GIGABYTE GA-X79S-UP5-WiFi Motherboard

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X79 Series Ultra Durable Motherboards

Transcript of GIGABYTE GA-X79S-UP5-WiFi Motherboard

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X79 SeriesUltra Durable

Motherboards

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Media Kit Contents

• GA-X79-UP5-WIFI Overview• GIGABYTE Unique Features• ECC Memory Support• 4 Channel DDR3 on 8 Slots• Overclocking Features• Dual LAN• Ultra Durable 5• 3D Power • 3D BIOS• Dual UEFI BIOS• Dualband Wi-Fi• Bluetooth 4.0• On/Off Charge Technology

X79S-UP5-WIFI

• One fuse per USB Port Design • PCIe Gen. 3.0• 3-way Graphics Support• Motherboard Specifications

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X79S-UP5-WIFI

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Unique Features

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X79S-UP5-WIFI

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Intel® Xeon® Support

Intel Xeon E5 2600/1600 processors bring the successful Sandy Bridge architecture to the Intel Xeon processor line-up in the form of Sandy Bridge EP.

With up to 8 cores coupled with a larger 20MB L3 cache and clock speeds of up to 3.6GHz Intel Xeon processors offer unrivalled performance

Intel® Xeon® E5 2600/1600 processors• 8 64-bit Cores• 20MB L3 Cache• 3.6GHz Clock• 32nm ‘Sandy Bridge EP’ Architecture

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(note: ECC memory support requires an Intel® Xeon® processor)

ECC DDR3 Support

The GIGABYTE X79-UP5-WIFI supports more robust and ultra reliable ECC (error-code correction) DDR3 memory modules.

Designed to detect and eliminate all single-bit data errors to ensure virtually zero data corruption

ECC Memory Brings:• Error detection and correction• Eliminates single-bit errors• Greater data stability

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Serial Attached SCSI - SAS

The Intel C606 Chipset provides SAS support for up to eight SAS drives Improved performance and long-term stability make SAS drives ideal for 24/7 intensive workstation and mission critical applications

SAS is currently the dominant storage technology used in server, workstation and professional class media creation computers

• Faster read and writes – up 15,000rpm• Faster data seek times – more responsive• Better long term stability – up to 2 million hours MTBF

i.e. Mean Time Between Failures• Available in 3.5” and compact 2.5” form factors• SCSI protocol offers improved data integrity

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Backward-compatible with SATA devicesOffers RAID 0, 1, 10 Support

Serial Attached SCSI - SAS

The GIGABYTE Z79S-UP5 offers eight onboard SAS ports making it the ultimate choice for reliable, high-performance storage

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4 Channel DDR3 on 8 Slots

The GIGABYTE X79S-UP5-WIFI boasts exceptional memory bandwidth with four channel DDR3 support on 8 DIMM slots memory intensive applications

Essential for prosumer and creative professionals that need the absolute maximum system memory

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Overclocking Features

Onboard Restart buttonAssists user in getting the absolute maximum control

Onboard Power Puts users in the driving seat when experimenting with different hardware configurations

OC ButtonInstant Overclocking button

DualBIOS™ Switcher Switch between main and backup BIOS

Clear CMOS buttonConveniently placed in real IO

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Dual Gigabit LAN

Features both Intel® Gigabit Ethernet and the Realtek GbE LAN directly onboard, providing the ultimate in networking flexibility

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6 USB 3.0 Ports 2 on board, 4 at rear

Unprecedented Connectivity6 USB 3.0 Ports / 8 SAS Connectors

8-Port SAS 3Gb/s

2 SATA3 Ports on board 4 SATA2 Ports on board

2 IEEE 1394a Ports 1 on board, 1 at rear

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Ultra Efficient Cooling! Lower Temperatures!

