Halogen Free Component -...
Transcript of Halogen Free Component -...
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Affordable Technology and Manufacturing LeadershipAffordable Technology and Manufacturing Leadership
Hamid R. Azimi, Ph. [email protected]
Materials Technology Development Manager
Houssam W. Jomaa, [email protected] Packaging EngineerSenior Packaging Engineer
ATTD, Intel CorporationOct, 2009
Halogen Free Component Halogen Free Component …………Transition ChallengesTransition Challenges
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Agenda
Intel HF Progression/History HF and Non-HF Component Material Comparison HF Component Conversion Challenges & Solutions Component Summary & Call to Action HF PCB Conversion Challenges Summary
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130nm Wire bondLead-frame
HF MoldCompound
90nm Flip-ChipHF Via PlugHF UnderfillH Build-up
H Solder ResistH Core
Volu
me
/ Com
plex
ity
45nm Flip-ChipHF Build-upHF Solder
ResistHF Via PlugHF Underfill
HF Core
65nm Flip-ChipHF Build-upHF Solder
ResistHF Via PlugHF Underfill
H Core
Time
Intel’s Halogen Free Technology Progression
* Applies to components containing flame retardants & PVC only. Halogens are below 900 PPM bromine, 900 PPM chlorine, and 1500 PPM combined bromine andchlorine.
2008/9
Intel’s Phased Approach to a LF Compatible HF Technology….. Shipped over 200M units from 45nm technology
Build-upBuild-up
CoreCorePTH PlugPTH Plug
Solder ResistSolder Resist
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HF & Non-HF Material Comparison
Build up DielectricSolder ResistCore
Build-upBuild-up
CoreCorePTH PlugPTH Plug
Solder ResistSolder Resist
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HF Build-up and Solder Resist Comparison
HF Build up and HF Solder Resist with better or equivalentproperties to Non-HF were developed in 2006.
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HF Core Material …. What is changed?
BrR R Br+
Br H R+
Br H + R
OH + H BrH
OH Br+
M
OHOH M
O
LF Reflow Temp
+
Biggest Challenge with HF Cores … Thermal Stability at LF Reflow
... It took Intel over 4 years of continous work with supply chain to develop the right HF corematerial compatible with substrate manufacturing and Intel LF assembly
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HF Core Material ComparisonTg
TM
A (°
C)
CTE
x1/
y1 (<
Tg,
ppm
/°C
)
CTE
x2/
y2(>
Tg,
ppm
/°C)
CTE
z1
(< T
g, p
pm/°
C)
Die
lect
ricC
onst
ant
(@ 1
GH
z)
Dis
sipa
tion
Fac
tor
(@ 1
GH
z)
Moi
stur
eA
bsor
ptio
n(%
)
CTE
z2
(>Tg
, ppm
/°C
)
Mod
ulus
@ 2
5°C
(GPa
)
Mod
ulus
@ 2
60°C
(GPa
)
Peel
Str
engt
h(k
N/m
)
Halogenated core material properties: MaximumHalogenated core material properties: Maximum
Halogenated core material properties: MinimumHalogenated core material properties: Minimum
HF Material Property ValueHF Material Property Value
• HF and non-HF Cores are mostly comparable.• Lower CTEz1 is preferred.
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PACKAGE COPLANARITY Comparison
Ball coplanarity:
13X14mm thin (400 um) core
Ball coplanarity
Pkg. C
opla
narity
(m
ils)
1
2
3
4
5
6
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HF nHF
HF/ nHF
Variability Chart for Coplanarity (mils)
Pkg. C
opla
narity
(m
ils)
3
4
5
6
7
8
9
10
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HF nHF
HF/nHF
Variability Chart for Max CO
Ball
copl
anar
ity (m
ils)
Ball
copl
anar
ity (m
ils)
H H
Equivalent BGA/LGA coplanarity
Ball coplanarity:
25X27mm thin (400 um) core
LGA coplanarity:
42.5X45mm thin (400 um) core
Land coplanarity
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HF Package Failure Mechanisms / Challenges
Internal Delam / Blister
SR DelamCu
UF fillet crack
Key Solutions to a LF-compatible HF package:• Core material…. thermally stable > 260C
• Substrate Design & Mfging …. better metal to polymer adhesion• Substrate and Assembly environment … moisture exposure control
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Factors Impacting Reliability
Product 1: Fail rate after 85/85 20hrs + 4x reflow @ 260oC.
Design can significantly impact blistering failure rate.
Fail mode: Blister
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SR DelamCu
Product 2: Time to fail at 260oC isothermal hold.
Factors Impacting Reliability
Fail mode: SR Delam & UF crack
UF fillet crack
Both Design and Core can significantly impact SR delam and UF fillet crack rate.
betterbetterdesigndesign
Direct moisture path / Chimney No Direct moisture path / No Chimney
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HF Component Summary
Successfully eliminated BFRs from Intel products through a phasedapproach.
HF Conversion completed with 45nm technology; since then Intel hasshipped over 200M HF units.
To meet the LF assembly requirements, a co-optimization of materials,design and mfging along with close collaboration with the supply chain is amust
Call to Action:– Accelerate development of new component material sets for improved thermal
stability to meet future DR requirements– Accelerate industry wide adoption of HF component material sets
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Agenda
Intel HF Progression/History HF and Non-HF Component Material Comparison HF Component Conversion Challenges & Solutions Component Summary & Call to Action HF PCB Conversion Challenges Summary
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Data Source: S. O’Connell, Dell
Halogen Free PCB
• Requires Industry Standards & Verification Criteria• New Materials & Validation of Performance
• Business Implications – Cost, Capacity
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Industry Concerted Efforts: iNEMI Initiative Halogen-Free Materials
Stephen Tisdale, Chair HFR-FreeLeadership Program
HFR-Free PCB Materials(Chair: John Davignon – Intel)
HFR-Free Signal Integrity(Chair: Stephen Hall - Intel
Co-Chair: David Senk - Cisco)
Identify key mechanical performancecharacteristics and determine if they are in thecritical path for the HFR-free PCB materialtransition.
Define the critical electrical requirements for eachproduct type, characterize the properties of availabledielectrics, and create a design data base to helpensure signal integrity does not roadblock the use ofHFR-free PCB’s
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Halogen Free PCB Challenges
There are many different Flame Retardant options available
Challenges being worked out include:– Higher Dk – high speed signaling design improvements– Cost – needs work across supply chain and better design
– higher layer to compensate for x-talk and higher matl/mfging cost– Stiffer/higher modulus -- shock, vibe, cold ball pull impact considerations
Need a concerted effort across the industry on driving tradeoffs acrossdesign, fabrication, and materials to derive solutions
Effort to improve the laminate properties have begun and requires continuedcollaboration across the entire supply chain to make it successful.
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Thank You!
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