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Transcript of Freescale Automotive Body MCU...
External Use
TM
Freescale Automotive Body MCU
Introduction
S e p t . 2 0 1 4
Jason Yang | Automotive BD
TM
External Use 1
Agenda
• Automotive Body Electronics Overview
• Freescale Body MCU Roadmap
• KEA Family for general purpose MCU
• MagniV for Distributed Nodes
• MPC574xG for BCM/Gateway
TM
External Use 2
Automotive Body Electronics Overview
TM
External Use 3
Body MCU Market Overview
0
200
400
600
800
1000
1200
1400
1600
2009 2010 2011 2012 2013 2014 2015 2016 2017
$M
Body SAM $M WINDOW LIFT
RAIN SENSITIVE WIPERS
POWER SEATS
POWER DOOR/TAILGATE/ROOF
PASSIVE KEYLESS ENTRY
MIRROR ADJUST
LIGHTING
KEYLESS ENTRY
IMMOBILISER
HVAC
HEATED SEATS
ELECTROCHROMIC MIRROR
ELEC. SUNROOF
BODY CONTROL MODULE
ALARM
SAM Overview
• Body control and HVAC systems dominate the SAM.
• OEM function optionalism driving growth in LIN connected
solutions.
• Growth in LED lighting
• 8/16-bit still very significant portion of the SAM in 2010
• 32-bit SAM growing
Body Control
HVAC
Lighting
Window Lift, Mirror
And Wiper
44%
29%
27% 8 bit
16 bit
32 bit
2010 SAM by bits
TM
External Use 5
Kinetis 32-Bit ARM MCU comes to automotive - KEA Series
Kinetis E Auto: 32-bit ARM Auto MCU • 32bit M0+ 48MHz high performance & low power
• 8K to 128K embedded flash, pin to pin compatible
• AECQ100 qualified, -40C to 125C, enhanced ESD (6kV)
• Automotive connectivity: CAN, LIN(SCI), SPI and IIC
• Automotive IPs: ADC, ACMP, Timers (FTM, PWM, PIT, PWT, RTC)
• Vdd = 2.7 - 5.5V, 3.3V or 5V convenience
Start your design easily today! • Most complete MCU + development environment
• 24 Hours to prototype level, 2 months to production grade
• Samples and Evaluation Boards (8K to 128KB)
• PPAP July 2014
TM
External Use 6
S12 MagniV: Integration Beyond the MCU
Our S12 MagniV portfolio simplifies system design with the integration on High-
Voltage (HV) analog features onto MCUs for automotive applications
S12ZVM
BLDC Motor Control
S12ZVC
Small CAN nodes
MM912/S12VR
Window Lift
S12ZVL
LIN Nodes
S12VR
MM912_S812 S12ZVL
Reduced PCB Space
Improved manufacturing efficiency
Reduced Bill of Material
Simplified development
MM912_S812
S12ZVC
TM
External Use 7
New
Integration,
Low Power,
Security &
Safety
Functional Safety and Security Security modules protect ECUs against various attack scenarios and Safety modules ensure robust operation per ISO 26262
Low Power Management New low-power modes, analog comparators, and pretended networking support help meet stringent next generation power budgets and ensure greener vehicles
