Feature completeIn 1995, we released the first fully coupled thermo-electro-mechanical (TEM) analysis tool for MEMS andMEMS packaging. Since then, our analysis modules havegrown by leaps and bounds encompassing all aspects ofmechanical, thermal, piezoelectric, piezoresistive,electrostatic, electromagnetic, and fluidic modeling —ranging from linear and non-linear behavior; to steadystate and transient analysis; to static and dynamicbehavior. In addition, a bevy of enhancements now allowyou to perform parametric loading, take into accountprocessing conditions, and greatly reduce problems sizesby sub-modeling or create macro models for integrationwith SPICE.

Our analysis modules are packed full of features that arefar too many to list here. And yes, we are confident theywill meet the needs of your most demanding application.It is little wonder then that IntelliSuite is used incorporations worldwide ranging from blue chips tostartups and is part of the MEMS curriculum in leadinguniversities around the world.

Built for performanceWhile others have taken a quick to the market approachby combining off-the-shelf modeling tools, we havemeticulously designed IntelliSuite™ to provide the bestperformance possible. Our algorithms are designedaround MEMS. For instance, consider our innovativeExposed Faced Meshing tool, which allows you todecouple mechanical and electrostatic meshes, resultingin up to a 90% savings in computational time1, or our

squeeze film damping algorithms that are over85% speedier than conventional methods.2

Our microfluidics module is specificallydesigned for MEMS, it is not an automotive oraerospace solver forced into the micro-domain.We designed our solver from the ground up forunparalleled performance, and at the same timeintegrated electrokinetics and electrochemicalreactions and heat transfer in fluids, capabilitiesnot found in other tools.

Similarly, we built our Electromagnetic modulespecifically for RF MEMS applications, allowingyou to go beyond the limitations of quasi-planarmodeling in conventional tools.

Are you still using a patchwork of FEA tools orother software products? Try us, we guaranteethat you will never go back!

Thermal analysisIntelliSuite™ gives you a fullrange of tools to model heattransfer phenomena.Designing a thermal actuatoror a bolometer? Want to

calculate thermal stresses during packaging?Want to model Joule heating or heat flux? Noproblem! This tool does it all. Or use the tool inconjunction with other analysis modules tocalculate the temperature coefficient andresponse of your device.

Electrostatic analysisThe electrostatic module of IntelliSuiteis designed from the ground up for realworld MEMS problems, like a 200-fingerradial comb drive or a corrugated RF-MEMS device. Other CAD tools run into

severe limitations while solving real world problems andhave to use reduced toy models. Not IntelliSuite. Ourinnovative Exposed Face Meshing algorithm can solveextremely large problems up to 90% faster than othertools on the market. In fact, now you can even investigatesecond order effects such as levitation due to the groundplane (important in most comb drive structures),temperature coefficients of your capacitors, and chargebuildup that can cause potential arcing.

Multi-dielectric problems, dielectric discontinuities, andparasitic capacitance can all be modeled accuratelywithout resorting to costly trial and error in the fab.

Mechanical analysisOne of the strong suits of IntelliSuite isits unparalleled capability in mechanicalanalysis and its integration with thethermal and electrostatic modules toperform fully coupled analyses.

IntelliSuite comes with a full featured mechanical modulethat can solve the most complex linear or non-linear,transient or steady state, static or dynamic problems.Stress and strain calculations, modal and bucklinganalysis, and frequency response can all be performedwith ease. Full squeeze film damping, dynamic responseto complex vibration inputs, shock analysis, and Q factorcalculations are equally easy to derive. Difficult problemssuch as the shift of natural frequency due to voltage orstress loading or the effect of residual processing stresseson device performance are likewise easy to analyze.

Contact analysis & micro-assemblyIntelliSuite really shines when it comes to contact, postcontact, and micro-assembly analysis. Other MEMS CADtools are limited to analyzing single dielectric layers withartificial air stops, and make you specify contact faces apriori. IntelliSuite avoids such limitations. Ourproprietary algorithms take into account multi-dielectricmoving or deformable boundaries and help you locatethe exact point of contact.

IntelliSuite's contact analysis goes way beyond thereduced order models and other gross simplifications andcan help you model complex post-contact phenomenonsuch as hysterisis. Micro-assembly techniques such as

stress release, pop-up structures, latchingmechanisms, and bi-stable and multi-stableelements can also be modeled with IntelliSuite.

