Henkel Advanced Thermal Materials for Higher...
Transcript of Henkel Advanced Thermal Materials for Higher...
![Page 1: Henkel Advanced Thermal Materials for Higher Performancesite.eettaiwan.com.s3.amazonaws.com/events/pdf/5.Henkel-1330.pdf · Henkel Advanced Thermal Materials for Higher Performance](https://reader033.fdocuments.us/reader033/viewer/2022051205/5ad3bdbf7f8b9afa798e5f24/html5/thumbnails/1.jpg)
Henkel Advanced Thermal
Materials for Higher
Performance
2016 TW Power Seminar
Oct 6th, 2016
![Page 2: Henkel Advanced Thermal Materials for Higher Performancesite.eettaiwan.com.s3.amazonaws.com/events/pdf/5.Henkel-1330.pdf · Henkel Advanced Thermal Materials for Higher Performance](https://reader033.fdocuments.us/reader033/viewer/2022051205/5ad3bdbf7f8b9afa798e5f24/html5/thumbnails/2.jpg)
2
Agenda
1. Henkel Overview
2. Roadmaps / TIM portfolios
3. Applications per Market Segment
4. BOND-PLY LMS-HD Discussion
5. Conclusion
![Page 3: Henkel Advanced Thermal Materials for Higher Performancesite.eettaiwan.com.s3.amazonaws.com/events/pdf/5.Henkel-1330.pdf · Henkel Advanced Thermal Materials for Higher Performance](https://reader033.fdocuments.us/reader033/viewer/2022051205/5ad3bdbf7f8b9afa798e5f24/html5/thumbnails/3.jpg)
3
Who we are140 Years of History
• Founded 1876
• Headquarters: Düsseldorf, Germany
![Page 4: Henkel Advanced Thermal Materials for Higher Performancesite.eettaiwan.com.s3.amazonaws.com/events/pdf/5.Henkel-1330.pdf · Henkel Advanced Thermal Materials for Higher Performance](https://reader033.fdocuments.us/reader033/viewer/2022051205/5ad3bdbf7f8b9afa798e5f24/html5/thumbnails/4.jpg)
4
Adhesive TechnologiesTotal Henkel Sales
2015 Sales by business sector
Corporate = sales and services not assignable to the individual business sectors.
49%
22%
28%
1%
Adhesive Technologies Beauty Care Laundry & Home Care Corporate
49% of Henkel Sales
Adhesive
Technologies
![Page 5: Henkel Advanced Thermal Materials for Higher Performancesite.eettaiwan.com.s3.amazonaws.com/events/pdf/5.Henkel-1330.pdf · Henkel Advanced Thermal Materials for Higher Performance](https://reader033.fdocuments.us/reader033/viewer/2022051205/5ad3bdbf7f8b9afa798e5f24/html5/thumbnails/5.jpg)
5
Adhesive TechnologiesFive Business Segments
Packaging
And Consumer
Goods
Transport
and
Metal
General
IndustryElectronics
Consumer,
Craftsmen
and
Building
![Page 6: Henkel Advanced Thermal Materials for Higher Performancesite.eettaiwan.com.s3.amazonaws.com/events/pdf/5.Henkel-1330.pdf · Henkel Advanced Thermal Materials for Higher Performance](https://reader033.fdocuments.us/reader033/viewer/2022051205/5ad3bdbf7f8b9afa798e5f24/html5/thumbnails/6.jpg)
6
Serving Our Customers WorldwideGlobal End-to-End Business
Henkel has a global presence with a footprint in every geography
Globally aligned infrastructure to serve our customers locally
Electronics Headquarters:
Irvine, CA USA
Estimated Adhesive ElectronicsEmployees: 3,086
R&D, Technical Service, Sales
R&D, Technical Service, Sales, Manufacturing
Technical Service, Sales, Manufacturing
Manufacturing
![Page 7: Henkel Advanced Thermal Materials for Higher Performancesite.eettaiwan.com.s3.amazonaws.com/events/pdf/5.Henkel-1330.pdf · Henkel Advanced Thermal Materials for Higher Performance](https://reader033.fdocuments.us/reader033/viewer/2022051205/5ad3bdbf7f8b9afa798e5f24/html5/thumbnails/7.jpg)
7
Henkel ElectronicsProduct Lines
Die Attach
Adhesives
Molding
Compounds
Assembly
AdhesivesLiquids
Inks &
