GLAST LAT ProjectDOE/NASA Review of the GLAST/LAT Project, Aug. 14, 2001 W Neil Johnson 1 Gamma-ray...

GLAST LAT Project DOE/NASA Review of the GLAST/LAT Project, Aug. 14, 2001

W Neil Johnson 1

Gamma-ray Large Gamma-ray Large Area Space Area Space TelescopeTelescope

GLAST Large Area Telescope:GLAST Large Area Telescope:

Calorimeter (WBS 4.1.5)

W. Neil JohnsonNaval Research LabCalorimeter Subsystem Manager

[email protected]


W Neil Johnson 2

Calorimeter Subsystem

Outline

Programmatic Status

Lehman Review Recommendation Status

Technical Progress

Assembly & Test

Resources

Issues / Concerns


W Neil Johnson 3

Programmatic StatusProgrammatic Status

In France the CNES Scientific Program committee issued positive recommendation and re-confirmed the French participation in GLAST.

A CNES Preliminary Requirements Review will occur in October to authorize the technical approach and French organization. This review will secure the budget for the implementation phase.

Management activities have focused on creating CAL WBS, revised plans, schedules, and costs for the development and fabrication of the calorimeter

Interim Design Review held in Paris, June 11 – 13, focused on detailed review of the Swedish and French responsibilities, interfaces, work flow and schedules.

Financial problems in France for this FY have been resolved and, as a result, the PIN photodiode procurement (US) for EM diodes was released.

Significant efforts have been placed in improving or creating CAL documentation for PDR – required specifications, plans and procedures have been identified and responsible persons have been assigned.

Completed CAL Subsystem Peer Design Review on July 27.


W Neil Johnson 4

Lehman Review Recommendation StatusLehman Review Recommendation Status

Sign and implement international agreements– Drafts exist of MoA among participating laboratories and of NASA-CNES

International LoA. – MoA has been updated by US and French participants; no apparent

action on LoA. Successful PRR should permit French signatures. Organize French efforts and commitment to roles and responsibilities

– Done. Documented in MoA and WBS. Develop bottoms up resource-loaded schedule

– Done. Delivered to PMCS on 7/20/01. Revisions continue. Update the cost estimate and assign adequate contingency

– Bottoms up costing completed. Contingency analysis on-going. Overall funding and profile are problems.

Resolve PIN diode glue problems– Resources have been applied. Test and selection program identified.

Backup solution identified. Tests are continuing. Define responsibilities for procurement, qualification and testing of

ASICs– Done. SLAC designs and tests prototypes. NRL does the rest.


W Neil Johnson 5

Technical ProgressTechnical Progress

CsI Crystals– The first two crystal optical test benches have

been completed at NRL and have been shipped to Sweden.

– First metrology test bench has been completed in Sweden.

– First 24 crystals from Amcrys-H have been received and tested in Sweden.

• The crystals were generally as expected although several crystals were slightly out of specification. These out of spec conditions were generally either over sized or incorrect light tapering along the crystal.

PIN Photodiode– 1st photodiode delivery expected Aug 15th. – Flex cable design for connection of PIN to

readout electronics has been iterated with mechanical and electrical engineering.

13 CsI Crystals from Amcrys-H

BTEM PIN diode and flex cable


W Neil Johnson 6

Technical Progress (2)Technical Progress (2)

Crystal Detector Elements (CDE)

– New baseline for CDE includes optical wrapping (VM2000) attached to CsI crystal rather than applied to structure walls.

– Mylar tape on corner bevels holds 4 VM2000 strips.

Mylar tape

VM 2000 film strip

Dual PIN diode

Flex cable

CsI Crystal

Glue


W Neil Johnson 7


PIN Photodiode – CsI Crystal Bonding– Studies of potential bonding material continue at IN2P3 and NRL.– IN2P3 contract with CETIM to model the bonding problem

• Rejects hard epoxies• Soft epoxy and silicone are OK.

– Bonding Plan• Test soft epoxy & silicone elastomer with primer• A vacuum gap is the backup solution.• Thermal (-30°C to +50°C) cycling in vacuum environment tests

between glass and CsI with surface preparation.• The type of bonding for the EM will be chosen after 12 thermal-

vac cycles. A set of photodiodes that are larger than CAL diode will be bonded on CsI and ultimately tested for 100 cycles.

