GEM RD updates from Chinese groups Yuxiang Zhao University of Science and Technology of China May...

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3 Updates from Yi Zhou

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GEM R&D updates from Chinese groups Yuxiang Zhao University of Science and Technology of China May 24,2013 1 Five Chinese Groups China Institute of Atomic Energy (CIAE) Lanzhou University Tsinghua University University of Science and Technology of China (USTC) Institute of Modern physics 2 3 Updates from Yi Zhou 30cmx30cm GEM chamber assembling(NS2) Shielding board(top) GEM foil 4 Setup for the Lab test Read out board, pad readout for Lab test Top of the chamber, holes for radioactive source Test platform 5 To do list Noise issue(High voltage divider???) Lab test Uniformity test Gain Charging effect, etc Italian electronics 6 7 Updates from Xiaomei Li Photolithography Lab Construction At CIAE Key step for GEM foil production: Lamination and exposure of dry film photoresist Lab construction at CIAE after CERN training session Hot Roll Lamination(HRL) machine Exposure system Room equipped with yellow light source Exposure of Dry Film Photoresist Doing test for Lamination and exposure of dry film photoresist Collaborated with PCB factory Accuracy needs to be improved 9 Recent Funds CIAE group have got three funds recently: Two from CIAE for Lab Construction and Detector Development Fund from State Key Laboratory of Particle Detection and Electronics for the R&D of Large Area GEM foil 10 11 Updates from Zhigang Xiao Last Update of GEM at Tsinghua University Hardware Preparation: 1 45x45 cm2 GEM foils arrived in Feb and shipped to DetLab at IMP. 2Assembling techniques: To use glue method 3To use strip readout for the large area prototype. 4 First Large area ( 45*45 cm2 ) prototype is expected in the next two months, (not sure whether can be ready by Huangshan workshop) 5 Test ASIC based FEE and VME DAQs. 1) 64 channels of APV FEE (developed in Tsinghua University) delivered; 2) Noise performance is not promising, we spent a lot of time and energy to reduce the noise level to a usable status (All test are OK without connecting to detector). Grounding to be improved. 3) VME-DAQ with multi peak-ADC modules development done and tested recently.