Piezoelectric and piezoresistiveanalysisIntelliSuite ships with themost sophisticatedpiezoelectric andpiezoresistive modelingcapabilities in the industry.Considering piezo actuation for your MEMSdevice? IntelliSuite can handle your needs suchas time varying loading; steady state, modebased or direct integration transient analysis ofyour device. In addition, you can look at afloating conductor voltage as a function of timevarying loading which is important for acoustictransducer and microphone design.

RF and Microwave MEMSThe IntelliSuiteelectromagnetic analysismodule is specificallydesigned to address the needsof researchers in RF MEMS,microwave, and Optical MEMS by providing fast,accurate, cost-effective solutions forelectromagnetic and RF associated phenomena.

IntelliSuite makes it easy for anyone with abackground in MEMS to safely navigate the pitfalls of high-frequency analysis. Our RF MEMSmodule was designed with the user in mind,with no arcane interfaces or complex waveformmodels. Best of all there are no $100 k +packages to purchase!

Whether you are designing an RF Switch, atunable capacitor, a VCSEL, an antenna, or awaveguide, you will find IntelliSuiteindispensable. We have full support for multipledielectrics with gaps and lossy conductorsallowing you to model devices in full 3d. Nomore limitations to quasi-planar structures. Ouralgorithms are designed to give accurate resultsfor even the most highly resonant structures.

BioMEMS and Microfluidics analysisMost Computational Fluid Dynamics(CFD) tools available on the marketwere designed for either aircrafts orautomobiles, or for flow in pipes. Theyare not optimized for microfluidics or

bioMEMS. We created a full solver optimized for MEMSapplications from the ground up. At the same time wewent way beyond the existing code bases by addingsupport for electrokinetic phenomenon, Red-Oxreactions, acids, bases, ampholytes, and fluid-structureinteraction. To top it off we added advanced visualizationalgorithms to look at cross sectional profiles, velocityvectors, and transients. Our code base is not only faster atsolving microfludics problems but is the only MEMS toolfor problems ranging from electrophoresis to isoelectricfocusing. This module is fine tuned for real worldbioMEMS.

Packaging analysisOne of our dictums has been to concurrently design theMEMS and packaging. In fact, far too many MEMSprojects fail due to the lack of packaging considerationsupfront. IntelliSuite is at its best in demystifyingpackaging of MEMS devices. Packaging related stresses,thermal gradients, and the temperature response of adevice can all be modeled without needing to purchaseyet another tool. IntelliSuite gives you the tools toperform die level and board level packaging thermo-mechanical and high frequency analysis.

CompatibilityIntelliSuite is designed to be an open system that fits wellwith others. We speak a wide range of file formats rangingfrom DXF and GDS II (for mask import and export) to

IGES and PATRAN (solid model orFEA input) to ABAQUS, ANSYS(FEA model import and export) toTouchstone (high frequencyanalysis). Our macro models can

be used in conjunction with SPICE for further integration.Analysis results & solid models can be exported to AVI orJPG format for adding panache to your next presentation.Plus, all of our file formats are rigorously documentedand available. Unlike other tools, there is no danger ofvendor lock-in.

ApplicationsConventional MEMS

Accelerometers, Pressure sensors,Gyroscopes, Microphones, MOEMS,Bolometers, Biometric scanners, Electrostaticswitches, Thermal switches, MicromotorsOptical switches (Electrostatic, piezo andmagnetic), Radiation detectors, Microheatersand hotplates, Cryogenic heat exchangers,AFM/SPM toolsets, Microgrippers.

Mechanism designRadial and linear combdrives, Gear trains,Bistable and multi-stable elements, Resonantstructures, Motors, Membranes, Cantilevers,Popup structures, Microassembly.

Electromagnetics and RF MEMSElectrostatic switches (parallel, series andcapacitive), resistive switches, tunable MEMScapacitors, Pacheco switches, Phase shifters,Inductors, Planar antennas

Microwave applicationsMicrostrip circuits, stripline circuits, slotlinecircuits, coplanar waveguides, thickconductors, electro-optical modulation,dielectric discontinuities, 2-port waveguidecomponents, monolithic microwave integratedcircuits. (MMICs)

BioMEMS and Total Analysis Systems (µTAS)Capillary electroseparation, µ-capillary zoneelectrophoresis (µCZE), flow cyclometry, µ-capillary iso-electric focusing (µCIE), µ-capillary isotachophoresis (µCI),dielectrophoresis, micro-mixers, T-sensors,reaction chambers, drug delivery, mixing inserpentine chambers, potentiostatic andgalvanostatic modeling. Array devices such asDNA hybridization chips, diffusion systems,proteomics on a chip,