Unprecedented Integration Single-chip solution offering multicore architecture and advanced networking protocols for next generation communication requirements while reducing the quantity of body control/gateway ECUs
TM
External Use 8
KEA Family Introduction
TM
External Use 9
KEA128 Block Diagram
Communications I/O System
6+2+2ch
16bit Flex
Timer(2)
2
I2C
2
SPI
3
SCI
(LIN)
2
KBI
16ch,
12bit ADC
w/8 FIFO
1
PWT
2
Analog
Comp-
arators
Peripheral Bus
SWD
Debugger
Debug
RAM
Up to
16KB
System
Peripheral
Bridge
Flash
UP To
128KB
1xWDT
1-Cycle GPIO
BME(1)
Applications:
• Automotive general purpose
Operating Characteristics:
• Voltage range: 2.7 to 5.5 V
• Temperature range: -40 to 125°C
Key Features:
• ARM Cortex M0+ core 48MHz
• Up to 128K embedded flash
• Up to 16K RAM
• External OSC and internal ICS for clock
• System functions: LVD, WDG, CRC, LP
modes
• Communication: SPI, SCI, IIC, CAN
• Timers: FTM, PWM, PIT, PWT, RTC
• 12bit ADC and ACMP
Packages:
•16TSSOP, 24QFN, 32/ 64 and 80LQFP
• Pin compatible within KEA family
PMC
2.7-5.5V
POR
Ext Osc
(1-20M, 32K)
FLL Clk Mult
Int R/C OSC
(~32KHz 2%)
Int LP Osc
(1KHz)
LVD
NV
IC
1-C
Y M
UL
ARM Cortex M0+
48MHz Core Freq
(1) Support bit operation in RAM
(2) Faster timer running 2 x core clock
1
MSCAN RTC
Open-
Drain IO,
KBI,
GPIO
1
PIT
EEPROM
256B
Option
TM
External Use 10
KEA products comparison table
Device
Features
Flash RAM EE
PROM Freq
MS
CAN SCI SPI ATD PWT
Flex-
Tim ACMP IIC GPIO
Packag
es
KEAZN8 8K 1K emulate 48MHz 0 1 1 12c12b 1 6c+2c
16b 2 1
Up to
22
16
TSSOP/
24 QFN
KEAZN16 16K 2K 256B 40MHz 0 3 2 16c12b NA 6c+2c+
2c 16b 2 2
Up to
57
32/64
LQFP
KEAZN32 32K 4K 256B 40MHz 0 3 2 16c12b NA 6c+2c+
2c 16b 2 2
Up to
57
32/64
LQFP
KEAZN64 64K 4K 256B 40MHz 0 3 2 16c12b NA 6c+2c+
2c 16b 2 2
Up to
57
32/64
LQFP
KEAZ64 64K 8K emulate 48MHz 1 3 2 16c12b 1 6c+2c+
2c 16b 2 2
Up to
71
64/80
LQFP
KEAZ128 128K 16K emulate 48MHz 1 3 2 16c12b 1 6c+2c+
2c 16b 2 2
Up to
71
64/80
LQFP
TM
External Use 11
Applications: • Seats/Sun Roof
• Windows/Doors
• Mirror/Wiper
• Fuel/Water Pump controller
• Body Control
• Park Assist
• DC/BLDC Motor control
• Ambient lighting
• Infotainment connection module
• GPS/Radio companion MCU
Reference Solutions: • BLDC motor control
• Vehicle Interior / Exterior LED Lighting
• Low Power LIN/CAN Node Networking
• Motorcycle Engine Control
Kinetis Auto: General Purpose 32 Bit ARM MCU
TM
External Use 12
Kinetis EA Series MCUs for Automotive Built on the ARM® Cortex® -M0+ Processor
Single-Cycle I/O Port •50% higher GPIO toggling
frequency than standard I/O
•Improves reaction time to
external events allowing bit-
banding and software
protocol emulation
•Save precious cycles, e.g.
