From%Standard%MEMS% Processes%(MUMPs®)%to% …meptec.org/Resources/10 - Cowen.pdf · Design...
Transcript of From%Standard%MEMS% Processes%(MUMPs®)%to% …meptec.org/Resources/10 - Cowen.pdf · Design...
From Standard MEMS Processes (MUMPs®) to Commercial Success
Allen Cowen MUMPs Program Manager
[email protected] www.memscap.com
MEPTEC MEMS Symposium
2 May 16 MEPTEC MEMS Symposium
Overview
! MUMPs (MultiUser MEMS Processes) – Standardized MPW Processes and Examples
! PolyMUMPs ! SOIMUMPs ! PiezoMUMPs ! MetalMUMPs
! Semicustom Process and Examples (MUMPsPlus) ! Outside Vendor Standardized Processes ! Custom MEMS Fabrica8on (Pros and Cons) ! MEMSCAP Introduction
3 May 16 MEPTEC MEMS Symposium
• Bulk Micromachining – Deep RIE/RIE – Wet bulk micro-machining – VOA, 2x2, SOIMUMPs
• Surface Micromachining – Poly-Silicon Processing (PolyMUMPs) – Adaptive Optics, Microphones
• High aspect ratio thick metal plating – LIGA-like (MetalMUMPs) – Microrelay, Copper Cross Connect
MEMSCAP Fabrication Capabilities
4 May 16 MEPTEC MEMS Symposium
! Started in December 1992 ◦ 215 Process Runs to Date ◦ Hundreds of thousands of
devices shipped ! Worldwide Customer Base ! Supports ◦ Low volume foundry work ◦ Standard films, thicknesses on Si substrates ◦ Rapid Prototyping ◦ IP Generation ◦ Undergraduate (MEMS 101) and Graduate (Thesis) Level
5 May 16 MEPTEC MEMS Symposium
MUMPs® Textbook
• Textbook uses MUMPs as the example MEMS processes
• Author: Joel Kubby, University of California at Santa Cruz " Long 8me MUMPs user even prior to Academia
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! Regular Run Schedule ! 12 scheduled MUMPs runs in 2016 (4 Poly, 4 SOI, 3 Piezo, 1 Metal)
! Process flexibility ! PolyMUMPs (traditional) ! SOIMUMPs (Silicon-On-Insulator) ! MetalMUMPs (Electroplated Nickel) ! PiezoMUMPs (SOIMUMPs like, with additional Piezoelectric AlN layer) ! MUMPs-PLUS (semi-custom)
! Web-based interface: www.memscap.com/products/MUMPS ! Reference and Support
! Process files available for all platforms and CAD tools ! Element Libraries
! CaMEL (PolyMUMPs) ! SOIMUMPs and MetalMUMPs
! PolyMUMPs Technical FAQ ! Microsoft Guide to PolyMUMPs ! Bibliography of MUMPs® published papers
! Google Scholar for more!
MUMPs® Summary
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PolyMUMPs® Process
" Polysilicon surface micromachining " 8 lithography levels, 7 physical layers
" 3 Polysilicon layers " 1 Metal layer
" ApplicaLons " Adap8ve op8cs " Microphones " Sensors and Actuators
Poly0 Poly1 Poly2 Metal
Nitride 1st Oxide 2nd Oxide
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PolyMUMPs® Process
" Programmable Elements " Springs, Comb drives etc " Parameterized layouts
" Correct by construcLon " Incorporates design rules
" Anchors etc correctly drawn " Proven to work
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PolyMUMPs® Process
" Design Rules " Allow check of manufacturabiliy
" CAD tools " Automa8c checks
" Spacing, Surround
" Structure specific checks
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SOIMUMPs Process
" Bulk Micromachining " 10 or 25um structure layer (single crystal silicon)
" Double-‐side paVern/etch " 2 Metal layers " Deep RIE/RIE Processing
" ApplicaLons " VOA, 2x2 Op8cal Switches " Mirror arrays " Resonators, Oscillators, and Gyroscopes
" Micro-‐actuators
VOA
11 May 16 MEPTEC MEMS Symposium
Bulk Si
10 µm Si 1 µm buried oxide
Not to scale
2000 Å thermal oxide
200 Å Cr, 1 µm Al 0.5 µm AlN
! SOI-Based, Bulk Micromachining with piezoelectric layer
! 0.5 µm Piezoelectric Aluminum Nitride ! AlN is a large band gap (6 eV) material
with a large resistivity ! Good temperature/humidity stability ! Higher signal-to-noise ratio
! Applications – Ultrasonic transmitters and receivers (MUTs). – Frequency references. – Temperature sensors (resonant frequency
changes with temperature) – Force sensor – Energy harvesters
PiezoMUMPs Process
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MetalMUMPs® Process
" Thick Metal PlaLng Process " 10 lithography layers " Thick electroplated Ni (18-‐22um) " Nitride, Polysilicon, and thin metal structural layers
" ApplicaLons " Microrelays " RF Switches, cross-‐connect switches " Magne8c devices
Courtesy of Zyvex Corporation
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Prototype to Production
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Seacoast Science’s PolyMUMPS Sensors
Upper and lower plates are polycrystalline silicon, polymer is filled through holes in the top plate to make the individual capacitors sensitive to chemicals. http://www.seacoastscience.com/Downloads/Seacoast_White_Paper.pdf
Individual chemicapacitor
15 May 16 MEPTEC MEMS Symposium
SeaPort Mini Gas Chromatograph for Educa8on
• Single chemicapacitor readout • Separate, analyze and idenLfy compounds • For volaLle liquids or gas samples • Uses Seacoast’s MCCD detector • Current design sold for educaLonal use • Distributed by Vernier SoSware and
Technology • Used by students right out of the box • 1500 deployed in schools
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Standard+Custom=MUMPs-PLUS!
