General Surface Mount Application Machine (GSMxs™) …GraphicLib)/GS39300… · · 2006-03-16e...

GS-393-00A5781A

General Surface MountApplication Machine

(GSMxs™)5781A

Universal Part Number: GS-393-00A Issued 26-Feb-99

GS-393-00A 5781A

GS-393-00A5781A

Incorporates a precision linear motor with Universal’s patented VRMTM technology.

Easily configurable to support surface mount assembly processes.

Includes a user-friendly, graphical interface complete with an on-line componentdatabase, CAD translation, and a machine performance simulator.

General Surface Mount Application Machine(GSMxs)

Machine Highlights

IMCProduct Line

IMCProduct LineAdvanced Surface

Mount Product LineAdvanced Surface

Mount Product Line

GS-393-00A 5781A

GS-393-00A 5781A

Contents

Introduction ............................................................................................................... 1Functional Description ............................................................................................. 1Standard Features ..................................................................................................... 1

Fiducial Inspection................................................................................................ 1Base Frame .......................................................................................................... 1Postitioning System .............................................................................................. 2Universal Platform Software ................................................................................. 2Machine Control System Architecture ................................................................... 2CD-ROM Drive ...................................................................................................... 2

Optional Features ...................................................................................................... 3Feeders ................................................................................................................ 3General Application Placement Head .................................................................... 3High Force Head ................................................................................................... 3UFP300+ High Accuracy Head ............................................................................. 3Gripper Nozzles .................................................................................................... 4Nozzle Changer .................................................................................................... 4Staged Board Handling ......................................................................................... 4

Vision ........................................................................................................................ 5Vision On-the-Fly .................................................................................................. 5Multi-pattern Find .................................................................................................. 5Component Centering/Inspection Cameras ........................................................... 6Front and Backlighting .......................................................................................... 6

Miscellaneous ........................................................................................................... 7Transformer .......................................................................................................... 7Uninterruptable Power Supply ............................................................................... 7GEM ..................................................................................................................... 7Basic Network Kit ................................................................................................. 7Feeder Storage Cart ............................................................................................. 7BOARDFLO® ....................................................................................................... 7Component Reject Station .................................................................................... 7Conveyor .............................................................................................................. 7Vibratory Reject .................................................................................................... 7Matrix Tray ............................................................................................................ 7Advanced Surface Mount Options ........................................................................ 8

Supporting Documents ............................................................................................. 9Technical Specification ............................................................................................ 9

Components (Front and Rear General Application Placement Heads) ................... 9Feeder Input ....................................................................................................... 10Positioning System Specifications ...................................................................... 10Placement Specifications (General Application Placement Head) ....................... 11Global and Local Fiducial Shapes and Dimensions ............................................. 12Overall Fiducial Recommendations ..................................................................... 12Board Specifications ........................................................................................... 13Board Handling ................................................................................................... 14Installation Considerations .................................................................................. 16Machine Dimensions .......................................................................................... 16Service Requirements ........................................................................................ 16Environmental Requirements .............................................................................. 17

Appendix A, GSM Feeders .................................................................................. A-19Platform Tray Feeder (PTF), model 4559A ....................................................... A-19Stackable Matrix Tray Feeder, model 4556A .................................................... A-28

GS-393-00A5781A

Contents

Tape Feeders, model 4695A ............................................................................ A-30Track Feeder, model 4696A ............................................................................. A-34Stationary Matrix Tray Platform, model 4697A ................................................. A-37Multi-tube Feeders, model 4698A .................................................................... A-38

Appendix B, Placement Heads ............................................................................ B-40UFP300+ High Accuracy Head ........................................................................ B-40

Appendix C, Cameras .......................................................................................... C-42

Appendix E, Advanced Surface Mount Assembly (ASMA) ................................ E-43Introduction ..................................................................................................... E-43Applications ..................................................................................................... E-43Application Summary ...................................................................................... E-45Optional Features ............................................................................................ E-48

GS-393-00A 5781A

All specifications are subject to periodic review and may be changed withoutnotice.

© Universal Instruments Corporation, 1999. All rights reserved.

The following are trademarks of Universal Instruments Corporation, registeredU.S. Patent and Trademark Office: P2PTM, UniversalTM, U-DesignTM. GSMxsTM isa trademark of Universal Instruments Corporation.

EthernetTM is a trademark of Xerox Corporation. FluorowareTM is a trademark ofFluoroware, Inc. IntelTM is a trademark of Intel Corporation. IBMTM and OS/2TM

are registered trademarks of International Business Machines Corporation.SurftapeTM is a trademark of Tempo Electronics.

GS-393-00A5781A

GS-393-00A

Introduction

The General Surface Mount Application Machine (GSMxs) is anultra high accuracy placement system that handles a wide rangeof surface mount components. It is a member of the UniversalInstruments GSMxs family of machines featuring precision linearscales, linear motors, and advanced vision processing capabilities.

In consideration of essential health and safety requirements, theGSMxs is CE marked.

Functional Description

Typically, four components are picked from various feeder loca-tions, vision inspected on-the-fly, and placed on the board. SeeTechnical Specifications for details on the configuration optionscurrently available.

Standard Features

Fiducial Inspection - registers the board in the machineand compensates for linear board distortions (stretch,shrink and non-orthogonality). Local fiducials are used tomeasure local board distortion. The downward-looking(P.E.C., pattern error correction) fiducial inspection cam-era is mounted under the beam. See the Technical Specifi-cations section for shapes, dimensions and overall specifi-cations.

Base Frame - was designed to minimize tolerance accu-mulation from subassembly to subassembly and maximizerigidity and stability. All major subassemblies are edge-jus-tified and dowel-pin registered to precision-milled, datumsurfaces machined into the base frame. This ensures thatthe positional relationships are held mechanically, notthrough adjustment.

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Positioning System - is an overhead, gantry style utilizinga single X-axis beam driven on both ends by linear motortechnology. One micron linear encoders are used.

Universal Platform Software - Universal's Platform Soft-ware (UPS) offers a common look for all platform applica-tions. It features an intuitive graphical human interface,data and control interfaces, including CAD import, com-prehensive data import and GEM.

• CAD data translation

• feeder setup optimization

• machine performance simulation

• placement sequence optimization

• feeder library

• error recovery

• on-line file manager

• easily modified industry-standard surface mount com-ponent database

• On-line Operation and Maintenance Manuals

Machine Control System Architecture

• Intel 80486-based embedded P.C.

• 2.0 Gigabyte Hard Drive

• Motorola 68030-based machine controller

• Motorola 68000 series-based motion controllers

CD-ROM Drive - is available for installation in the VMEchassis next to the floppy disk drive. CD-ROM simplifiesand speeds up the installation of upgrades and access tomachine documentation from just one CD ROM.

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vidually or simultaneously in any combination to pick com-ponents prior to placement.

The GAPH head can be selected for the front or rear ofthe beam.

High Force Head - General purpose four-spindle headwith 40mm spacing between each spindle. This headhandles the same broad range of surface mount compo-nents as the General Application Placement Head. In addi-tion, the high force head expands the placement force to arange of 175 to 2500 grams.

UFP300+ High Accuracy Head - the single spindle picksultra-fine-pitch components with a need for a high degreeof X, Y and theta (�) accuracy. The head installs on thefront or rear of the beam and accesses feeders on thesame side as the head installation.

See appendix for detailed information on the UFP300+High Accuracy Head.

Optional Features

Feeders - include tape feeders, track feeders, multi-tubefeeders, and matrix tray feeders. Refer to appendix fordetailed information.

General Application Placement Head - general purposehead (with 40mm spacing between each spindle) handlesthe broadest range of surface mount components. Thishead offers the best mix of accuracy and speed for mostsurface mount applications.