Extreme Heatpipe DesignExcellent heat dissipation from the critical areas of the motherboard for extended life-time and added performance

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Industry Leading 60A Rated Power Stage with Lower Losses, Higher Efficiency and Excellent Thermal Management

Up to 60° C Lower Temp.*

Designed for Overclocking Intel® “K” SKU CPUs and for use in Water Cooled Systems

*Up to 60° C lower temp. obtained using 4 phase IR3550 PowIRstage® with 2x Copper PCB vs. 4 phase D-Pak MOSFET @ 100A load 10 mins lab testing without heatsink IR®, PowIRstage® and DirectFET® are registered trademarks of International Rectifier.

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The Industry’s Highest Quality CPU Power Design

Our Best Ultra Durable™ Motherboards YetGIGABYTE is yet again raising the bar of motherboard quality and durability with their latest Ultra Durable™ 5 technology, featuring a range of High Current Capable components that provide the highest quality power delivery to the CPU for record-breaking performance, cool and efficient operation and extended motherboard lifespan.

IR3550 PowIRstage®Highest rated and most awarded Power Stage in the industry.• Providing power delivery rated up to 60A, while maintaining cool operating temperatures.• Perfect Match: GIGABYTE Ultra Durable™ 5 motherboards use both IR digital PWM controllers and IR PowIRstage® ICs, for a uniquely seamless power delivery system.

2X Copper PCBProviding sufficient power trace paths between components to handle exceptional power loads associated with overclocking and to remove heat from the critical CPU power delivery area.

High Capacity Ferrite Core ChokesRated up to 60A to provide the most stable power delivery.

Optimal CPU Power Design

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Cool Power, Inside and OutGIGABYTE Ultra Durable™ 5 motherboards use IR3550 PowerIRstage® ICs, which feature the industry’s highest 60A rating, with Lower Losses, Higher Efficiency and Excellent Thermal Management.

PWM controller

MOSFET Drivers

High and Low side MOSFETs

Choke Capacitor CPU

Power connections between the MOSFETs use very low loss copper, reducing losses and helping to spread the heat.

Specialized MOSFET driver IC by International Rectifier.

High side MOSFET (Control FET) has very low gate charge. Low side MOSFET (SyncFET) has an integrated Schottky Diode for even higher efficiency.

The current has very short paths from the bottom of the device, through either the control FET (duty cycle ON) or the Sync FET (Duty cycle OFF) and through the copper clip. This is another reason the device is so durable and can handle 60A.

Custom Copper leadframe conducts heat away from the silicon.

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Single Package DesignIR has leveraged it’s world class packaging technology developed for the DirectFET®, improving the thermal capability and layout of the PowIRstage® significantly over that of other MCM packages.

Single Package Design*

VS.. Multi-Chip DesignOther MOSFET layout implementations use a multi-chip, side-by-side arrangement of the high and low side MOSFETs and driver IC, taking up significant board real estate and creating more electrical leakage.

High Side MOSFET(Traditional MOSFET)Low Side MOSFET(Traditional MOSFET)Driver IC(MOSFET Driver)

High Side MOSFET

Low Side MOSFET

Driver IC

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Driver IC Developed by International RectifierIR3550 PowIRstage® ICs feature a specialized MOSFET driver IC which is tuned perfectly for the MOSFET pair. Many Driver MOSFET companies use drivers from other companies, thus the drivers are not really optimized for the MOSFETs. With co-packaged Driver+ MOSFETs, IR has designed this driver to optimize this module for greatest efficiency.

IR3550 Power Stage X-ray picture IR3550 Power Stage decapsulation picture

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Ultra Cool, Ultra Efficient, Ultra PerformanceHigh Efficiency = Low Power Loss = Less heat = Longer Lifespan

Traditional MOSFETComparison Sample

Lower RDS(on) MOSFETup to 40°C Lower

IR3550 PowIRstage®up to 60°C Lower

OK Good Best

* Testing result for reference only. Results may differ according to system configuration.