MicrofluidicsMicrovalves, nozzles, mixers, fluid-membraneinteraction

Feature highlightsGeneral analysis features• Linear and non-linear analysis• Static, steady state, and transient analysis• Fully 3D coupled dynamics analysis• Parametric variations• Fabrication process-induced effects• Submodeling, symmetry, and other size reducing techniques• Animation and color mapping of results• Export and import to/from other engineering CAD tools

Electrostatic analysis• Electrostatic pressure, potential, & charge distribution• Capacitance matrix derivation• Parasitic capacitance calculations

Mechanical analysis• Stress-displacement calculations (principal and invariant stresscalculations)• Natural frequency and modal analysis• Dynamic analysis with external force/acceleration loading• Shock analysis• Q factor calculation• Damping analysis (including squeeze film effects)• Squeeze film calculations (90% faster than conventionaltechniques)• Definition of customized functions for external loading• Small and large displacement theory• Residual stress incorporation• Multiple simultaneous input loading• Contact and post-contact analysis• Hysterisis analysis• Microassembly and latching modeling• Popup and bistable elements

Thermal analysis• Heat transfer problems• Conduction or convection modeling• Joule/resistive heating modeling• Temperature distribution/gradients

Piezo modeling• Piezoresistive and piezoelectric modeling• Displacement and deformation due to voltage loading• Natural frequency and mode shapes as a function of loading• Analyse, simulate, and design piezoelectric transducers, sensorsand actuators• Static analysis (stresses, strains, voltages, etc)• Frequency shift due to loading and frequency sweep analysis• Mode based transient analysis• Direct integration transient analysis (both auto increment andfixed increment analyses)• Time dependent loading• Floating conductor voltage determination

Coupled analysis• Exposed face meshing to decouple mechancial and electrostaticmeshes resulting in performance enhancements• Displacement due to voltage and thermomechanical loading• Capacitance due to voltage and thermomechanical deformation• Natural frequency shift due to voltage and thermomechanicalloading• Coupled piezo analysis• Pull-in voltage, contact, and hysteresis loop calculations• Full multi-dielectric capabilities• Stress, temperature, potential, charge, and pressure distribution• Joule/resistive heating actuation• Assembly and latching analysis• Post-assembly coupled analysis• Heat transfer

Packaging/System modeling• Full die and board level packaging modeling• Effect of packaging in low pressure• Incorporation of epoxies, dams, filler, and gettermaterials• High frequency packaging analysis• Macromodel derivation of input to SPICE and relatedtools

Electromagnetics and high frequency analysis• Fully 3D Method of Moments (MOM) solver • Frequency domain formulation• Powerful, easy-to-use builder• MEMS & monolithic microwave IC applications• Defined dielectric stack• Distinct material properties definition• Lossy conductors with finite thickness• Dielectric discontinuities• Reliable results for highly resonant structures• Asymptotic estimator for reduced computation• Broadband simulations• 3D, quasi-planar, & planar structure modeling• Volume currents used for modeling• S-, Z-, & Y-parameter computation• Quality factor, group delay• Characteristic parameters of feeding lines

Microfluidic analysis• Adsorption modeling• Redox reactions at electrodes (Galvanostatic orpotentiostatic formulations)• Newtonian and non-newtonian fluids• Steady state or transient analysis• Electrokinetics (including electroosmosis,electrophoresis and dielectrophoresis)• Reaction kinetics of multi-valent analytes• Acids, bases, and ampholytes• Fully coupled transport stoichiometry• Strong and weak analytes• Distributions solved exactly with no a prioriapproximations (pH, current, voltage, conductivity,ionic strength)

1 Y. He et al, "An Improved Meshing Technique and its Application in theAnalysis of Large and Complex MEMS Systems," SPIE Symposium onMicromachining and Microfabrication *(1997)

2. D.J. Keating et al, "Effects of squeezed film damping on dynamic finiteelement analyses of MEMS." Design, Test, Integration, and Packaging ofMEMS/MOEMS, Cannes, France. (2001)

IntelliSuite, IntelliFAB, IntelliMask, MEMaterial, AnisE, Total MEMS solutions,Solutions for the MEMS professional are trademarks of IntelliSense SoftwareCorporation. Microsoft Office is a trademark of Microsoft Corporation.Errors and Omissions Excepted. IntelliSense Software does not acceptliabilities due to errors or omissions in this document. © IntelliSenseSoftware, 2004