Flexible Electronics PPT by Sourabh Kumar
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Transcript of Flexible Electronics PPT by Sourabh Kumar
Presentation on
Flexible Electronics
P R E S E N T E D BY SOURABH KUMAR13ECIEC008
B.TECH, EC, VIII SEMCITM COLLEGE SITAPURA
Outline:
• Introduction to Flexible Electronics• Technologies and Integration Processes• Fabrication Technology• Flexible circuit board• Flexible electronic components• Manufacturing of flexible circuits & device• Material and thickness• Market Growth• Applications• Advantages and disadvantages• Reference & Conclusion
Introduction to Flexible Electronics
• Flexible electronics, also known as flex circuits, is a technology for assembling electronic circuits by mounting electronic devices on flexible plastic substrates.
• FLEXIBLE ELECTRONICS can actually be defined as the electronic devices which can be bent and stretched into any shape at any time.
Flexible Electronics A generic large-area electronic structure is composed of :
SubstrateBack-plane Front-plane Encapsulation
TECHNOLOGIES AND INTEGRATION PROCESSES Any manufacturable device has four essential characteristics:
Superior and pre-specified performance, with reproducibility, uniformity, and reliability
High yield to acceptable tolerance Simulations exist for both reverse engineering during development
and right-first-time designProven adequate in-service lifetime.
FABRICATION TECHNOLOGY FOR FLEXIBLE ELECTRONICS
Fabrication on sheets by Batch Processing.. On a rigid carrier, facing up and loose; In a tensioning frame, facing up or down; In a frame, facing down and loose
Fabrication On Web by roll-to-roll Processing
Additive Printing
Flexible Circuit boards
Flex circuits are made up of
flexible plastic substrate
usually polyimide, Polyester or
thin sheets of glass
Flexible electronic componentsElectronic components such as transistors are
being made from silicon nanomembrane usually called
TFT’s(thin film transistors).
Flexible resistors & capacitors structures are
shown diagrammatically usually called thin flim resistors
and thin flim capacitors
Resistor Capacitor
Lithium-ion flexible battery
Non volatile Memories
Flexible DisplaysOrganic light-emitting diodes (OLEDs) are normally
used instead of a back-light for flexible displays.
Manufacturing of flexible circuits & devices
For the manufacturing of flexible electronics “Roll
to Roll” (R2R) processing inkjet printing and soft
lithography process is used.
Steps of R2R processing
Layers materials and their thicknessBase material or substrate
1.Flexible polymer flim2. Polyethylene terephthalate3. Thin glass sheet
12-125 µm
Conductive path
1. Copper foil2. Polyester3. Graphene
200 nm
Market Growth• The market for flexible, printed, and organic large-area electronics
is rapidly growing. Currently estimated at over $200M, the global
market is expected to increase to a $800M market by 2020.
Applications
Automotive field. Space crafts. Foldable displays.
Military. Electronics Devices. Health Care
Displays and Human- machine interaction
Energy management and mobile devices
Wireless systems
Electronics Embedded in the living environment
Flexible solar cells
Flexible outwears
Flexible Electronic products1 3
2
Stretchable Lithium ion battery
Developed by University of llinois at Urbana
Flexible Devices
ADVANTAGES
light weightSmaller dimensions requiredSpace savingFoldable and bendableIncreased circuitry densityWide Viewing Angle
DISADVANTAGES
Initial investment may be expensive
Integration of components would be challenge for engineers
Precision machines requiredLifetimeManufacturing
ConclusionFlexible electronics in future will play a part in
field of security, entertainment and may lead to
innovative applications
The demand for flexible electronic products at
present may not be noticed but upto 2020 there would
be huge demand and preference will be given to the
flexible products in market
References
• [1] www.wikkipedia.org.in/flexibleelectronics
• [2] "Printed Circuit Techniques" by Cledo Brunetti and Roger W. Curtis (National
Bureau of Standards Circular 468 first issued 15 November 1947)
• [3] Gleskova, H., Wagner, S., Gasˇpar k, V. & Kova´cˇ, P. 150uC Amorphous
Silicon thin-Film Transistor technology for Polyimide Substrates. J.Electrochem.
Soc.148, G370-G374 (2001)
• [4] Cotema, coating machinery GmbH www.cotema.de
Queries if any???