Adding a second General Application Placement Head re-duces the number of nozzle changes when building aproduct. The GAPH head has four spindles with 40mmspacing between each. These spindles can be driven indi-

General ApplicationPlacement Head

UFP300+High Accuracy Head

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Gripper Nozzles - Gripper tooling is used for componentswith no flat surface for vacuum picking. Ribbon cable con-nectors, inter-board headers, and potting forms are someexamples of the components handled by this tooling. Thegripping action is accomplished using the same vacuum andair kiss as the standard nozzle tips. The gripper tooling isnot compatible with nozzle changers. Each application re-quires specific tooling. Contact your Universal Sales Engi-neer for evaluation of your application.

Nozzle Changer - allows programmed nozzle changes toaccommodate components with different vacuum require-ments. Two changers with a total capacity of 13 nozzlesare standard for handling a wide range of components.

Staged Board Handling - buffers a board within the lanewhile a board is being populated. Features automatic widthcontrol based on programmed board parameters. Boardtransfer capabilities include left-to-right, pass through, andright-to-left. Mechanical board stops are standard and ac-commodate unique board shapes.

Gripper Nozzles

Staged Board Handling

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VisionVision On-the-Fly - For components up to 1.25 inchessquare (32mm), the GSMxs performs vision inspection on-the-fly. The head picks four components and passes overthe upward-looking (P2P®, Part-to-Pad-Matching) camera.While the head passes over the camera, the vision systemcaptures all four component images. The head then placesthe components at the vision-adjusted coordinates. Forcomponents that do not fit into a single field of view, thehead stops over an upward-looking camera. The visionsystem then captures multiple fields of view to acquire theentire component image.

Multi-pattern Find - A vision algorithm that uses patternrecognition to locate and center non-standard componentsprior to placement. Non-standard components includeheaders, connectors, shields, stampings, and others.

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Component Centering/Inspection Cameras - TheGSMxs supports two upward looking cameras, one in thefront feeder area and one in the rear. Two cameras re-duce the travel distance to the camera and allow theGSMxs to efficiently handle a greater range of compo-nents. Refer to appendix for information on selecting theappropriate cameras.

Front and Backlighting - The GSMxs is available withfront and backlighting for component inspection. For frontlighting, the inner LED banks are strobed as the vision sys-tem captures the front image of the component. Forbacklighting, the backlight towers strobe the two outerLED banks, illuminating the special backlighting nozzle.The vision system captures the silhouette of the compo-nent. Backlighting is recommended for components withhighly-reflective component leads, and any component thatdoes not image well. It cannot be used with componentsthat require multiple fields of view.

Front Lighting

Backlighting

Back light LEDs

Lens

Mirrors

CameraField of View »2" x 1.5"Standard magnification

Mirrors

CameraField of View »2" x 1.5"Standard magnification

Front light LEDs

Lens

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MiscellaneousTransformer - allows for the conversion of input powersources to the machine requirements.

Uninterruptible Power Supply - Ensures precisely con-trolled, continuous power to the GSMxs for at least tenminutes after losing the main power.

GEM - The Generic Equipment Model software licenseprovides a set of communication, data collection, command,and control tools for GSMxs machines. Based on theSemiconductor Equipment and Materials International stan-dard, SEMI E30-93, this software opens the system archi-tecture for integration into factory data collection and auto-mation systems.

Basic Network Kit - includes Ethernet Network Cardand IBM OS/2 TCP/IP client software and a 16 MB RAMupgrade to the GSMxs imbedded PC. With this option theGSMxs is ready for connection to an Ethernet TCP/IP net-work, providing high speed, reliable communications anddata transfer to all computers connected to the network.

Feeder Storage Cart - features three shelves of off-linestorage for up to 132, 8mm tape feeders.

BOARDFLO® Conveyors - transport the board be-tween individual machines within a system.

Component Reject Station - for components up to 2.0"square:

Conveyor - Two modes of operation move rejected com-ponents away from the GSMxs placement head:

• Programmable indexing cycles components until thesensor is interrupted stopping the machine.

• The belt moves continuously moving components offthe end.

Vibratory Reject - moves the components away from theGSMxs placement head for manual removal.

Matrix Tray - the stationary matrix tray feeder can beused as a reject matrix for valuable components.

Feeder Storage Cart

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Advanced Surface Mount Options - For even greaterflexibility covering a broader spectrum of components,combine the GSMxs with Advanced Surface Mountoptions.

Advanced Surface Mount Assembly (ASMA) includes thelist below.

• controlled collapse chip connection (C4)

• direct chip attach (DCA)

• ceramic ball grid array (CBGA)

• ceramic column grid array (CCGA)

• plastic ball grid array (PBGA)

• tape ball grid array (TBGA)

flip c

hip

BGA

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Supporting DocumentsAppendix A GSMxs Feeders, models 4556A, 4559A, 4695A,

4696A, 4697A, and 4698AAppendix B Placement HeadsAppendix C CamerasAppendix E Advanced Surface Mount Assembly (ASMA)

Technical Specification

Components (Front and Rear General Application Placement Heads)

Minimum Maximum

Width/Diameter 0.04" (1.016mm) 2.5" (63.5mm) 1, 2

Length 0.02" (0.508mm) 2.0" (51mm) 1

Thickness 0.020" (0.508mm) 2 0.500" (12.7mm)

Weight 35 grams, maximum. Consult the factory forheavier components.

Feature Pitch 0.010" (0.25mm) 3 — 2

Feature Width See appendix for cameras

Feature Count — 1000

1. Maximum component size for on-the-fly vision is 1.25"(31.8mm).

2. The GSMxs can handle other size components. For example,the GSMxs has placed a 5.75" x 0.510" (146.1mm x 12.95mm)SMD connector device using specific head, camera, andprocess applications. Consult your Universal Sales Engineer.

3. Requires the use of a high magnification camera. The GSMxscan handle other pitches. For example, the GSMxs has placeda 0.005" (0.13mm) pitch device using specific head, camera,and process applications. Consult your Universal SalesEngineer.

4. Maximum component size for front head to rear camera andrear head to front camera is 2.0" (76.20mm)

X YLengthWidth

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Feeder InputNumber of Feeder Slots Used(Total Available = 48)

Tape Feeder 8 & 12 mm 1 slot16 & 24 mm 2 slots32 & 44 mm 3 slots56mm 4 slots

Track Feeder 3 slots

Multi-tube Feeder 40mm 2 slots50mm 3 slots

Platform Tray Feeder (PTF) 9 slots

Stackable Matrix Tray 9 or 12 slots

Stationary Matrix Tray Feeder 8 or 9 slots

Component Reject Station 3 slots

Positioning System SpecificationsX Axis Travel 18.97" (482mm)

Y Axis Travel 35.55" (903mm)

Resolution 0.000039" (0.001mm) (1 micron)

Bidirectional <5 µm @ 6�Repeatability

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Placement Specifications (General Application Placement Head)

Placement Rate 4700 components per hour

Placement Tact 0.77 secondsTime

Component Low; Medium; HighPlacement Force (nominal reference values:

150 g to 350 g, to the nearest gram)with C4 option 175 to 2500 grams, programmable

Intrinsic Availability 98%

Placement Performance X, Y: � (rotational):with FX or HF head ±24µm@ ±6� ±0.2° @ ±6�on front of beam � < 4�m � < 0.033°

CP > 2.0 CP > 2.0Cpk > 1.5 Cpk > 1.5

with UFP head ±18µm@ ±6� ±0.15° @ ±6�on front of beam � < 3µm � < 0.025°

CP > 2.0 CP > 2.0Cpk > 1.5 Cpk > 1.5

Verified with all components of variation included: all spindles atall rotations over entire placement area for multiple boards and foreach head and camera combination, using glass slugs placed onglass plates. Data is analyzed on a per placement site basis andpooled across all placement sites.