• Aging tests ( thermal cycling and irradiation) are performed on these glues with particular attention to transparencies

• Bonding for FM will be reviewed after completion of test program and experience with EM fabrication.


W Neil Johnson 8


Pre Electronics Module (PEM)– Verification Model 2 (VM2)

tooling has been designed and is being fabricated

– Baseplate design has been modified to meet LAT Grid stiffness requirements.

– Preliminary thermal and structural analysis have been completed.

– VM2 will contain 12 CDE and 84 mass dummies

– Science performance evaluation before LAT PDR


W Neil Johnson 9


First prototype GCFE1 ASIC received at SLAC in June 01– Contains all functionality

• Analog: Multi-gain amplification, shaping, auto-range gain selection, trigger discriminators, five 7-bit DAC’s

• Digital: VHDL synthesized and auto place&routed digital circuits (~10,000 gates) for configuration/mode registers, write&read state-machine, data-acquisition state-machine & logic, etc.

– Digital circuits are fully functional, tested up to limit of test-box, 40 MHz, (f=20 MHz is nominal)

– Found capacitor-to-capacitor short of calibration-circuit to gain-selection circuit. Bug discovered in linear capacitor extract software

– Analog amplifier and shaper are functional after cut of trace on chip– Single range calibration, charge-amplifier with external gain select, shaping,

post-amplification, auto-ranging, acquisition sequence, rail-amplifiers, trigger discriminators are fully operational. Performance tests are in progress.

2nd Version GCFE2 received last week, has Single-Event Upset hardened registers incorporated

3rd version GCFE3 with short fixed to be submitted July 28.


W Neil Johnson 10

Assembly & Test in EuropeAssembly & Test in Europe

CsI crystals delivered to Sweden at rate of 200 per month.– Starts early. Last crystals delivered ~ 5 months before

needed. PIN photodiodes delivered to France at rate of 600 per 5 weeks.

– Delivery rate not a problem for Hamamatsu. CDE Assembly and Test at rate of ~ 200 per month (~ 6 days per

crystal) PEM Assembly in France requires 7 weeks per module

– Assembly, Metrology

– Cosmic muons

– Environmental: Thermal vac & vibration (TBR)

– Final test (cosmic muons)

Total Processing Time ~ 9 weeks per module


W Neil Johnson 11

Module Assembly and Test ScheduleModule Assembly and Test Schedule

Phase Module

EM QM, 1-2 3-6 7-16

PEM Acceptance 14 9 8 5

Elect Integration 25 14 10 9

Calibration 12 6 5 4

Environmental 28 17 11 11

Pre-ship Verification

10 7 6 6

Margin 5 5 8 8

Total per Module 94 58 48 43

The challenge – sustained receipt, assembly, test and delivery of a module every two weeks.

– One PEM arrives at NRL every two weeks. – Five Modules in process at once.– One Module ships to LAT Integration Site (SLAC) every two weeks.

• (but last Module arrives at SLAC five weeks before required date.)

• Duration of assembly and test phases (working days for each Module)


W Neil Johnson 12

Assembly and Test ScheduleAssembly and Test Schedule

Module Planned Module

Delivery Date

LAT Schedule Integration

Date

Weeks delivery is

early

Qual Model (FM A) 13 May 03 15 Aug 03 13

Flight Spare (FM B) 03 Jun 03 15 Aug 03 10

Flight Model 1 29 Jul 03 03 Nov 03 14

Flight Model 2 19 Aug 03 03 Nov 03 11

Flight Model 3 27 Aug 03 02 Jan 04 18

Flight Model 4 10 Sep 03 02 Jan 04 16

Flight Model 5 24 Sep 03 15 Jan 04 17

Flight Model 6 08 Oct 03 15 Jan 04 14



Flight Model 9 12 Nov 03 12 Feb 04 13

Flight Model 10 26 Nov 03 12 Feb 04 11

Flight Model 11 10 Dec 03 26 Feb 04 11

Flight Model 12 24 Dec 03 26 Feb 04 9

Flight Model 13 07 Jan 04 10 Mar 04 9

Flight Model 14 21 Jan 04 10 Mar 04 7

Flight Model 15 04 Feb 04 24 Mar 04 7

Flight Model 16 18 Feb 04 24 Mar 04 5

Delivery for integration into LAT

– Instrument integration schedule specifies required Ready For Integration (RFI) dates.

– RFI rate: Two Modules every two weeks.

• Too much work in parallel, so we’ll start earlier and stretch deliveries.