* Up to 60° C lower temp. obtained using 4 phase IR3550 PowIRstage® with 2x Copper PCB vs. 4 phase D-Pak MOSFET @ 100A load 10 mins lab testing without heatsink

IR's IR3550 PowIRstage® are more power efficient and operate cooler than competing MOSFETs, resulting in longer component lifespan and more head room for greater overclocking performance.

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IR3550 PowIRstage® ICs feature greater power efficiency and are the industry’s highest rated MOSFETs, able to provide up to 60A of power. This ensures the best power delivery to the CPU, for more stable operation and better overclocking performance.

16 Traditional MOSFETs in Operation 4 PowIRstage® ICs in Operation

IR3550 PowIRstage® ICs are so efficient, that even though the 4 PowIRstage® ICs in operation on the right are doing the same workload as the 16 traditional MOSFETs in operation on the left, their temperature is still up to 30° C cooler than the traditional MOSFET design.

* Testing result for reference only. Results may differ according to system configuration.

Configuration: Intel Core™ i7-3770K CPU, Default CPU frequency (3.5GHz), 1.2V Vcore, Default BIOS setting, DDR3 1333MHz, 500W PSU, CPU water cooling with no MOSFET heatsink. Software: Microsoft Windows® 7 running Power Thermal Utility at 100% loading.

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Cooler Temperatues = Higher Overclocks

Overheat

IR3550 PowIRstage® ICs remain cooler than other MOSFET designs, allowing users to overclock to greater levels of performance. Each power component has a maximum thermal operational temperature, and once it is reached, adding more voltage will only result in a failed overclock. Since IR3550 PowIRstages® are able to operate at cooler temperatures at higher voltages than traditional designs, overclockers are able to have more headroom to increase voltages, resulting in higher potential overclocks.

MOSFET Overclocking Stability

IR3550PowIRstage®

Lower RDS(on) MOSFET(Also known as Power Pak MOSFET...)Traditional MOSFET

(Also known as D Pak MOSFET... )

Best

Good

OK

Not enough powerfor overclocking

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Industry Leading Peak Efficiency up to 95%

* Testing result for reference only. Results may differ according to system configuration.VIN=12V, VOUT=1.2V, ƒSW = 300kHz, L=210nH (0.2mΩ), VCC=6.8V, CIN=47uF x 4, COUT =470uF x3, 400LFM airflow, no heat sink, 25°C ambient temperature, and 8-layer PCB of 3.7” (L) x 2.6” (W).

IR3550 PowIRstage® ICs are more efficient, with peak efficiency up to 95%, during normal operation.

Even at higher Current levels, IR3550 PowIRstage® ICs are able to maintain lower power losses. Lower power loss also means less heat as a byproduct.

Current Typical MOSFET Designs

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60A High Capacity Power Stage

60A High Capacity Ferrite Core Chokes

2x Copper PCB

High Current Capable Components

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All New 3-Way Digital Power

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All new hardware and software-based Digital Power Engine for both the PWM and Memory that delivers unprecedented power delivery control

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Memory Zone A Memory Zone B

PowerPower

Power

CPU and VSA

Memory A and VTT

All New 3-Way Digital Power

Memory B

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Brand new IR3550 PowIRstage® Digital PWM controller from International Rectifier

-Supports Dual VR12.5/VR12.0 Modes (a requirement for future 22nm CPUs).

-Auto Voltage Compensation to deliver an always steady flow of power to the CPU and Memory

Digital Power control for Memory for real-time adjustment

-Set OVP (Over Voltage Protection) to safeguard your memory.

-Memory Load-line Calibration to fix memory vdroop for a quicker response time.

-Adjust memory PWM frequency on-the-fly.