The Mean is the arithmeticaverage of a set of measurements.

Accuracy is the distance betweenthe mean and the target value.

Standard Deviation is a measureof the variability of a processoutput.

Repeatability is one standarddeviation.

Cp is a capability index whichcompares the spread of theprocess to the distance betweenthe upper and lower specifications.

Cpk is the process capability index,which is a measure of the process'sability to produce product withinspecifications.

where ��= the standard deviation(pooled) of the sample where x = thesample mean.

where � = the standard deviation(pooled) of the sample.

Cp =Upper Spec Limit - Lower Spec Limit

6�

Target

Mean USLLSL

±2�±1�

±3�

Accuracy

CpK = min(x - Lower Spec Limit, Upper Spec Limit - x )3�

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D1

D2

D1

D2

D1

D2

D1

D1

D2

D1

D1

D2

Global and Local Fiducial Shapes and DimensionsShape D1 D2Disc Min=.24" (.61mm) —

Max=.250" (6.35mm)

Swiss Min=.040" (1.02mm) Min=.020" (.508mm)Cross Max=.250" (6.35mm) Max=.230"(5.84mm)

Rectangle Min=.030" (.762mm) Min=.030" (.762mm)(Square) Max=.250" (6.35mm) Max=.250" (6.35mm)

Double Min=.030" (.762mm) Min=.040" (1.02mm)or Right Max=.250" (6.35mm) Max=.250" (6.35mm)Box Left

Diamond Min=.050" (1.27mm) —Max=.175" (4.45mm)

Plus Min=.030" (.762mm) Min=.030" (.762mm)Max=N/A Max=N/A

Doughnut Min=.050" (1.27mm) Min=.020" (.51mm)Max=.250" (6.35mm) Max=.220" (5.59mm)

Overall Fiducial RecommendationsUniversal recommends that a minimum of three global fiducials beused for boards assembled on the GSMxs—two to six fiducialsdepending on the process. Although the GSMxs handles a range offiducial types, the most reliable fiducial recommendations follow:

Shape Solid, filled circle

Size Minimum -- 0.024" (0.61mm)Maximum -- 0.118" (3.00mm)

Tolerance 0.001" (0.025mm)

Clearance The fiducial clearance area must be at least twotimes the diameter of the fiducial

Material Bare copper or copper covered with either clearanti-oxidation coating, nickel plating, tin plating,hot air leveled solder coating, or gold.

Flatness The fiducial surface should be flat within 0.0006"(0.015mm)

Mask Solder resist coatings should not cover a fiducialmark or its clearance area.

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Board Specifications

Staged Board HandlingEdge Clearance 3mm 5mm

Min Max Min Max

Width 2.00"2 9.84" 2.00" 10.00"

(50.8mm) (249.94mm) (50.8mm) (254.00mm)

Length 2.00" 13.00" 2.00" 13.00"

(50.8mm) (330.20mm) (50.8mm) (330.20mm)

Thickness2 0.020" 0.200" 0.020" 0.200"

(0.508mm)(5.08mm) (0.508mm)(5.08mm)

Weight3 N/A 6 lbs N/A 6 lbs

(2.72 kg) (2.72 kg)

Top Side Clearance N/A 0.500" N/A 0.500"

(12.7mm) (12.7mm)

Bottom Side See illustration below.Clearance

Allowable Warp Reference ANSI/IPC-D-300G, Printed BoardDimensions and Tolerances.

Thick Board HandlingEdge Clearance 3mm 5mm

Min Max Min Max

Width 2.50"2 9.84" 2.50"2 10.00"

(63.50mm)(249.94mm) (63.50mm)(254.00mm)

Length 2.50" 13.00" 2.50" 13.00"

(63.50mm)(330.20mm) (63.50mm)(330.20mm)

Thickness2 0.020" 0.50" 0.020" 0.50"

(0.508mm)(12.70mm) (0.508mm)(12.70mm)

Weight3 N/A 6 lbs N/A 6 lbs

(2.72 kg) (2.72 kg)

Top Side Clearance N/A 0.500" N/A 0.500"

(12.7mm) (12.7mm)

Bottom Side See illustration below.Clearance

Allowable Warp Reference ANSI/IPC-D-300G, Printed BoardDimensions and Tolerances.

1. For other sizes, contact your Universal Sales Engineer.

2. Requires the removal of mechanical board stops.

3. Represents the sum of all board weights within the GSMxsboard handling system.

Top sideclearance

EdgeclearanceWidth

LengthThickness

Allowablewarp

Bottomside

clearance

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Fixed front railRear rail

0.5" (12.7mm) clearance underboard

P.C. board section

Maximum underboard clearance area

component

com

pone

nt

1.0" (25.4mm)

1.0" (25.4mm) clearance under board

P.C. board rails

Board HandlingMinimum Maximum

Transfer Height 35.4" (899mm) 38.00" (965.2mm)

Transfer Time 2.5 seconds

Board Support - minimizes the effects of board warp, sag, and/or flex by supporting the board during component placement.The board support uses a grid pattern containing removable pins.

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GSMxs Views

GSM

1407.16mm(55.4")

P

E

558.8mm(22.0")

Beam

Rear Feeder Bank

Front Feeder Bank

Nozzle Changers

76mm(3.0")

Pneumatic Connection

Electrical Connection

P

E686mm

(27")

254mm(10")

2134mm(84")

P

E

xs

1549mm(61")

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Installation Considerations

Machine DimensionsLength1 Depth Height Weight

GSMxs 55" 61" 84" 5150(1397mm) (1549mm) (2134mm) (2336kg)

Domestic 71" 87" 73" 2 5600Shipping (1803mm) (2210mm) (1854mm) (2540kg)

Air Freight 72" 88" 73" 2 5800(1829mm) (2235mm) (1854mm) (2631kg)

Sea Freight 72" 88" 73" 2 5800(1829mm) (2235mm) (1854mm) (2631kg)

Floor Space A minimum clear area of three feet (one meter)around the machine perimeter is recommended formachine operation and servicing.

1. Length is in the direction of board flow.

2. Machine light tower and monitor shipped separately.

Service RequirementsElectrical 230 VAC, nominal

Frequency 50 or 60 Hz (49-51 or 59-61 Hz).Frequency must be stated at time of order.

Phases 3

Number of 4 (three phase lines and ground)wires

Service Service must be grounded Deltaconfiguration

Branch circuit 30 ampssize

Distortion <10% total harmonic distortion

Average power 5000 watts

Electrical 3" (76.2mm) from frontconnection 27" (686mm) from floor

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Service Requirements (continued)Pneumatics

Air consump- 9.9 scfm (280.3 Nliters/minute)tion for basemachine 1

Air flow required 10.73 cfm at 90psito base (303.8 liters/minute at 6.21 bar)machine 2

Clean air Clean air is defined as: dew point must be 20° F.(11° C.) below ambient temperature; oil at 0.08ppm at 82° F. (28° C.); input air filtered to 5microns particle size.

Pneumatic 20" (508mm) from front, 10" (254mm) fromconnection floor. Internal thread connection is 3/8" NPT and

provided with the machine.

Equipment is adequately protected againstingress of solid and liquid contaminants.

1. Air consumption is air used by the base machine during anormal machine cycle and measured in standard cubic feet perminute (Nliters/min).

2. Air flow value is used to calculate the input air line which mightsupply several machines. The flow value is measured in cubicfeet per minute (cfm) or liters per minute (liters/min).