set faster peripherals for
low-power access
•Access GPIO/peripherals
while processor fetches the
next instruction
Energy Efficiency •2-stage pipeline – reduced
cycles per instruction (CPI)
enabling faster branch
instruction and ISR entry
•Program memory access on
alternate cycles
Micro Trace Buffer •Powerful, lightweight trace
solution enabling fast debug
•Non-intrusive – trace
information stored in small
area of MCU SRAM (size
defined by programmer)
• Trace read over Serial Wire
/JTAG (CPU stopped)
Processing •Only 56 Instructions, mostly
coded on 16-bit. Option for
fast MUL 32x32 bit in 1 cycle
•Cortex-M0/3/4 compatible
•1.77CM/MHz
•Best-in-class code density –
reduced cost, power
consumption and pin-count
TM
External Use 13
24 Hours to Prototype: Typical Development Flow
Choose Your
Hardware
Install
Development Suite
Prototype with
Demo Code
1 2 3
• Demo boards
• Reference solutions
• Initialization / autocoding
• Compiler
• Debug
• Low-level drivers: CAN,
LIN, Flash
• Demo code: CAN
wakeup, LIN comms
• Peripheral enhancement
routines
TM
External Use 14
Kinetis EA Series MCUs for Automotive IDE Support
Freescale (CodeWarrior 10.1)
• Includes MQX Task Aware Debug plug-in option
• MCU v10.1 Complier Update for MQX3.7
• Includes Processor Expert
IAR (Embedded Workbench)
• Reliable, Powerful and Easy to Use
• The most widely used C/C++ tool chain for ARM MCUs
• Support for Kinetis 10/20/30/40/60, ColdFire+ and ColdFire
• Freescale MQX™ RTOS integration
• Ready-made project templates
• Professional technical support organization
Keil (MDK)
• Tailored to ARM Cortex-M devices
• Optimized Compiler, IDE, Debugger, Debug/Trace Adapters
• Support advanced Cortex-M and CoreSight technologies
TM
External Use 15
Kinetis EA Series MCUs for Automotive Motor Control Libraries
Wide group of algorithms • Basic mathematics, logic, controllers, modulations, transformations up to observers
• Tool for beginners as well as for professionals
• Libraries are optimized, tested and easy to use
• Implemented with C-callable function interface
Implemented Algorithms • Sine , Cosine , Tangent , Arcus Sine, Arcus Cosine, Arcus Tangent, Arcus Tangent, Shifted
Arcus Tangent, Square Root, Ramp, Limiter, Hysteresis, Signum, Look-up Table, PI Controller
• Clarke Transformation, Inverse Clarke Transformation, Park Transformation, Inverse Park Transformation, Space Vector Modulation, Vector Limiter, PMSM Decoupling, DC Bus Ripple Elimination
• IIR filter, Moving avg. filter
TM
External Use 16
Kinetis EA Series MCUs for Automotive MQX™ Lite RTOS - Overview
Very light MQX kernel for resource-limited MCUs • Targeted at the Kinetis L family initially
• Packaged as a Processor Expert component
I/O capability provided by Processor Expert • USB via FSL bare-metal stack, also a Processor Expert component
• No POSIX-like drivers or file access
Programming model allows upward code migration • A true subset of the full MQX RTOS
• Code built with MQX Lite will move to full MQX RTOS easily
• Same task templates, same API - some very minor differences
Available as a component within the Freescale s/ware offerings • Processor Expert software, MCU driver suite - Supports IAR, Keil, and GCC compilers /
build chains
• CodeWarrior Development Studio V10.3
TM
External Use 17
MagniV for Distributed Nodes
TM
External Use 18
A Technology Sweetspot for Sensor and Actuators
Digital Logic S12, PWMs, Timers,
SRAM, SPI, SCI, GPIO,
Watchdogs, etc.
High-Voltage
Analog Low Side & High
Side Drivers,
Voltage Regulator
LIN/CAN Phy. etc.
Non-Volatile