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GIGABYTE Turbo Voltage Response

Turbo Voltage Response allows the CPU and Memory voltage to reach their target voltages quicker, helping to improve overclocking performance and provide better power savings

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Maintain Optimal Voltage

By adjusting load line calibration, Vdroop can be avoided, maintaining optimal voltages levels despite increasing current levels

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Real-time PWM Frequency Switching

3D Power frequency control allows users to change the PWM controller frequency so that the CPU VRM can adjust power delivery speeds more quickly

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3D Power Utility

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More Control than Ever Before

Voltage Control

Voltage parameters can be modified within 3D Power, including load line calibration the of CPU. OVP (Over Voltage Protection) can also be adjusted to change default protection range of the CPU, memory controller, VTT and system memory.

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Phase Control

Users can calibrate OCP (Over Current Protection) for the CPU, integrated memory controller and system memory power levels. This allows the Phase control to deliver even more power to the system when needed.

More Control than Ever Before

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Frequency Control

GIGABYTE’s all-digital PWM allows for adjustable frequency control of CPU, VTT, Integrated Memory Controller and both A/B and C/D Memory arrays.

More Control than Ever Before

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GIGABYTE 3D BIOS™ is based on GIGABYTE UEFI DualBIOS™, re-imagining the traditional BIOS environment to make it more accessible and easier to use than ever.

3D Mode: A graphical, intuitive BIOS experience that makes it easy to understand how BIOS settings affect your PC’s performance.

Advanced Mode: A comprehensive and full-featured BIOS environment designed with veteran BIOS users in mind

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3D Mode: A streamlined graphical BIOS environment with descriptions and notes to help novice and casual users

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3D Mode: Simply click the 3D BIOS logo to reveal real-time CPU core, BCLK and Memory frequencies

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Advanced Mode: A comprehensive UEFI BIOS environment designed specifically for Overclockers and power users who demand maximum control over their PC’s hardware

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GIGABYTE DualBIOS™ features two physical BIOS ROMS mounted onto the motherboard. One chip acts as your "Main" BIOS, or the BIOS your system primarily uses during boot up. The second chip acts as a "Backup" BIOS and will automatically restore data to the main BIOS in case of malfunction.

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Bluetooth 4.0 + Wi-Fi card

Dual Band WiFi Card

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GC-WB300D

IEEE 802.11a/b/g/n

Exclusive Bluetooth 4.0 CapabilityGIGABYTE is the only motherboard vendor to bundle Bluetooth 4.0 compatible PCIe card. Bluetooth 4.0 includes Bluetooth Smart; a new class of Bluetooth technology that offers revolutionary low power consumption.

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Auto select best signal

Better performance (bandwidth)

Improve connectivity

Higher throughput

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GC-WB300D features DUAL BAND (2.4/5 GHz) operation

Great bandwidth with no interferenceGreat bandwidth with no interference2.4/5GHz dual band router.2.4/5GHz dual band router.

5 GHz

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BT 4.0 Low Energy

Support BT 4.0 device connection

Prolong device battery life

Bluetooth 4.0 LE

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Turn your desktop into a Personal Cloud Center or Wireless AP with GIGABYTE WiFi

Share

Works with other brands!Works with other brands!WiFi Share modeWiFi Share mode

Simply ‘drag and drop’ to the remote PC* and share!

*Requires WiFi Share running on both computers.*Requires WiFi Share running on both computers.

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GIGABYTE Cloud Station – Magic at Your fingertips!GIGABYTE Cloud Station – Magic at Your fingertips!

Monitor your system health status or tune

it for better performance on smart phone with “EasyTune

Touch”

Share your photos from smart phone to a bigger PC screen with ”PictureView”

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Turn Your Desktop PC Into The Center of Your Personal Cloud Free Remote Access/Control Software for PCs

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*Due to certain mobile phone limitations, users may need to connect the mobile phone to their PC before the PC enters S4/S5 mode to enable a quick charge from non ON/OFF Charge USB ports. Charging results may vary by model.

Quick Charge for iPhone / iPad / iPod touch

ON/OFF Charge USB Port

* ON/OFF Charge USB Port may vary by model.