! Slight modification of one of the four MUMPs processes ! Extra layer, different thickness or
material ! Customer’s wafers are added to regular
MUMPs lot to take advantage of batch processing/pricing for unmodified process steps
! Singulated, shipped at die level ! Quoted on a case-by-case basis
! Examples ! Additional Patternable Nitride ! Thicker Poly or oxide ! Additional/Different Metal ! Backside Etch
PolyMUMPsPlus Std Layer Range(µm) Nitride 0.1-1.5
Poly0 0.1-3.0
Oxide1 0.3-5.0
Poly1 0.1-3.0
Oxide2 0.3-5.0
Poly2 0.1-3.0
Metal 0.05-1.0
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MUMPs-PLUS Capabilities
Std Layer Range(µm) Isolation Oxide 0.1 – 2.2
Oxide1 0.1 – 3.0
Nitride1 0.1 – 1.0
Poly 0.1 – 3.0
Nitride2 0.1 – 1.0
Oxide2 0.1 – 3.0
Anchor Metal 0.05 – 1.0
Nickel 1 – 30?
Sidewall Metal 0.1 – 5.0
MetalMUMPsPlus Std Layer Range(µm) Pad Metal 0.05 - 1.0
Silicon 3 - 100
Buried Oxide 0.5 – 4.0
Substrate 300 - 600
Blanket Metal 0.05 – 1.0
SOIMUMPsPlus
Std Layer Range(µm) AlN 0.5 - 10
Isolation Oxide 0.5 – 4.0
PiezoMUMPsPlus
Custom Layer/Processes
Oxide below Nitride
Nitride between Poly layers
Metals (Au, Cr, Pt, Cu, Ag, Ni)
CMP
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! MEMSCAP MagSwitch
! BMC Adaptive Optics
! Silicon Microphones Deformable mirror
Electrostatically actuated
diaphragm Attachment post
Membrane mirror
Diced WLP wafer before P&P
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! Used PolyMUMPs for cost-effective prototyping in early 90s
! Design variations and iterations on each run validated target designs and encouraged further development
! Vision Science ◦ Retinal Imaging ◦ Corneal Ablation
! Laser Communication ◦ Point To Point Secure Communication ◦ Holographic Waveform Coding
! Astronomy ◦ Extreme AO ◦ Terrestrial Planet Finder
! Consistent Development program for MEMSCAP
Star
Planet
Visible Nulling Coronagraph for Terrestrial Planet Finder
Deformable mirror
Electrostatically actuated
diaphragm Attachment post
Membrane mirror
Images from Scanning Ophthalmoscopes
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Cheaper and Faster To Market
Process Type Proof of Principle Prototyping Pre-Production Production
Custom Process $$$$$$ $$$$$ $$$$$ $$$$
Standard Process $ $ $$$$ $$$
Custom Process 6-12 months 12 months 9 months
Standard Process 3 months 6-9 months 6 months
Standard Processes
! CAD tools for MEMS can be effective for standard processes
! Design Rules allow checks of manufacturability
! Allow simulation of designs before fab
! Many runs of same process ->statistical analysis
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! MEMS packaging not trivial issue ! Packaging is a major part of the cost. ! Generic MEMS packaging nonexistent
! Each system is a custom package
! Packaging may impact system performance ! Viscous damping of moving parts
! Vacuum packaging may be desirable
! Failure due to moisture -‐> s8c8on
! Package strain on piezoresis8ve or membrane devices
! Thermal impact on op8cal systems
Slides courtesy Simon Fraser University
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! MEMS scanning micro-mirror ! Electrostatic actuation controls
movement along short axis ! Electromagnets control actuation
along the long axis. ! Precise alignment between bottom
stator and top rotor.
Maradin Ltd. Tel. +972 (4) 6273653 E-Mail: [email protected] www.maradin.co.il
24 May 16 MEPTEC MEMS Symposium
Custom Products BU MEMSCAP, Inc.
Highly Experienced MEMS Foundry Over 20 years • MCNC-Cronos-JDSU-
MEMSCAP
All major MEMS processes on
6” toolset 7000 ft2 of cleanroom
space 3000 ft2 of test space
Mature ISO Program
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• Deposition – Low Stress Nitride – Low Stress Poly-Silicon – Thermal and Low Temperature Oxides – Phosphosilicate Glass (PSG) – Anneals
• Lithography – Projection Alignment – Contact Alignment – Front/Back Alignment – Wafer Bonding – Photo-mask Layout and Fab
• Post Processing – Wafer Probe – Dicing – Die Bonding – Wire Bonding – CO2 and HF Release – Pick / Place
MEMSCAP Process Capabilities • Wafer Bonding
– Silicon-Silicon, Silicon-Glass, Silicon-Metal Eutectic, Metal-Metal Eutectic
• Etching – Deep RIE – Silicon – RIE – Poly-Silicon – RIE – Dielectrics – Wet – KOH, HF Vapor Phase
• Metallization – Evaporative – Lift-Off, Planetary Electroplating – Sputter – DC, RF, RF-Biased
• Metrology – SEM Measurements and Analysis – Film: Stress, Thickness, Resistivity – Profilometry – Interferometry – Infrared Inspection – Parametric In-Line Testing
26 May 16 MEPTEC MEMS Symposium
Product Development in U.S.
Lambda Router VOA MAG OXC
Pre-MEMSCAP
2x2 Switch
MEMSCAP Foundry
Mag Switch Endosure™ Deformable Mirrors
VOA