Typical delivery rate: One Module every two weeks.

– Plan: FMs arrive at LAT Integration Site 5 to 18 weeks earlier than required.

• Some margin for slippage.


W Neil Johnson 13

Resources - Mass EstimateResources - Mass Estimate

Component Mass in Kg

per ModuleComposite Structure 3.363Structure shell 7.090Dampers 0.320Fasteners 0.500Crystal Detector Element 79.132Printed Circuit Boards(AFEE) 1.690Miscellaneous 0.100

Total Mass of CAL Module (kg) 92.195CAL Allocation Per Module (kg) 93.250

Mass (kg)

SRR Est. (Adj.) 1482.1

ANSI/ AIAA Reserve Recom'd

101.8

Subsystem Reserve Allocation

9.9

Subsystem Budget Allocation

1492.0 (93.25 /module)

Mass Reserve Analysis

90% of reserve held at LAT level


W Neil Johnson 14

Resources - Power EstimateResources - Power Estimate

Item Quantity Each Total

GCFE 48 8 384ADC Max145 (no sleep) 48 4 192Digital Controller ASIC 4 80 320DAC 1 6 6DAC Buffers 4 5 20References 2 5 10LV Biasing 48 1 24PIN Bias 1 1 1

TOTAL Power per AFEE (mW) 957TOTAL Power per Module (mW) 3,828Allocated Power per Module (mW) 5,688

Power (mW)

Power (Watts)

SRR Est. (Adj.) 87.0

ANSI/ AIAA Reserve Recom'd

12.0

Subsystem Reserve Allocation

4.0

Subsystem Budget Allocation

91.0

(5.69 / module)

Power Reserve Analysis

75% of reserve held at LAT level

Conditioned Power at 3.3 & 70 VFor each AFEE board (4 / Module)


W Neil Johnson 15

Resources - Cost EstimateResources - Cost Estimate

4.1.5 CalorimeterFY99 $ FY00 FY01 FY02 FY03 FY04 FY05 FY06 Total

Total Labor 1,038,582 792,375 1,819,014 2,154,173 1,535,554 868,956 253,158 8,461,812Total Material 137,187 222,000 1,119,600 808,375 231,525 39,500 8,750 2,566,937Total Travel 25,000 44,500 157,350 240,100 139,500 133,900 32,400 772,750

0 0 0 0 0 0 0Grand Total FY99 $ 1,200,769$ 1,058,875$ 3,095,964$ 3,202,648$ 1,906,579$ 1,042,356$ 294,308$ 11,801,499$

Inflation Factor (from FY99) 4.10% 8.16% 12.38% 16.76% 21.31% 26.05% 31.00%

Grand Total RY $ 1,250,000$ 1,145,278$ 3,479,187$ 3,739,440$ 2,312,957$ 1,313,846$ 385,543$ 13,626,253$

4.1.D Science Analysis SoftwareFY99 $ FY00 FY01 FY02 FY03 FY04 FY05 FY06 Total

Total Labor - - 198,557 198,557 198,557 198,557 99,278 893,506

Total FY99 $ -$ -$ 198,557$ 198,557$ 198,557$ 198,557$ 99,278$ 893,506$


Total RY $ -$ -$ 223,134$ 231,837$ 240,878$ 250,273$ 130,055$ 1,076,177$

4.1.5 & 4.1.D Total (Current Estimate)FY99 $ FY00 FY01 FY02 FY03 FY04 FY05 FY06 Total

Total FY99 $ 1,200,769$ 1,058,875$ 3,294,521$ 3,401,205$ 2,105,135$ 1,240,913$ 393,586$ 12,695,004$


Total RY $ 1,250,000$ 1,145,278$ 3,702,321$ 3,971,277$ 2,553,836$ 1,564,119$ 515,598$ 14,702,429$


W Neil Johnson 16

Cost Comparison w/ ProposalCost Comparison w/ Proposal4.1.5 & 4.1.D Total (Current Estimate)FY99 $ FY00 FY01 FY02 FY03 FY04 FY05 FY06 Total

Total FY99 $ 1,200,769$ 1,058,875$ 3,294,521$ 3,401,205$ 2,105,135$ 1,240,913$ 393,586$ 12,695,004$


Total RY $ 1,250,000$ 1,145,278$ 3,702,321$ 3,971,277$ 2,553,836$ 1,564,119$ 515,598$ 14,702,429$

