© Fraunhofer

Fraunhofer Research Institution for

Microsystems and

Solid State Technologies EMFT

Research and Cooperation Partnerfor

Sensors and Actuators

BMBF DLR-IB Workshop, Bucharest Nov. 12th, 2015

Dr. Detlef Bonfert, Circuits and Systems, ATIS

© Fraunhofer

Content

Fraunhofer Gesellschaft

Fraunhofer EMFT

Facts and Figures

Vision

Sensors market

Research and service offering

Equipment and infrastructure

Business areas

Core competences

© Fraunhofer

“Fraunhofer lines”

The Fraunhofer-Gesellschaft

The Fraunhofer-Gesellschaft undertakesApplied Research focussing on

- high value

- direct implementation

- private and public enterprises

- wide benefit to the society

since 1949.

Our Customers :

Industry

Service Sector

Public Administration

© Fraunhofer

Fraunhofer-Gesellschaft, the largest organization for applied research in Europe

€1.9 billion annual research budget totaling

Roughly two thirds of this sum is generated through contract research on behalf of industry and publicly funded research projects

Roughly one third is contributed by the German federal and Länder governments in the form of base funding

International cooperation

“Fraunhofer lines”

© Fraunhofer

Mission Statement

Fraunhofer-Gesellschaft:

-promotes and undertakes applied research in an international context

-of direct utility to private and public enterprises and of wide benefit to society as a whole

-offers a platform that enables its staff to develop the professional and personal skills

Fraunhofer Institutes :

help to reinforce the competitive strength of the economy:

in their region

throughout Germany

in Europe and worldwide

“Fraunhofer lines”

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Die Fraunhofer-Gesellschaft Locations in Germany

Wertheim/Bronnbach

Mannheim

Karlsruhe

Pfinztal

Ettlingen Stuttgart

Freiburg

Kandern

Efringen-Kirchen

Alzenau

Würzburg Bayreuth

Erlangen, Nürnberg, Fürth

Regensburg

Straubing

Augsburg

Weßling

München, Garching

Freising

Prien

Holzkirchen

Bremen

Teltow

WildauPotsdam-Golm

Cottbus

BremerhavenHamburg

Kassel

Frankfurt

Darmstadt

Rostock

Oldenburg

Hannover

Braunschweig

Goslar

Göttingen

MünsterLemgo

PaderbornDortmund

Schmallenberg

Gelsenkirchen

Duisburg

Oberhausen

Köln

Euskirchen

AachenWachtberg

Bonn, Sankt Augustin

Kaiserslautern

Saarbrücken

St. IngbertSulzbach

Leipzig

Chemnitz

Freiberg

Dresden, Moritzburg

Zittau

Magdeburg

Halle

Schkopau

Leuna

Itzehoe

Lübeck

ErfurtJena

HermsdorfIlmenau

Berlin

Sulzbach-Rosenberg

Remagen

66 institutes and independent research units

more than 22,000 staff

Institute/independent research unit

Other research unit

Headquarter

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Health and nutrition Affordable healthcare

Challenges – ”The Markets Beyond Tomorrow”

Safety and security Disaster prediction and management

Information and communication

Mobility and transportation Low-emission, reliable mobility in urban areas

Energy and living Low-loss generation, distribution and use of electricity

Production and environment Life-cycle production

Foto

s ©

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un

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fer

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ICT

Life Sciences

Light & Surfaces

Microelectronics

-Institutes working in related subject areas cooperate in Fraunhofer Groups-foster a joint presence on the R&D market-they help to define the Fraunhofer-Gesellschaft’s business policy-they act to implement the organizational and funding principles of the Fraunhofer model.

Production

Materials and Components –MATERIALS

Defense and Security VVS

Pooling expertiseFraunhofer Groups

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Applied Solid State Physics IAFElectronic Nano Systems ENASHigh Frequency Physics and Radar Techniques FHRIntegrated Circuits IISIntegrated Systems and Device Technology IISBMicroelectronic Circuits and Systems IMSModular Solid State Technologies EMFTTelecommunications, Heinrich-Hertz-Institut HHIPhotonic Microsystems IPMSSilicon Technology ISITEmbedded Systems and Communication Technologies ESKReliability and Microintegration IZM

Associated membersDigital Media Technology IDMTOpen Communication Systems FOKUSNon-Destructive Testing IZFP