Memory Flash, EEPROM
Existing
Low Leakage 180nm CMOS+NVM 40V UHV Devices
TM
External Use 19
2015
15+ Years of System in Package (SiP) Experience
Troll - MUX3
• 8-bit HC05 Hyper-integrated Climate Stepper Driver
908E626
• HC08 + SMOS5 AFS Stepper Driver
908E630
• 8-bit HC08 (SOG) + SMOS8 Relay Driver
912F634
• 16-bit S12I32 + SMOS8 Relay & Switch Driver
S12VR64 (first part of
MagniV family
2009 2008 2007 2006 2005 2004 2003 2002 2001 2000 1999 1998 2010 1997
Start of SiP R&D
Mechatronics Package
HC05 Microcontroller with EEPROM (IDR60% -1.2um)
SiP Architecture
HC08 Microcontroller with flash (0.5um)
SMOS5 (0.8um)
54ld SOIC Package
SMOS8 (0.25um)
QFN Package
S12 Core (0.25um)
Architecture Repartitioning
Monolithic Architecture
1st Gen 2nd Gen 3rd Gen
2011 2012 2013 2014
4th Gen
HC05PV8
• 8-bit HC05 Hyper-integrated Relay Driver
908E624
• 8-bit HC08 + SMOS5 Relay Driver
908E622/1
• 8-bit HC08 + SMOS5 Mirror Driver
LL18UHV technology
Monolithic SiP
Pro
ducts
Technolo
gie
s
S12ZVM S12ZVH
S12ZVL
S12ZVC
S12Z Core
TM
External Use 20
S12 MagniV Roadmap
< 2012 2013 2014 2015 2016 2017
Motor
Control
Instrument
Cluster
LCD Displays
General
Purpose
Production
First
Sample Date
(left edge)
Product
Qualification
(right edge)
Proposal
Planning
Execution
S12ZVH
S12ZVL32
S12ZVFP
S12ZVC
High temp
(AEC Grade 0)
PWM command
S12VR64/48
LIN applications
CAN applications
S12ZVML
32-128kB, 64pin.6ch GDU, 50MHz
64-128kB, LCD, 4 stepper drivers
64kB, LCD
64-192kB; 48-64pin; 32MHz
8-32kB; 32-48pin, 32MHz
S12ZVMC (no CAN phy)
S12ZVHL
32-64kB, LCD, 2 stepper drivers
16-32kB; 6ch GDU
32pin only, 16-32kB
Small CAN
Nodes
LIN Nodes
S12ZVM
DC Motors
BLDC
Motors
Relay-driven window lift/sunroof
32-48pin; 25MHz
MM912H/G634
S12ZVHY (no LIN phy)
Last Updated 06JUN14
S12VR32/16
S12ZVL128
64-128kB; CAN/LIN gateway
(no CAN PHY)
TM
External Use 21
S12 MagniV Benefits S12 MagniV solutions deliver optimal system cost and
physical footprint for sensor and actuator applications.
Reduced PCB Space Up to 30%
Improved manufacturing efficiency Replacing typically 3 IC by 1 MagniV reduces assembly and test cost while quality improves
Reduced Bill Of Material (BOM) Fewer components to purchase, handle, store and qualify
Simplified motor control that speeds up time-to-market Save up to 6 months on development, validation and ISO26262 implementation • Abstract the complexity of 3-phase motor control software development • Production ready Automotive quality SW and Tools • SafeAssure program
TM
External Use 22
Motor Control Solutions
Production Proposal Planning Execution
Re
lay-d
rive
n
DC
-mo
tors
H-B
rid
ge
drive
n
DC
-mo
tors
Bru
sh
less D
C
Mo
tors
S12VR 48K-64KB; 32/48pin
LIN with PHY; LS drivers
S12ZVML 32-128KB; 64pin
LIN with PHY, 100nC
S12ZVMC 64-128KB; 64pin
2nd 5V VREG for ext CAN, 100nC
S12ZVM 16/32KB; 64pin; 50nC
S12ZVML 32-128KB; 64pin
LIN with PHY, 100nC
S12ZVMC 64-128KB; 64pin
2nd 5V VREG for ext CAN, 100nC
LIN applications
CAN applications
PWM controlled apps
< 200W Motors > 200W Motors
High temp option (AEC Grade 0)
Switch panel interface
S12VR 32/16kB, 32pin
LIN with PHY; LS-driver
TM
External Use 23
S12
Vreg
Temp
Sense
PLL
BDM
HVI
LIN
PHY
High
Side
Flash
EEPROM RAM
ADC
10bit
TIM
KWU
RTI
COP SPI
SCI0
SCI1
Ext. Osc
IRC
PWM
8ch
Low
Side
Relay
Driver
EVDD
Hallout
LIN
LG
ND
LIN
VS
EN
SE
Window Lift with S12VR
Pinout representing functionality,
Physical pins location is not correct
VS
UP
LS1
LSGND
LS0 M M
Vbat
Hall
Sensor IOC
IOC
Switches HVI0
HS1
HVI1
HVI2
HVI3
HS0
Indicator
LED
Debug &
Programming
Connector
Altern.