Coatings
Solder
Materials
Thermal
Solutions
• Die Attach Paste
• Die Attach Film
• Dicing Die Attach
Film
• Conductive Die
Attach Film
• WBC
• Mold Compound
• Powders
• ECA
• NCA
• SMA
• ABA
• Assembly Films
• Underfills
• Sealants
• CBP
• Encapsulants
• Light Cure
Adhesives
• LPM
TECHNOMELT
• LCM
• NCP
• Conductive Inks
• Non-Conductive
Inks
• Blendable
Resistors
• Shielding Coatings
• Solder Paste
• Liquid Flux
• Solder Wire
• Solder Wire
• Solder Bar
• Assembly Film
• Thermal Interface
• Thermally
Conductive
Adhesives
• Thermally
Conductive
Grease
• Liquid Gap Filler
• GAP PADS
• SIL PADS
• Insulated Metal
Substrate (IMS)
Abbreviations:ABA = Assembly Bench AdhesivesLCM = Liquid Compression MoldingNCP = Non Conductive Paste
ECA = Electrically Conductive AdhesiveNCA = Non Conductive AdhesiveCBP = Circuit Board Protection
LPM = Low Pressure MoldingSMA = Surface Mount AdhesivesWBC = Wafer Backside Coating
![Page 8: Henkel Advanced Thermal Materials for Higher Performancesite.eettaiwan.com.s3.amazonaws.com/events/pdf/5.Henkel-1330.pdf · Henkel Advanced Thermal Materials for Higher Performance](https://reader033.fdocuments.us/reader033/viewer/2022051205/5ad3bdbf7f8b9afa798e5f24/html5/thumbnails/8.jpg)
8
Technology Platforms & Market DriversMarket-Tailored Product Solutions
Henkel Solutions
Assembly LiquidsAssembly
Adhesives
Circuit Board
Protection
Solder
Materials
Thermal
Materials
Mark
et
Need
s
Customer Mfg.
Efficiency
Sustainability
High Reliability
Miniaturization
Potting
Compound
Electrically
Insulating Film
Printed Inks
Encapsulants
(Glob Top)
Insulated Metal
Substrate (IMS)
Gap Pads
Low Pressure
Molding
Non-Conductive
Pastes
Liquid Gap
Filler
Conformal Coatings
Electrically Conductive
Pastes
Assembly Film
Adhesives
Surface Mount
Adhesives
Gasketing
CSP Underfills
(Cornerbond)
Solder Materials
![Page 9: Henkel Advanced Thermal Materials for Higher Performancesite.eettaiwan.com.s3.amazonaws.com/events/pdf/5.Henkel-1330.pdf · Henkel Advanced Thermal Materials for Higher Performance](https://reader033.fdocuments.us/reader033/viewer/2022051205/5ad3bdbf7f8b9afa798e5f24/html5/thumbnails/9.jpg)
9
Agenda
1. Henkel Overview
2. Roadmaps / TIM Portfolios
3. Applications per Market Segment
4. BOND-PLY LMS-HD Discussion
5. Conclusion
ADHESIVES
LIQUID
GAP FILLER
THIN
BONDLINE
GAP PAD® SIL-PAD®
THERMAL
CLAD®
THERMALLY
CONDUCTIVE
MATERIALS
![Page 10: Henkel Advanced Thermal Materials for Higher Performancesite.eettaiwan.com.s3.amazonaws.com/events/pdf/5.Henkel-1330.pdf · Henkel Advanced Thermal Materials for Higher Performance](https://reader033.fdocuments.us/reader033/viewer/2022051205/5ad3bdbf7f8b9afa798e5f24/html5/thumbnails/10.jpg)
10
Power Market Drivers
Power Densities Cost Automation Legislation
• Increasing Watts/In3
• Driving Higher
Reliability
Requirements
• Si SiC/GaN
• Low Cost Chinese
Entrants
• Process Improvement
• Manual to Semi or Fully
Automatic
• Reduced Manufacturing
Footprint
• Improved Efficiencies
• Sustainable
• Environmental
![Page 11: Henkel Advanced Thermal Materials for Higher Performancesite.eettaiwan.com.s3.amazonaws.com/events/pdf/5.Henkel-1330.pdf · Henkel Advanced Thermal Materials for Higher Performance](https://reader033.fdocuments.us/reader033/viewer/2022051205/5ad3bdbf7f8b9afa798e5f24/html5/thumbnails/11.jpg)
11
Global Power Supply TrendsHenkel Solutions
• The Power Supply industry is advancing innovation through investment in
lean manufacturing and total cost solutions….