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GIGABYTE motherboards feature a 3x USB power boost, delivering greater compatibility and extra power for USB devices. GIGABYTE’s unique USB power design is also able to efficiently regulate output over the full voltage range, which greatly enhances USB device compatibility. In addition, dedicated lower resistance fuses ensure lower voltage drops, and provide more stable and plentiful power delivery.

3x USB Power Boost

GIGABYTE Helps You Quick Charge Your iPhone / iPad / iPod TouchGIGABYTE On/Off Charge technology allows you to charge your iPhone, iPad and iPod Touch regardless of whether your PC is on, in standby mode or even off. A derivative of GIGABYTE's highly acclaimed 3x USB Power feature, On/Off Charge enables devices to draw more current from GIGABYTE motherboard USB ports than standard USB ports allow, so that charging from your PC can be as fast as with a charger.

* 3x USB power is a maximum theoretical value. Actual performance may vary by system configuration.

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On GIGABYTE X79 motherboards each USB port has its own dedicated power fuse that prevents unwanted USB port failure, helping to safe guard your important data during transfer.

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Support for PCI Express Gen.3

The latest Gen.3 PCI Express technology delivers maximum data bandwidth for the latest discrete graphics cards and PCIe SSDs

Approx. double the potential data bandwidth

PCI Express Gen. 2 = 5.0GT/s = 4Gb/s

PCI Express Gen. 3 = 8.0GT/s = ~ 8Gb/s

4Gb/s4Gb/s

8Gb/s8Gb/s

PCI e Gen 3 PCI e Gen 3 PCI e Gen 2 PCI e Gen 2

Gen 3 SSDOCZ Z-Drive R5

Gen 3 GraphicsGIGABYTE HD 7950

Must use a 3rd Gen. Intel® Core™ processor with native PCIe Gen 3

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Multiple Display Support with 3-way CrossFire X™ and 3-way SLI ™

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X79S-UP5-WIFI Design Features

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Processor

• Intel Core i7 and Intel Xeon processors in the LGA2011 package

Chipset

• Intel C606 Express Chipset

• Realtek ALC898 codec (Audio)

• 1 x Intel GbE LAN chip (LAN)

• 1 x Realtek GbE LAN chip (LAN)

• 1 x Marvell 88SE9172 chips (SATA 6Gb/s)

• Fresco FL1009 chips (USB3.0)

• VIA VL800 chip (USB3.0)

• iTE IT8728 chip (IO Controller)

Memory

Supports 4 Channel DDR3 with 8 DIMM slots

inc. ECC Memory

Expansion Slots

• 4 x PCI Express x16 slots (2x16,x8,x4)

• 1 x PCI Express x1 slots

• 1 x PCI slots

Internal I/O Connectors

•1 x 24-pin ATX main power connectorŠŠ

•1x 8-pin ATX 12V power connectorsŠŠ

•2 x SATA 6Gb/s connectors ŠŠ

•4 x SATA 3Gb/s connectorsŠŠ

•8 x SAS 3Gb/s connectors

•1 x CPU fan headerŠŠ

•4 x system fan headersŠŠŠŠ

•1 x S/PDIF Out headerŠŠ

•3 x USB 2.0/1.1 headersŠŠ

•1 x USB 3.0/2.0 header

•1 x IEEE 1394a port

•1 x Clear CMOS jumper

•1 x Trusted Platform Module (TPM) header

•1 x power button

•1 x reset buttonŠŠ

Rear I/O Connectors

•1 x PS/2 keyboard/mouse portŠŠ

•CPU OC /BIOS switch /Clear CMOS button

•5 x USB 2.0/1.1 portsŠŠ / 4 x USB 3.0/2.0 portsŠŠ

•1 x eSATA/USB Combo connector

•1 x eSATA 6Gb/s connector

•2 x RJ-45 portŠŠ / 5 x audio jacks

•1 x optical S/PDIF Out connector

X79S-UP5-WIFI Specifications

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Thank you