Environmental RequirementsMinimum Maximum

Operating 40° F (4.4° C) 95° F (35° C)Temperature Range

Storage -4° F (-20° C) 149° F (65° C)Temperature

Operating Humidity 10% non-condensing 90% non-condensing

Operating Altitude — 8202 feet (2500meters)

Noise level 70 dbA in accordance with National MachineToolbuilders Assoc. Noise MeasurementTechnique Standard — June 1986.

Operating For optimum placement performanceEnvironment Universal's linear motor machines are designed

to work in an environmentally-controlled setting.

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A - 19Appendix A, GSMxs Feeders - GS-393-00A

Appendix A, GSM Feeders

Platform Tray Feeder (PTF), model 4559A

Introduction

The optional Platform Tray Feeder (PTF) is designed to comple-ment the strengths of Universal’s platform family of placementsolutions while reinforcing the GSMxs attributes of reliability,flexibility, ease of use, and high throughput.

The Platform Tray Feeder (PTF) can present up to 58 differentpart numbers of most leaded and area array components to theUniversal family of platform machines for placement. The PTFcan be loaded with stacks of matrix trays without stopping com-ponent placement in the GSMxs.

In consideration of essential health and safety requirements, thePlatform Tray Feeder is CE marked.

Platform Tray Feeder (PTF)

A - 20 GS-393-00A - Appendix A, GSMxs Feeders


The primary function of the PTF is to provide components frommatrix trays for gang-picking at the GSMxs. To accomplish this,the PTF is configured at setup, then the components and matrixtrays are defined using the feeder and component databases inthe Product Editor of the GSMxs. The Universal Platform Soft-ware (UPS) can optimize and assign component positions withinindividual pallets to create a valid product.

After setup configuration, the operator loads matrix trays in thedefined pallets of the elevator using the feeder load procedure.During loading, matrix trays can be stacked to the top of the pal-let, then the pallet is easily pushed into place in the magazine slot.When all pallets are loaded, the feeder door is latched and thestart button is pushed to begin operation.

During operation, the feeder uses six axes of servo control to ac-curately move matrix trays and components to the pick points ofthe PTF and the GSMxs. The GSMxs software signals the servo-controlled tray transport to extend the selected pallet out of themagazine. While the pallet is extended, the feeder head assembly,also servo-controlled, picks the component from the matrix tray.Up to four components are selected from the same pallet or anyother pallet in the elevator. The presence of a component issensed, then placed on the transfer shuttle. The components onthe servo-controlled transfer shuttle are spaced at 40mm andmoved for gang-picking to the GSMxs pick point.

As each matrix tray is emptied, the feeder head assembly auto-matically removes the matrix tray from the pallet to a customer-supplied empty tray bin. When an empty stack or pallet is deter-mined by the Universal Platform Software, the correspondingLED illuminates on the magazine indicating which pallet to refill.The operator loads the pallet or pallets as required, and returnsthe PTF to the run sequence without pausing the GSMxs place-ment process.

Transfer Shuttleto GSMxs

Door to accesselevator andrefill pallets withmatrix trays


Tray Transport - The tray transport automates the palletselection and matrix tray disposal. The GSMxs softwaresignals the servo-controlled tray transport to move the se-lected pallet out of the magazine. While the pallet is ex-tended, the feeder head assembly, also servo-controlled,picks the component from the matrix tray and places it onthe transfer shuttle moving it into the GSMxs. When thematrix tray is empty, the feeder head assembly automati-cally removes the matrix tray from the pallet to a cus-tomer-supplied empty tray bin. If the user does not wantautomatic disposal of empty matrix trays, the UPS can beconfigured to force manual removal.

Standard Features

Pallets - Small, medium, or large-depth pallets accommo-date most of the leaded and area-array components pack-aged in matrix trays. Pallets are selected separately or in astandard configuration, and hold one or two unique compo-nent IDs for up to a total of 58 matrix tray component IDs.The various depths of the pallets allow small to large stacksof matrix trays, optimizing production needs. The standardconfiguration includes five small pallets, three medium pal-lets, five large pallets, and one small purge pallet. An op-erator can load a stack of matrix trays within 20 seconds,and pallets easily slide into any one of the 29 magazineslots without delaying GSMxs placement.

Transfer Shuttle - The servo-controlled transfer shuttlemoves components (spaced 40mm apart) from the feederto the precise pick point of the GSMxs for placement.Transfer time of four components from one tray to the pickpoint is only six seconds. Transfer shuttle movement is par-allel to board transfer in the GSMxs.

Tray Transport

Transfer Shuttle Assembly

Medium Pallet with fullMatrix Trays

GSMxs

PTF

Components


Technical Specifications

ConfigurationGSMxs software The PTF is controlled by Universal Platform

Software (UPS). The UPS processes diagnosticmessages, and optimization of one product.Included is a graphic interface for definingcomponents, matrix trays, magazine slots andfeeder configuration from the feeder andcomponent database.

Configuration The base platform has side entrance holes forinstalling the PTF transfer shuttle in the rightrear, left rear, left front, and right front. TheGSMxs supports one PTF.

A manual slide-width 36" (914mm) PTFConveyor is supplied with the PTF.

Required feeder 9 feeder slots when installed in side entranceslots holes.

Empty tray bin Use to collect empty matrix trays, customersupplied.

Component Pick and Transfer SpecificationsTact time 1.5 seconds per component

Transfer time 6 seconds, 4 components from one tray to9 seconds, 4 components from pallets inmagazine slots 2, 3, 4, and 5 or four othercontiguous magazine slots to the pickposition of the GSMxs.

Shuttle transfer 35.4" to 38.00" (899mm to 965.2mm)height

Allowable configurationsfor a PTF installation on thefeeder bank of the GSMxs.

Note: Maximum of one PTFper machine.

Platform front

36" PTFConveyor

Board flow

PTF TransferShuttle

➦

GSMxs

Feeders

Platform front

22"Conveyor

Board flow

PTF➦

GSMxs

36" PTFConveyor

TransferShuttle

Feeders

Platform front

Boardflow

PTFGSMxs

36" PTFConveyor

TransferShuttle

Feeders

➦

Platform front

Boardflow

PTFGSMxs

36" PTFConveyor

TransferShuttle

Feeders

➦


Components Fed From PTFType Leaded and area-array

Dimensions 0.25" to 2.0" (6.4 to 51mm) square, manualnozzle change may be required for a full rangeof component picking.

Thickness 0.04" to 0.50" (1.0 to 12.7mm), flat and smoothsurface for vacuum retention. See NozzleRequirements.

Weight Up to 50 grams each. See Nozzle Requirements.

Matrix trayDimensions • 4" x 4" x 0.1" (102 x 102 x 3mm), minimum

• 13.0" x 11.5" x 0.5" (330 x 292 x 12.7mm),one component ID, or

• 13.0" x 5.5" x 0.5" (330 x 140 x 12.7mm) forone or two component IDs (two matrix trays)in one pallet.

Height Height of trays and components cannot exceedthe top of the pallet.

Weight, maximum 10 pounds (4.54 kg) total combined weight ofmatrix trays and components per pallet.

300 grams maximum empty weight. Trays thatdo not meet JEDEC standards can be manuallyremoved.

Pick area, empty The pick area of a matrix tray is a smoothsurface that allows vacuum retention andtherefore, removal of an empty matrix tray.Reference IEC specifications for requirements.


PalletsSmall Medium Large

Pallet depth 0.50" (12.7mm) 1.05" (26.7mm) 2.55" (64.8mm)

Pallet capacity

Number of stacks 1 or 2 1 or 2 1 or 2

Number of trays 2 4 8per stack

Magazine slots 1 2 4required per pallet

Load time 20 to 30 seconds to load a stack of trays andclamp each stack flush with the pallet leadingedge.