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5

6

9

7

8

10

11

4

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b

12

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Fraunhofer Group for Microelectronics

Freiburg

Dresden

Duisburg

Erlangen

Itzehoe

Berlin

Chemnitz

München

2

71

946

10

128 b

aIlmenau

4

11

5

Wachtberg

3

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Fraunhofer EMFT

Hansastraße 27d

80686 München

Josef-Engert-Straße 13 / Biopark

93053 Regensburg

110 employees in 2 locations

Director: Prof. Dr. rer. nat. Christoph Kutter

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The Team

© Fraunhofer

Vision of Fraunhofer EMFT:

We stand for:

Cutting edge applied research

For sensors and actuators

With our technological innovations:

We help people

Contribute to sustaining our environment

Internet of things (IoT) has practically unlimited IP address space

© Fraunhofer

Market for Sensors

Internet of Things

Practically unlimited IP address space

Industry 4.0

50 Billion connected devices

Sensors

Processors

Actuators

© Fraunhofer

MEMS / NEMS

Chemical /BiologicalSensors

Radiationdetectors

EMFT developments :NanoFETMEMS MicrophoneHigh-g Sensor

Industrial developments :Acceleration Sensor

IDT (CO2)Electrochemical

Transducer

SiGe pin-DiodeSi pin-Diode

Si-Photomultiplier

Fast low noise JFETLow noise MOSFET

Very Low noise JFET

Special ElectronicsSensors for

Phys ical Parameters

Sensors and Electronics

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Internet of Things Internet der Dinge

Agriculture

Smart Grid

Energy Efficiency

Automotive

Smart City

Intelligent Buildings Security

Health

Smart Home

Industry 4.0

Big Data

Sensor& Hubs

CoreNetwork

PrivateNetwork

Cloud

Communication

© Fraunhofer

Sensors Market – Industry Branches

Source: Intechno Consulting (2012)

Billion €0 5 10 15 20 25 30 35 40 45 50

Others

Medical technologies

Information and communicationTechnologies

Household appliances, Consumerelectronics

Building

Vehicles, Airplanes, Ships

Process industries

Mechanical engineering

2016

2006

© Fraunhofer

Research, Development and Innovation Service Offering

Studies (Technology assessments)

Modeling and simulation

Custom development

Pre-development

Process steps

Components and systems

Prototype and small batch production

In close cooperation with our customers

Analysis and test

Risk and problem analysis

Development of test methods and equipment

Seminars and trainings

© Fraunhofer

Equipment and Infrastructure

Equipment

150mm and 200mm MEMS-Line

200mm CMOS-Line

Analytics and test & characterization

Backend and thin silicon technologies

Pilot line for micro-fabrication on plastic film substrates

Chemical and bio lab

Infrastructure

Clean room 640 m2 (ISO-4 and ISO-5)

Laboratories 1600 m2

3 Seminar rooms, 1 Video conf. room

© Fraunhofer

Business Areas

Sensors and actuators

Microdosage systems

Flexible systems

Sensor materials

Design and test

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Application Areas

Sensor materials

Sensors and actuators

Flexible systems

Mikrodosagesystems

Design andtest

Packaging Textiles Medical technology

Environmentaltechnology

Electronics Engineering

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Functional molecules and surfaces

Silicon processes, device- and 3D-integration

Heterointegration and foil technologies

Systems and prototypes

Core Competencies

© Fraunhofer

Interdigital-Capacitor for Gas Detection

Indicator

Electrode 1

Electrode 2

Substrate

CIDK

CDL

ZCC

ZWBIndicator

Impedance

Technology Features:3x6 mm, C ~ 10pFHeating- and Temperature Sensor integrated

Interdigital- Capacitorwith ZIF (Zero Insertion Force)

connector

Scematics

Application Areas

Climate control

Breathing gas control

Emission gases

Process control

USB Stick sensor family

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Functional Principle of Micropump

© Fraunhofer

Drivers for Microfluidic Actuators

(Microfluidic actuator developed in-house by dept. MAF)

Medical applications

e.g. Insulin patches

Consumer applications

e.g. Scent dosing

u-pump

ASIC

Targets :

Low-cost & compact solution

High-safety and accuracy

© Fraunhofer

>> Thin Chip Foil Package <<Hybrid integration of thin IC devices on film substrates