• Henkel’s Innovative Thermal Interface
Materials (TIMs):+Eliminate Mechanical Fasteners
+Save Space (2D & 3D)
+Ensure Highest Dielectric Strength
+Ensure Highest Thermal Performance
+Improve L/T Reliability & Durability
+Increase Production Though-put / Yields
= Lowest Total Solution Cost
![Page 12: Henkel Advanced Thermal Materials for Higher Performancesite.eettaiwan.com.s3.amazonaws.com/events/pdf/5.Henkel-1330.pdf · Henkel Advanced Thermal Materials for Higher Performance](https://reader033.fdocuments.us/reader033/viewer/2022051205/5ad3bdbf7f8b9afa798e5f24/html5/thumbnails/12.jpg)
12
Gap Pad® TIMsExpanding Pad-Form Innovation
RELEASED
1 2 3 4 5
Thermal Performance (W/m-K)
SOFT
VALUE
Silicone
Silicone-Free
POLYURETHANE
Lowest
Modulus
HC1000
HIGH DURABILITY
GPV0, 1450, 1500
GP1000HD
GP HC 3.0
GP3500 ULMULTRA LOW MOD
GPV0-US-C
6
GP2202SF
GP1000SF GP2200SF
GP3004SF
GP HC 5.0
Specialty
NEW LINE
EMI Absorbing GP EMI 1.0
7
*
* *
Putty-like
5000S352500S20,3000S30 GPV0-S/US, 1500S, 2000S40
![Page 13: Henkel Advanced Thermal Materials for Higher Performancesite.eettaiwan.com.s3.amazonaws.com/events/pdf/5.Henkel-1330.pdf · Henkel Advanced Thermal Materials for Higher Performance](https://reader033.fdocuments.us/reader033/viewer/2022051205/5ad3bdbf7f8b9afa798e5f24/html5/thumbnails/13.jpg)
13
Gap Filler Liquid TIMsMarket Leading Solutions
GF1000, GF1000SR, GF1500, GF2000
RELEASED
Thermal Performance (W/m-K)
GAP FILLER 2K
POTTING 2K
LOW MODULUS 2K
2K Cure-In-Place
LOW VOLATILE 2K GF1500LV
1 2 3 4 5 6
GF3500LV
GF1400SL
LIQUI-FORM LF2000 LF3500
1K Pre-Cured Gel
SILICONE FREE 2K GF1100SF
**
GF3500S35GF1000/1000SR, 1500, 2000 GF4000
![Page 14: Henkel Advanced Thermal Materials for Higher Performancesite.eettaiwan.com.s3.amazonaws.com/events/pdf/5.Henkel-1330.pdf · Henkel Advanced Thermal Materials for Higher Performance](https://reader033.fdocuments.us/reader033/viewer/2022051205/5ad3bdbf7f8b9afa798e5f24/html5/thumbnails/14.jpg)
14
Liquid AdhesivesFlexible Cure – Coming Soon
RELEASED
1 2 3 4 5
Thermal Performance (W/m-K)
LIQUI-BOND SA
HEAT-CURE
LBSA1000, 1800, 2000
Silicone
One-part refrigerated-storage, heat-cure
2K RT-storage, heat-cure
Epoxy
LBSA3505
LBEA1805LIQUI-BOND EA
383 high bond strength, no glass beadsLOCTITE:
Activator-based
Adhesives
LOCTITE: Silicone
384
315
3874
3873
5404
3875
3876
repairable, no glass beads
with glass beads
no glass beads
with glass beads
One-part refrigerator-store, heat cure
Two-part, no glass beads
Two-part, with glass beads
Silicone
Acrylic – RT Fast Fixture
LOCTITE:
2K Bead-on-Bead
LIQUI-BOND
Adaptive CURE 2K RT storage / RT - Flexible cure