Pallet weight 16 pounds (7.26 kg), maximum combined weightof pallet and full matrix trays.

MagazineMagazine capacity 29 pallet slots

Standard magazine package includes 5 small, 3medium, and 5 large pallets plus one purgepallet. A large pallet is placed in the bottommagazine slot to accommodate this pallet mix.

Small pallet, 29 at 0.50" (12.7mm) deep, maximumMedium pallet, 15 at 1.05" (26.7mm) deep, maximumLarge pallet, 8 at 2.55" (64.8mm) deep, maximum

Capacity 135 pounds (61.3 kg), including pallets, matrixtrays, and components

2 magazine slots

Full matrix traysPartially full matrix trays

Medium size pallet

Component ID number one

Component ID number two

1 magazine slot

Small size pallet

Partially full matrix trays



4 magazine slots

Full matrix traysPartially full matrix trays

Large size pallet

Full matrix traysFull matrix trays




PTF shown installed on General Surface Mount Application Machines (GSMxs)(platforms with side entrance holes)

GSM

914mm (36")

PTF Conveyor

914mm (36")

PTF ConveyorBoard flow

P

E

Pneumatic Connection

Electrical Connection

P

E

PlatformTray Feeder(PTF)




32" (813mm)

584mm (23.0") GSMxs

E

584mm (23") 584mm (23")

2134mm(84")

279mm (11")

610mm (24")

876mm(34.5")

xs

1397mm (55.0")

2273mm (89.5")

229mm (9")


Installation ConsiderationsLength 1 Depth Height Weight

Overall 32" 58" 62" 1155 pounds(813mm) (1473mm) (1575mm) (524 kg)

Domestic 42" 69" 67" 1250 poundsShipping (1067mm) (1753mm) (1702mm) (568 kg)

Air Freight 43" 69" 69" 1355 pounds(1092mm) (1753mm) (1753mm) (615 kg)

Sea Freight 43" 69" 69" 1375 pounds(1092mm) (1753mm) (1753mm) (624 kg)

Floor Space A minimum clear area of three feet (one meter)around the machine perimeter is recommended formachine operation and servicing.

1. Length is in the direction of board flow.

PTF Service RequirementsElectrical 230 VAC, provided by the GSMxs

Electrical interface is needed for existing GSMxsinstallations. Consult your Universal SalesEngineer.

Pneumatic Provided by the Platform

Vacuum Generated internally by PTF feeder

PTF Conveyor Service Requirements100 to 130 VAC, 50/60 Hz, 7.5 amperes200 to 260 VAC, 50/60 Hz, 7.5 amperes.Separate drop required.

Environmental RequirementsMinimum Maximum

Operating 40° F (4.4° C) 95° F (35° C)Temperature

Operating — 10.8° F/hourTemperature (6° C/hour)Change Tolerance

Storage -4° F (-20° C) 149° F (65° C)Temperature

Operating Humidity 10% non-condensing 90% non-condensing

Operating Altitude — 8202 feet (2500 meters)

Noise 70 dbA in accordance with National MachineToolbuilders Assoc. Standards.


Supporting Documents

International Electrotechnical Commission (IEC) Standards,286-5, revision 1995-02 for Packaging of Components forAutomatic Handling

SMEMA Software/Communications Interface Standard 2.0


Stackable Matrix Tray Feeder, model 4556A

Introduction

The model 4556A, Stackable Matrix Tray Feeder moves a stackof matrix trays all loaded with components of one part number tothe pick position of the GSMxs. Empty trays are discarded.Vacuum pickup requires trays with a smooth surface and solid-backed pockets near the center of the tray.

Standard Features

The simple, compact feeder will move up to a 3.75 inch, 15.0pound stack of matrix trays to the GSMxs pick position. Twosize feeders are available. For other than stated matrix traysizes, consult your Universal Sales Engineer.

• 6.1 Feeder, 5.35 to 6.10 inches (135.9 to 154.9mm) wide by10.5 to 13 inches (266.7 to 330.2) long matrix trays. Totalfeeder width, 7.00" (177.8mm).

• 8.3 Feeder, 5.35 to 8.38 inches (135.9 to 212.9mm) wide by10.5 to 13 inches (266.7 to 330.2) matrix trays. Total feederwidth, 9.37" (238.0mm).


A stack of matrix trays is presented to the GSMxs for componentpickup. The GSMxs picks from the top tray. When the top trayis empty, the stack moves to the discard position. The empty trayis picked, uncovering the next full matrix tray. The remainingloaded stack returns to the pick area, while the empty tray is dis-carded, manually or automatically. A full stack of matrix trays ismanually loaded as needed.

SAVA 305-s- 142

GSMxs9" (228.6mm)

Interface Plate on GSMxs

Floor

14" (355.6mm)

LiftLift

Electrical Enclosure Assy 2

Notes:1 Approximate, may vary with machine setup.2 Remove the Electrical Enclosure Assy before picking up the Feeder.

Length 1

Height

Elevator Assy


Technical SpecificationsLength Width Height Weight

Overall 36.62" 7-9.37" 31.50" 50 pounds(930mm) (177.8- (800.2mm) (22.7 kg)

238.0mm)

Elevator NA NA 16.25" 35 pounds(412.8mm) (15.9 kg)

Electrical NA NA 15.25" 15 poundsEnclosure (387.4mm) (6.8 kg)Assembly

Floor Clearance 14" (356.6mm), approximately

Altitude Up to 1000m above mean sea level

Ambient Air +5°C to +40°CTemperature Range

Average Ambient Not to exceed +35°C in 24 hoursAir TemperatureRange

Free Air Operating +5°C to +55°CTemperature

Average Free Air Not to exceed +50°C in 24 hoursOperatingTemperature

Humidity Range 30% to 95%, non-condensing

Noise 65 dbA

Transportation -25°C to +55°C, up to +70°C in 24 hoursand Storage Store in shipping carton, Universal # M00067900

or mounted on Feeder Cart Assembly,Universal # 45577701.

Required Feeder 6.1 Feeder, 9 feeder slotsPositions 8.3 Feeder, 12 feeder slots

Service Requirements

Electrical Power is provided by the GSMxs. IEC-typeconnector, 120VAC, 50-60 Hz., 1.6 ampere.Voltage fluctuation, 10%.

Pneumatic Air is provided by the GSMxs at 3 cfm at 80 psi(84.95 liters/minute at 5.52 bar) with a 0.25"(6.35mm) hose.

Vacuum Generated internal to the feeder.

Safety Bottom panel provided.

Moving 60 pound pallet jack, and 15 minutes to uncrate.To lift uncrated Feeder, disassemble and use liftpoints shown in illustration.


Tape Feeders, model 4695A

Introduction

The model 4695A tape feeder is available to process a widerange of punched or embossed component tapes. Reel loadedfeeders can be kept in readiness for installation on the GSMxs.

Machine Concept

Each feeder is dedicated to a tape width and index pitch. Theelectrical and pneumatic connections are engaged when thefeeder is mounted to the GSMxs.

Modular design of the feeder permits quick feeder changeover onthe GSMxs while the machine is cycling.

Standard Features

Select a dedicated tape feeder for the following tape sizes and index.

• 8mm (2 or 4mm index)

• 12mm (4, 8, or 12mm index)

• 16mm (4, 8, 12, or 16mm index)

• 24mm (4, 8, 12, 16, 20, or 24mm index)

• 32mm (4, 8, 12, 16, 20, 24, 28, or 32mm index)

• 44mm (4, 8, 12, 16, 20, 24, 28, 32, 36 or 40mm index)

• 56mm (4, 8, 12, 16, 20, 24, 28, 32, 36 or 40mm index)

Feeder design is based on EIA-481-1, EIA-481-2, and EIA-481-3standards. Punched carrier, embossed carrier tapes, reels andcomponents meeting the above standards are processed by thesefeeders. Reference Technical Specifications section where limi-tations apply.