• Flexible fan-out package for thin IC devices

• µ-controller IC embedded in flexbile polymer package on PI-film

• IC thickness: 25 µm• Package thickness: below 120 µm

• Wafer level flexible package for thin IC devices on polyimide film

• First run: polyimide films were supported by carrier substrates

• Future target:manufactured in roll-to-roll

christof.landesberger@emft.fraunhofer.de

© Fraunhofer

EMFT‘s approach for >> Thin Chip Foil Package <<

Die separation

Plasma Dicing

Die embedding in film substrates

SMD like Assembly at customer‘s s ite

Deliver in robust foil package

Thin device wafers

christof.landesberger@emft.fraunhofer.de

© Fraunhofer

Flexibility of „Thin Chip Foil Packages“ after delamination and separation

No cracks were observed after delamination and handling

© Fraunhofer

Flexible Electronics

Useful properties of plastic film substrates

verythin

flexible

large area

efficientmanufacture

surfacequality

light weight

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Automated placement of ultra-thin dies in cavities on film substrates

Die bonding equipment: Panasonic FCB3

25µm thin µC in cavities on films

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Microscopic view onto microcontroller IC after embedding in transparent polymer and electrical interconnection

© Fraunhofer

EMFTs competencies in flexible electronic systems and roll-to-roll processing

Technology supplier for electronics on plastic films

Metal layer patterning down to 20 µm line / space by

roll-to-roll processing, including double side and micro-

via

Wide possibilities in thin and thick film processing on

sheet and roll-to-roll base

Development of flexible electronic systems (circuits,

sensors, displays, energy)

Foil-to-Foil assembly processes

Preparation processing of ultra-thin semiconductors

Integration of ultra-thin silicon devices on or in film

substrates

Self-assembly and self-alignment processes

© Fraunhofer

© Fraunhofer

Fraunhofer EMFT – Polytronics Area of researchBavarian Polytronics Demonstration Center in Munich - funded 2001Focus on Polytronic , FOLAE and Multi-functional Systems (sheet and R2R)

© Fraunhofer

Roll-to-roll manufacture technology for film substrates

Bavarian Demonstration Center >> Polytronics <<

Fine-line patterning of metallized plastic films Thick-film screen printing on sheets and rolls

Sputter deposition Web coating Foil lamination Laser processing Electrical testing

© Fraunhofer

Devices on Plastic Films

RFId antennaeOrganic electronics EL signageHiRes Wiring Printed passives

Temperature ElectrochemicalUltra thin ICs Capacitive sensor Biosensor

© Fraunhofer

Roll-to-roll processing of wiring layers on film substrates

Ultra-fine pitch copper wiring; 20 µm line / space

Prepared by roll-to-roll processing on polyimide, PET or PEN substrates

Double side wiring of web substrates

laser drilled and electroplated microvia

© Fraunhofer

Selected Tools for LED-Analysis and -Characterization

Up to 180° Temperature

Humidity,

OpticsBend & Twist

© Fraunhofer

FP7 i-Tex: Intelligent Textiles for Illumination

2011 - 2015

© Fraunhofer

Example: ATIS Bending Tester

© Fraunhofer

Modular RF-Metrology

0 … 110 GHz

Wafer Level 200 mmKoax 0 … 67 GHz

Wafer Level 300 mm

- 55 ° C … (300°C)

Koax 1 mm + BiasT

Hohlleiter W10

10 MHz – 67 GHz

PNA5250A

© Fraunhofer

Fraunhofer EMFT Mission

Scientific excellence

We have the courage to try out new things

We possess new ideas and put them to practical use

We are in demand on renowned conferences

We cultivate the next generation of scientists

Strong partnershipswith industry

We deliver what we promise, on schedule

We communicate frankly and honestly

We help our partners to succeed

Fun and motivation at work

We continuously improve our professional and personal skills

We set ourselves challenges

We treat each other with fairness, friendliness and respect

We consider different people as enrichment

© Fraunhofer

Industry Customers and Project Partners

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Automotive supplier:

Automotive producer:

Semiconductor :

Electrical Application :

Possible Industry Partners in Romania:

© Fraunhofer

ANCSNational Authorities:

National Organization:

Universities:

National Research Institutes:

Local Microelectronic companyCleanroom made by IPA:

IPA

Existing Contacts with Romanian Partners :

© Fraunhofer

Fraunhofer EMFT -

Your research and cooperation partner for sensors and actuators

Thank youfor

your attention !