gauss signal


TDR Resolution and Rise Time

Faster rise time includes higher frequency content

Higher frequency means smaller wavelength

Smaller wavelength leads to a better resolution of discontinuities

max

%90~10

876.0

ft rise


TDR Response Different Rise Time

TDR response of 50–39–50 ohm

loss free MS line

Rise time in ns

Pick the correct rise time based on the high-speed digital standard technologies

and not by minimum distance of the discontinuities


Effect of Loss on TDR Response

Lossy medium:

attenuates the “spikes” and “dip” in TDR response

decreases the rise time degrades the TDR resolution


TDR Cross Probing Z

(t)

Locating the discontinuity using the TDR Cross probing

Only available in time domain solver

Requires 3D time domain power flow result monitor


Scattering parameter describes the DUT performance

Insertion loss, e.g. S21

Return loss, e.g. S11

X-talks:

Near end x-talk, e.g. S31

Far end x-talk, e.g. S41

Reconstruction of TDR response from return

loss (reflection coefficient)

S-Parameter

DUT 1 2

3 4

S21 S11

S31 S41


S-Parameter Result

Typical S-Parameter results TDR response from the return

loss


Connector Examples

DisplayPort

USB 3.0

High Speed Backplane Connector

Power Connector


DisplayPort Connector

Consists 1,2 or 4 differential data pairs

5.4Gbps raw data rate for each lane

DisplayPort plug model

DisplayPort receptacle model

Joint model with activated

cutting plane view


PCB Test Fixture and Excitation Port

Waveguide port with differential

signal definition

Line impedance and differential

mode pattern are automatically

calculated


Copper 100% IACS

Plastic housing with Eps_r=4 and

TanD=0.02

Fmax 6GHz ~ Trise=146ps

T-solver with hexahedral mesh

Energy decay -40dB

Open boundary in all direction

Simulation Setting

Hexahedral mesh view in x-normal plane


TDR Result (Open End)

h1>h2 higher parasitic inductance at

data line 1

h2

h1

Data line 1

Data line 2

Z(t

)

Time / ps


Z(t

)

TDR Result – Interior Design Modification

w1 h1

Compensate the parasitic capacitance

Increase the width space w1 100um

Increase the height space h1 50um


Z(t

)

Time / ps

TDR Result – Design Modification

Adding simplified plastic cover

at launcher

Add plastic cover at launcher helps to compensate the parasitic inductance

Introduces higher parasitic capacitance

Improve the TDR at the launcher (200ps-400ps)


S-Parameter Results Original Connector Modified Connector

Return loss has been improved

Staggered signal pin assignment

helps to keep X-talk low

+ -

+ -

+ -

G

G

G


Eye Diagram PRBS N=7

5Gbs data rate with trise=130ps

Good insertion loss and low cross talk level results in proper eye opening

eye width= 190ps

eye height= 0.94


Example 2

USB 3.0 Standard A-Connector


USB 3.0 Standard A-Connector Same interface as USB 2.0 standard A-connector, but with added

Superspeed USB Signal which offers 5 Gbps signal rate, 10x faster

than Hi-Speed USB 2.0

Compatible with the USB 2.0 standard A-connector

STP (Shielded Twisted Pair) used for USB 3.0 and Unshielded

Twisted Pair (UTP) for USB 2.0

USB 2.0

Differential

Signal Pair

(UTP)

GND

Power

GND

USB 3.0

Differential

Signal Pair (STP) USB 3.0

Differential

Signal Pair

(STP)


3D Simulation Settings Differential mode

with 90ohm impedance

Simplified 3D

Cable Cross

section

Mated connector

Fmax=11.52GHz for 50ps Trise (20%-80%)

T-solver hexahedral mesh (22M mesh)

Energy decay -40dB

Open boundary in all directions

Copper 100% IACS and LCP for plastic component


Cable Construction

Model of USB3.0 cable cross

section using CST CABLE STUDIO®

Low insertion loss at 2.5GHz for 3m long

USB 3.0 cable

3.3dB loss @ 2.5GHz

* Data taken from Universal Serial Bus 3.0 Specification


Differential TDR mated connector

Z(t

)