32mmEmbossed Carrier

8mmCarrier Tape

12mm Feeder


Handle

Latch

ComponentReel Holder

1 5a Scrap CarrierTape Exit

6

Component Pick UpPosition

4This End to the GSMxs

2 Mylar Cover TapeTake-up Reel

5Peeler Blade

3 Manual FeederIndex Tool


The following sequence of events describe the tape feeder func-tions. The numbers in parenthesis relate to the callouts on thetape feeder.

(1) A component tape reel is mounted on the component reelholder.

(2) The component tape is routed beneath the take-up reel to theindex wheel.

(3) The component tape is advanced through the feeder usingthe feeder index tool.

(4) Pins on the index wheel engage holes in the component tapeadvancing components to the pickup position.

(5) The top mylar cover tape is threaded back over the peelerblade to the take-up reel while the empty component carriertape is routed out through the carrier tape scrap guide.

(6) The latch locks and releases the feeder on the GSMxs.

Supporting Documents

EIA-481A Electronic Industries Association Standard - Tapingof Surface Mount Components for Automatic Place-ment.


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Tape

Pocket

Component

0.23" (5.8mm)

Tape Pocket Depth Limitations:

Tape size Pocket length 3 Pocket depth

8mm N/A 0.098" (2.49mm)

12 to 24mm N/A 0.394" (10mm)

32 to 56mm Up to 1.140" (28.9mm) 0.394" (10mm)Between 1.140" and 1.378" 0.360" (9.14mm)(28.9mm and 35mm)

Notes:

1. The feeder index cycle begins when the Z axis (spindle) reaches the up position. The default time to indexthe next part to the pick position is 0.70, 1.0, or 2.0 seconds dependent on the feeder model.

2. Indicates a double stroke cylinder.

3. Tapes with pocket lengths longer than 1.378" (35mm) must be evaluated by Universal.

Shown is the maximum distancefrom the top of the tape to the top ofthe component.


Track Feeder, model 4696A

Introduction

The Track Feeder supports and positions component tubes forcomponent transport to the pick position for GSMxs presentation.Tracks and feeder bases are sold separately. Consult your Uni-versal Sales Engineer for the Track Application Listing. TheTrack Application Listing contains the component types and di-mensions that can be used on the track feeder.

Machine Concept

The track assembly and the feeder base assembly make up thetrack feeder.

The component specific track accommodates a maximum of fourtubes. Track assemblies, with or without isolator assemblies, canbe installed on the base assembly.

Modular design of the track feeder permits quick feeder change-over on the GSMxs.

Standard Features

Track Assembly

The component track assembly, with or without an isolator as-sembly, is application specific. Tracks are available for SOIC,LCC, PLCC, SOJ, and MOD DIP components. Select the re-quired track from the Track Application Listing. Tracks with iso-lators are used for the most common component packages. Atrack load assembly or wireform supports the component tubes.

Feeder Base Assembly

The feeder base assembly, with GSMxs mounting, includes theinterface and shutter assembly.


Feeder Base

2 Track Assembly withIsolator Assembly

1 ComponentTube

3 Interface Assembly (Usedwith isolator equippedtrack assembly. Removedwhen installing all others.)

3a Shutter


The following sequence of events describes the track feederfunctions. The numbers in parenthesis relate to the callouts onthe track feeder.

(1) Components are loaded:

• Automatically from component tube.

• Manually from a component tube. Nonstandard tubes mayrequire a manual method.

(2) The components move through the track assembly to thepickup position. An isolator relieves component back-pres-sure for ease of component pickup.

(3) The interface, between the track and the feeder base, in-cludes a shutter. Components remain in the track, capturedby the shutter until the component is picked.


Technical SpecificationsRequired Feeder 3 feeder slotsPositions

Service Requirements

Electrical Power is provided by the GSMxs.

Pneumatic Air is provided by the GSMxs.


Stationary Matrix Tray Platform, model 4697A

Introduction

The stationary matrix tray platform is a base for up to 7 x 13 inchmatrix trays. The matrix tray platform requires no power andhas no options.


The matrix tray support clamp assembly secures matrix trays forcomponent pickup by the GSMxs.

Technical SpecificationsMaximum 1.0" (25.4mm)component andtray height

Weight 26 pounds (11.8 kg)

Required feeder 8 feeder slotspositions

Service None is required.requirements


Multi-tube Feeders, model 4698A

Introduction

The model 4698A Multi-tube Feeder delivers a variety of compo-nents from tubes to the pick position on the GSMxs. The feederis loaded with multiple tubes of the same component type andpart number. It automatically ejects empty tubes and continuesfeeding components. The feeder can be manually loaded withfull tubes while the GSMxs is operating.

The General Application Placement Head can gang-pick fromthe Multi-tube feeders that require two feeder slots.

Standard Features

Each feeder is dedicated to a component style. Universal Instru-ments offers the following multi-tube feeders for integration tothe GSMxs.

· 16 pin SOIC

· 28 pin PLCC

· 32 pin PLCC

· 44 pin PLCC

· 52 pin PLCC

· 68 pin PLCC



The following sequence of events describe the multi-tube feederfunctions. The numbers in parenthesis relate to the callouts onthe Multi-tube Feeder illustration.

(1) Tubes are stacked, one on top of the other and at an angle,for gravity feed of components to the singulator/track assem-bly.

(2) The singulator retains the second component in line, while al-lowing the first component in line to advance to the conveyor.When the singulator returns, the line of components advanceby one component length.

(3) The conveyor indexes the component to the end stop for pickup by the GSMxs. head.

(4) An empty tube ejects from the bottom of the feeder and thenext one in the stack drops into position for feeding to thesingulator

2

4

1

Technical SpecificationsElectrical Power is provided by the GSMxs.

Pneumatic Air is provided by the GSMxs.

Required feeder 2 feeder slotspositions

Tube length 19.75 to 22.00" (501.6 to 558.8mm)

Tube stack height 4.00" (101.6mm), maximum

Index rate Programmable in feeder library. Recommendedminimum setting is 1.300 seconds.

3

B - 40 GS-393-00A - Appendix B, GSMxs Placement Heads

Appendix B, Placement Heads

UFP300+ High Accuracy Head

Compatible Features and OptionsConfiguration The UFP300+ High Accuracy Head can be

installed on the front or rear of the beam on theGSMxs.

The UFP300+ head accesses the camera,feeders, and nozzle changer on the same side asthe head installation.

Components are picked from feeder slotpositions 8 to 29 and 44 to 65.

Compatible/ Flux DispenserOptional General Application Placement HeadFeatures Dispense Head

Nozzle ChangersHigh Force 4 Spindle Head

Components (UFP300+ head)

Minimum Maximum

Width (X) 0.04" (1.016mm) 2.0" (51mm) 1, 2

Length (Y) 0.02" (0.508mm) 2.0" (51mm) 1

Thickness 0.020" (0.508mm) 0.500" (12.7mm)

Feature pitch 0.006" (0.15mm) —

Feature width See camera appendix

Total feature count — 1000

1. Maximum component size for on-the-fly vision is 1.25"(31.8mm) with standard magnification.

2. The GSMxs can handle other size components. Consultyour Universal Sales Engineer.X Y

B - 41Appendix B, GSMxs Placement Heads - GS-393-00A

Placement Specifications (UFP300+ head)Placement rate 800 components per hour

Component 150 to 10,000gplacement force range

Final placement 50 defects per million (dpm)performance

Intrinsic availability 98%

Placement performance

X & Y ±17.5 microns @ 5�CP � 1.67� � 3.5 microns

Performance based on placement of 140 lead, 25 mil pitch glasscomponents on a glass substrate using global fiducials. Dataanalyzed on a per placement site basis (n = 30).