![Page 15: Henkel Advanced Thermal Materials for Higher Performancesite.eettaiwan.com.s3.amazonaws.com/events/pdf/5.Henkel-1330.pdf · Henkel Advanced Thermal Materials for Higher Performance](https://reader033.fdocuments.us/reader033/viewer/2022051205/5ad3bdbf7f8b9afa798e5f24/html5/thumbnails/15.jpg)
15
Adhesives (Pad form)Pressure Sensitive Adhesives & Laminates
RELEASED
1 2 3 4 5
Thermal Performance (W/m-K)
Tapes
BOND-PLY
Pressure Sensitive
Adhesive
BP100
BP400
Fiberglass reinforced
Un-reinforced
Polyimide film reinforced
BOND-PLY
HEAT-CURE BP LMS500P
Fiberglass reinforced
Polyimide film reinforced
BP660P
BP LMS-HD*Laminates
BP800
SEALANTS (NEW) TLB 400 SLT
![Page 16: Henkel Advanced Thermal Materials for Higher Performancesite.eettaiwan.com.s3.amazonaws.com/events/pdf/5.Henkel-1330.pdf · Henkel Advanced Thermal Materials for Higher Performance](https://reader033.fdocuments.us/reader033/viewer/2022051205/5ad3bdbf7f8b9afa798e5f24/html5/thumbnails/16.jpg)
16
Thin Bond-Line Thermal Interface MaterialPad-Form
RELEASED
2.0 1.0 0.5 0.25
TO220 Thermal Performance (oC/W @ 50PSI)
HF625
Phase Change Material
HF300P
HF225U/T
Aluminum Foil
Fiberglass reinforced
Polyimide film reinforced
PEN film reinforced
HF300G
HF105, 225F-AC
Unreinforced
Hi-FLOW:
Electrical Isolating
Non-Isolating
EIF1000 KB(1), KA(2), K3
TCF2000 (AF)
Aluminum reinforced, Zinc Oxide Filler
Polyimide film reinforced
TCF1000 (AL, ALH)
LOCTITE:
Electrical Isolating
Non-Isolating Aluminum reinforced, Graphite Filler
TCF4000 PXFUn-reinforced, Aluminum Filler
HF650P
HF565U/T
![Page 17: Henkel Advanced Thermal Materials for Higher Performancesite.eettaiwan.com.s3.amazonaws.com/events/pdf/5.Henkel-1330.pdf · Henkel Advanced Thermal Materials for Higher Performance](https://reader033.fdocuments.us/reader033/viewer/2022051205/5ad3bdbf7f8b9afa798e5f24/html5/thumbnails/17.jpg)
17
Thin Bond-Line Thermal Interface MaterialDispensable
RELEASED
2.0 1.0 0.5 0.25
TO220 Thermal Performance (oC/W @ 50PSI)
Non-Curing Compounds
TIC TIC1000A TIC4000
LOCTITE
PHASE CHANGE
PASTES
LOCTITE Grease
1000hr@125C Open Bake Stable
TCP8010 TC8M
TCP4000 (D, Pm, Pe, DLV)
TCP7000
TCP7800NC
![Page 18: Henkel Advanced Thermal Materials for Higher Performancesite.eettaiwan.com.s3.amazonaws.com/events/pdf/5.Henkel-1330.pdf · Henkel Advanced Thermal Materials for Higher Performance](https://reader033.fdocuments.us/reader033/viewer/2022051205/5ad3bdbf7f8b9afa798e5f24/html5/thumbnails/18.jpg)
18
Sil-Pad® Thermal Interface Material
RELEASED
1.5 0.8 0.4 0.2
Thermal Performance (oC-in2/W @ 50PSI)
Silicone
SIL-PAD
Silicone-Free
SP400-9mil, 7mil SP900S, SPA1500/2000, SP2000
Polyimide film
SP800-5mil
SP980-9mil (High pressure applications)
POLY-PAD
Highest Electrical
Isolation
Polyimide film
SP-K4, K6, K10
SP1200-12mil
PP-K4 PP-K10
PP-400 PP-1000