SPI&UART
based Test
Connector
VD
DX
VD
DA
KWU
EVDD
High-Voltage
Components
Digital
Components
5V Analogue
Components
MCU Core
and Memories
TM
External Use 24
S12VR Development Tools and Enablement
HARDWARE:
• S12VR64EVB: S12VR Evaluation Board ($149,-)
• USBMULTILINKBDM: In-Circuit Debugger/Programmer
COMPILER, DEBUGGER:
• CW_V5.1HCS12_VR64SP: CodeWarrior for HCS12(X) v5.1 VR64 Service Pack
• ZAP 6812 ICD: Cosmic ZAP HCS12 BDM Debugger.
APPLICATION NOTE, REFERENCE DESIGN, MIDDLEWARE:
• AN4540 Comparison Between the MC9S12VR and MM912_634
• AN4650 Functional Differences between Tomar 2.1 (2N05E) & Tomar 3 (0N59H)
• Anti-Pinch Window Lift Reference Design
http://www.freescale.com/webapp/sps/site/prod_summary.jsp?code=RDS12VR
• FSL_LIN_2.1_DRIVER: LIN 2.1 / J2602 Driver
TRAINING:
• AN4448: MC9S12VR Family Demonstration Lab Training
• S12 MagniV Mixed-Signal Microcontroller Introduction: Overview on S12-MagniV family, including S12VR64 introduction
• http://www.youtube.com/watch?v=dCnc7X9mptc&feature=player_embedded
Not needed
with EVB
TM
External Use 25
S12ZVL – Key Features High-Voltage
Components
Digital
Components
5V Analogue
Components
MCU Core
and Memories
SPI
TIM 16b
6+2ch 128B
EEPROM
(ECC)
8-32KB
Flash (ECC)
S12Z 32MHz Bus IIC
LIN-PHY 10-Bit
ADC
Temp
Sense
1kB
RAM
(ECC)
PLL RCosc.
+/-1.3%
Pierce
Osc.
HV Input 1#
E-Vdd
1-3#
NGPIO
SCI 1 SCI 0
G
P
I
O
Vreg
70, or up to 170mA
with ext. Ballast
PWM 8ch 8b
or 4ch 16b
Vsup
sense
BDM
BDC KWU
Win Wdog
High Voltage
Input 12V Input for
Switch Monitoring
Routable to ADC
Vsup sense Monitoring supply voltage
(sense after protection
diode)
Packaging Options 32-LQFP and 48-LQFP
32-QFN 5x5mm
Voltage Regulator 5V/70mA total supply or
170mA with external ballast
for more current and lower
power dissipation
NGPIO 1-3# 5V / 25mA sink
Eg. for RGB-LED
SPI, IIC Serial link to other Ics,
e.g sensors,…
LIN Physical
Layer LIN2.2 and SAE
J2602 compliant
+/- 8kV ESD
capability
External Supply 5V / 20mA switchable for
local (same PCB), over
current protected
TM
External Use 26
S12ZVL
Product Name S12ZVL S12ZVLS
Package 48-LQFP 32-LQFP 32-QFN
Flash memory (ECC) 32 / 16 / 8 kB 32 / 16 kB
EEPROM (ECC) 128B
RAM (ECC) 1kB
SCI / SPI / IIC 2 / 1 / 1
LIN-PHY 1
HVI 1
V reg 12V/70mA; extendable to 170mA with ext. Ballast
Timer 6ch + 2ch (16 Bit)
PWM 8ch 8 Bit (or 4ch 16Bit)
ADC 10ch 10Bit 6ch 10Bit
eVdd (5V/20mA) 1ch (source)
N-GPIOs (5V / 25mA) 3ch (sink) 1ch (sink) 3ch (sink)
Temperature options C / V / M
TM
External Use 27
Target Applications
LIN-Sensors LIN-switchpanels LIN-Actuator
Product Function
• Hooking up sensors into
automotive LIN-Network
(with signal pre-
conditioning
Market Requirements
• LIN-PHY, 12V-Vreg, MCU
• Small formfactor (QFN)
• ADC, SPI
Product Function
• Reading multiple switch-
positions and feeding into
LIN-network
Market Requirements
• LIN-PHY, 12V-Vreg, MCU
• Multiple GPIOs
• ADC
Product Function
• Converting LIN-
command into an activity
(eg driving LEDs)
Market Requirements
• LIN-PHY, 12V-Vreg, MCU
• Drivers (3x25mA drive
strength in case of RGB-
LED)
• ADC
TM
External Use 28
Switch Panel with S12ZVL High-Voltage
Components
Digital
Components
5V Analogue
Components
MCU Core
and Memories
On-board
Switches
LED
Backlight
Dials
Off-board
Switches
Battery
Voltage
LIN Bus
SPI
TIM 16b
6+2ch 128B
EEPROM
(ECC)
8-32KB
Flash (ECC)
S12Z 32MHz Bus IIC
LIN-PHY 10-Bit
ADC
Temp
Sense
1kB
RAM
(ECC)
PLL RCosc.