Proposal Costs - CalorimeterFY99 $ FY00 FY01 FY02 FY03 FY04 FY05 FY06 Total

Total Labor 1,038,513 922,847 1,719,538 2,406,522 1,285,468 450,791 - 7,823,679Total Material 137,187 132,603 1,174,387 401,732 104,757 26,562 1,977,228Total Travel 24,300 44,550 66,075 134,300 109,775 43,380 422,380

Grand Total FY99 $ 1,200,000$ 1,100,000$ 2,960,000$ 2,942,554$ 1,500,000$ 520,733$ -$ 10,223,287$


Grand Total RY $ 1,249,200$ 1,189,759$ 3,326,393$ 3,435,752$ 1,819,718$ 656,362$ -$ 11,677,184$

(Current - Proposal) RY$ 800$ (44,481)$ 375,929$ 535,525$ 734,117$ 907,757$ 515,598$ 3,025,245$

Changes in Work Scope from Proposal to Current Estimate

FY99 $ FY00 FY01 FY02 FY03 FY04 FY05 FY06 Total

Analog ASIC Devel - moved from France - 106,581 117,462 215,000 - - - 439,043Increased Monitoring of French Program - - 91,275 105,800 - - - 197,075Increased Env Testing - - - 95,000 89,000 - - 184,000Additional Sys Engineering - - 72,000 72,000 160,000 80,000 40,000 424,000Additional I&T Support - - - - 150,000 275,000 - 425,000Program Stretch - - - - - 210,000 283,000 493,000Grand Total FY99 $ -$ 106,581$ 280,737$ 487,800$ 399,000$ 565,000$ 323,000$ 2,162,118$


Grand Total RY $ -$ 115,278$ 315,487$ 569,560$ 484,045$ 712,159$ 423,130$ 2,619,659$

Cost Growth RY $ 800$ (159,759)$ 60,442$ (34,035)$ 250,072$ 195,598$ 92,468$ 405,586$


W Neil Johnson 17

Issues / ConcernsIssues / Concerns

CAL project is working hard to make up for lost time. Additional personnel are being added in US and France to support engineering development.

Near term schedule to CDR will be a challenge. Critical near term milestones include

– Determination of the PIN diode bonding solution and verifying its ability to meet the performance and environmental requirements.

– Completion of VM2 prototype, demonstrating science performance (before PDR) as well as mechanical design verification (post PDR).

– Completion of GCFE analog ASIC performance testing and obtaining completely functional parts for EM fabrication.

– Completion of EM fabrication and test program prior to CDR. Revised CAL cost and schedule have just recently (7/20) been

submitted to SLAC. – CAL funding is insufficient and profile is not optimal. Resources lost in FY

’02 reappear too late (FY ’04) to be of much use. – More iterations are required – Environmental test plan needs more consideration.

• Cost issues• Over-testing issues


W Neil Johnson 18

Backup MaterialBackup Material


W Neil Johnson 19

Test MatrixTest Matrix

HARDWARE MECHANICAL ELECTRICAL THERMAL OTHER

LEV

EL

COMPONENT (ITEM)

QU

AN

TIT

Y

TY

PE

SU

PP

LIE

R

ST

AT

IC L

OA

D

SIN

E B

UR

ST

SIN

E S

WE

EP

RA

ND

OM

VIB

AC

OU

ST

IC

PR

ES

SU

RE

PR

OF

ILE

MA

SS

PR

OP

ER

TIE

S

INT

ER

FA

CE

VE

RIF

EM

C/E

MI

ES

D C

OM

PA

TA

BIL

ITY

(G

ND

ING

)

MA

GN

ET

ICS

FU

NC

TIO

NA

L

TH

ER

MA

L V

AC

UU

M

TH

ER

MA

L B

AL

AN

CE

TH

ER

MA

L C

YC

LE

HU

MID

ITY

RA

DIA

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N

BA

KE

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BE

AM

TE

ST

– E

M S

HO

WE

RS

BE

AM

TE

ST

- H

AD

RO

NS

BE

AM

TE

ST

– H

EA

VY

IO

NS

COMMENTS

C VM2 CsI Det Elements (CDE) 12 Q F A A M T A A A T TQ TQ T

C VM2 PreElect Modules (PEM) 1 Q F T TQ TQ TQ TQ M T T TQ TQ T

C VM Electronics Prototype 1 Q N T

EM CsI Det Elements (CDE) Q F T TQ TQ TQ M T T TQ TQ M TQ TQ applies to sample batches