Highest Electrical
Isolation
Q-PAD
Rubber-based Mica & Grease Replacement
Aluminum Foil
Fiberglass reinforced Q-PAD 3
Q-PAD II
SOFT-TACK SP1500STSP1100ST
![Page 19: Henkel Advanced Thermal Materials for Higher Performancesite.eettaiwan.com.s3.amazonaws.com/events/pdf/5.Henkel-1330.pdf · Henkel Advanced Thermal Materials for Higher Performance](https://reader033.fdocuments.us/reader033/viewer/2022051205/5ad3bdbf7f8b9afa798e5f24/html5/thumbnails/19.jpg)
19
Agenda
1. Introduction
2. Roadmap
3. Applications per Market Segment
4. BOND-PLY LMS-HD Discussion
5. Conclusion
![Page 20: Henkel Advanced Thermal Materials for Higher Performancesite.eettaiwan.com.s3.amazonaws.com/events/pdf/5.Henkel-1330.pdf · Henkel Advanced Thermal Materials for Higher Performance](https://reader033.fdocuments.us/reader033/viewer/2022051205/5ad3bdbf7f8b9afa798e5f24/html5/thumbnails/20.jpg)
20
Network / Server / Workstation / Computer Power SuppliesHenkel Solutions
Application: Discrete to heat plate
No Mechanical Fasteners
Material Feature Benefits
BOND-PLY
LMS-HD
Cured
core
Guaranteed min.
VBD No fixture in
oven
LIQUI-BOND
SA 2000
1k,
2 W/m-k
Excellent thermals, 1
part # vs pads
LIQUI-BOND
EA 1805Epoxy
Optional cure from
25ºC up to 150ºC
LIQUI-BOND
SA 2005
(Jefferson)
2k,
Flexible
cure
25ºC cure or very fast
cure at elevated
temps
GAP PAD VO
Ultra Soft
Soft/Com-
pliant
Low stress on
componentsAC-DC Power Supply
![Page 21: Henkel Advanced Thermal Materials for Higher Performancesite.eettaiwan.com.s3.amazonaws.com/events/pdf/5.Henkel-1330.pdf · Henkel Advanced Thermal Materials for Higher Performance](https://reader033.fdocuments.us/reader033/viewer/2022051205/5ad3bdbf7f8b9afa798e5f24/html5/thumbnails/21.jpg)
21
Network / Server / Workstation / Computer Power SuppliesHenkel Solutions
Application: Discrete to heat plate
Mechanical Fasteners
DC-DC ConverterAC-DC Power Supply
Material Feature Benefits
SIL-PAD K-10,
TCP 1700
Multiple
SP
options
SP line: Wide variety
of thickness, W/m-k,
hardness, substrates
HI-FLOW 650P PCM Wets out interface
like a liquid, film
isolation
Q-PAD 2 Non-
isolating
For use on Insulated
packages
![Page 22: Henkel Advanced Thermal Materials for Higher Performancesite.eettaiwan.com.s3.amazonaws.com/events/pdf/5.Henkel-1330.pdf · Henkel Advanced Thermal Materials for Higher Performance](https://reader033.fdocuments.us/reader033/viewer/2022051205/5ad3bdbf7f8b9afa798e5f24/html5/thumbnails/22.jpg)
22
Power ManagementHenkel Solutions
Application: PCBA to heat sink
No Mechanical Fasteners
Material Feature Benefits
LIQUI-BOND
SA 1000
Low
viscosity
Screenable, 1 part #
vs. pads
LIQUI-BOND
SA 2000
2 W/m-k Excellent thermals
BOND-PLY
LMS-HD
Cured
core
Guaranteed min.