Time / ns


Differential insertion loss -7.5dB @2.5GHz for mated

cable assembly

Differential Insertion Loss

5.3dB loss @2.5GHz

Frequency / GHz

Mated connector

Output

Mated connector

Input

USB 3.0 cable

Circuit simulator CST DESIGN STUDIO™


Differential NEXT Crosstalk between the USB 3.0

differential pairs

Differential Crosstalk

-45dB Xtalk @2.5GHz

Frequency / GHz


Eye Diagram

minimum eye

height

minimum eye width

UI = 200ps 5Gbs data rate

Eye width and height are calculated from the center UI


Example 3

High Speed Backplane Connector


Backplane Connector

Up to 20Gbs data rate for each differential pair

Staggered pin configuration and edge-coupled design to achieve low loss and

low cross talk

Differential pair pin

assignments

Backplane side

Daughte

r card

sid

e


Simulation Settings Mated connector

Fmax=30GHz

T-solver with hexahedral mesh (17M mesh)

Open boundary in all directions

-40dB energy decay

Conducting material: Brass (28% IACS)

Non-conducting material: LCP

Simplified PCB

test fixture

(output)

Simplified PCB

test fixture

(input)


Differential TDR TDR with 50ps (10%-90%) A

B

C D

E F

G H

I J

Modification of interior design to meet the TDR specification

Time/ns

Z(t

)


Interior Modification

Time/ns

Z(t

)


Differential Insertion Loss A

B

C D

E F

G H

I J

Losses for the selected pairs are within the limit <1dB for 6Gbs (3GHz) <2dB for 20Gbs (10GHz)

Frequency / GHz


Crosstalk measurement always on daughter card side:

NEXT measurement: Signal injected on daughter card

side. NEXT <3.25% with 50ps (10%-90%)

Differential Crosstalk (NEXT)

NEXT 1

in NEXT 2

NE

XT

(%

)

Time/ns

Peak – Peak NEXT: 1.2%


Differential Crosstalk (FEXT) in

FEXT 1

FEXT 2

FE

XT

(%

)

Time/ns

FEXT measurement: Signal injected on backplane side

FEXT <5.75% with 50ps (10%-90%)

Peak – Peak FEXT: 1%


Worst Case Crosstalk

Cro

ssta

lk (

%)

Time/ns

Multi-pair-active crosstalk when the signal is injected from all

adjacent pairs. One victim pair and six aggressor pairs

Peak – Peak NEXT: 2.7%


Eye Diagram PRBS N=7

eye width= 90ps

eye height= 0.9

Eye diagram from the center output port at daughter card side with UI=100ps (20Gbs) Circuit simulation time using 40x40 s-matrix

SPICE equivalent network extraction: 12m Transient simulation: 40s


Example 4

Power Connector


Multidisciplinary Approach Losses in material introduced

from HF EM-field

Losses in material introduced

from stationary or LF EM-field

Temperature increment as the result of losses

Increasing of temperature

leads to structure deformation

Structure deformation

detunes the HF-performance


Simulation Setup Simulation of mated connector

DC current for each cable 7.5A

Brass material for pin and socket

Nylon material for housing

Additional material parameter

definitions: Thermal conductivity

Thermal expansion coefficient

Young’s modulus

Input

6x 7.5A Output


Simulation Workflow

Stationary current solver

Current distribution

Export thermal loss

Stationary thermal solver

Source: thermal loss

Temp. distribution

Heat flow

Structural mechanic solver

Source: temp. distr.

Deformation

original structure

deformed structure Automatic update all tasks!


Pre-processing:

Supports various formats of 3D CAD import (CATIA, Pro-E, STEP, etc.) and

various formats of PCB layout (ODB++, Zuken, Cadence, etc.)

Realistic material parameter modeling for HF and Multiphysic simulation

Realistic cable modeling using CST CABLE STUDIO®

Complete technology

T! and F! offer flexibility to choose most efficient solver

HPC computing supported from both solvers

Post processing:

Automatic line impedance calculation, TDR, s-parameter and eye diagram

Fast and accurate circuit simulation using CST DESIGN STUDIO™

Seamless simulation workflow for system simulation

Conclusions

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High Speed and High Power Connector Design · 2016-04-13 · Supports various formats of 3D CAD...

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Transcript of High Speed and High Power Connector Design · 2016-04-13 · Supports various formats of 3D CAD...