C EM PreElect Modules (PEM) 1 Q F M TQ TQ TQ TQ M T T TQ TQ M A

C EM Front End Elect (AFEE) 4 Q N A A A A M T A A A T TQ TQ M A A

S EM CAL Module 1 Q N TQ TQ TQ M T T T T T TQ TQ M A A T T T

QM CsI Det Elements (CDE) Q F T TQ TQ TQ M T T TQ TQ M TQ TQ applies to sample batches

C QM PreElect Modules (PEM) 1 Q F M TQ TQ TQ TQ M T T TQ TQ M A

C QM Front End Elect (AFEE) 4 Q N A A A A M T A A A T TQ TQ M A

S QM CAL Module 1 Q N TQ TQ TQ M T T T T T TQ TQ M A A

FM CsI Det Elements (CDE) F F TQ TQ TQ M T T TQ M TQ TQ applies to non-flight samples

C FM PreElect Modules (PEM) F F M TA TA TA TA M T T TA M A

C FM Front End Elect (AFEE) F N QS QS QS QS M T QS QS QS T QS M A

S FM CAL Module 17 F N QS QS TA M T QS QS QS T TA M A QS

Calorimeter Verification plan & Environmental Specification, TBD System Level Electrical Requirements, TBD Contamination Control Plan, TBD Grounding checked for each component prior to S/C integration

LEVEL OF ASSEMBLY: S = Subsystem C = Component SUPPLIER: F = France N = NRL

UNIT TYPE: PF = ProtoFlight F = Flight S = Spare Q = Qual. unit

VERIFICATION METHOD: T = Test QS = Qual by Similarity A = Analysis TQ = Test, Qual level M = Measurement TA = Test, Acceptance level I = Inspection


W Neil Johnson 20

Thermal Simulation of Bonding to CsIThermal Simulation of Bonding to CsI

• Thermal (-30°,20°) simulation of constraints on different glues curing at 20°C by CETIMThermal (-30°,20°) simulation of constraints on different glues curing at 20°C by CETIM

Masterbond EP29 Hard epoxy

Masterbond EP37 3FLF Soft epoxy

Dow corning 93500 with primer

E(tensile modulus)

2600 MPa 490 MPa

?

Tensile strength 45 MPa 28 MPa

7 Mpa

Elastic limit 30 MPa 15-20 MPa Elongation at break

180%

? Elongation at break 140%

Max Von Mises constraints inside the glue (#thickness)

1 mm : 50 MPa 2 mm : 37 MPa

1 mm :13 MPa

1 mm : 0.31 MPa

Hard epoxy does not fit

EP 37 stands the dilatation safety margin : 1.2

93500 stands the dilatation safety margin > 7


W Neil Johnson 21

Development ProgramDevelopment Program

PEM VM2 Prototype

– Mechanical Model w/ 12 CDE and 84 dummy crystals

– CDE Performance testing before LAT PDR

– Environmental testing completed by Dec ‘01 Front End Electronics

– GCFE Test Board – Radiation Testing - Nov ‘01

– VM Board, GCFE + GCRC FPGA

– Functional testing with CDE

– Radiation testing – Jan ‘02 Engineering Model (EM)

– Form and function of flight units, commercial grade parts where required, fully populated PEM