VBD No fixture in
oven
BOND-PLY 800 PSA Press and stick
DC-DC Converter
![Page 23: Henkel Advanced Thermal Materials for Higher Performancesite.eettaiwan.com.s3.amazonaws.com/events/pdf/5.Henkel-1330.pdf · Henkel Advanced Thermal Materials for Higher Performance](https://reader033.fdocuments.us/reader033/viewer/2022051205/5ad3bdbf7f8b9afa798e5f24/html5/thumbnails/23.jpg)
23
Power ManagementHenkel Solutions
Application: PCBA to heat plate Material Feature Benefits
Gap Filler 1500 1.8 W/m-k Low assembly force,
1 part # vs pads
LIQUI-FORM
2000
Low CVE Minimal expansion
during reflow temps
LIQUI-FORM
3500
Low CVE,
3.5 W/m-k
Minimal expansion
during reflow temps
Gap Filler 4000 4.0 W/m-k Excellent ThermalsDC-DC ¼ Brick
![Page 24: Henkel Advanced Thermal Materials for Higher Performancesite.eettaiwan.com.s3.amazonaws.com/events/pdf/5.Henkel-1330.pdf · Henkel Advanced Thermal Materials for Higher Performance](https://reader033.fdocuments.us/reader033/viewer/2022051205/5ad3bdbf7f8b9afa798e5f24/html5/thumbnails/24.jpg)
24
AutomotiveHenkel Solutions
Application: Power control unit, Cool, Seal, Isolate Material Feature Benefits
Gap Filler 1500 1.8 W/m-k Low assembly force,
1 part # vs pads
New 2k LIQUI-
BOND
materials,
Adhesive
Flexible
cure
temps
Ability to cure at 25ºC
up to 180ºC
TLB 400 SLT
Sealant
Flexible
cure
temps
Ability to cure at 25ºC
up to 180ºC
![Page 25: Henkel Advanced Thermal Materials for Higher Performancesite.eettaiwan.com.s3.amazonaws.com/events/pdf/5.Henkel-1330.pdf · Henkel Advanced Thermal Materials for Higher Performance](https://reader033.fdocuments.us/reader033/viewer/2022051205/5ad3bdbf7f8b9afa798e5f24/html5/thumbnails/25.jpg)
25
Energy Management / PhotovoltaicHenkel Solutions
Application: Cooling PCBA to heat sink Material Feature Benefits
Gap Filler 1500 1.8 W/m-k Low assembly force,
1 part # vs pads
LIQUI-BOND
2000
2 W/m-k Excellent adhesion
and thermals
LIQUI-FORM
3500
Low CVE,
3.5 W/m-k
Minimal expansion
during reflow temps
Gap Filler 4000 4 W/m-k Excellent Thermals
GAP PAD HC
3.0
3 W/m-k Cost effective pad,
excellent thermals
![Page 26: Henkel Advanced Thermal Materials for Higher Performancesite.eettaiwan.com.s3.amazonaws.com/events/pdf/5.Henkel-1330.pdf · Henkel Advanced Thermal Materials for Higher Performance](https://reader033.fdocuments.us/reader033/viewer/2022051205/5ad3bdbf7f8b9afa798e5f24/html5/thumbnails/26.jpg)
26
Power Supply TrendsHenkel Solutions
Components and Low Cost Heat Sinks with increased out-
of-flatness tolerance
• Thicker and more Compliant Bond-Ply LMS-HD, up to 16 mil
• Liqui-Bond SA 2000, dispensable solution with elevated
temperature cure
• Liqui-Bond SA 2005 (Project Jefferson), 2k flexible cure
profile, can be cured at room temperature up to 180°C.
