Heat transfer study in M0’ using the thermistors on the APD’s and on the boards
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Transcript of Heat transfer study in M0’ using the thermistors on the APD’s and on the boards
27/11/02 Paul Baillon wach4 2002 Paris 1
Heat transfer study in M0’using the thermistors on the APD’s and on the boards
27/11/02 Paul Baillon wach4 2002 Paris 2
Starting the electronic.Calibration of the APD’s
27/11/02 Paul Baillon wach4 2002 Paris 3
27/11/02 Paul Baillon wach4 2002 Paris 4
Elec. offElect. on
Power cooling waterThe flow is 0.14 liter/s.
The cooling power for 0.42 (out-in) is 2.5W/channel.
inout
27/11/02 Paul Baillon wach4 2002 Paris 5
in
out 0.013
Elec. off Elec. on
Regulating cooling waterThe flow is 0.22 liter/s.
The cooling power for 0.013 (out-in) is 0.12W/channel
27/11/02 Paul Baillon wach4 2002 Paris 6
Power coolingFailure on the main cooling circuit
on 23/9/02Effects on the temperature
of the electronic and the APD’s
27/11/02 Paul Baillon wach4 2002 Paris 7
out
in
1.29
27/11/02 Paul Baillon wach4 2002 Paris 8
Boards
Apd’s0.03
1
27/11/02 Paul Baillon wach4 2002 Paris 9
in
out
Regulating waterTemperature increase 0.005
27/11/02 Paul Baillon wach4 2002 Paris 10
Conclusions:•Temperature of APD (Thermistor) is 0.1 above cooling waterwhen the electronic is on.•When the water of the power circuit has its temperature increase by 1.34: -Temperature of APD (Thermistor) is 0.1 above cooling water -The outgoing regulating water increases its temperature by 37% and the APD’s by 30%. -The connector of the APD (on the board ) has its temperature increased by 1.34 at maximum. (it cannot be higher than the increase of the power cooling ).
All the heat going to the regulating circuit and to the APD’s goes through that connector.
Then we deduce that the connector has a temperature less than 1.34/0.3=4.4
(above the regulating water.)
27/11/02 Paul Baillon wach4 2002 Paris 11
Effects on the APD’s of power variations
in the electronic.It is due to a low voltage variation
correlated to temperature variations in the control rackin the barrack.
27/11/02 Paul Baillon wach4 2002 Paris 12
board
APD thermistors
0.012
0.12
27/11/02 Paul Baillon wach4 2002 Paris 13
Conclusion:
The rise of the board temperature is clearly correlatedto a rise of the low voltage power supply and of its current. The rise is 4% in temperature of the board to which corresponds 12% rise on the APD thermistors.
There is more power consumption and heat release at the bottom of the board (FPPA?)