High-Efficiency GaAs Thin-Film Solar Cell Reliability · High-Efficiency GaAs Thin-Film Solar Cell...

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Confidential and Proprietary Information of ALTA Devices, Inc. High-Efficiency GaAs Thin-Film Solar Cell Reliability NREL PV Module Reliability Workshop, Feb. 26-27, 2013 Erhong Li and Prasad Chaparala Alta Devices, Inc.

Transcript of High-Efficiency GaAs Thin-Film Solar Cell Reliability · High-Efficiency GaAs Thin-Film Solar Cell...

Page 1: High-Efficiency GaAs Thin-Film Solar Cell Reliability · High-Efficiency GaAs Thin-Film Solar Cell Reliability ... Cell Level Reliability - Thermal Cycling Test ... High-Efficiency

Confidential and Proprietary Information of ALTA Devices, Inc.

High-Efficiency GaAs Thin-Film Solar Cell Reliability NREL PV Module Reliability Workshop, Feb. 26-27, 2013

Erhong Li and Prasad Chaparala

Alta Devices, Inc.

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Confidential and Proprietary Information of ALTA Devices, Inc.

Alta Devices Flexible Solar Technology

‣ World-record efficiencies • Single junction cell/module: 28.8% / 24.1% • Dual junction cell: 30.8%

HIGH ENERGY DENSITY 240W/m2

HIGHLY FLEXIBLE <15cm RADIUS

ULTRA LIGHT WEIGHT 1 gm/W

CAN BE MADE INTO ANY FORM FACTOR

Erhong Li, NREL PVMRW 2013 2

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How Alta’s  Flexible  Cells  Are Formed

Substrate Reuse

MOCVD

Lift-off Epitaxial

Front metal AR CoatingCut Test

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Mobile Power Applications

UAVs / Aerospace

Remote Power

Portable Electronics

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Built-in Reliability Methodology

‣ In-depth reliability characterization, beyond certification & specs • Know when, where and why it fails

‣ Built-in reliability mindset • Reliability - integral part of development • Cell-level accelerated testing for fast feed-back

System Reliability

Module Reliability

Interconnect Reliability

Cell Reliability

IEC tests Lifetime estimation Failure limits

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Reliability Tests

‣ Technology Reliability Characterization • Accelerated tests on bare solar cells (un-encapsulated) • IEC tests on glass mini-modules (150 cm2)

‣ Reliability Tests Sample HTOL LTSL Damp Heat Thermal

Cycling Humidity

Freeze Cells 150C

168hrs -60C

168hrs 85C/85%RH

168hrs -40C/85C 200 cys

NA

Modules 110C NA IEC61646 IEC61646 IEC61646 1000hrs

‣ Failure Criterion • Pmax Degradation(%) = (Pmax@Tx-Pmax@T0)/Pmax@T0*100

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Cell Level Reliability – High Temperature Test

‣ Cells tested @150C for 168hrs ‣ Pmax degradation < 6%

PL @0hr

PL @168hrs

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Cell Level Reliability – Low Temperature Test

‣ Cells tested @-60C for 168hrs

‣ Pmax degradation < 2%

PL @0hr

PL @168hrs

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T168

Cell Level Reliability - Damp Heat Test

‣ Cells tested @ 85C/85%RH for 168hrs ‣ Pmax degradation < 6%

PL @0hr

PL @168hrs

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Cell Level Reliability - Thermal Cycling Test

‣ Thermal  cycling under  2” bend  radius (-40C/85C, IEC profile, 200 cycles) ‣ Pmax degradation < 10%

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Reliability of Cells from Multiple Substrate Reuses

‣ Substrate reuse is one of the key process steps to lower cost for GaAs thin-film solar technology ‣ Cells tested @150C for 168hrs ‣ No intrinsic degradation mechanism was found on

material up to 10-time substrate reuse

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Module Level Reliability – High Temperature Test

‣ Module tested @110C, 1000hrs

‣ Pmax degradation < 5%

Target

PL @0hr

PL @4000hrs

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Module Level Reliability – Damp Heat Test

‣ Pmax degradation < 5% at 1000hrs ‣ Results exceed IEC test requirements

Target

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Module Level Reliability – Thermal Cycling Test

‣ Pmax degradation < 5% at 200cys ‣ Results exceed IEC test requirements

Target

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Module Level Reliability – Humidity Freeze Test

‣ Pmax degradation < 5% at 10cys ‣ Results exceed IEC test requirements

Target

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Module Level Reliability – UV + TC + HF EL @0hr ‣ Pmax degradation < 5%

‣ Modules passed UV sequence test • UV (15kWh/m2) • TC50 • HF10

EL @UV+TC50+HF10

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Conclusion

‣ Thin-film solar cells from GaAs reuse substrate show no intrinsic degradation after reliability tests

‣ Broad range of cell-level and module-level reliability tests demonstrate that Alta Devices GaAs thin-film solar technology from Epitaxial Lift-off (ELO) process exceeds lifetime requirements for PV applications

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Acknowledgement

‣ Thanks to Chris Ling, Sharon Myers and Chris France for support

‣ Thanks to the Device/EPI/Process/Integration/Matrix team to provide materials for this reliability study

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