Room temperature storage
Smaller footprint, Compact designs, Higher power density
• High thermal conductivity adhesives, now up to 3 W/mk
• Wide variety of adhesive options to eliminate mechanical
fasteners
![Page 27: Henkel Advanced Thermal Materials for Higher Performancesite.eettaiwan.com.s3.amazonaws.com/events/pdf/5.Henkel-1330.pdf · Henkel Advanced Thermal Materials for Higher Performance](https://reader033.fdocuments.us/reader033/viewer/2022051205/5ad3bdbf7f8b9afa798e5f24/html5/thumbnails/27.jpg)
27
Agenda
1. Henkel Overview
2. Roadmap
3. Applications per Market Segment
4. BOND-PLY LMS-HD Discussion
5. Conclusion
![Page 28: Henkel Advanced Thermal Materials for Higher Performancesite.eettaiwan.com.s3.amazonaws.com/events/pdf/5.Henkel-1330.pdf · Henkel Advanced Thermal Materials for Higher Performance](https://reader033.fdocuments.us/reader033/viewer/2022051205/5ad3bdbf7f8b9afa798e5f24/html5/thumbnails/28.jpg)
28
BOND-PLY LMS-HD
This Innovative Construction combines:
• Cured Inner Layer: A high performance inner core coated over fiber glass (e.g. a High Performance “Sil-Pad”)• Delivers:
• High dielectric breakdown voltage (DBV)
• High thermal performance (Tc)
• High durability
• Ease / Handling
• Uncured Outer Layers: Two thermally enhanced, B-staged layers symmetrically coated over the cured inner layer.• Delivers:
• Soft interface for enhanced wet-out (Pre-Cure).
• Low stress laminate for L/T Reliability (Post Cure).
Now available in
16 mil thickness.
![Page 29: Henkel Advanced Thermal Materials for Higher Performancesite.eettaiwan.com.s3.amazonaws.com/events/pdf/5.Henkel-1330.pdf · Henkel Advanced Thermal Materials for Higher Performance](https://reader033.fdocuments.us/reader033/viewer/2022051205/5ad3bdbf7f8b9afa798e5f24/html5/thumbnails/29.jpg)
29
BOND-PLY LMS-HD
Processing (Typical)
• Oven cured after initial pressure only (IPO)• Not required to run the assembly fixture through
the pass-thru oven.• Reduces oven time and post-processing time due
to reduced thermal mass.
Target Applications
• High Performance discrete Semi-Conductor / Heatsink assemblies where traditional attachment methods include clips, screws, rivets, or PSA tapes.
• High Density Power Designs with limited space and High Reliability requirements.
![Page 30: Henkel Advanced Thermal Materials for Higher Performancesite.eettaiwan.com.s3.amazonaws.com/events/pdf/5.Henkel-1330.pdf · Henkel Advanced Thermal Materials for Higher Performance](https://reader033.fdocuments.us/reader033/viewer/2022051205/5ad3bdbf7f8b9afa798e5f24/html5/thumbnails/30.jpg)
30
BOND-PLY LMS-HDPower Supply Trends
Discrete Device and Heatsink Flatness is becoming more variable:
Heat Sink Flatness
Standard Thicknesses are available to Optimize your Design:• 10 mil: ~3mil• 12 mil: ~4 mil• Now available in16 mil
• Die-cut parts or Kiss-cut Rolls
![Page 31: Henkel Advanced Thermal Materials for Higher Performancesite.eettaiwan.com.s3.amazonaws.com/events/pdf/5.Henkel-1330.pdf · Henkel Advanced Thermal Materials for Higher Performance](https://reader033.fdocuments.us/reader033/viewer/2022051205/5ad3bdbf7f8b9afa798e5f24/html5/thumbnails/31.jpg)
31
BOND-PLY LMS-HD Wet-outHow LMS HD works
• Interfacial wet-out initiates via displacement.
• Increased dwell time = Greater wet-out = Greater lap shear performance.
• Primary process variables include pressure, pressure distribution, and dwell time.
Note: Not to scale
No Force
TO-220
Excessive Force and/or dwell
time
Moderate Force
![Page 32: Henkel Advanced Thermal Materials for Higher Performancesite.eettaiwan.com.s3.amazonaws.com/events/pdf/5.Henkel-1330.pdf · Henkel Advanced Thermal Materials for Higher Performance](https://reader033.fdocuments.us/reader033/viewer/2022051205/5ad3bdbf7f8b9afa798e5f24/html5/thumbnails/32.jpg)
32
BOND-PLY LMS-HDCost Savings Over Traditional Assemblies
• LMS-HD vs Traditional A (3) component example…
• Reduced heatsink costs: No drilling or tapping.
• Improved Quality DPPM on heatsinks due to poor deburring or upsets.
