Hardware-in-the-Loop Testbed
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Transcript of Hardware-in-the-Loop Testbed
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Hardware-in-the-Loop Testbed
Team 186
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Project Collaborators• Team Members:
o Aaron Eaddy – EEo Ken Gobin – EE/COMPEo Douglas Pence – ENGR PHYS/EE
• Team Advisor/Sponsor:o Sung Yeul Park – Assistant Professor
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Outline• Background• Components:
o Microcontrollero Interface circuito Sensor circuits
• Design Updates• Circuitry• Timeline• Budget
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Background• Hardware-in-the-Loop:
o A simulation technique that is used in the development and testing of complex real-time embedded system designs.
o Benefits:• Function tests are able to be done at an early stage of development.• Laboratory tests are cheaper, more flexible and highly controllable.• No potential major risk of physically damaging test failures.• Tests are easy to reproduce and provide highly consistent results.
• Improve battery operation and monitoring• State of Health• State of Charge• Remaining useful life• Voltage, current, and temperature
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Components
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Design UpdatesInitial Design:• TI ezDSP® F28335
o 6 data/address lines, 59 GPIO, ADCo MATLAB® Simulink, Code Composer Studio®
Updated Design – Rev 1:• dSPACE® RTI-1104
o ADC ports, PWM CP-18 connector, embedded microcontrollero MATLAB® Simulink software for digital signal processing and ease-of-use displayo Removed CCS as an “extra” middle software process. Less complicated and more robust.
Updated Design – Rev 2:o Changed from ‘8’-channel design to hybrid ‘4+2’-channel designo Changed from 1 to 2 PCB design – isolate analog from digital and provide safety barriero Simplified GPIO requirements with PWM MUX selecto Added scaling, filtering and digital isolator
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dSPACE® Microcontroller
dSPACE® RTI-1104 dSPACE® ControlDesk
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dSPACE® Limitations• Maximum 8 ADC channels• Maximum of 10-Volt ADC processing signal limit• Maximum of 5-Volt system hardware limit
• Main reason for switching from ‘8’-channel design to ‘4+2’-channel design was related to these limitations, specifically the 8 ADC channel hardware limitation.
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Sensors and Circuits• Voltage Sensor• Current Sensor
o Internal Impedance of each Cell.
• Temperature Sensoro Ambiento Battery Surface
• Amplificationo Integration with ADC
• Scaling for Multiple Cells• Requirements
o 30Vo 4 Cells
• Integration
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Voltage Sensing Circuit
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Current Sensor
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Current Sensing Circuit
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Temperature Sensing Circuit
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Interface Circuit
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Printed Circuit Board Design
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TimelineResearch Item
Jan Feb MarApr
3 4 1 2 3 4 1 2 3 4
Design
Schematics + Part List x x x
PCB Layout x x x x x x x x
Parts Order x x x
PCB Order x x
Board Assembly x x
Board Testing
Hardware x x
DSP x x
Power Test x x
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Budget• Total Budget $1,000• Current Expenditure Estimate:
o Temperature Sensors and Initial Parts - $156o PCB Order - $198o Additional Parts and Expandable Testing Components - $492
• Budget Surplus Estimate $154
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Questions
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