– Functional testing

– Environmental testing

– Beam tests

– Delivered to SLAC for T&DF, software development


W Neil Johnson 22

VM2 & EM DevelopmentVM2 & EM DevelopmentID Task Name Duration Start Finish

4 VM Plan 41.8 wks Thu 3/1/01 Tue 12/18/01

5 Xtal (15+1) delivery to F 0 days Fri 6/29/01 Fri 6/29/01

6 Xtal metrology 5 days Fri 6/29/01 Thu 7/5/01

7 Light yield test 10 days Fri 7/6/01 Thu 7/19/01

8 NRL PIN delivery to F 0 days Fri 8/24/01 Fri 8/24/01

9 PIN acceptance 2 days Fri 8/24/01 Mon 8/27/01

10 French PINs delivery 0 days Sun 9/2/01 Sun 9/2/01

11 F PIN acceptance 3 days Mon 9/3/01 Wed 9/5/01

12 Preliminary Bonding Procedure available 0 days Tue 8/14/01 Tue 8/14/01

13 CDE assembly 10 days Thu 9/6/01 Wed 9/19/01

14 CDE Test 8 days Thu 9/20/01 Mon 10/1/01

15 VM2 structure development 141 days Thu 3/1/01 Thu 9/13/01

16 VM2 structure available 0 days Fri 9/14/01 Fri 9/14/01

17 VM2 PEM Integration and Light Yield Test - ISSUE 6 days Tue 10/2/01 Tue 10/9/01

18 VM AFEE 162 days Thu 3/1/01 Fri 10/12/01

19 PDR prep / margin 14 days Wed 10/10/01 Mon 10/29/01

20 LAT IPDR 0 days Mon 10/29/01 Mon 10/29/01

21 VM2 PEM Env Test - ISSUE 50 days Wed 10/10/01 Tue 12/18/01

22 EM plan 52.4 wks Tue 8/14/01 Wed 8/14/02

23 EM PEM 29.4 wks Tue 8/14/01 Wed 3/6/02

24 EM Structure available 0 days Fri 12/21/01 Fri 12/21/01

25 PINs diodes available 0 days Tue 10/9/01 Tue 10/9/01

26 Bonding Procedure finalized ?? Same as preliminary0 days Tue 8/14/01 Tue 8/14/01

27 Xtal delivery to F (>96 logs) date? 5 wks Mon 9/17/01 Fri 10/19/01

28 CDE assembly & test 54 days Mon 10/22/01 Thu 1/3/02

29 Clean room ready 1 day Mon 12/31/01 Mon 12/31/01

30 EM PEM assembly (logs insert) 16 days Fri 1/4/02 Fri 1/25/02

31 EM PEM assembly (closeouts) 1 day Mon 1/28/02 Mon 1/28/02

32 EM PEM test (muon, light yield (Poly) why this long? 54-->2222 days Tue 1/29/02 Wed 2/27/02

33 Transportation F-NRL 5 days Thu 2/28/02 Wed 3/6/02

34 EM A&T 43.6 wks Mon 10/15/01 Wed 8/14/02

35 EM AFEE development 100 days Mon 10/15/01 Fri 3/1/02

36 EM AFEE available (-digital ASIC?) 0 days Mon 3/4/02 Mon 3/4/02

37 EM PEM available @ NRL 0 days Fri 3/15/02 Fri 3/15/02

38 PEM acceptance 10 days Mon 3/18/02 Fri 3/29/02

39 EM assembly 30 days Mon 4/1/02 Fri 5/10/02

40 EM test 10 days Mon 5/13/02 Fri 5/24/02

41 EM Env Test 28 days Mon 5/27/02 Wed 7/3/02

42 Beam Test (hadrons) 30 days Thu 7/4/02 Wed 8/14/02

43 CAL CDR 0 days Wed 6/5/02 Wed 6/5/02

44 I-CDR 0 wks Mon 8/5/02 Mon 8/5/02

6/29

8/24

9/2

8/14

9/14

10/29

12/21

10/9

8/14

3/4

3/15

6/5

8/5

J F M A M J J A S O N D J F M A M J J A S O N D2001 2002


W Neil Johnson 23

Current Estimate vs FundingCurrent Estimate vs Funding

4.1.5 & 4.1.D Total (Current Estimate)FY00 FY01 FY02 FY03 FY04 FY05 FY06 Total

Total RY $ 1,250,000$ 1,145,278$ 3,702,321$ 3,971,277$ 2,553,836$ 1,564,119$ 515,598$ 14,702,429$

Funding Profile

Funding - NASA (RY $) 1,250,000 1,030,000 3,326,393 3,435,752 1,819,718 656,362 - 11,518,226Funding Delta 3/24/01 - - (666,393) - 719,385 - - 52,992Funding - SLAC (RY $) - 115,000 99,000 - - - - 214,000Total Funding (RY $) 1,250,000$ 1,145,000$ 2,759,000$ 3,435,752$ 2,539,104$ 656,362$ -$ 11,785,218$

Funding Short Fall RY $ (Current Est - Funding) 0$ 278$ 943,321$ 535,525$ 14,732$ 907,757$ 515,598$ 2,917,211$

GLAST LAT ProjectDOE/NASA Review of the GLAST/LAT Project, Aug. 14, 2001 W Neil Johnson 1 Gamma-ray...

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Transcript of GLAST LAT ProjectDOE/NASA Review of the GLAST/LAT Project, Aug. 14, 2001 W Neil Johnson 1 Gamma-ray...