• More compact designs: Potential use of D2 Pak vs. TO-220
Application Example
0
25
50
75
100
Screw Ferrell Tap Labor Energy Total AssemblyCost
Assembly CostsTraditional vs. LMS-HD
Pad LMS-HD
<$$
![Page 33: Henkel Advanced Thermal Materials for Higher Performancesite.eettaiwan.com.s3.amazonaws.com/events/pdf/5.Henkel-1330.pdf · Henkel Advanced Thermal Materials for Higher Performance](https://reader033.fdocuments.us/reader033/viewer/2022051205/5ad3bdbf7f8b9afa798e5f24/html5/thumbnails/33.jpg)
33
BOND-PLY LMS and LMS-HD ProcessingCure Profiles
With Fixture, LMSBLN Simulation
No Fixture, LMS-HDBLN Simulation
<22 minutes!
![Page 34: Henkel Advanced Thermal Materials for Higher Performancesite.eettaiwan.com.s3.amazonaws.com/events/pdf/5.Henkel-1330.pdf · Henkel Advanced Thermal Materials for Higher Performance](https://reader033.fdocuments.us/reader033/viewer/2022051205/5ad3bdbf7f8b9afa798e5f24/html5/thumbnails/34.jpg)
34
Value Stream MappingImproved Processing with BOND-PLY LMS-HD
Inventory:
1. Standardization
heat sink profile
2. LMS-HD roll,
standard width
Inventory:
1. Discrete
Components
Tooling:
Single minute
exchange of die
Automatic
cut-to-length
LMS-HD
Place LMS-
HD on heat
sink
Place
components
on LMS-HD
Jig
Press
components
on LMS-HD
Custom
Press Insert
Cure in Oven
LMS
assembly,
No Fixture
Change
Over Time:
Est. 1 min
Place in
bin: Bin
size = to
the Kanban
order size
Est. 1 min Est. 1 min Est. 1 min Est. 8 min
Total Cycle
Time
Est. 11 min
Est. 0 min Est. 0 min
Value
Add
Wait
Est. 0 min
LEAN Opportunities:
Smaller batch sizes:
1. Single minute tooling
change over
2. Eliminate raw material
inventory change by using
standardized heat sink profiles
and rolls of LMS-HD that are
cut to length on the assembly
line
3. Placing oven in-line with
assembly table
4. Finished good inventory level
drops to Kanban order size
![Page 35: Henkel Advanced Thermal Materials for Higher Performancesite.eettaiwan.com.s3.amazonaws.com/events/pdf/5.Henkel-1330.pdf · Henkel Advanced Thermal Materials for Higher Performance](https://reader033.fdocuments.us/reader033/viewer/2022051205/5ad3bdbf7f8b9afa798e5f24/html5/thumbnails/35.jpg)
35
Agenda
1. Henkel Overview
2. Roadmap
3. Applications per Market Segment
4. BOND-PLY LMS-HD Discussion
5. Conclusion
![Page 36: Henkel Advanced Thermal Materials for Higher Performancesite.eettaiwan.com.s3.amazonaws.com/events/pdf/5.Henkel-1330.pdf · Henkel Advanced Thermal Materials for Higher Performance](https://reader033.fdocuments.us/reader033/viewer/2022051205/5ad3bdbf7f8b9afa798e5f24/html5/thumbnails/36.jpg)
36
ConclusionsHenkel solutions
• Offers a wide range of innovative and high performance materials to solve your most
challenging thermal needs.
• New materials have been developed that save space, assembly costs and energy, yet
provide great thermal and adhesion performance.
• Henkel maintains its industry leadership position by partnering with industry leaders to
develop the next generation of thermal products.
• Please feel free to contact us with your challenging thermal needs!
![Page 37: Henkel Advanced Thermal Materials for Higher Performancesite.eettaiwan.com.s3.amazonaws.com/events/pdf/5.Henkel-1330.pdf · Henkel Advanced Thermal Materials for Higher Performance](https://reader033.fdocuments.us/reader033/viewer/2022051205/5ad3bdbf7f8b9afa798e5f24/html5/thumbnails/37.jpg)
Thank you!