+/-1.3%
Pierce
Osc.
HV Input 1#
E-Vdd
1-3#
NGPIO
SCI 1 SCI 0
G
P
I
O
Vreg
70, or up to 170mA
with ext. Ballast
PWM 8ch 8b
or 4ch 16b
Vsup
sense
BDM
BDC KWU
Win Wdog
Wakeup
TM
External Use 29
Intelligent Sensor Application
http://www.bmw.com/com/en/insights/technology
/technology_guide/articles/rain_sensor.html 5V Supply
High-Voltage
Components
Digital
Components
5V Analogue
Components
MCU Core
and Memories
SPI
TIM 16b
6+2ch 128B
EEPROM
(ECC)
8-32KB
Flash (ECC)
S12Z 32MHz Bus IIC
LIN-PHY 10-Bit
ADC
Temp
Sense
1kB
RAM
(ECC)
PLL RCosc.
+/-1.3%
Pierce
Osc.
HV Input 1#
E-Vdd
1-3#
NGPIO
SCI 1 SCI 0
G
P
I
O
Vreg
70, or up to 170mA
with ext. Ballast
PWM 8ch 8b
or 4ch 16b
Vsup
sense
BDM
BDC KWU
Win Wdog
Rain /
Light
Sensor
ASIC
Automotive Voltage
LIN Bus
TM
External Use 30
S12Z
Vreg
Temp
Sense
PLL
BDM
LIN
PHY
Flash
EEPROM RAM
ADC
10bit
RTI COP
SCI0
Ext. Osc
IRC
VDDX
LIN_In
VD
DS
VD
DX
LIN RGB application draft
GPIO
LIN Master
VSUP
PWM
3x16bit
Verpolschutz BC
TL
3x20mA
RGB LED
S12ZVL16/32
High-Voltage
Components
Digital
Components
5V Analogue
Components
MCU Core
and Memories
TM
External Use 31
S12ZVL Development Tools and Enablement
HARDWARE:
• X-TWR-S12ZVL32 & X-TRK-S12ZVL
(both available now, TRK will replace TWR, $99 each)
• TRK-S12ZVL : OOBE EVB (available for launch, $99)
• USBMULTILINKBDM: In-Circuit Debugger/Programmer (available now)
COMPILER, DEBUGGER:
• CW_V10.x: CodeWarrior for S12ZVL
• ZAP 6812 ICD: Cosmic ZAP HCS12 BDM Debugger.