C - 42 GS-393-00A - Appendix C, GSMxs Cameras

Appendix C, Cameras

Technical Specifications

Camera SpecificationsMagnification

Standard magnification 1 pixel = 0.004" (0.102mm)Medium magnification 1 pixel = 0.0026" (0.066mm)High magnification 1 pixel = 0.0013" (0.033mm)

Minimum lead width with inspection

Standard magnification 0.010" (0.254mm)Medium magnification 0.0065" (0.165mm)High magnification 0.00325" (0.083mm)

Minimum lead width without inspection


Maximum component size in a single field of view (F.O.V.)


Required pixels for

Centering, lead width and space between leads 2.0 pixelsInspection, lead width and space between leads 2.5 pixelsBumped components, per feature and spacingbetween features 5.0 pixels

E - 43Appendix E, GSMxs Advanced Surface Mount Assembly - GS-393-00A

Appendix E, Advanced Surface Mount Assembly (ASMA)

Introduction

The flexibility of the GSMxs makes it readily adaptable to assem-bling bare die to the next level package; either a component levelpackage or a board level substrate. To focus on these particularassembly requirements, Universal Instruments established theAdvanced Surface Mount Assembly Product Team to workclosely with customers and develop the appropriate applicationsolutions using the GSMxs, typically in a GSMxs Placement Ma-chine configuration. This document outlines typical applicationsand the GSMxs options developed by the Advanced SurfaceMount Assembly Product Team to meet the assembly require-ments.

Applications

This Appendix covers any application involving the placement ofbare die, in either an active circuitry up or die attach configura-tion for subsequent wire bonding or an active circuitry down orflip chip configuration. Applications include the assembly of com-ponents, such as pin grid array (PGA) and ball grid array (BGA)packages, as well as direct attachment of the die to a printed cir-cuit board or substrate.

E - 44 GS-393-00A - Appendix E, GSMxs Advanced Surface Mount Assembly

Flip Chip Application

There are many interconnection schemes for flip chip applica-tions, where the bare die is placed with the active surface facingthe next level package, thus creating the shortest possible inter-connect path. Bare die for flip chip applications have an array ofinterconnects across the active surface, either along the periph-ery or distributed across the entire surface. The most commonflip chip interconnection scheme uses solder as the interconnec-tion material. The interconnection structures on the die, referredto as bumps, are typically made of solder, 4 to 5 mils in diameteron a 8 to 10 mil pitch, although larger and smaller bump diametersand coarser pitches are also used. The composition of the soldercan be either 63Sn/37Pb (eutectic) or 3Sn/97Pb depending on theapplication.

Flip chip die can be attached to various types of substrate media,including FR-4, ceramic, copper/polyamide, and flex cables. Thetypical flip chip attachment process includes picking the die fromthe appropriate input feeder, fluxing, and placement, followed bya mass reflow. It should be noted that solder paste depositiondoes not typically precede the placement process, since the inter-connect pitches are finer than typically supported by the solderprinting process. All the solder needed to form the solder joint isprovided by either the bump on the die or the pad on the substratedepending on the application. For flip chip die, flux is used to me-chanically hold the die in place until reflow in addition to cleansingthe solderable surfaces. The die along with any other standardsurface mount components can be soldered in a single massreflow process.

Die Attach Application

For die attach applications, the die is fabricated in the traditionalmanner with wire bond pads located along the periphery in eithera single or staggered double row. Prior to placement of the dieonto the next level package, epoxy or solder paste is screened ordispensed onto the placement site. The die is then placed with theactive circuitry facing upward or away from the surface of theprinted circuit board or substrate. After placement, the assemblyis reflow soldered or the epoxy is cured, preparing it for the wirebonding process.

63Sn/37Pb solder padReflow temp 183°CGlass epoxy

board

Die3Sn/97Pbsolder ball

Die

Au Ceramicsubstrate

3Sn/97Pb solder ballReflow Temp 316°C


Application Summary

Advanced Surface Mount Assembly Product Team has config-ured the GSMxs to handle a wide variety of component andboard level assembly processes. The following applications are apartial listing of the assembly solutions developed to date:

� Building CBGA (ceramic ball grid array) and CCGA (ce-ramic column grid array) components. In fact, the GSMxs isused for two aspects of this application. First, the GSMxs isused to flux and place a flip chip onto the small ceramic sub-strate. For some applications which also include surfacemount capacitors, solder paste is dispensed and the capaci-tors placed in a single assembly run with the flip chip. Theassembly is then mass reflowed. Second, arrays of solderballs or columns are put into a graphite boat/carrier and thenare screen printed with solder paste prior to entering theGSMxs. The assembled ceramic substrate from the first pro-cess step is placed on the arrays, and mass reflowed a sec-ond time. Solders used in each assembly process are care-fully chosen to ensure that each solder joint is not melted dur-ing each assembly step.

� Building PBGA (plastic ball grid array) components. TheGSMxs is used either to dispense flux and place a flip chipdie or dispense conductive epoxy and place a bare die forsubsequent wire bonding onto a strip of small laminate (FR-4)substrates. As in the CBGA and CCGA components, capaci-tors may also be assembled in a single assembly run. This as-sembly is then reflowed or cured.

� Building PGA (pin grid array) components. The GSMxs isused to place bare die into conductive epoxy in ceramic PGA

CBGA

PGA

PBGA

cavity package. For this application, an upline dispensing sys-tem was used for the dispensing operation to maximize thethroughput of the GSMxs, however, the epoxy could havebeen dispensed within the GSMxs

� Building silicon on silicon multi-chip modules. A silicon wafersubstrate is loaded into the GSMxs in a pallet. The wafer has


been stenciled with a special formulation of solder paste in abump pattern. Silicon chips without bumps are placed in aflipped configuration on the wafer. The assembly is massreflowed, and the paste reflows to form a bumped intercon-nect.

� Building hybrid circuits. Thick film ceramic substrates arestenciled with conductive epoxy or solder paste. SMT com-ponents and bare die are placed into the epoxy by theGSMxs. Bare die from 0.38mm square (15 mils square) havebeen successfully assembled.

� Building a PCMCIA format PCB with SMT components in-cluding resistors, capacitors, TSOPs, QFPs, and flip chips.

Bare die on flexible circuits

Silicon on siliconmulti-chip modules

PCMCIA

The SMT components are placed into screened solder paste.On the flip chip site, the board has pre-deposited with eutec-tic solder, so the machine dispenses no clean flux on theboard and then places the flip chip component. With thisGSMxs as the fine pitch placement machine, the entire prod-uct can be built on a standard SMT line.

� Building PCBs and flex cables with COB technology. ThePCB or flex cable enters the GSMxs where conductive ep-oxy is dispensed and the bare die is placed. In addition to the

GSMxs, Universal has integrated complete COB lines, in-cluding cure ovens, plasma cleaners, and wire bonders.


C4 Option

To assemble flip chip die on a GSMxs, the C4 Option must beadded. The C4 Option consists of:

� a high or ultrahigh magnification upward looking camera withlow angle circular lighting for optimal illumination of thebumps on the flip chip die.

� unique vision algorithms for reliably processing interconnectarrays (bumps) of a specific pattern at high speed, in a highperformance vision system.

Universal has developed extensive flip chip process and applica-tions expertise. In addition to providing the machine upgrade, Uni-versal will provide the technical support necessary to ensure asmooth implementation of this advanced assembly technology.

