Figs01 2nd Edition

8/10/2019 Figs01 2nd Edition

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R. Ludwig and G. BogdanovRF Circuit Design: Theory and Applications

2nd edition

Figures for Chapter 1

Figure 1-1 Block diagram of a generic RF system.

DAC

OSC.

PA

ADC LNA

D i g i t a l

C i r c u

i t r y

Analog-to-DigitalConverter

Digital-to-AnalogConverter

Local Oscillator

TransmitterPower Amplifier

Receiver LowNoise Amplifier

Switch

Low-PassFilter

BandpassFilter

Antenna

Mixed Signal

Circuits

Analog Circuits

Mixer


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Figure 1-2(b) Printed circuit board layout of the power amplifier.

BFG425

B F G 2 1

RF in RF out

Input MatchingNetwork

First StageTransistor

Interstage MatchingNetwork

OutputMatchingNetwork

DC Bias Network

Second StageTransistor

Dual Transistor IC

0.5 inch


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Figure 1-3 Electromagnetic wave propagation in free space. The electric and mag-netic fields are shown at a fixed instance in time as a function of space ( are unitvectors in x - and y -direction).

x

y

z

H = H y y

E = E x x

x ,^

y ^


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.Table 1-1 Frequency bands and their applications

Frequency Band Frequency Typical Application

VHF (Very High Frequency) 88 108 MHz FM broadcasting

UHF (Ultrahigh Frequency) 824 894 MHz810 956 MHz

CDMA mobile phone serviceGSM mobile phone service

UHF (Ultrahigh Frequency) 2,400 MHz WLAN

SHF (Superhigh Frequency) 5,000 5,850 MHz Unlicensed NationalInformation Infrastructure

SHF (Superhigh Frequency) 6,425 6,523 MHz Cable Television Relay

SHF (Superhigh Frequency) 3,700 4,200 MHz Geostationary fixed satellite

serviceX Band 8 12.5 GHz Marine and airborne radar

Ku Band 12.5 18 GHz Remote sensing radar

K Band 18 26.5 GHz Radar

Ka Band 26.5 40 GHz Remote sensing radar


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.

Figure 1-4 Skin depth behavior of copper aluminumgold and typical solder

104 105 106 107 108 1090

0.5

1

1.5

2

f , Hz

, m m

Solder

Al

Au

Cu

Cu 64.5 106

S/m,= Al 40.0 10

6 S/m,= Au 48.5 10

6 S/m,=

solder 6.38 106

S/m.=


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Figure 1-5(a) Schematic cross-sectional AC current density representation

normalized to DC current density.

2a

Current Flow

| J z| /J z 0

r a a

Low currentdensity

High currentdensity


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Figure 1-5(b) Frequency behavior of normalized AC current density for a copperwire of radius a = 1 mm.

r , mm

0

0.20.4

0.6

0.8

1

1.2

1.4

1.6

1.8

2

1 kHz

10 kHz

100 kHz

1 MHz 10 MHz

100 MHz

1 GHz

0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 10

| J z |

/ J

z 0


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Figure 1-6 The exact theoretical per-unit-length resistance as a function offrequency for round wires of varying materials and radii. The dashed lines representthe DC and skin depth based resistance approximations.

100

101

102

103

104

105

106

107

108

109

102

101

100

101

f , Hz

R ,

/ m

Cu, 0.1 mm

Cu, 1 mmAl, 1 mm

Solder, 1 mm


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Figure 1-7 One- and quarter-watt thin-film chip resistors in comparison with aconventional quarter-watt resistor.


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Figure 1-8 Electric equivalent circuit representation of a high frequency resistor.

R L L

C a

C b


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Figure 1-9 Electric equivalent circuit representation of a wire-wound resistor at high frequency.

R

C 1

L1

C 2

L2 L2


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Figure 1-10 Absolute impedance value of a 2000 - thin-film resistor asa function of frequency.

104 105 106 107 108 109 1010100

101

102

103

104

f , Hz

| Z |

,

Ideal resistance

Capacitive effect

Inductive effect


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Figure 1-11 Electric equivalent circuit of a capacitor at high frequency.

L

Re

C

Rs


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Figure 1-12 Absolute value of the capacitor impedance as a func-tion of frequency.

106 107 108 109 1010102

101

100

101

102

103

104

f , Hz

| Z | ,

Real capacitor

Ideal capacitor


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Figure 1-13 Actual construction of a surface-mounted ceramic multilayer capacitor.

Electrodes

Ceramic material

Terminations


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Figure 1-14 Distributed capacitance and series resistance in the inductor coil.

Rd Rd

C d C d


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Figure 1-15 Equivalent circuit of the high-frequency inductor.

L Rs

C s


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Figure 1-16 Inductor dimensions of an air-core coil.

l

2a 2 r

d


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Figure 1-17 Frequency response of the impedance of an RFC.

107 108 109 1010100

101

102

103

104

105

f , Hz

| Z | ,

Real inductor

Ideal

inductor


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Table 1-2 Standard sizes of chip resistors

Geometry Size Code Length L, mils Width W , mils

0402 40 20

0603 60 300805 80 50

1206 120 60

1812 120 180 L W


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Figure 1-18 Cross-sectional view of a typical chip resistor.

Protective coatResistive layer

Marking

Ceramic substrateInner electrodesEnd contact

End contact


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Figure 1-19 Cross section of a typical single-plate capacitor connected to theboard.

Circuit traces

Chip capacitor Ribbon lead or wire


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Figure 1-20 Clusters of single-plate capacitors sharing a common dielectricmaterial.

Dual capacitor Quadrupole capacitor


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Figure 1-21 Typical size of an RF wire-wound air-core inductor (courtesy of Coil-craft, Inc.).


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Figure 1-22 Flat coil configuration. An air bridge is made by using either a wire or aconductive ribbon.

Air bridge

Terminal Terminal


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Figure 1-23 Construction of a three-dimensional LTCC/HTCC module made out ofindividual layers of ceramic tape that are collated, stacked, and fired (courtesy ofLamina Ceramics Inc.).

BuriedResistor

BuriedCapacitor

Vias

MetalCore

Metalizationon

Ceramic

Surface-mountedactive devices


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Figure 1-24 Impedance and quality factor behavior of a real, non-magnetic core in-ductor as measured by the HP 4192A LCR meter.

103

102

101

100

101

102

Q

101 102 103 104 105 106 107 101 102 103 104 105 106 107100

101

102

103

104

105

f , Hz f , Hz

| Z | ,

Resistancedominates

Inductive behavior

Self resonance

Capacitivebehavior


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Figure 1-25 LCR meter with a plastic core torroidal inductor con-nected to the test fixture and a measurement taken at 100 kHz .

Figs01 2nd Edition

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