APPLICATION NOTE, REFERENCE DESIGN, MIDDLEWARE:
• Reference Designs / Demos:
- Ultrasonic distance measurement (available for launch)
- LIN-RGB (LED) (available for launch)
• FSL_LIN_2.1_DRIVER: LIN 2.1 / J2602 Driver (available now)
Not needed
with EVB
TM
External Use 32
MPC574xG for High-end Gateway
TM
External Use 33
Multiplex Architecture for modern cars
Ethernet
Flexray
LIN
MOST
Bo
dy C
AN
Co
mfo
rt CA
N
Dia
gn
ostic
CA
N
Po
we
rtrain
CA
N
... Up to 6 x CAN
Central or
Integrated
Gateway
Potentially
other
interfaces
Potentially
active star
Switch
or
PHY
TM
External Use 34
32-bit Body Electronics MCU Roadmap
Single Core
Dual Core
En
try B
CM
Past 2012 2014 2016
Mid
-Hig
h B
CM
In
teg
rate
d
Gate
ways
2013 2015
Triple Core
First Sample
Date (left edge)
Execution
Proposal
Planning
Production
Product
Qualification
(right edge)
1H 1H 1H 1H 2H 2H 2H 2H
90nm Body Products 55nm Body Products
Security
MPC5668G/E z6+z0, 116MHz,
Up to 2M Flash, 592k RAM
Flex, Ether, MLB, CAN, LIN MPC5646/5/4C z4+z0, 120MHz,
Up to 3M Flash, 256k RAM
Flex, Ether, Security,
CAN, LIN
MPC5646/5/4B z4, 120MHz,
Up to 3M Flash, 192k RAM
Flex, Security,
CAN, LIN
MPC5607/6/5/B z0, 64MHz,
Up to 1.5M Flash, 96k RAM
CAN, LIN
MPC5604/3/2/B/C z0, 64MHz,
Up to 512k Flash, 48k RAM
CAN, LIN
MPC5602/1D z0, 48MHz,
Up to 256k Flash, 16k RAM
CAN, LIN
MPC5748/7/6G z4+z4+z2, 160MHz,
3M-6M Flash,
Flex, Ether, Security,
MLB, USB, CAN, LIN
MPC5748/7C z4+z2, 160MHz,
4M-6M Flash,
Flex, Ether, Security,
CAN, LIN
MPC5746/5C z4+z2, 160MHz,
2M to 3M Flash,
Flex, Ether, Security,
CAN, LIN
MPC5746/5B z4, 160MHz,
2M to 3M Flash,
Flex, Security,
CAN, LIN
TM
External Use 35
256k
SRAM
(with ECC)
256k
SRAM
(with ECC)
MPC5748C/G - Development Device and High End Gateway/BCM Solution
Communications I/O System
48ch*
ATD
10bit
eMIOS
96ch
4
I2C,
3 SAI
4
DSPI
6
SPIs
8
CAN
18
LIN
Flex
32ch*
ATD
12bit
CTU
3
Analog
Comp-
arators
CROSSBAR SWITCH
Memory Protection Unit (MPU)
Crossbar Masters
3x Nexus
Class 3+
JTAG
Debug System
Peripheral
Bridge
HSM
256k
SRAM
(with ECC)
Flash controller
SIUL
16xPIT+RTI
3xSWT
3xSTM
SSCM
STCU (MBIST/LBIST)
FCCU
BAF/BAR
16xSemaphore
DMA MUX
6M
Flash
incl EE emulation
(with ECC)
Applications:
•High end Gateway and Body Modules
Key Characteristics:
•2x e200z4 + 1x z2 cores, FPU on z4 cores
•160 MHz max for z4s and 80 MHz on z2
•HSM Security Module option supports both SHE
and EVITA low/medium standard
•Media Local Bus supports MOST communication
•2 x USB 2.0 (1 OTG and 1 Host module) support
interfacing to 3G modem and infotainment domain
•2x Ethernet 10/100 Mbps RMII, MII, +1588, AVB
•Ethernet switch
•CAN module optionally supports CAN FD
•SDHC provides standard SDIO interface
•Low Power Unit provides reduced CAN, LIN, SPI,
ADC functionality in low power mode
•Designed to ISO26262 process for use in ASIL B
•-40 to +125C (ambient)
•3.0V to 5.5V
Packages:
•176 LQFP, 256 BGA, 324 BGA
VReg
RTC/API
8-40MHz Osc
FMPLL
32KHz Osc
16MHz IRC
128KHz IRC
ML
B
SD
HC
Fle
xR
ay
2x U
SB
2.0
Eth
ern
et
e200z2
Core
e200z4
Core
e200z4
Core
*Mixture of internal and external channels
Features available depend on package and device version
1
CRC
5747C 5748C 5747G 5748G
Cores 2 2 3 3
Flash 4M 6M 4M 6M
RAM 512k 768k 768k 768k
MLB N N Y Y
USB N N Y Y
Low
Power
Unit
Interface
32
ch
eD
MA
Eth
ern
et
X
Cut 2 Features Represented Below
TM
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www.Freescale.com