C4 Retrofit Kit

A GSMxs without the factory installed C4 option kit can be retro-fitted with the C4 Option in the field. It requires minorreconfiguration of the machine and hardware replacement.

flip c

hip


Optional Features

Feeders for Silicon Die

Precision Slide Top Matrix Tray Feeders

Precision slide top matrix tray feeders are designed to securelylocate multiple Fluoroware type matrix trays within the pick uparea of the GSMxs placement machine. For loading and unload-ing of matrix trays the operator releases the latch and slides thetop plate in or out of the machine. Applications using this type offeeder are subject to some restrictions, and it is recommendedthat the factory be consulted for complete applications discussion.Precision matrix tray feeders are available for both 2 x 2 and4 x 4 matrix trays.

Tape Feeders

Silicon die for standard die attach or flip chip applications can beinput into the placement machine in conventional tape and reelformat. For applications where the die are packaged in this man-ner, standard Universal Instruments tape feeders can be used.(see appendix A for details)

Silicon die can also be packaged in coverless tape format. Cover-less tape uses a tacky film fixed along the bottom of a punchedcarrier tape. The die is placed onto the tacky film, holding it inplace, thus requiring no cover tape. Unlike conventional tape andreel, this input format does not require a specific pocket size tocontain the die. Currently, coverless tape is not covered by anyindustry standard and is sometimes referred to as Surftape.


Coverless Tape Feeder for Flip ChipApplications

When packaged in coverless tape, die for flip chip applicationsmust be inverted prior to placement, which is accomplished withinthe tape feeder via an internal flip mechanism. The back side ofthe die is ejected from the tacky tape with a die ejector mecha-nism and transferred to the flip mechanism. The flip mechanisminverts the die, and presents it to the placement machine with theactive circuitry facing downward.

Coverless Tape Feeder for COB AttachApplications

When packaged in coverless tape, die for COB applications donot need to be inverted prior to placement. The back side of thedie is ejected from the tacky tape with a die ejector mechanismand presented directly to the placement machine with the activecircuitry facing upward.


Wafer Handling Option

Die for either flip chip or die attach applications can be presentedto the placement machine in wafer format. Wafers are availablein various diameters up to 8 inches. Frames are used to hold thewafer during the dicing process. These same frames can be usedfor presentation of the wafer to the placement machine. Multiplewafers and multiple part numbers can be resident in the waferhandler at the same time, and can be presented to the machine asneeded for a particular assembly. The quantity of individual diewithin a wafer will vary with respect to the size of the wafer andthe size of the individual die.

Once wafers in frames have been loaded into the wafer handler,the frame is automatically removed from the wafer magazine,loaded onto an X-Y table and precisely located. A die ejectormechanism is located under the die to be picked, and is raised tolift the die from the tacky tape in the wafer ring. The die is thenpicked up with a vacuum collet and transported to a four spindletransfer shuttle. This process is repeated up to four times beforethe transfer shuttle indexes these die for pickup by the placementmachine. For flip chip applications where the die require invertingprior to placement, the vacuum collet transports the die to an in-verter instead of the four spindle transfer shuttle. The inverterhas four placement locations. Once loaded with die, the inverterrotates 180°, and places the die on the four spindle transfershuttle which then indexes the die for pickup.

Unlike other input media which, in principal, contain only goodcomponents, the wafer will contain both functional and defectivedie. To avoid using the defective die in an assembly, they must besorted during the testing process. The results of the sorting pro-cess can either be downloaded from the testing equipment via awafer map, or the defective die can be marked with an ink dot inthe test equipment , which can later be identified by the visionsystem in the wafer handler. Both defective die identificationscenarios can be accommodated.


Fluxing Options

For applications requiring flux, there are options for applying fluxto either the substrate or the component just prior to placement.The type of fluxing mechanism will be dictated by material prop-erties of the flux.

Micro-Dispense Fluxer

The Micro-Dispense Fluxer has been designed to allow for pre-cise dispensing of low solids flux onto the center of the placementsite. This fluxer consists of a positive displacement pump pro-grammable in 0.1 microliter increments. The pump forces fluxdown a capillary tube which is lowered to the substrate during thedispensing process. A sealed container of flux which feeds thepump is mounted within the machine, incorporating low level andpressurization sensing which signals the operator when flux needsreplenishing or if the container is not properly sealed. Whenmounted in the machine, the Micro-Dispense Fluxer occupies oneof the two available head positions in the Universal Platform.

Thin Film Applicator

Note—This assembly uses an imbedded class II laser for sens-ing low flux conditions.

The Thin Film Applicator has been designed to apply flux directlyto an array of bumps or solder balls on the underside of a compo-nent. The flux is applied by dipping the component into a thin filmof flux immediately prior to placement. Components can bedipped either individually or up to three at once depending on thecomponent size. The flux film thickness is adjustable with a doc-tor blade on a rotating disk. During non-fluxing, the disk rotatescontinuously. During component fluxing, the disk is stopped mo-mentarily, the bumps are lowered into the flux and raised, andthen the disk begins rotating again. Sensors, mounted within theThin Film Applicator automatically sense when flux needs to beapplied to the disk. A container of flux is mounted within the ThinFilm Applicator and incorporates low material sensing which sig-nals the operator when the flux needs replenishing by the opera-tor.

The Thin Film Applicator can also be used for materials otherthan flux, such as epoxy, grease, etc. For these special applica-tions, please consult an applications engineer.


C4 Optionminimum maximum

Die size 0.020" square 2.000" square

Bump size 0.003" diameter N/A (ultrahigh magnification)0.005" diameter (high magnification)

Bump pitch 0.005" diameter N/A (ultrahigh magnification)0.009" diameter (high magnification)

Placement The nominal placement capability for flip chipperformance components placed on a GSMxs with the C4

option installed follows:

GAPH/C4 ±30 microns @ 5�Placement Head: CP �1.67

� � 6 microns(HD Front)�: ±0.2° @ ±5��(cp �1.67)� Repeatability � 0.04°x, y, ��1.50 Cpk

UFP300+ ±17.5 microns @ 5�Placement Head CP � 1.67

� � 3.5 microns

The nominal placement capability for bare die indie attach applications is the same as forstandard surface mount components as outlinedin the GSMxs General Specification.

Cycle Time For flip chip components, the placement rate willvary widely depending on size, number of bumpsimaged, type of feeding method selected, thetype of fluxer, and whether fluxing is required foreach placement. The cycle time can varybetween 1 and 5 seconds. For bare die, theplacement rates are less variable, and areroughly equivalent to those for standard surfacemount components as outlined in the GSMxsGeneral Specification. When the C4 Option isinstalled on the GSMxs, the cycle time forstandard surface mount components remainsunaffected.

Placement pressure 175 g to 2500 g (GAPH/C4 Head)150 g to 10,000 g (UFP300+ Head)Consult factory for placement forces less than150 grams.

Service requirements

Electrical Provided by the GSMxsPneumatic Provided by the GSMxsVacuum Provided by the GSMxs


Coverless Tape FeederConfiguration 8mm, 12mm, 16mm, 24mm

Custom tape widths and formats are available

Required feeder 2 feeder slots are required for 8 through 24mmpositions feeders

Service requirement

Electrical Provided by the GSMxsPneumatic Provided by the GSMxsVacuum Generated within the feeder

Precision Slide Top Matrix Tray FeedersConfiguration Common base with interchangeable top plates

Top Plate 12 - 2 x 2 Fluoroware type traysConfiguration 3 - 4 x 4 Fluoroware type trays

Custom top plate are available upon request

Required feeder 6 slotspositions

Service requirements

Electrical Not requiredPneumatic Not requiredVacuum Not required

General Surface Mount Application Machine (GSMxs™) …GraphicLib)/GS39300… · · 2006-03-16e...

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