Giving Voice to the WorldPushing the Envelope on Handset Integration to Support Emerging Markets for Ultra-Low Cost Phones

Bill Krenik, PhDManager, Advanced ArchitecturesWireless Terminals Business Unit

Wireless Meets Africa

Farmers used to walk around for hours looking for working pay phones to call markets and find the best prices for their fruit –with mobile phones they can now easily link up with customers, brokers and the market.

Humanitarian and Business Benefits

Reduction of povertySocial developmentMarket developmentAccess to healthcare

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200

Ultra-Low Cost Handsets Enable Growth in Emerging Markets

China India UndevelopedAsia/ME

SouthAmerica

Handset Shipments 04 08

Emerging Markets GrowthGSM Association: Handset cost is a critical barrier

Mobile networks cover 80% of the world’s population~ 5 billion people are in cellular range; only 25% use cellularNext billion customers to come from emerging marketsGSMA set initial tender for $40 handset price point; now at <$30 handset

Several hundred million ultra-low cost handsets expected by 2010

Source: GSMA

EasternEurope

66%

26%

98%

36%

59%

vs. Industry Growth of 23%

Source: Forward Concepts, Global Cellular Handset & Chip Markets, April 2005

Expanding Global Reach

India South Africa Nigeria Democratic Republic of Congo Egypt Algeria Tunisia Bangladesh

Phase 1 Phase 2

RwandaUgandaSwazilandCameroonZambiaCote d'IvoireKazakhstanPakistanRussia

Turkey Thailand Philippines Malaysia Indonesia Pakistan Yemen Sri LankaKenya

UkraineAlgeriaIraqLesothoMozambiqueTanzania

Handsets delivered to operators in: Handsets will be delivered to operators in:

Source: GSMA

GSMA –Connecting the Unconnected

Phase 2: Sub $30

Specs

Handset form

Weight

Talk time

Stand-by time

Availability

Features

Candy bar

3.04 oz (86 g)

450 minutes

330 hours

Early 2006

SMS, pre-loaded games, alarm, calculator, stopwatch, currency converter

Participants are operators in countries with GNP per capita below the World Bank average and mobile penetration below 60%Other hurdles to be addressed include taxation, payment mechanisms, and regulatory issuesHandsets delivered to operators in 17 countries representing 1.8 billion people

Phase 1: Sub $40

Source: GSMA

Silicon Cost is a Major Factor in Overall Phone BOM

Portelligent estimates that silicon accounts for 31% of phone cost

SG Cowen estimates that silicon for a typical GSM phone is 26% of phone cost

Casing Battery DisplayBaseband Chip

Analog Memory RF Passives, PA, etc.

Typical Cell Phone Block Diagram

Deep Submicron Digital

FLASH EEPROM

Analog CMOS

SiGe BICMOS

Hi Voltage

Discrete Passives: SAW Filters, Inductors

RadioCODEC

Digital Baseband Logic

Memory

UserInterface

LNA

PA

RXSynth

TX

Passives Power Management

Aud

ioD

ispl

ay

TI Digital RF ProcessorTechnology

Lower-priced handsetsIncreased system performanceImproved battery lifeSleeker form factor

1/2 the silicon1/2 the power1/2 the board area

Digital Baseband

Power Management & Analog

Transceiver

TI DRP™ technology integrates major cell phone functions into

single-chip

Modern CMOS10 um

1 um

100 nm

10 nm

1 nm1970 1980 1990 2000 2010 2020

34 Years of Scaling History

Feature size shrinks by 70% each generation

Moore's Law

90 nm in 2004

Generations occur about every 2 years

1st 65 nm in 2005

Presumed Limitto Scaling

Deep UV Litho

Beginning ofSubmicron CMOS

SOC Technology –Not an Easy Task

System Design &

Algorithms

DRP™Technology –RF, Analog, and

Digital Circuit Design (LNA, PLL, DAC,

ADC)

Wafer Process Technology(90nm, 65nm, 45nmDigital RF process)

Manufacturing Expertise(300mm, test flow)

A/D

A/D

Digital RF Processor

Digital Filtering& Control

Mixed Signal

Processor

DigitalBB

Mixed Signal

Processor

300mm

65nm transistor

Applications Processing

& MCS Technology

Single-Chip System

Logic and Memory Functions

February 2004 – 1st phone call on DRP test chip

Single-Chip Solution Key Milestones

March 2005 – 1st phone call on fully functional single-chip solution

August 2005 – 1st phone call on a commercial network (from India to Europe)

June 2001 – World’s first single-chip solution, TI’s BRF 6100

1997 – TI initiates DRP™ Technology research

DRP™

65nm

Flexible IntegrationOptions

GPSDTV

DTV

WLAN

BTWLAN

DTV

SDR

GSM/GPRS

BB&RF

BTWLAN

130nm

GPSBB

GPSRF

WLANBB

WLANRFGSM/

GPRSBB

GSM/GPRS

RF

BTBB&RF

Technology Legacy

90nm

DRP Migration Across Multiple Standards

BTBB&RF

GSM/GPRS

BB&RFDTV

BB&RF

GPSBB&RF

WLANBB&RF

Integrating to Deliver the Most Competitive and Flexible Product Portfolio

2003 2004 2005 2006 2007 2008

SoC Integration Extends Growth of Wireless

SoC

Moore’s Law… but SoC Integration can continue IC cost reduction and perpetuate growth of WirelessPredicted to

stagnate in the next decade

Giving Voice to the World

Low cost strategy has both humanitarian and business benefits

SoC

DRP™ SoC technology and aggressive deep sub-micron node scaling (65nm today!) are essential to the ultra low cost market

Technology from the low cost market is finding its way into other market segments